Semiconductor News 20250620

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1. Texas Instruments Plans to Invest More Than $60 Billion in U.S. Base Chip Manufacturing. Texas Instruments has announced plans to invest more than $60 billion over the next several decades to strengthen its semiconductor manufacturing capabilities in the United States. This is expected to contribute significantly to building the foundation of the semiconductor industry in the United States.
2. A New Phase in CPO and SiPh Competition: TSMC and Taiwan’s Supply Chain Take the Lead As competition for Co-Packaged Optics (CPO) and Silicon Photonics (SiPh) technologies intensifies, TSMC and the Taiwanese supply chain are taking the lead in this area. This will accelerate the deployment of next-generation high-speed connectivity technologies for AI and data centers.
3. Tesla to Adopt TSMC’s 3nm Technology for HW5 Chip; Mass Production Scheduled for 2026. Tesla will reportedly adopt TSMC’s 3nm process technology for its next-generation HW5 chip for self-driving, with mass production scheduled to begin in 2026. This demonstrates that high-performance AI chips are critical to the evolution of the automotive industry.
4. Nvidia CEO Warns U.S.: Sanctions Won’t Stop China’s AI Momentum. Nvidia’s CEO warned that even with U.S. sanctions, China’s AI technology development momentum cannot be stopped. This highlights the complexity of the international competitive and geopolitical situation in the AI field.
5. Huawei’s Super Nodes Compete with Nvidia’s, but Supply Chain Risks Are a Concern Huawei’s super nodes have reached a level of performance that is competitive with Nvidia’s offerings, but there are concerns about supply chain-related risks. This suggests China’s semiconductor self-sufficiency efforts and the challenges it faces.
6. Intel Shows 18A Node Performance: 25 %向上、消費電力40%Speed Reduction. Intel has showcased the performance of its next-generation “18A” node technology, demonstrating a 25 %向上し、消費電力が40%reduction in speed. This demonstrates Intel’s commitment to process technology competitiveness and to driving the development of high-performance, low-power chips.
7. Fierce competition over 2nm chip manufacturing: large disparities in production yields. Intense development competition continues over state-of-the-art 2nm chip manufacturing, and there are reports of large disparities in production yield among companies. This indicates the difficulty of miniaturization technology and the possibility that the technological superiority of each company will determine future market share.
8. Nvidia Rubin Accelerates SK Hynix’s Dominance in Competition for HBM4 Supply. Nvidia’s Rubin said that SK Hynix is further strengthening its advantage in the race to supply HBM4 (High Bandwidth Memory), which is a key determinant of AI chip performance, and its supply chain is directly linked to the development of the entire AI industry.
9. BOE enters the advanced packaging business with a pilot production line using glass substrates. BOE has entered this growing field with the launch of a pilot production line for advanced packaging using glass substrates. This demonstrates the evolution of packaging technology, which is essential for higher performance chips, and BOE’s strategy to expand its business portfolio.
10. Apple Tries to Use Generative AI to Design Chips. Apple is reportedly exploring the possibility of using generative AI (Generative AI) for its chip designs. This is expected to lead to significant productivity gains in the chip design process, suggesting that AI could change the way semiconductor development is conducted.

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