| Publication / registration number | title |
|---|---|
| US5888907A | Plasma processing method |
| US6074518A | Plasma processing apparatus |
| US5900103A | Plasma treatment method and apparatus |
| US7477960B2 | Fault detection and classification (FDC) using a run-to-run controller |
| US6544380B2 | Plasma treatment method and apparatus |
| US7505879B2 | Method for generating multivariate analysis model expression for processing apparatus, method for executing multivariate analysis of processing apparatus, control device of processing apparatus and control system for processing apparatus |
| US6264788B1 | Plasma treatment method and apparatus US7877161B2 Method and system for performing a chemical oxide removal process |
| US5904780A | Plasma processing apparatus |
| US7648610B2 | Baffle plate, apparatus for producing the same, method of producing the same, and gas processing apparatus containing baffle plate |
| US6106737A | Plasma treatment method utilizing an amplitude-modulated high frequency power |
| US5343047A | Ion implantation system |
| US6423242B1 | Etching method |
| US7047095B2 | Process control system and process control method |
| US5067798A | Laser beam scanning system |
| US7289866B2 | Plasma processing method and apparatus |
| US8175736B2 | Method and system for performing a chemical oxide removal process |
| US20060096951A1 | HPE and method for controlling process non-uniformity |
| US20170047200A1 | Plasma Processing |
| US9799561B2 | Method for oxidizing a semiconductor device |
| US20170032987A1 | Dry etching apparatus |
| US7172675B2 | Observation window of plasma processing apparatus and plasma processing apparatus using the same |
| US9859175B2 | Substrate processing system, method of managing the same and method of manufacturing semiconductor device with the same |
| US20200335376A1 | Capacitively-coupled plasma substrate processing apparatus including a focus ring and a substrate processing method using the same |
| US11018046B2 | Substrate processing apparatus including edge ring |
| US20210305021A1 | Focus ring, chuck assembly for securing a substrate and plasma treatment apparatus having the same |
| Special fair 05-065048 | Alignment method in multi-layer resist process |
| Japanese Patent Application Laid-Open No. 63-102320 | Plasma generator |
| Special fair 06-082635 | Semiconductor processing equipment |
| Japanese Patent Laid-Open No. 01-228308 | Significant signal amplifier circuit |
| Japanese Patent Application Laid-Open No. 01-302231 | Laser Scanning System |
| Patent 2648947 | Inspection device for semiconductor devices |
| Japanese Patent Laid-Open No. 02-135749 | Optical Probing Method |
| Japanese Patent Laid-Open No. 02-136765 | Optical Probing Device |
| Patent 2610178 | Optical Probing Method |
| Japanese Patent Laid-Open No. 02-194541 | Optical Prober |
| Japanese Patent Application Laid-Open No. 05-135732 | Ion |
| Japanese Patent Application Laid-Open No. 06-013017 | Processing device and ion implantation device |
| Patent 3264988 | Ion |
| Patent 3173671 | Ion |
| Patent 3162245 | Plasma processing method and plasma processing equipment |
| Patent 3210207 | Plasma processing equipment |
| Patent 3360265 | Plasma processing method and plasma processing equipment |
| Japanese Patent Laid-Open No. 10-074600 | Plasma processing equipment |
| Japanese Patent Laid-Open No. 10-335308 | Plasma processing method |
| JP 2000-082699 | Etching processing equipment |
| Patent 4230029 | Plasma processing equipment and etching method |
| Patent 4493756 | Plasma processing equipment and plasma processing method |
| Patent 4592856 | Baffle plate and gas treatment equipment |
| Patent 3348003 | Plasma processing equipment |
| Japanese Patent Application Laid-Open No. 2003-045846 | Monitoring method and control method for semiconductor manufacturing equipment |
| Patent 4274747 | Semiconductor manufacturing equipment |
Patent
