TOC
Main News
- Former President Trump and TSMC have proposed the construction of a $1 trillion AI and robotics complex in Arizona. This initiative has the potential to be a huge driver of AI and robotics manufacturing in the United States.
- Texas Instruments (TI) has announced plans to invest $60 billion in semiconductor manufacturing in the United States, building a total of seven plants. This is a major initiative that will significantly enhance semiconductor manufacturing capacity in the United States.
- SK Hynix is extending its lead over Samsung in the HBM competition, especially by leading the development of custom HBM4E in collaboration with NVIDIA and Microsoft. This has established a competitive advantage in the next-generation HBM market.
- Samsung’s 1c DRAM yield has reportedly reached up to 70%, paving the way for the introduction of HBM4 by the end of the year. This indicates that Samsung is overcoming yield challenges in next-generation HBM production.
- NVIDIA is considering the first use of humanoid robots in the production of AI servers. This represents an innovative approach to manufacturing high-performance AI products.
- The United States has notified the Chinese factories of Samsung and SK Hynix of its policy to restrict the entry of U.S. semiconductor equipment into China. This action could have a direct geopolitical impact on the major semiconductor manufacturers’ operations in China.
- With Nvidia exerting pricing pressure on TSMC, Nintendo Switch 2 production has shifted to Samsung. This suggests the importance of competition and pricing in the foundry market.
- China’s 15th Five-Year Plan identifies chip tool upgrades and “re-globalization” as key to supply chain restructuring. This is China’s long-term strategic direction in the semiconductor industry.
- Micron is challenging its Korean rivals with breakthroughs in SOCAMM and support from PTI. This is a move by Micron to increase its competitiveness in the advanced memory packaging field.
- Taiwan’s chip packaging industry faces a triple threat as the Trump administration’s tariff deadline looms. This is indicative of the broad economic and geopolitical pressures affecting the semiconductor industry.
News List
| 投稿日 | 日本語タイトル | 原語タイトル | 記事URL |
|---|---|---|---|
| DIGITIMES | |||
| Jun 20, 10:12 | マイクロン、SOCAMMのブレークスルーとPTIの支援で韓国ライバルに挑む | Micron challenges South Korean rivals with SOCAMM breakthrough and PTI support | https://www.digitimes.com/news/a20250620PD207/micron-pti-competition-high-end-packaging.html |
| Jun 20, 15:18 | ウィストロンITS、新設の半導体部門でチップ設計レースに参入 | Wistron ITS enters chip design race with new semiconductor division | https://www.digitimes.com/news/a20250620PD228/wistron-subsidiary-ic-design-technology-ic.html |
| Jun 20, 11:56 | インテル支援のSATAS、シャープの日本工場でパイロットライン建設を開始 | Intel-backed SATAS begins pilot line construction at Sharp’s factory in Japan | https://www.digitimes.com/news/a20250620PD223/production-equipment-manufacturing-intel-chairman.html |
| Jun 20, 11:16 | サムスン、歩留まり懸念を背景にEDAパートナーシップで2nmファウンドリ推進を強化 | Samsung bolsters 2nm foundry push with EDA partnerships amid yield concerns | https://www.digitimes.com/news/a20250620PD218/samsung-2nm-design-eda-ip.html |
| Jun 20, 09:37 | 台湾のチップブラックリストが、見た目以上にインドにとって重要な理由 | Why Taiwan’s chip blacklist matters more to India than it seems | https://www.digitimes.com/news/a20250619VL207/taiwan-tsmc-chip-supply-india-china-export-restrictions.html |
| Jun 20, 15:50 | GBM、リンクセテック買収を通じてAI製品ラインを拡大、シンガポールとマレーシアでの事業に注力 | GBM expands AI product line via Lincstech acquisition, focus on Singapore and Malaysia operations | https://www.digitimes.com/news/a20250619PD204/gbm-acquisition-ems-subsidiary-walsin.html |
| Jun 20, 14:08 | 台湾のチップパッケージング産業、トランプの関税締切迫る中で三重の脅威に直面 | Taiwan chip packaging sector faces triple threat as Trump tariff deadline looms | https://www.digitimes.com/news/a20250620PD224/taiwan-chipbond-packaging-testing-2025.html |
| Jun 20, 12:31 | 台湾のチップサプライヤー、アリゾナが新竹と同様のエコシステムを再現するのは難しいと指摘 | Arizona unlikely to replicate Hsinchu’s ecosystem, Taiwan chip supplier says | https://www.digitimes.com/news/a20250620PD221/tsmc-taiwan-expansion-manufacturing-arizona.html |
| Jun 20, 12:29 | HBM競争が加速する中、SKハイニックスがサムスンに対するリードを拡大 | SK Hynix widens lead over Samsung as HBM race accelerates | https://www.digitimes.com/news/a20250620PD225/sk-hynix-samsung-hbm-2025-chipmakers.html |
| Jun 20, 11:53 | TDK、スマートグラススタートアップSoftEyeを買収し、AIハードウェアポートフォリオを拡大 | TDK acquires smart glasses startup SoftEye to expand AI hardware portfolio | https://www.digitimes.com/news/a20250620PD222/tdk-smart-glasses-electronics-hardware-startup.html |
| Jun 20, 11:27 | 報道によると、サムスンとSKハイニックスが3D DRAMへの足掛かりとしてVCT DRAMの開発を加速している | Samsung and SK Hynix reportedly accelerate VCT DRAM development as stepping stone to 3D DRAM | https://www.digitimes.com/news/a20250620PD214/dram-samsung-sk-hynix-3d-development.html |
| Jun 20, 10:52 | 自動車市場の逆風をAIサーバーが相殺、FHtがASIC成長を見据え生産体制を拡大 | Auto market headwinds offset by AI servers; FHt expands production to capitalize on ASIC growth | https://www.digitimes.com/news/a20250620PD208/growth-production-asic-market-ai-server.html |
| Jun 20, 09:38 | HBM分断が深刻に：SKハイニックスは事業を多角化、サムスンは内製化を推進 | HBM divide deepens: SK Hynix diversifies, Samsung pulls in-house | https://www.digitimes.com/news/a20250618PD233/sk-hynix-samsung-hbm-supply-chain-dram.html |
| Jun 20, 09:38 | 中国の第15次五カ年計画（4）：チップ装置のアップグレードと『再グローバリゼーション』がサプライチェーン再編の鍵 | China’s 15th Five-Year Plan (4): Chip tool upgrade and ‘re-globalization’ at the heart of supply chain reset | https://www.digitimes.com/news/a20250618PD240/equipment-market.html |
| Jun 20, 07:48 | NvidiaがTSMCに価格圧力をかける中、Switch 2はサムスンへ移行 | Switch 2 shifts to Samsung as Nvidia pressures TSMC on pricing | https://www.digitimes.com/news/a20250619PD241/samsung-nintendo-switch-nvidia-tsmc-2nm.html |
| Jun 20, 07:46 | シンガポール、ジョホールにAI活用型特区設置で自国版深セン建設を模索 | Singapore looks to build its own Shenzhen with AI-powered SEZ in Johor | https://www.digitimes.com/news/a20250618PD237/singapore-malaysia-johor-data-center-chips-manufacturing.html |
| wccftech | |||
| 日経 Tech Foresight | |||
| 2025-06-20 | 組み込みマイコン、40nmの壁突破 メモリーが進化左右 | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC179IL0X10C25A6000000 | |
| 2025-06-20 | 【特許】韓国UP化学、ZrやHfの酸化物薄膜 メモリーに | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC176TU0X10C25A6000000 | |
| 2025-06-20 | 東大など、光導波路多重型の行列演算回路 AI処理向け | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC1343E0T10C25A6000000 | |
| 2025-06-20 | ラピダス、「液晶技術が必要」 シャープ系元社長参画 | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC191N50Z10C25A6000000 | |
| マイナビニュース テックプラス | |||
| 2025-06-20 | TIが米国での半導体製造に向けて600億ドルの投資計画を発表、合計7工場を建設へ | https://news.mynavi.jp/techplus/article/20250620-3359168/ | |
| 2025-06-20 | レゾナック、宇宙向け半導体封止材の評価実験を2025年秋にISSで実施へ | https://news.mynavi.jp/techplus/article/20250620-3359118/ | |
| 2025-06-20 | 2025年上半期の米国半導体業界を振り返る – インテル・AMD・NVIDIAの動向は？ | https://news.mynavi.jp/techplus/article/20250620-3358967/ | |
| 2025-06-20 | SATASが後工程自動化パイロットラインの設置先をシャープ亀山工場に決定、整備を開始 | https://news.mynavi.jp/techplus/article/20250620-3358802/ | |
| 2025-06-20 | SamsungのHBM3E 8-HiがBroadcomの認定試験に合格か？ 海外メディア報道 | https://news.mynavi.jp/techplus/article/20250620-3358780/ | |
| 2025-06-20 | MicronのHBM3E 12Hi 36GB製品、AMDのInstinct MI350シリーズに採用 | https://news.mynavi.jp/techplus/article/20250620-3358766/ | |
| 2025-06-20 | Vicorの48V電源で小型軽量化した、高性能アクティブサスペンションシステム | https://news.mynavi.jp/techplus/kikaku/20250620-3355033/ | |
| 2025-06-20 | 半導体後工程製造装置事業で2030年代に売上高1000億円、ヤマハロボティクスが中長期経営計画を策定 | https://news.mynavi.jp/techplus/article/20250620-3358449/ | |
| TrendForce | |||
| 2025-06-20 | 報道によれば、UMCはシンガポールを超え、先進パッケージング拡大を狙い台湾南部の施設への進出を検討している | UMC Reportedly Eyes Southern Taiwan Facility for Advanced Packaging Expansion Beyond Singapore | https://www.trendforce.com/news/2025/06/20/news-umc-reportedly-eyes-southern-taiwan-facility-for-advanced-packaging-expansion-beyond-singapore/ |
| 2025-06-20 | 報道によれば、SK hynixはNVIDIAおよびMicrosoftと連携しカスタムHBM4Eの推進を先導、一方SamsungはHBM4で後れを取っている | SK hynix Reportedly Leads Custom HBM4E Push with NVIDIA, Microsoft; Samsung Trails with HBM4 | https://www.trendforce.com/news/2025/06/20/news-sk-hynix-reportedly-leads-custom-hbm4e-push-with-nvidia-microsoft-samsung-trails-with-hbm4/ |
| 2025-06-20 | トランプ政権のAI担当顧問によると、チップ設計において中国は米国に最大2年の遅れ | Trump’s AI Czar: China at Most Two Years Behind U.S. in Chip Design | https://www.trendforce.com/news/2025/06/20/news-trumps-ai-czar-china-at-most-two-years-behind-u-s-in-chip-design/ |
| 2025-06-20 | 報道によれば、Samsungの1c DRAM歩留まりが最大70%に達し、年内にHBM4導入への道が開かれる | Samsung’s 1c DRAM Yields Reportedly Reach up to 70%, Paving Way for HBM4 by Year-end | https://www.trendforce.com/news/2025/06/20/news-samsungs-1c-dram-yields-reportedly-reach-up-to-70-paving-way-for-hbm4-by-year-end/ |
| 2025-06-20 | Audi、新型Q3を発表―初のマイクロLEDヘッドライトを搭載 | Audi Unveils New Q3, Featuring Micro-LED Headlights for the First Time | https://www.trendforce.com/news/2025/06/20/news-audi-unveils-new-q3-with-micro-led-headlights-and-phev-gasoline-and-diesel-still-offered/ |
| Semiconductor Digest | |||
| 5 hours ago | 次世代半導体パッケージングを推進する革新的技術 | Novel Technologies to Advance Next-Generation Semiconductor Packaging | https://www.semiconductor-digest.com/novel-technologies-to-advance-next-generation-semiconductor-packaging/ |
| 5 hours ago | TECHCET、半導体ALD/CVD前駆体市場の見通しを予測し、成長を強調 | TECHCET Predicts Semiconductor ALD/CVD Precursor Market Outlook, Highlights Growth | https://www.semiconductor-digest.com/techcet-predicts-semiconductor-ald-cvd-precursor-market-outlook-highlights-growth/ |
| 5 hours ago | Nuvvon、全固体電池のスケーラビリティにおける大きなブレークスルーを報告 | Nuvvon Reports a Major Breakthrough in Solid-State Battery Scalability | https://www.semiconductor-digest.com/nuvvon-reports-a-major-breakthrough-in-solid-state-battery-scalability/ |
| 5 hours ago | ウエハースケールアクセラレータがAIを再定義する可能性 | Wafer-Scale Accelerators Could Redefine AI | https://www.semiconductor-digest.com/wafer-scale-accelerators-could-redefine-ai/ |
| 日本経済新聞 | |||
| 2025-06-21 | NYダウ小反発、35ドル高 中東情勢巡る交渉進展に期待 | https://www.nikkei.com/article/DGXZQOFL2100L0R20C25A6000000/ | |
| 2025-06-21 | 米国株、ダウ反発し35ドル高 中東情勢巡る交渉進展に期待 ナスダックは反落 | https://www.nikkei.com/article/DGXZQOFL2100P0R20C25A6000000/ | |
| 2025-06-21 | 米国株、ダウ反発 中東情勢巡る交渉進展に期待 ハイテク株安は重荷 | https://www.nikkei.com/article/DGXZQOFL20DP50Q5A620C2000000/ | |
| 2025-06-21 | サントリー、水クレジットの認証組織 資源の再生量評価 | https://www.nikkei.com/article/DGXZQOUC193T50Z10C25A6000000/ | |
| 2025-06-21 | NVIDIA、AIサーバー生産にヒト型ロボの初導入検討 ロイター報道 | https://www.nikkei.com/article/DGXZQOGN20DNU0Q5A620C2000000/ | |
| 2025-06-21 | NTTデータ、25年内にタイでDC稼働 130億円投資 | https://www.nikkei.com/article/DGXZQOGS19CHF0Z10C25A6000000/ | |
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| 2025-06-21 | 関西電力、消えない増資への不満 戦略見えず株価3割安 | https://www.nikkei.com/article/DGXZQOUF234GU0T20C25A5000000/ | |
| 2025-06-21 | ユニチカ、撤退の繊維事業をセーレンに一部売却 岡崎事業所を譲渡 | https://www.nikkei.com/article/DGXZQOUF202YY0Q5A620C2000000/ | |
| ダイヤモンドオンライン | |||
| Jun 20 21:00 | ニデック、村田製作所、京セラ、TDK…電子部品が好調の中、大幅減益に陥った「独り負け企業」の内情 | https://diamond.jp/articles/-/366794 | |
| Jun 20 20:10 | 日本郵船と商船三井の「待遇と人事」を公開・ベイカレント新社長の経歴で深まる“謎”・半導体材料の太陽HDに株主やPEファンドらが包囲網 | https://diamond.jp/articles/-/367066 | |
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| Tom’s Hardware | |||
| 2025-06-20 23:21 | トランプとTSMCが1兆ドル規模のアリゾナ州AI複合施設を提案 | Trump and TSMC pitched $1 trillion Arizona AI complex | https://www.tomshardware.com/tech-industry/artificial-intelligence/trump-and-tsmc-pitched-usd1-trillion-ai-complex-softbank-founder-masayoshi-son-wants-to-turn-arizona-into-the-next-shenzhen |
| 2025-06-20 21:00 | AMDとMicrosoftの提携が、ニビディアに対抗してチームレッドの競争力維持にどのように寄与するか | How AMD’s partnership with Microsoft could help Team Red stay competitive against Nvidia | https://www.tomshardware.com/video-games/xbox/how-amds-partnership-with-microsoft-could-help-team-red-stay-competitive-against-nvidia |
| 2025-06-20 20:43 | ホワイトハウスの暗号通貨・AI顧問、中国が米国に追いついていると警告 | White House crypto and AI adviser warns China catching up to the U.S. | https://www.tomshardware.com/tech-industry/white-house-crypto-and-ai-adviser-warns-china-catching-up-to-the-u-s-before-deepseek-people-thought-that-chinese-ai-models-were-years-behind-and-we-realized-that-they-are-only-months-behind |
| 2025-06-20 20:37 | ある言語AI企業、18日間でインターネット全体を翻訳可能と主張 | This Language AI company says it can now translate the entire internet in just 18 days | https://www.tomshardware.com/tech-industry/artificial-intelligence/this-language-ai-company-says-it-can-now-translate-the-entire-internet-in-just-18-days-194-day-task-slashed-by-deployment-of-nvidia-dgx-superpod-with-dgx-gb200 |
| 2025-06-20 20:28 | 初めて、Nvidia製品がヒューマノイドロボットを用いて製造される可能性が | Nvidia products could be made using humanoid robots for the first time ever | https://www.tomshardware.com/tech-industry/semiconductors/nvidia-products-could-be-made-using-humanoid-robots-for-the-first-time-ever-company-in-talks-with-foxconn-to-deploy-them-in-houston-factory-building-gb300-ai-servers |
| 2025-06-20 19:59 | AMD、次世代Xbox向けMicrosoftとの提携発表を受けカスタムチップのロードマップをちら見せ | AMD teases custom chip roadmap following next-gen Xbox partnership announcement with Microsoft | https://www.tomshardware.com/pc-components/cpus/amd-teases-custom-chip-roadmap-following-next-gen-xbox-partnership-announcement-with-microsoft-company-says-it-will-create-a-full-roadmap-of-gaming-optimized-chips-powered-by-ryzen-and-radeon |
| TechPowerup | |||
| 2025-06-20T16:52:54+00:00 | Sapphire Radeon RX 9060 XT Pulse OC 16GBレビュー ― Samsungメモリのテスト結果 | Sapphire Radeon RX 9060 XT Pulse OC 16 GB Review – Samsung Memory Tested | https://www.techpowerup.com/review/sapphire-radeon-rx-9060-xt-pulse-oc/ |
| 2025-06-20T15:55:26+00:00 | ASUS Republic of Gamers、ROG NUC（2025）ゲーミングミニPCを発表 | ASUS Republic of Gamers Announces ROG NUC (2025) Gaming Mini PC | https://www.techpowerup.com/338196/asus-republic-of-gamers-announces-rog-nuc-2025-gaming-mini-pc |
| 2025-06-20T15:46:21+00:00 | 人型ロボットがNVIDIAのGB300 NVL72「Blackwell Ultra」を組み立てる | Humanoid Robots to Assemble NVIDIA’s GB300 NVL72 “Blackwell Ultra” | https://www.techpowerup.com/338195/humanoid-robots-to-assemble-nvidias-gb300-nvl72-blackwell-ultra |
| 2025-06-20T15:20:23+00:00 | OXSが新型Storm A2 ANCワイヤレスゲーミングヘッドセットを発表 | OXS Announces New Storm A2 ANC Wireless Gaming Headset | https://www.techpowerup.com/338194/oxs-announces-new-storm-a2-anc-wireless-gaming-headset |
| 2025-06-20T14:14:16+00:00 | Samsung、1c DRAM技術で70%の歩留まりを達成したと報じられる | Samsung Reportedly Achieves 70% Yields for Its 1c DRAM Technology | https://www.techpowerup.com/338192/samsung-reportedly-achieves-70-yields-for-its-1c-dram-technology |
| 2025-06-20T11:58:14+00:00 | IntelのCore Ultra 7 265Kおよび265KF CPUが250ドル未満に | Intel’s Core Ultra 7 265K and 265KF CPUs Dip Below $250 | https://www.techpowerup.com/338191/intels-core-ultra-7-265k-and-265kf-cpus-dip-below-usd-250 |
| 2025-06-20T10:27:10+00:00 | Cadence、次世代オーディオ向けにキャッシュコヒーレントなHiFi 5s SMPを発売 | Cadence Launches Cache-Coherent HiFi 5s SMP for Next-Gen Audio Applications | https://www.techpowerup.com/338188/cadence-launches-cache-coherent-hifi-5s-smp-for-next-gen-audio-applications |
| 2025-06-20T09:11:01+00:00 | AMD、ミッドレンジ市場を盛り上げるためにRyzen 5 9600X3Dを準備中 | AMD Readies Ryzen 5 9600X3D to Spice Up the Mid-range | https://www.techpowerup.com/338186/amd-readies-ryzen-5-9600x3d-to-spice-up-the-mid-range |
| EETimes Taiwan | |||
| 2025-06-20 | 水素エネルギーは現代のAIデータセンターにおけるエネルギー解決策なのか？ | 氫能是當今AI資料中心的能源解決方案嗎？ | https://www.eettaiwan.com/20250620nt31-hydrogen-is-it-the-energy-answer-for-today-s-ai-data-centers/ |
| 2025-06-20 | 中国の低空経済が急速に離陸する | 中國低空經濟加速起飛 | https://www.eettaiwan.com/20250620nt61-china-s-low-altitude-economy-development/ |
| 2025-06-20 | Nvidia、Twitter規格版を中国のAI市場向けに供給 GDDR7出荷の勢いを牽引する見込み | Nvidia推特規版供中國AI市場 可望帶動GDDR7出貨動能 | https://www.eettaiwan.com/20250620nt21-gddr7-shipment-momentum/ |
| EETimes Asia | |||
| EETimes India | |||
| ZDNET Korea | |||
| 2025-06-21 | 「ギャラクシーZ Fold7、これだけ薄くなった」…厚さを比較すると | “갤럭시Z폴드7, 이만큼 얇아졌다”…두께 비교했더니 | https://www.zdnet.co.kr/20250621065959%22%20title=%22 |
| 2025-06-21 | もし人類が子供を産まなくなったら | 인류가 더 이상 아이를 낳지 않는다면 | https://www.zdnet.co.kr/20250621071159%22%20title=%22 |
| 2025-06-20 | オテックキャリア、高効率ヒートポンプ調達攻略を加速 | 오텍캐리어, ‘고효율 히트펌프’ 조달 공략 박차 | https://www.zdnet.co.kr/20250620235656%22%20title=%22 |
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| 中央日報 | |||
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| 2025-06-20 | 케이그라운드벤처스、新成長エンジン企業のグローバル進出を積極支援 | 케이그라운드벤처스, 신성장동력 기업 글로벌진출 적극 지원 나서 | https://www.joongang.co.kr/article/25345252 |
| BAIDU | |||
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