Semiconductor News 20251010

TOC

Main News

  1. TSMC Q3 2025 Sales Exceed High Estimates on the Back of AI Driven Demand for Advanced Processes TSMC’s sales for the third quarter of 2025 exceeded high prior estimates. Behind this strong performance is strong demand for advanced processes driven by **AI (Artificial Intelligence)**. This fact demonstrates that the explosive growth of AI technology is a major growth engine at the forefront of semiconductor manufacturing and that TSMC maintains its technological edge.
  2. China Tightens Rare Earth Export Controls, Linked to AI and National Security China is tightening its rare earth (REE) export controls for national security reasons. These regulations include a new ban on foreign assistance for rare-earth-related technologies. In particular, Beijing has linked rare earths to AI and national security and is tightening its technology controls, with 14nm logic and 256-layer memory chip production technology also subject to individual review. This move is warned to pose risks to the global supply chain, including the supply of HDDs and other PC components.
  3. Intel Begins Manufacturing World’s Most Advanced 18A Chips in the U.S.; Fab 52 Now Fully Operational Intel has announced that it has become the first company to manufacture the world’s most advanced chips in the United States, with Fab 52 fully operational for the cutting-edge 18A node. This “long-awaited” 18A node has achieved its lowest ever defect density, signaling its readiness for internal and external customers. Intel also plans to move to an “annual” AI product cycle after years of delay, and the 18A process will be used in the next generation of AI PC platforms, such as Panther Lake.
  4. NVIDIA Partners with Samsung to Supply HBM3E for Blackwell Ultra GB300 AI Systems NVIDIA has partnered with Samsung on the supply of HBM3E (High Bandwidth Memory) for the next generation Blackwell Ultra GB300 AI systems. This is a major win for Samsung in the AI field in Korea. NVIDIA CEO Jensen Huang has also reportedly confirmed that Samsung’s 12-layer HBM3e offering is for GB300, and specific order negotiations are currently underway.
  5. U.S. Semiconductor Investment Surges , Making Arizona the “Second Silicon Valley” U.S. semiconductor investment is surging, contributing to a doubling in the number of attendees at Semicon West. The U.S. plans to invest 96 trillion yen to make Arizona the “Second Silicon Valley” with the goal of domestic production of semiconductors. Taiwanese semiconductor companies are also establishing new bases in Arizona, with Amkor Technology beginning construction on a $7 billion advanced packaging facility. In addition, Applied Materials and Arizona State University have opened a “Materials-to-Fab” center.
  6. Intel Announces Panther Lake Architecture, the First AI PC Platform Built on 18A Intel has announced the Panther Lake architecture, the first AI PC platform built on the 18A process. This next-generation platform combines performance and efficiency to simultaneously improve CPU core responsiveness and performance. The AI performance of the embedded GPU will be more than doubled, and XeSS-MFG technology will be introduced to accelerate gaming performance.The Panther Lake “Core Ultra Series 3” CPUs will be announced at CES 2026 and will be available in Q1 2026.
  7. TSMC Advanced Packaging Vice President Says Parallel Development Key to Meeting Rapidly Growing AI Packaging Demand The vice president of TSMC’s Advanced Packaging Division noted that the rapid growth of AI chips has led to a surge in demand for packaging. To effectively meet this growing demand, he said, parallel development, in which multiple technologies and processes are advanced simultaneously, is essential. Competition in this area is intensifying with China’s move to seize control of glass substrate TGV technology and 3M’s participation in the Next Generation Chip Packaging Consortium.
  8. Applied Materials Improves AI Chip Performance with Hybrid Bonding and Electron Beam Metrology Applied Materials (AMAT) is driving AI chip performance improvements through advanced semiconductor manufacturing technologies. Specifically, AMAT is improving the performance of AI chips by advancing hybrid bonding andelectron beam metrology technologies. In addition, AMAT has announced three next-generation semiconductor manufacturing equipment models for 2nm and beyond semiconductor manufacturing processes, supporting the development of cutting-edge AI chips as a manufacturing equipment manufacturer.
  9. Microsoft Azure Announces World’s First NVIDIA GB300NVL72Supercomputing Cluster for OpenAI Microsoft Azure has announced the world’s first NVIDIA GB300 NVL72 supercomputing cluster for OpenAI. This marks the deployment of a state-of-the-art infrastructure to support AI research and development. The cluster is powered by the Blackwell Ultra GB300 AI system, a partnership between NVIDIA and Samsung for the supply of HBM3E.
  10. AMD Announces Radiance Cores, Neural Arrays, and More for Next-Generation RDNA GPU Architecture AMD announced Radiance Cores, Neural Arrays, and UniversalCompression. These elements are designed to deliver faster real-time tracing (RT), upscaling with improved image quality, and lower bandwidth requirements, and are intended to increase Nvidia’s competitiveness as a major competitor in the AI semiconductor war.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Oct 9, 12:19ガラス基板TGV:中国がAI HPCパッケージングを掌握する優位性Glass substrate TGV: China’s edge to capture AI HPC packaginghttps://www.digitimes.com/news/a20251009PD218/glass-substrate-hpc-packaging-china.html
Oct 9, 16:26TSMCの2025年第3四半期売上高は、AIによる先端プロセス需要を背景に高予測を上回るTSMC’s 3Q25 revenue surpasses high forecast as AI drives advanced process demandhttps://www.digitimes.com/news/a20251009PD237/tsmc-revenue-2025-demand-growth.html
Oct 9, 15:17米国の半導体投資が急増し、Semicon Westの移転により参加者数が倍増Semicon West relocation doubles attendance as US chip investment surgeshttps://www.digitimes.com/news/a20251009PD229/semicon-west-investment-2025-semi-manufacturing.html
Oct 9, 08:57Nvidiaのライバル企業、インドに13億米ドルを投じ、新たな研究拠点を計画との報道Nvidia rival reportedly plans US$1.3B investment and new research hub in Indiahttps://www.digitimes.com/news/a20251009VL201/graphcore-investment-nvidia-technology-acquisition.html
Oct 9, 06:57台湾の半導体戦略、アリゾナ州に新たな拠点を築くTaiwan’s semiconductor playbook finds new home in Arizonahttps://www.digitimes.com/news/a20251008PD219/arizona-taiwan-2025-semicon-west-hsp.html
Oct 9, 16:42Applied Materials、ハイブリッドボンディングと電子ビーム計測でAIチップ性能を向上Applied Materials advances AI chip performance with hybrid bonding and e-beam metrologyhttps://www.digitimes.com/news/a20251009PD232/applied-materials-gaa-e-beam-metrology-chips-performance.html
Oct 9, 15:01解説:中国のTGVへの野心は困難な道のりに直面Commentary: China’s TGV ambitions face an uphill battlehttps://www.digitimes.com/news/a20251009PD222/packaging-equipment-technology-development-materials.html
Oct 9, 14:46中国、海外支援の新たな禁止措置でレアアース輸出規制を強化China tightens rare earth export controls with new ban on overseas assistancehttps://www.digitimes.com/news/a20251009PD226/rare-earth-security-2025-materials-data.html
Oct 9, 12:52Phoenix Silicon International、新工場FAB3Bでウェーハ生産能力を拡大Phoenix Silicon International expands wafer production capacity with new FAB3B facilityhttps://www.digitimes.com/news/a20251009PD201/psi-wafer-manufacturing-production-capacity-expansion.html
Oct 9, 12:33北京、レアアースをAIと国家安全保障に結びつけ、技術規制を強化Beijing tightens tech controls, linking rare earths to AI and national securityhttps://www.digitimes.com/news/a20251009PD219/china-rare-earth-exports-policy-materials-security.html
Oct 9, 12:33米タイの駐在員規制強化を受け、台湾企業は人事配置の見直しへTaiwanese firms set to revamp HR deployment as US, Thailand tighten expat ruleshttps://www.digitimes.com/news/a20251009PD223/donald-trump-talent-salary-staff-tsmc.html
Oct 9, 12:06メモリモジュールメーカー、中国国慶節連休中に消費者向けDRAM価格提示を停止Memory module makers halt consumer DRAM price quoting during China’s National Day holidayhttps://www.digitimes.com/news/a20251009PD209/dram-memory-module-price-ddr5-china.html
Oct 9, 11:49台湾、米国のチップ関税の脅威の中、InnoTech Expo 2025を推進Taiwan pushes ahead with InnoTech Expo 2025 amid US chip tariff threathttps://www.digitimes.com/news/a20251009PD215/taiwan-2025-expo-taipei-technology.html
Oct 9, 11:47台湾が中国のインボリューションから学ぶべき教訓Lessons Taiwan should learn from China’s involutionhttps://www.digitimes.com/news/a20251009PD207/taiwan-china-price-competition-industrial.html
Oct 9, 11:16TSMC先進パッケージング部門副社長、急増するAIパッケージング需要に対応するには並行開発が鍵と語るParallel development key to meet surging AI packaging demand, says TSMC Advanced Packaging Division VPhttps://www.digitimes.com/news/a20251009PD216/tsmc-semicon-west-demand-2025-development.html
Oct 9, 11:00Nvidiaの台湾本社計画、用地問題に直面するも政府が支援を約束Nvidia’s Taiwan headquarters plan hits land hurdles, but government pledges supporthttps://www.digitimes.com/news/a20251009VL203/nvidia-taiwan-taipei-expansion-moea.html
wccftech
2025-10-10招待制にもかかわらず、OpenAIのSora動画アプリが1日平均20万ダウンロードを記録OpenAI’s Sora Video App Now Averaging 200K Downloads Per Day, Despite Invite-Only Accesshttps://wccftech.com/openais-sora-video-app-now-averaging-200k-downloads-per-day-despite-invite-only-access/
2025-10-10『Ghost of Yōtei』、累計160万本以上を販売。『対馬』よりわずかに遅いペースGhost of Yōtei Has Sold Over 1.6 Million Units to Date, Only Slightly Slower Than Tsushimahttps://wccftech.com/ghost-of-yotei-sold-over-1-6-million-units-only-slightly-slower-than-tsushima/
2025-10-10フィリップス、低予算ゲーマー向けに高速300Hz eスポーツゲーミングモニター『Evnia 25M2N3200U』を発表Philips Launches Evnia 25M2N3200U, A Fast Esports 300Hz Gaming Monitor, Built For Budget-Concious Gamershttps://wccftech.com/philips-launches-evnia-25m2n3200u-a-fast-esports-300hz-gaming-monitor/
2025-10-10EssilorLuxotticaのCEOはスマートグラスがスマートフォンに取って代わると見るが、数字にはずれがあるEssilorLuxottica CEO Sees Smart Glasses Replacing Smartphones, But There Is A Disconnect In The Numbershttps://wccftech.com/essilorluxottica-ceo-sees-smart-glasses-replacing-smartphones-but-there-is-a-disconnect-in-the-numbers/
2025-10-10サムスンのGalaxy XRのリーク情報で、4KマイクロOLEDディスプレイ、Snapdragon XR2+チップ、Google AI統合が発表前に明らかにSamsung’s Galaxy XR Leak Reveals 4K Micro-OLED Displays, Snapdragon XR2+ Chip, And Google AI Integration Ahead of Launchhttps://wccftech.com/samsung-galaxy-xr-leak-specs-design-ai/
2025-10-10Radeon RX 9070 XTが『Call Of Duty: Black Ops 7』でRTX 5070 Tiを圧倒。1440pで31%高いパフォーマンスを発揮Radeon RX 9070 XT Demolishes RTX 5070 Ti In Call Of Duty: Black Ops 7; Delivers 31% Higher Performance At 1440phttps://wccftech.com/radeon-rx-9070-xt-demolishes-rtx-5070-ti-in-call-of-duty-black-ops-7/
2025-10-10PlayStation Storeのアップデートで、全プレイヤー向けに全文ユーザーレビューが追加PlayStation Store Update Adds Full-Length User Reviews For All Playershttps://wccftech.com/playstation-store-update-adds-full-length-user-reviews/
2025-10-10『インディ・ジョーンズと大いなる円環』、10月10日配信の記念アップデートでエンディングが拡張Indiana Jones and the Great Circle Gets Extended Ending With Anniversary Update Launching On October 10https://wccftech.com/indiana-jones-and-the-great-circle-gets-extended-ending-with-anniversary-update-launching-on-october-10/
2025-10-10Heart Machineが人員削減を発表、『Hyper Light Breaker』の開発を終了Heart Machine Confirms Layoffs, Ending Development on Hyper Light Breakerhttps://wccftech.com/heart-machine-layoffs-hyper-light-breaker-development-ending/
2025-10-10サムスンの小型AIモデル、ARC-AGIパズルでGemini 2.5 Proのような大規模LLMを凌駕Samsung’s Tiny AI Model Outperforms Huge LLMs Like Gemini 2.5 Pro On ARC-AGI Puzzleshttps://wccftech.com/samsungs-tiny-ai-model-outperforms-huge-llms-like-gemini-2-5-pro-on-arc-agi-puzzles/
2025-10-09スティーブ・ジョブズとティム・クックのApple CEOとしての14年間を詳細なインフォグラフィックで比較。一方は会社の価値を13,900%も高めたSteve Jobs’ & Tim Cook’s 14-Year Tenure As Apple CEO Gets A Detailed Infographic Comparison; One Of Them Raised The Company’s Value By A Whopping 13,900%https://wccftech.com/apple-ceos-steve-jobs-and-tim-cook-14-year-careers-compared-in-infograph/
2025-10-09『Final Fantasy VII Remake Intergrade』と『Final Fantasy VII Rebirth』のPS5向けツインパックが12月に発売Final Fantasy VII Remake Intergrade, Final Fantasy VII Rebirth Physical Twin Pack Launches This December on PS5https://wccftech.com/final-fantasy-vii-remake-integrade-final-fantasy-vii-rebirth-physical-twin-pack-launches-this-december-on-ps5/
2025-10-09マーク・サーニー氏、「数年後」のPlayStation 6登場を示唆かMark Cerny Seems to Tease PlayStation 6 Arrival In “A Few Years Time”https://wccftech.com/sony-amd-mark-cerny-jack-huynh-project-amethyst-ps6-playstation-6/
2025-10-09UESP Wikiがベセスダと会談し、『The Elder Scrolls VI』のキャラクターデザインに参加。「将来の展望に非常に興奮している」と語るUESP Wiki Met with Bethesda to Design a Character for The Elder Scrolls VI and Left ‘Extremely Excited About What’s in Store’https://wccftech.com/uesp-wiki-met-bethesda-design-character-the-elder-scrolls-vi-excited/
2025-10-09MIDiA Researchが推奨:『GTA VI』は最高の販売ポテンシャルを発揮するために70ドルで販売すべきGTA VI Should Cost $70 to Achieve Maximum Sales Potential, MIDiA Research Recommendshttps://wccftech.com/gta-vi-should-cost-70-achieve-maximum-sales-potential/
2025-10-09AMDが次世代RDNA GPUアーキテクチャ向けにRadiance Cores、Neural Arrays、Universal Compressionを発表:高速RT、高画質アップスケーリング、低帯域幅要求を実現AMD Unveils Radiance Cores, Neural Arrays & Universal Compression For Next-Gen RDNA GPU Architecture: Faster RT, Better Upscaling, & Lower Bandwidth Needshttps://wccftech.com/amd-unveils-radiance-cores-neural-arrays-universal-compression-next-gen-rdna-gpu-architecture/
2025-10-09Intelの「待望の」18Aノードが過去最低の欠陥密度を達成、社内外の顧客への準備が整ったことを示唆Intel’s ‘Highly-Anticipated’ 18A Node Achieves Record-Low Defect Density, Signaling Readiness for Internal & External Customershttps://wccftech.com/intel-18a-node-achieves-record-low-defect-density/
2025-10-09『Battlefield 6』、『King of Meat』、『Little Nightmares III』などが今週GeForce NOWに登場Battlefield 6, King of Meat, Little Nightmares III and More Join GeForce NOW This Weekhttps://wccftech.com/nvidia-geforce-now-battlefield-6-little-nightmares-iii-king-of-meat/
2025-10-09Intel Xe3グラフィックスが正式発表: Xe2より50%以上高速、RTユニット強化、Panther Lake「Arc B-Series」iGPUに12Xeコア、次世代Arc向けにXe3P後継もIntel Xe3 Graphics Official: Over 50% Faster Than Xe2, Enhanced RT Units, 12 Xe Cores For Panther Lake “Arc B-Series” iGPU & Xe3P Successor For Next-Gen Archttps://wccftech.com/intel-xe3-graphics-official-50-percent-faster-than-xe2-xe3p-next-gen-arc-family/
2025-10-09Intel Panther Lake詳細:18AコンピュートタイルにCougar Cove Pコア、Darkmont EコアはRaptor Cove Pコアより高速、同電力でLunar Lakeよりマルチスレッド性能が50%以上向上Intel Panther Lake Deep-Dive: 18A Compute Tile With Cougar Cove P-Cores, Darkmont E-Cores Faster Than Raptor Cove P-Cores, Over 50% Faster Than Lunar Lake In MT At Same Powerhttps://wccftech.com/intel-panther-lake-deep-dive-18a-compute-tile-cougar-cove-p-cores-darkmont-e-cores/
2025-10-09Intel、長年の遅延を経てついに「年次」AI製品サイクルに移行。年末までに推論最適化GPUの発表を計画Intel to Finally Switch To An ‘Annual’ AI Product Cadence After Years of Delay; Inference-Optimized GPU Planned For Showcase By Year-Endhttps://wccftech.com/intel-to-finally-switch-to-an-annual-ai-product-cadence-after-years-of-delay/
2025-10-09Intel XeSS 3 MFG「Multi-Frame Gen」が最大4倍モードで発表、XMXコア搭載の全Arc GPUに対応、XeSS 2ゲームもサポート、Arc向けにさらなる性能/効率最適化Intel XeSS 3 MFG “Multi-Frame Gen” With Up To 4x Mode Unveiled, Coming To All Arc GPUs With XMX Cores, XeSS 2 Games Supported & Further Perf/Efficiency Optimizations For Archttps://wccftech.com/intel-xess-3-mfg-multi-frame-gen-up-to-4x-mode-unveiled-coming-to-all-arc-gpus/
2025-10-09Intelが米国で世界最先端チップの製造を初めて開始。Fab 52が最先端18A向けに完全稼働することを発表Intel Becomes the First to Produce the World’s Most Advanced Chips in the US; Announces Fab 52 to Be Fully Operational For Cutting-Edge 18Ahttps://wccftech.com/intel-becomes-the-first-firm-to-produce-the-world-most-advanced-chips-in-the-us/
2025-10-09初の「Intel 18A」チップを体験:Fab 52のPanther Lake & Clearwater Forest、PTL RVP & DevKitの詳細、オンサイトデモHands-On With The First “Intel 18A” Chips: Panther Lake & Clearwater Forest at Fab 52, Detailed Look at PTL RVP & DevKit, On-Site Demoshttps://wccftech.com/hands-on-intel-18a-panther-lake-clearwater-forest-live-demos-wafers-tech-tour-2025/
2025-10-09Intel Panther Lake「Core Ultra Series 3」CPUはCES 2026で発表、2026年第1四半期に発売予定Intel Panther Lake “Core Ultra Series 3” CPUs To Launch At CES 2026, Availability In Q1 2026https://wccftech.com/intel-panther-lake-core-ultra-series-3-cpus-ces-2026-launch-january-availability/
2025-10-09Intel Clearwater Forest「Xeon 6+」CPU詳細:最大288のDarkmont Eコア、576MBキャッシュ、Foveros D3D + EMIB 2.5Dを備えた18AIntel Clearwater Forest “Xeon 6+” CPUs Deep-Dive: Up To 288 Darkmont E-Cores, 576 MB Cache, 18A With Foveros D3D + EMIB 2.5Dhttps://wccftech.com/intel-clearwater-forest-xeon-6-cpus-up-to-288-darkmont-cores-576-mb-cache-18a/
2025-10-09任天堂アメリカ、著作権侵害でRedditユーザーに450万ドルの損害賠償を請求Nintendo of America Is Seeking $4.5m In Damages From Redditor Due to Copyright Violationshttps://wccftech.com/nintendo-of-america-seeking-4-5-m-damages-copyright-violations/
2025-10-09アメリカでのPC出荷台数の伸びが失速する中、アジア太平洋地域が二桁成長で販売を牽引PC Shipment Growth Loses Momentum In America While Asia-Pacific Region Drives The Sales By Double-Digit Growthhttps://wccftech.com/pc-shipment-growth-loses-momentum-in-america-while-asia-pacific-region-drives-the-sales-by-double-digit-growth/
2025-10-09NVIDIA、Blackwell Ultra GB300 AIシステム向けHBM3E供給でサムスンと提携、韓国大手にとって大きな勝利にNVIDIA Taps Samsung For HBM3E Supply In Blackwell Ultra GB300 AI Systems, Marking a Major Win For the Korean Gianthttps://wccftech.com/nvidia-taps-samsung-for-hbm3e-supply/
2025-10-09Galaxy Z TriFoldは3つのバッテリーを搭載、様々な特許画像で完全に展開した際の薄型デザインが明らかにGalaxy Z TriFold Will Sport Three Batteries, With Various Patent Images Revealing Its Slim Design When Completely Unfoldedhttps://wccftech.com/galaxy-z-trifold-patents-reveal-intricate-details/
2025-10-09AppleのiPhone Air 2は再びチタンフレームを採用、耐久性と洗練された軽量設計に注力Apple’s iPhone Air 2 To Feature Titanium Frame Again, Focusing On Durability And Refined Lightweight Buildhttps://wccftech.com/iphone-air-2-titanium-frame-durability-bending-2026/
2025-10-09Valveの次期VRヘッドセット「Deckard」が生産段階に入った可能性Deckard, the Next VR Headset by Valve, Might Have Entered Productionhttps://wccftech.com/the-next-vr-headset-valve-might-have-entered-production/
2025-10-09元ZeniMax Onlineの開発者がSackbird Studiosを設立し、オリジナルプロジェクトを開発中Ex ZeniMax Online Developers Form Sackbird Studios, Are Working on Original Projecthttps://wccftech.com/ex-zenimax-online-devs-form-sackbird-studios-working-original-project/
2025-10-09Ubisoft、昨年19世紀南北戦争後の時代を舞台にしたアサシンクリードのゲームをキャンセルしたと報じられるUbisoft Reportedly Cancelled A 19th Century Post-American Civil War Era Assassin’s Creed Game Last Yearhttps://wccftech.com/ubisoft-reportedly-cancelled-assassins-creed-19th-century-post-civil-war-game/
2025-10-09AppleのiPhone 18 Foldは、強度と重量の完璧なバランスのためにアルミニウムとチタンを組み合わせる可能性Apple’s iPhone 18 Fold Could Combine Aluminum And Titanium For The Perfect Balance Of Strength And Weighthttps://wccftech.com/iphone-18-fold-titanium-aluminum-frame-2026-launch/
日経 Tech Foresight
2025-10-10三菱電機、熊本のSiC新棟11月稼働 AIで歩留まり改善https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC095P80Z01C25A0000000
2025-10-10京大、Snペロブスカイト薄膜の新製法 大面積かつ均一https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC020MF0S5A001C2000000
2025-10-10【特許】TOTO、ウエハー温度を均一にする静電チャックhttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC0604X0W5A001C2000000
2025-10-09パワー半導体、AIサーバーでGaN飛躍 NVIDIAが提携続々https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC083MD0Y5A001C2000000
マイナビニュース テックプラス
2025-10-09浜ホト、米LLNL主導の核融合産業化に向けた半導体レーザ技術ワーキンググループに参画https://news.mynavi.jp/techplus/article/20251009-3531638/
2025-10-09ルネサス、産業分野向けに3つの誘導型位置センサICと専用の設計ツールを発表https://news.mynavi.jp/techplus/article/20251009-3531558/
2025-10-09imecが300mm GaN技術開発プログラムを指導、GFやKLAなど5社がパートナーとして参画https://news.mynavi.jp/techplus/article/20251009-3531455/
2025-10-092026年から2028年の300mm向け半導体製造装置の投資額は合計3740億ドルに、SEMI予測https://news.mynavi.jp/techplus/article/20251009-3531328/
2025-10-09800V EVアーキテクチャへの移行を推進 – 次世代オンボードチャージング向けSiChttps://news.mynavi.jp/techplus/article/20251009-3528596/
2025-10-09AMAT、2nm以降の半導体製造に向けた次世代半導体製造装置3機種を発表https://news.mynavi.jp/techplus/article/20251009-3528835/
TrendForce
2025-10-09半導体技術の機密漏洩が激化:Samsung、SK hynix、TSMCの営業秘密訴訟の最新情報Semiconductor Tech Leaks Heat Up: Latest on Samsung, SK hynix, and TSMC Trade Secret Caseshttps://www.trendforce.com/news/2025/10/09/news-semiconductor-tech-leaks-heat-up-latest-on-samsung-sk-hynix-and-tsmc-trade-secret-cases/
2025-10-09中国、レアアース規制を拡大し、14nmロジックおよび256層メモリを個別審査の対象にChina Expands Rare Earth Curbs, Subjects 14nm Logic and 256-Layer Memory to Case-by-Case Reviewhttps://www.trendforce.com/news/2025/10/09/news-china-expands-rare-earth-curbs-subjects-14nm-logic-and-256-layer-memory-chips-to-case-by-case-review/
2025-10-09ファーウェイ、韓国のR&D専門家300人以上を雇用か 中国が技術人材の獲得を強化Huawei Reportedly Hires Over 300 Korean R&D Experts as China Steps Up Tech Talent Hunthttps://www.trendforce.com/news/2025/10/09/news-huawei-reportedly-hires-over-300-korean-rd-experts-as-china-steps-up-tech-talent-hunt/
2025-10-09ジェンスン・フアン氏、サムスンのGB300向け12層HBM3eを認めたと報じられる、受注交渉が進行中Jensen Huang Reportedly Confirms Samsung’s 12-High HBM3e for GB300, Order Talks Underwayhttps://www.trendforce.com/news/2025/10/09/news-jensen-huang-reportedly-confirms-samsungs-12-high-hbm3e-for-gb300-order-talks-underway/
2025-10-09[洞察] NVIDIAがx86 RTX SoCでIntelと提携 — ArmベースのN1Xにとっての意味は?[Insights] NVIDIA Teams Up with Intel on x86 RTX SoCs — What Does This Mean for Its Arm-Based N1X?https://www.trendforce.com/news/2025/10/09/news-nvidia-teams-up-with-intel-on-x86-rtx-socs-what-does-this-mean-for-its-arm-based-n1x/
Semiconductor Digest
5 hours agoPragmatic Semiconductor、Peter Herweck氏を取締役会の議長に任命Pragmatic Semiconductor Appoints Peter Herweck as Chair to Board of Directorshttps://www.semiconductor-digest.com/pragmatic-semiconductor-appoints-peter-herweck-as-chair-to-board-of-directors/
5 hours ago新しいレポートがウェールズにおける半導体スキル強化の喫緊の必要性を強調New Report Highlights Urgent Need to Strengthen Semiconductor Skills in Waleshttps://www.semiconductor-digest.com/new-report-highlights-urgent-need-to-strengthen-semiconductor-skills-in-wales/
6 hours agoショーデイリー 2025 — 3日目Show Daily 2025 — Day Threehttps://www.semiconductor-digest.com/show-daily-2025-day-three/
6 hours agoアプライド・マテリアルズとアリゾナ州立大学、「Materials-to-Fab」センター開設を祝うApplied Materials and Arizona State University Celebrate Opening of ‘Materials-to-Fab’ Centerhttps://www.semiconductor-digest.com/applied-materials-and-arizona-state-university-celebrate-opening-of-materials-to-fab-center/
6 hours agoMalema LFC-7650シリーズ超音波流量コントローラーが2025年ベスト・オブ・ウェスト賞を受賞Malema LFC-7650 Series Ultrasonic Flow Controller Wins 2025 Best of West Awardhttps://www.semiconductor-digest.com/malema-lfc-7650-series-ultrasonic-flow-controller-wins-2025-best-of-west-award/
24 hours ago人材の未来への新たなアプローチ:全米マイクロエレクトロニクス教育ネットワークの導入A New Approach to the Future of Talent: Introducing the National Network for Microelectronics Educationhttps://www.semiconductor-digest.com/a-new-approach-to-the-future-of-talent-introducing-the-national-network-for-microelectronics-education/
日本経済新聞
2025-10-10日本株ADR9日、ほぼ全面安 トヨタやホンダの下げ目立つhttps://www.nikkei.com/article/DGXZQOFL1005G0Q5A011C2000000/
2025-10-10NYダウ、4日続落し243ドル安 利益確定売り優勢https://www.nikkei.com/article/DGXZQOFL100060Q5A011C2000000/
2025-10-10米国株、ダウ続落し243ドル安 利益確定売り ナスダックは反落https://www.nikkei.com/article/DGXZQOFL09DOF0Z01C25A0000000/
2025-10-10しぼんでも割れぬAIバブル 不吉な「今回は違う」https://www.nikkei.com/article/DGXZQOGN09DKL0Z01C25A0000000/
2025-10-10米国株、ダウ続落 相場の過熱感が重荷https://www.nikkei.com/article/DGXZQOFL09DOR0Z01C25A0000000/
2025-10-10個人の資産運用、AIより人間が優位 「ロボアドで失職した人いない」https://www.nikkei.com/article/DGXZQOGN130850T10C25A9000000/
2025-10-10ドイツ株9日 小幅続伸、連日で最高値 仏株は反落https://www.nikkei.com/article/DGXZQOFL09D080Z01C25A0000000/
2025-10-10アリゾナを「第2のシリコンバレー」に 米半導体、国産へ96兆円投資https://www.nikkei.com/article/DGXZQOGN07CYU0X01C25A0000000/
2025-10-10米中で過熱、AIロボット開発競争 ソフトバンクGが8000億円で名乗りhttps://www.nikkei.com/article/DGXZQOUC08D0V0Y5A001C2000000/
2025-10-10日立、NVIDIAのAIでエレベーター検査 効率化で作業員半減https://www.nikkei.com/article/DGXZQOUC276LO0X20C25A8000000/
ダイヤモンドオンライン
Oct 9 21:30「高市トレード」はいつ終わる?円安株高相場の継続を阻む「政治の機能不全」という大問題https://diamond.jp/articles/-/374537
Oct 9 12:0010年の成績が500%の投資信託も!?“宇宙”と“ロボット”に乗った人だけが見た資産の未来https://diamond.jp/articles/-/374340
Oct 8 20:22老舗商社の兼松が「ROEで伊藤忠超え」達成!非資源100%へ脱皮後の2大“稼ぎ頭”と、さらなる成長の種とはhttps://diamond.jp/articles/-/374414
Oct 7 21:22「日銀が大株主」の企業ランキング2025【上位10社】9位ファストリ、1位は?https://diamond.jp/articles/-/374398
Oct 7 20:50経営の神髄は「人間集団の運営」にあり――“財界四天王”櫻田武と電電公社総裁・真藤恒の熱き対談https://diamond.jp/articles/-/374352
Oct 7 20:30後発だったAMD、AI半導体戦争でいかに躍進したかhttps://diamond.jp/articles/-/374379
Oct 7 20:22「日銀が大株主」の企業ランキング2025【上位100社・完全版】含み益48兆円、10%以上保有は71社https://diamond.jp/articles/-/374397
Tom’s Hardware
2025-10-09 21:33中国が希土類輸出規制を拡大、PC部品供給にリスク – 国家安全保障のためHDDなどの材料への統制を強化China expands rare-earth export controls, creating risks for PC component supply – Beijing tightens grip on materials for HDDs and more to protect national securityhttps://www.tomshardware.com/tech-industry/china-expands-rare-earth-export-controls
2025-10-09 21:29ワシントンが目指す台湾との半導体50/50取引に、ある重要な要素が欠けているWashington’s ambition for a 50/50 semiconductor deal with Taiwan is missing a key componenthttps://www.tomshardware.com/tech-industry/semiconductors/washingtons-ambition-for-a-50-50-semiconductor-deal-with-taiwan-is-missing-a-key-component-lack-of-a-mature-homegrown-supply-chain-could-be-the-missing-link
2025-10-09 21:14Valveの次世代VRヘッドセット「Deckard」が量産段階に突入か、年間最大60万台の出荷を計画と報じられるValve’s next-gen ‘Deckard’ VR headset reportedly enters mass production, company allegedly plans to ship up to 600K units annuallyhttps://www.tomshardware.com/virtual-reality/valves-next-gen-deckard-vr-headset-reportedly-enters-mass-production-company-allegedly-plans-to-ship-up-to-600k-units-annually-upcoming-steam-frame-could-launch-before-the-end-of-the-year
2025-10-09 21:12伝説的なMicrosoft開発者が史上最も有名な製品アクティベーションキーの真相を明かす – 悪名高いWindows XPの「FCKGW」ライセンスキーは実は「壊滅的な漏洩」だったLegendary Microsoft developer reveals the true story behind the most famous product activation key of all time – infamous Windows XP ‘FCKGW’ licensing key was actually ‘a disastrous leak’https://www.tomshardware.com/software/windows/legendary-microsoft-developer-reveals-the-true-story-behind-the-most-famous-product-activation-key-of-all-time-infamous-windows-xp-fckgw-licensing-key-was-actually-a-disastrous-leak
2025-10-09 20:51イングランド銀行、IMFがAIバブルのリスクに2000年ドットコムバブルの影を警告 – ゴールドマン・サックスは「まだそこには至っていない」と慎重な見方Bank of England, IMF, warn AI bubble risk has shades of 2000 dotcom crash – Goldman Sachs cautions we’re not there ‘yet’https://www.tomshardware.com/tech-industry/bank-of-england-imf-warn-ai-bubble-risk-has-shades-of-2000-dotcom-crash-goldman-sachs-cautions-were-not-there-yet
TechPowerup
2025-10-09T19:14:41+00:00Battlefield 6 パフォーマンスベンチマークレビュー – 40以上のGPUをテストBattlefield 6 Performance Benchmark Review – 40+ GPUs Testedhttps://www.techpowerup.com/review/battlefield-6-performance-benchmark/
2025-10-09T19:03:37+00:00Microsoft Azure、OpenAI向けに世界初のNVIDIA GB300 NVL72スーパーコンピューティングクラスターを発表Microsoft Azure Unveils World’s First NVIDIA GB300 NVL72 Supercomputing Cluster for OpenAIhttps://www.techpowerup.com/341752/microsoft-azure-unveils-worlds-first-nvidia-gb300-nvl72-supercomputing-cluster-for-openai
2025-10-09T18:59:39+00:00Heroes of Might and Magic: Olden Era デモがリリース、ゲームは2026年発売に延期Heroes of Might and Magic: Olden Era Demo Released, Game Pushed back to 2026 Releasehttps://www.techpowerup.com/341751/heroes-of-might-and-magic-olden-era-demo-released-game-pushed-back-to-2026-release
2025-10-09T18:56:04+00:00ホラーファンタジーゲーム「Bye Sweet Carole」本日発売Horror-Fantasy Game Bye Sweet Carole Launches Todayhttps://www.techpowerup.com/341750/horror-fantasy-game-bye-sweet-carole-launches-today
2025-10-09T17:00:21+00:00AMDとソニーのリーダーたちがコラボレーションとゲーミング体験の未来について語るAMD and Sony Leaders Talk Collaboration and the Future of Gaming Experienceshttps://www.techpowerup.com/341746/amd-and-sony-leaders-talk-collaboration-and-the-future-of-gaming-experiences
2025-10-09T16:06:39+00:00Razer、Riot Gamesとのコラボレーションによる2XKOコレクションゲーミングギアを発表Razer Announces 2XKO Collection Gaming Gear in Collaboration with Riot Gameshttps://www.techpowerup.com/341745/razer-announces-2xko-collection-gaming-gear-in-collaboration-with-riot-games
2025-10-09T14:38:33+00:00EIZO、セキュリティおよび監視向けのDuraVision DX0231-IPデコーディングソリューションをリリースEIZO Releases DuraVision DX0231-IP Decoding Solution for Security and Surveillancehttps://www.techpowerup.com/341743/eizo-releases-duravision-dx0231-ip-decoding-solution-for-security-and-surveillance
2025-10-09T13:11:52+00:00Intel、18Aで構築された初のAI PCプラットフォーム「Panther Lake」アーキテクチャを発表Intel Unveils Panther Lake Architecture: First AI PC Platform Built on 18Ahttps://www.techpowerup.com/341742/intel-unveils-panther-lake-architecture-first-ai-pc-platform-built-on-18a
2025-10-09T13:05:38+00:00NVIDIA GeForce NOWにBattlefield 6と5つのゲームが追加NVIDIA GeForce NOW Gets Battlefield 6 and Five More Gameshttps://www.techpowerup.com/341741/nvidia-geforce-now-gets-battlefield-6-and-five-more-games
2025-10-09T12:37:06+00:00Philips、高性能eスポーツモニター「Evnia 25M2N3200U」を発表Philips Announces the Evnia 25M2N3200U A High-Performance eSports Monitorhttps://www.techpowerup.com/341740/philips-announces-the-evnia-25m2n3200u-a-high-performance-esports-monitor
2025-10-09T11:46:56+00:00AMD、Instinct MI450アクセラレーター向け2nmプロセスを正式に確認AMD Officially Confirms 2 nm Process for Instinct MI450 Acceleratorhttps://www.techpowerup.com/341738/amd-officially-confirms-2-nm-process-for-instinct-mi450-accelerator
2025-10-09T11:10:19+00:00ASUS、レトロカラーのProArt PA401、PA602 Wood Edition PCケースを発表ASUS Unveils ProArt PA401, PA602 Wood Edition PC Cases with Retro Colorshttps://www.techpowerup.com/341737/asus-unveils-proart-pa401-pa602-wood-edition-pc-cases-with-retro-colors
2025-10-09T10:50:34+00:00Amkor Technology、70億ドル規模のアリゾナ州の先進パッケージング施設の建設を開始Amkor Technology Starts Construction on $7 Billion Arizona Advanced Packaging Facilityhttps://www.techpowerup.com/341736/amkor-technology-starts-construction-on-usd-7-billion-arizona-advanced-packaging-facility
2025-10-09T09:19:39+00:00Alphacool、新しいApex Stealth Metal Auroraファンを発表Alphacool Launches New Apex Stealth Metal Aurora Fanshttps://www.techpowerup.com/341733/alphacool-launches-new-apex-stealth-metal-aurora-fans
2025-10-09T08:23:51+00:00Giga Computing、GITEX Global 2025でAI中心のサーバーソリューションを展示Giga Computing Showcases AI-Centric Server Solutions at GITEX Global 2025https://www.techpowerup.com/341732/giga-computing-showcases-ai-centric-server-solutions-at-gitex-global-2025
2025-10-09T08:16:26+00:00ASML、Marco Pieters氏を次期最高技術責任者に任命ASML Appoints Marco Pieters as Next Chief Technology Officerhttps://www.techpowerup.com/341731/asml-appoints-marco-pieters-as-next-chief-technology-officer
2025-10-09T08:10:02+00:00AMDとAWS、第5世代AMD EPYCプロセッサに基づく新しいAmazon EC2 M8aインスタンスの提供を発表AMD and AWS Announce Availability of New Amazon EC2 M8a Instances Based on 5th Gen AMD EPYC Processorshttps://www.techpowerup.com/341730/amd-and-aws-announce-availability-of-new-amazon-ec2-m8a-instances-based-on-5th-gen-amd-epyc-processors
2025-10-09T08:04:13+00:00MSI、PAX Australia 2025でゲーミングの未来を披露MSI Showcases the Future of Gaming at PAX Australia 2025https://www.techpowerup.com/341729/msi-showcases-the-future-of-gaming-at-pax-australia-2025
2025-10-09T07:37:41+00:00TRUSTA、FADU、Giga Computingが次世代エンタープライズSSDエコシステム構築のための戦略的提携を締結TRUSTA, FADU, and Giga Computing Forge Strategic Alliance to Build Next-Gen Enterprise SSD Ecosystemhttps://www.techpowerup.com/341727/trusta-fadu-and-giga-computing-forge-strategic-alliance-to-build-next-gen-enterprise-ssd-ecosystem
EETimes Taiwan
2025-10-09VTTはエッジで信頼を構築するVTT在邊緣建構信任https://www.eettaiwan.com/20251009nt31-vtt-builds-trust-on-the-edge/
2025-10-09中国、レアアースの管理を強化し、世界のサプライチェーンに影響中國收緊稀土控制 衝擊全球供應鏈https://www.eettaiwan.com/20251009nt51-china-s-rare-earth-grip-techcet-report-warns-of-global-supply-chain-shifts/
2025-10-09強悍な性能、新プロセッサーが最高のGAIスマートフォンを実現強悍冷勁 新處理器打造最佳GAI手機https://www.eettaiwan.com/20251009nt11-new-processor-creates-the-best-gai-phone/
2025-10-09AIと汎用サーバーの影響で、第2四半期のエンタープライズSSDは供給不足AI與通用伺服器驅動 第二季企業級SSD供不應求https://www.eettaiwan.com/20251009nt21-q2-enterprise-ssd-are-in-short-supply/
2025-10-08AIクラスターが万枚を突破:銅線は淘汰され、光技術がチップに進化當AI集群突破萬卡:銅線已死,光進晶片https://www.eettaiwan.com/20251008nt61-copper-are-dead-light-goes-to-chips/
2025-10-08エッジAIビジョンが監視、ストレージ、プライバシーを再構築するEdge AI視覺重塑監控儲存與隱私https://www.eettaiwan.com/20251008nt51-how-does-edge-ai-vision-meet-surveillance-storage-demands/
2025-10-08クアルコムがBMWとGoogleと手を組み、革新的な自動運転システムと代理型AI体験を実現高通攜手BMW與Google 打造創新自駕系統和代理式AI體驗https://www.eettaiwan.com/20251008nt31-build-innovative-self-driving-systems-and-agentic-ai-experiences/
2025-10-08TV用途が主要な原動力、2024年のMini LED出荷量は20%増加TV應用成主要動能 2024年Mini LED出貨量年增20%https://www.eettaiwan.com/20251008nt21-2024-mini-led-shipments/
EETimes Asia
2025-10-09Qolabのジョン・M・マルティニスが2025年ノーベル物理学賞を受賞Qolab’s John M. Martinis Receives 2025 Nobel Prize in Physicshttps://www.eetasia.com/qolabs-john-m-martinis-receives-2025-nobel-prize-in-physics/
2025-10-09Pegatron 5G、次世代5GオープンRANマクロラジオユニットにMaxLinearを採用Pegatron 5G Taps MaxLinear for Next-Gen 5G Open RAN Macro Radio Unithttps://www.eetasia.com/pegatron-5g-taps-maxlinear-for-next-gen-5g-open-ran-macro-radio-unit/
2025-10-093M、次世代チップパッケージングコンソーシアムに参加3M Joins Next-gen Chip Packaging Consortiumhttps://www.eetasia.com/3m-joins-next-gen-chip-packaging-consortium/
2025-10-09SEMI:今後3年間で世界の300mmファブ装置投資が3,740億ドルに達するとの予測SEMI: Global 300mm Fab Equipment Spending Forecast to Total $374B Over Next Three Yearshttps://www.eetasia.com/semi-global-300mm-fab-equipment-spending-forecast-to-total-374b-over-next-three-years/
2025-10-09UCIe 3.0、DSPベンダーをターゲットにUCIe 3.0 Aimed at DSP Vendorshttps://www.eetasia.com/ucie-3-0-aimed-at-dsp-vendors/
2025-10-08Muse Semiconductorの買収により、GSMEのグローバル展開が強化Muse Semiconductor Acquisition Strengthens GSME’s Global Reachhttps://www.eetasia.com/muse-semiconductor-acquisition-strengthens-gsmes-global-reach/
2025-10-08ShunYunとNewPhotonicsがフォトニックチップ製造のパートナーシップを締結ShunYun and NewPhotonics Ink Photonic Chip Manufacturing Partnershiphttps://www.eetasia.com/shunyun-and-newphotonics-ink-photonic-chip-manufacturing-partnership/
2025-10-08AIプラットフォームがPCIeの進化を牽引AI Platforms Shaping PCIe Evolutionhttps://www.eetasia.com/ai-platforms-shaping-pcie-evolution/
EETimes India
2025-10-08RFMWとPasternack、グローバルディストリビューション契約を拡大RFMW and Pasternack Expand Global Distribution Agreementhttps://www.eetindia.co.in/rfmw-and-pasternack-expand-global-distribution-agreement/
2025-10-08VeriSilicon、IoTおよび家電向けに特化したFD-SOIワイヤレスIPプラットフォームVeriSilicon FD-SOI Wireless IP Platform Targeted at IoT, Consumer Electronics Applicationshttps://www.eetindia.co.in/verisilicon-fd-soi-wireless-ip-platform-targeted-at-iot-consumer-electronics-applications/
2025-10-08先進パッケージングがインドの半導体産業における新たな戦場にAdvanced Packaging Becomes New Battleground in India’s Semiconductor Industryhttps://www.eetindia.co.in/advanced-packaging-becames-new-battleground-in-indias-semiconductor-industry/
ZDNET Korea
2025-10-10ジョインチョル議員「生産技術研究院、懲戒件数最多…試験成績書の不正発行などで、5年間に42回」조인철 의원 “생산기술연구원 징계 최다…시험성적서 부정 발급 등으로 5년간 42회”https://www.zdnet.co.kr/20251009213018%22%20title=%22
2025-10-10なぜバライゾンは一夜にしてCEOを交代したのか버라이즌은 왜 하루아침에 CEO를 바꿨나https://www.zdnet.co.kr/20251010015501%22%20title=%22
2025-10-10国政監査で通信会社のCEOが召喚…ビッグテックの幹部も相当数국정감사에 통신사 CEO 줄소환…빅테크 인사도 상당수https://www.zdnet.co.kr/20251010000824%22%20title=%22
2025-10-10フィギュアAI、3世代目ヒューマノイド『フィギュア03』を公開피규어AI, 3세대 휴머노이드 ‘피규어03’ 공개https://www.zdnet.co.kr/20251010023449%22%20title=%22
2025-10-10インテル・パンサーレイク、LP Eコアで日常作業の比率が↑인텔 팬서레이크, LP E코어로 일상 작업 전성비 ↑https://www.zdnet.co.kr/20251010000310%22%20title=%22
2025-10-09貿易センター、米SWAグループの造景で『グリーンセンター』へ変貌무역센터, 美 SWA그룹 조경으로 ‘그린센터’ 변모https://www.zdnet.co.kr/20251009235902%22%20title=%22
2025-10-09インテルの理由ある自信「エントリーモデルの外部GPUは不要」인텔의 이유 있는 자신감 “보급형 외장 GPU 필요 없다”https://www.zdnet.co.kr/20251009235236%22%20title=%22
2025-10-09パンサーレイク Xe3 GPU、ゲーム性能を加速する『XeSS-MFG』技術を投入팬서레이크 Xe3 GPU, 게임 성능 가속 ‘XeSS-MFG’ 기술 투입https://www.zdnet.co.kr/20251009233153%22%20title=%22
2025-10-09土地台帳・地籍図などの不動産書類が、10日からオンラインで発行可能に토지대장·지적도 등 부동산서류 온라인 발급 10일부터 가능해져https://www.zdnet.co.kr/20251009233602%22%20title=%22
2025-10-09日本、2030年までに半導体産業育成へ10兆円投資…素材・部品・装置の輸出機会日 2030년까지 반도체 산업 육성에 10조엔 투자…소부장 수출 기회https://www.zdnet.co.kr/20251009232158%22%20title=%22
2025-10-09インテル「パンサーレイク・Wi‑Fi7、より速く、より遠くへ行く」인텔 “팬서레이크 와이파이7, 더 빠르고 더 멀리 갈 것”https://www.zdnet.co.kr/20251009231421%22%20title=%22
2025-10-09インテル「パンサーレイク、エッジ市場を狙いIPUを強化」인텔 “팬서레이크, 엣지 시장 겨냥해 IPU 강화”https://www.zdnet.co.kr/20251009225736%22%20title=%22
2025-10-09インテル「パンサーレイク内蔵GPU、AI性能が2倍↑」인텔 “팬서레이크 내장 GPU, AI 성능 2배↑”https://www.zdnet.co.kr/20251009223946%22%20title=%22
2025-10-09『パンサーレイクCPUコア、応答性・性能が同時に向上』“팬서레이크 CPU 코어, 반응성·성능 동반 향상”https://www.zdnet.co.kr/20251009222528%22%20title=%22
2025-10-09ネクストス-ドバイDMCC、パートナーシップ締結…ブロックチェーン・ゲームエコシステムを拡大넥써쓰-두바이 DMCC, 파트너십 체결…블록체인·게임 생태계 확장https://www.zdnet.co.kr/20251009221644%22%20title=%22
2025-10-09インテル「パンサーレイク、性能と効率性を両立した次世代プラットフォーム」인텔 “팬서레이크, 성능·효율성 모두 잡은 차세대 플랫폼”https://www.zdnet.co.kr/20251009215923%22%20title=%22
2025-10-09『インテルファウンドリ、二大新技術を適用し、1.8ナノ半導体を初の商用化』“인텔 파운드리, 양대 신기술 적용 1.8나노 반도체 첫 상용화”https://www.zdnet.co.kr/20251009213955%22%20title=%22
2025-10-09インテル「AIの未来は、異種コンピューティングとオープン性にかかっている」인텔 “AI 미래, 이기종 컴퓨팅과 개방성에 달렸다”https://www.zdnet.co.kr/20251009212209%22%20title=%22
2025-10-09チェ・フェヒョン文化体育観光部長官、秋夕を迎え、主要文化施設の運営状況を点検최휘영 문체부 장관, 추석 맞아 대표 문화시설 운영 현황 점검https://www.zdnet.co.kr/20251009221315%22%20title=%22
中央日報
2025-10-10サムスン電子が笑う中、現代自動車が泣いている…対照的な第3四半期の業績見通し삼성전자 웃는데, 현대차 운다…엇갈린 3분기 실적 전망https://www.joongang.co.kr/article/25372754
2025-10-10『ソン』はすでに忙しくなっている…フィジカルAIを握るビッグテック‘손’은 이미 바빠졌다…피지컬 AI 움켜쥐는 빅테크https://www.joongang.co.kr/article/25372691
2025-10-09トランプと競争の決戦を前にした習近平…希土類と北朝鮮カードを切り出した트럼프와 경주 담판 앞둔 시진핑…희토류·북한 카드 꺼냈다https://www.joongang.co.kr/article/25372631
2025-10-09医科大学に襲いかかる『女性旋風』…5年間増加し続け、40%に迫る、その秘訣は一体何なのか의대 불어닥친 ‘여풍’…5년간 계속 늘어 40% 육박, 비결 뭐길래https://www.joongang.co.kr/article/25372597
2025-10-09中国、希土類における独裁体制をさらに強化…リサイクル技術の輸出にまで規制をかけた中, 희토류 독재 더 독하게 한다…재활용 기술 수출까지 통제https://www.joongang.co.kr/article/25372584
2025-10-09「来年のコスピ4000は余裕だ」…『金の指輪』を外して『半ズボン』に着替えよ“내년 코스피 4000 거뜬하다”…’금반지’ 빼고 ‘반바지’ 입어라https://www.joongang.co.kr/article/25372562
BAIDU
昨天15:07台湾当局の半導体産業計画、島内から激しい批判が寄せられる台当局半导体产业规划遭岛内痛批https://baijiahao.baidu.com/s?id=1845487937438242666&wfr=spider&for=pc
昨天22:42半導体板塊、午後に急落!中芯国際は下落し、華虹公司は暴落、何が起こったのか半导体板块午后跳水!中芯国际收跌,华虹公司炸板,发生了什么https://baijiahao.baidu.com/s?id=1845515838168811649&wfr=spider&for=pc
昨天22:42半導体板塊、午後に急落!中芯国際は下落し、華虹公司は暴落、何が起こったのか半导体板块午后跳水!中芯国际收跌,华虹公司炸板,发生了什么http://baijiahao.baidu.com/s?id=1845515869823677129&wfr=spider&for=pc
昨天21:17易天股份:同社の支配子会社である微组半導体は、全自動でミクロン単位の高精度技術に注力している…易天股份:公司控股子公司微组半导体专注于全自动微米级高精度微…https://baijiahao.baidu.com/s?id=1845510369810841934&wfr=spider&for=pc
昨天17:31海特高新:华芯科技の各株主は、第2世代および第3世代の化合物半導体の設計と…海特高新:华芯科技各股东将在第二代、第三代化合物半导体的设计和…https://baijiahao.baidu.com/s?id=1845496137690358002&wfr=spider&for=pc
昨天17:12オンラインとオフラインのプロモーションが双エンジンで始動、世界にアジアの半導体・集積回路産業展を知らせる…线上线下宣传双引擎启动,让世界听见亚洲半导体与集成电路产业展的…https://baijiahao.baidu.com/s?id=1845495076593186056&wfr=spider&for=pc
昨天21:37金と半導体の支援で、上海総合指数が3900点台を安定、増加資金が流入黄金和半导体助力,沪指站稳3900点,增量资金来了http://baijiahao.baidu.com/s?id=1845511662772121265&wfr=spider&for=pc
昨天19:01何事だ?半導体チップ株が午後に大幅下落!この分野は集中する好材料の催化で、14銘柄が…什么情况?半导体芯片股午后大幅回落!这一领域迎密集利好催化,14股…https://baijiahao.baidu.com/s?id=1845502061005385310&wfr=spider&for=pc
昨天20:39和讯投顾の陶亚威によると:指数が10年ぶりに3900を突破!半導体は急騰後に下落!和讯投顾陶亚威:指数时隔十年站上3900!半导体冲高回落!https://baijiahao.baidu.com/s?id=1845508227667816807&wfr=spider&for=pc
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