Semiconductor News 20260502

Today’s semiconductor news is a mix of unprecedented special demand brought about by global investment in AI infrastructure and the resulting supply chain frictions and industry restructuring. the explosion in AI demand has led to record exports from South Korea and record sales and profits for Samsung Electronics’ semiconductor business. TSMC has also announced its roadmap for next-generation processes and is increasing investment. At the same time, however, the challenges of rapid growth have been highlighted, including severe supply shortages, labor risks seen in strikes, and a shift in strategy surrounding the introduction of expensive next-generation lithography equipment. In Japan, Mitsubishi Electric Corporation has proposed a three-way joint venture in power semiconductors, and in China, Huawei is aiming for AI chip supremacy, among other dynamic mergers and acquisitions that are taking place on a global scale as companies struggle to survive.

TOC

Main News

  1. AI Demand Driving South Korea’s Export Growth and Supply Shortages
    Explosive demand for AI chips is driving South Korea’s exports to record highs, with April exports reaching $85.9 billion, up 48 percent from a year earlier despite geopolitical risks, with semiconductors in particular topping the $30 billion mark for the second month in a row. In particular, semiconductors surpassed the $30 billion mark for the second month in a row. On the other hand, production has not been able to keep up with the rapid growth in demand, and supply shortages are becoming more serious throughout the supply chain, making the expansion of production capacity and stable supply an urgent issue for manufacturers.
  2. Mitsubishi Electric Proposes Three-Year Power Semiconductor Joint Venture with Rohm and Toshiba
    It has been announced that Mitsubishi Electric has proposed to Rohm and Toshiba the establishment of a three-way joint venture in the power semiconductor business. The joint venture is intended to bring together Japanese companies to compete with global mega manufacturers in the power semiconductor market, which is indispensable for electric vehicles and industrial equipment. In this field, which requires huge capital investment, this is a major move in the reorganization of the industry that is attracting attention as a way to increase international competitiveness by centralizing R&D resources and production capacity.
  3. Samsung’s Semiconductor Business Posts Record Sales and Operating Profit
    In its first-quarter 2026 financial results, Samsung Electronics announced that its semiconductor business posted record sales and operating profit on the back of strong progress in the memory market.Demand for high-capacity memory for AI infrastructure and next-generation wide-bandwidth memory The sharp increase in demand for high-capacity memory for AI infrastructure and next-generation broadband memory is driving the business performance strongly. The company has completely emerged from a prolonged period of market stagnation and once again demonstrated its overwhelming profitability and market presence as a top manufacturer.
  4. TSMC Unveils Roadmap for A14 Process and Expands Investment Plan
    TSMC, the world’s largest foundry, has unveiled a new roadmap for A14 technology, its next-generation scaling process, and advanced packaging technology. At the same time, the company announced plans to further expand its capital investment plans to meet the onslaught of rivals and the explosive growth in demand for AI chips. The company intends to push forward with the development of cutting-edge technologies that push the physical limits and the expansion of its overwhelming production capacity in parallel in order to consolidate its market dominance over the medium to long term.
  5. Huawei May Cap ture Top Spot in China’s AI Chip Market
    Huawei may capture the top spot in China’s AI chip market by the end of 2026, as strict U.S. technology regulations continue. Huawei is rapidly expanding its share of the market for its own homegrown hardware while shipments of Nvidia’s latest AI chip, the H200, to China have stalled due to regulatory hurdles. The AI ecosystem in China is becoming increasingly self-sustaining, and a tectonic shift is taking place on the front lines of the race for technological supremacy between the U.S. and China.
  6. Bosch Develops 3rd Generation SiC Device and Ships to Automakers
    It has been reported that Bosch of Germany, a major automotive parts manufacturer, has developed a 3rd generation silicon carbide device, a next-generation power semiconductor, and has begun shipping samples to automakers. It is expected to be a high-performance power conversion solution that will directly lead to extended cruising range and shorter charging times for electric vehicles. Improving the efficiency of power semiconductors is a core technology for realizing a decarbonized society, and the battle for supremacy in the automotive chip market is becoming even more active.
  7. Samsung accelerates silicon photonics with order for optical modules
    Samsung Electronics’ foundry division has reportedly won an order for optical modules, which are essential for next-generation communications technology. This has prompted the company to further accelerate its promotion of silicon photonics, which fuses electrical and optical signals, and CPO technology, which is packaged together with chipsets, as the race for next-generation packaging technology to increase data transfer speeds and reduce power consumption in AI data centers is in full swing. The race for next-generation implementation technologies to increase data transfer rates and reduce power consumption in AI data centers is in full swing.
  8. TSMC’s Postponement of Introduction of High-NA EUV and ASML’s Shift in Strategy
    Behind TSMC’s immediate postponement of the introduction of its next-generation extreme ultraviolet lithography equipment, high-NA EUV, it is clear that demand for existing low NA equipment is still strong. In response to a changing customer base that is not willing to pay higher production costs, equipment manufacturer ASML is also quietly shifting its strategy. In the race to miniaturize cutting-edge processes, the industry is facing a major challenge: how to strike a balance between huge capital investment and cost efficiency.
  9. SoftBank to Establish New AI Company and Build Data Center in the U.S.
    The SoftBank Group has announced plans to establish a new company specializing in robotics and artificial intelligence in the U.S. and build a massive data center, with the aim of meeting the rapidly increasing demand for vast computing resources and data The company aims to meet the rapidly increasing demand for vast computing resources and data processing capacity as AI evolves and becomes more prevalent. The strategy is to increase its presence in the global AI market by promoting an integrated approach from the construction of hardware infrastructure to software development.
  10. Labor Risks Highlighted by Samsung Strike Threat
    The growing threat of a strike by labor unions at Samsung Electronics and other companies in South Korea is highlighting labor risks to the entire AI chip supply chain. With supply shortages of high-capacity memory and other products becoming more severe, a shutdown of operations at core manufacturing facilities could have an enormous impact on the construction of the global AI infrastructure. Against a backdrop of rapid growth and expanding profits, the entire industry is now questioning the state of corporate pay models and labor relations.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
May 1, 16:59TeraFabは、チップが一枚も製造される前から半導体業界を変革しているTeraFab is already changing the semiconductor landscape — before a single chip is madehttps://www.digitimes.com/news/a20260429VL224/tesla-manufacturing-ai-chip-intel-tsmc.html
May 1, 15:53AIチップブームにより、韓国の輸出は過去最高に達し、供給不足が深刻化AI chip boom sends Korea exports to record highs, supply crunch deepenshttps://www.digitimes.com/news/a20260501VL208/exports-demand-shipments-infrastructure-chips.html
May 1, 11:45AdvantestはAIチップ検査で好業績を上げたが、慎重な見通しが株価に影を落としているAdvantest beats on AI chip testing, cautious outlook dents shareshttps://www.digitimes.com/news/a20260501VL206/advantest-earnings-outlook-revenue-testing.html
May 1, 11:02三菱電機がロームと東芝との3社によるパワーチップJVを提案Mitsubishi Electric proposes three-way power chip JV with Rohm, Toshibahttps://www.digitimes.com/news/a20260429VL221/mitsubishi-electric-rohm-toshiba-president-2026.html
May 1, 11:02サムスン電子部品が供給逼迫を受け、MLCCの価格を5~10%引き上げする可能性を検討中Samsung Electro-Mechanics weighs MLCC price hike of 5–10% as supply tightenshttps://www.digitimes.com/news/a20260429VL222/semco-price-mlcc-demand-murata.html
May 1, 11:00マクロンミクスはeMMC供給ギャップの中、2026年第1四半期からの安定した成長を見込むMacronix eyes steady growth from 1Q26 amid eMMC supply gaphttps://www.digitimes.com/news/a20260428PD225/emmc-growth-nand-macronix-international-2026.html
May 1, 11:00サムスンのストライキの脅威は、AIチップのサプライチェーンおよび企業の給与モデルへの労働リスクの高まりを示しているSamsung strike threat highlights rising labor risk to AI chip supply chain and corporate pay modelshttps://www.digitimes.com/news/a20260428VL206/samsung-labor-strike-ai-chip-2026.html
May 1, 10:30KLA 2026年第3四半期:AIチップ需要がプロセス制御を牽引するも、業績予想は期待に届かずKLA 3Q26: AI chip demand drives process control, guidance fails to clear barhttps://www.digitimes.com/news/a20260501VL204/demand-process-control-kla-guidance-revenue.html
May 1, 09:05SanDisk 2026年第3四半期:AI需要がNANDを押し上げ、長期契約が利益モデルを再構築SanDisk 3Q26: AI demand lifts NAND, long-term deals reshape profit modelhttps://www.digitimes.com/news/a20260501VL203/sandisk-nand-demand-data-center-growth.html
日経 Tech Foresight
マイナビニュース テックプラス
2026-05-01ボッシュが第3世代SiCを開発、自動車メーカー各社へのサンプル出荷を開始https://news.mynavi.jp/techplus/article/20260501-4409342/
2026-05-012025年の世界ファウンドリ生産能力は1023万枚/月、年間売上高は1810億ドル Yole調べhttps://news.mynavi.jp/techplus/article/20260501-4409221/
2026-05-01エレファンテック、先端パッケージ向けガラスビア用銅ナノペーストを開発https://news.mynavi.jp/techplus/article/20260501-4408853/
2026-05-01ST、エッジAI時代のウェアラブル/AR/VR向け低消費電力CMOSイメージセンサを発表https://news.mynavi.jp/techplus/article/20260501-4408130/
2026-05-01吉川明日論の半導体放談 第370回 AppleのCEO交代 – 私が会った半導体業界のCEOたちhttps://news.mynavi.jp/techplus/article/semicon-370/
2026-05-01サムスンの2026年第1四半期決算、メモリ躍進で半導体事業の売上高・営業利益がともに過去最高を更新https://news.mynavi.jp/techplus/article/20260501-4405426/
TrendForce
2026-05-01Samsungファウンドリ、光モジュールの発注を受注と報じられ、シリコンフォトニクスとCPO推進を加速Samsung Foundry Reportedly Wins Optical Module Order, Steps Up Silicon Photonics and CPO Drivehttps://www.trendforce.com/news/2026/05/01/news-samsung-foundry-reportedly-wins-optical-module-order-steps-up-silicon-photonics-and-cpo-drive/
2026-05-01TSMCの高NA EUV延期の背後:低NAは堅調、顧客層が変動し、ASMLが静かに方針転換Behind TSMC’s High-NA EUV Deferral: Low-NA Stays Strong, Customer Landscape Shifts, and ASML Quietly Pivotshttps://www.trendforce.com/news/2026/05/01/news-behind-tsmcs-high-na-euv-deferral-low-na-stays-strong-customer-landscape-shifts-and-asml-quietly-pivots/
Semiconductor Digest
5 hours agoGOWIN SemiconductorがJLCPCBと協力GOWIN Semiconductor Collaborates with JLCPCBhttps://www.semiconductor-digest.com/gowin-semiconductor-collaborates-with-jlcpcb/
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6 hours agoNordson Test & InspectionがQuiptech Mexicoとのパートナーシップを発表Nordson Test & Inspection Announces Partnership with Quiptech Mexicohttps://www.semiconductor-digest.com/nordson-test-inspection-announces-partnership-with-quiptech-mexico/
6 hours agoULVACは日本にて希土類磁石用真空溶解炉の生産体制を確立ULVAC Establishes Japan-Based Production for Rare-Earth Magnet Vacuum Melting Furnaceshttps://www.semiconductor-digest.com/ulvac-establishes-japan-based-production-for-rare-earth-magnet-vacuum-melting-furnaces/
日本経済新聞
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2026-05-02「地経学」入門書相次ぎ刊行 企業の実務に生きる国際戦略https://www.nikkei.com/article/DGXZQOUD176ZJ0X10C26A4000000/
ダイヤモンドオンライン
May 1 19:25NTT、精工技研、古河電気工業…エヌビディアも推進する「光電融合CPO」がICTインフラの省電力化・高性能化のゲームチェンジャーに?主役候補6社も紹介!https://diamond.jp/articles/-/389387
May 1 09:00島津製作所の30代後半、主任級の年収は?【5000件の口コミ情報データ】https://diamond.jp/articles/-/389419
Apr 30 20:00ASMLのEUV露光装置、「レゴ」版は実物より入手困難https://diamond.jp/articles/-/389397
Apr 30 19:57大成建設トップが明かす「物価高での生存戦略」とは?1600億円で買収した東洋建設とのシナジーと次なるM&Aの標的を披露https://diamond.jp/articles/-/389363
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Apr 29 21:15新型AI「ミトス」は高市成長戦略にも影落とす!?新技術開発で政府がやるべきこととすべきでないことhttps://diamond.jp/articles/-/389273
Apr 29 20:10AI巨額投資の代償、テック大手が相次ぎ人員削減https://diamond.jp/articles/-/389270
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Apr 29 19:35フジクラ、三井金属、住友電気工業…データセンター関連で脚光「非鉄金属セクター」の勢いは続くのか?外部要因&内部要因の“両取り”が期待できる企業とはhttps://diamond.jp/articles/-/389284
Apr 29 19:25イラン「停戦後の世界」織り込み始めた日本株、トランプ関税“ショック後”に類似の株価形成で注目業種は?https://diamond.jp/articles/-/389193
Tom’s Hardware
2026-05-01 23:23ソフトバンク、米国でロボティクスとAI企業を設立し、データセンター建設を計画SoftBank plans robotics and AI firm in the US to build data centershttps://www.tomshardware.com/tech-industry/softbank-plans-robotics-and-ai-firm-in-the-us-to-build-data-centers-aims-for-usd100-billion-valuation-and-an-ipo-this-year
2026-05-01 22:44RAMプライスインデックス2026:全容量のDDR5およびDDR4メモリの当日の最安値RAM Price Index 2026: Daily lowest price on DDR5 and DDR4 memory of all capacitieshttps://www.tomshardware.com/pc-components/ram/ram-price-index-2026-lowest-price-on-ddr5-and-ddr4-memory-of-all-capacities
2026-05-01 22:40GPU価格追跡2026:Nvidia、AMD、Intel製全グラフィックスカードの本日の最安値GPU price tracking 2026: Lowest price on every graphics card from Nvidia, AMD, and Intel todayhttps://www.tomshardware.com/pc-components/gpus/lowest-gpu-prices-tracking
2026-05-01 22:01Huawei、2026年に中国のAIチップ市場で頂点を奪取か―NvidiaのH200出荷は規制上の停滞に悩むHuawei could seize China’s AI chip crown in 2026 as Nvidia’s H200 shipments stall in regulatory limbohttps://www.tomshardware.com/tech-industry/artificial-intelligence/huawei-could-seize-chinas-ai-chip-crown-in-2026-as-nvidias-h200-shipments-stall-in-regulatory-limbo-beijing-pushes-homegrown-ai-hardware-dominance-in-a-market-projected-to-hit-usd67-billion-by-2030
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2026-05-01 20:20Wingtech、13億ドルの損失を計上し、Nexperia監査崩壊を受け上海上場廃止の危機に直面Wingtech posts $1.3 billion loss and faces Shanghai delisting as Nexperia audit collapseshttps://www.tomshardware.com/tech-industry/wingtech-posts-1-3-billion-loss-and-faces-shanghai-delisting-as-nexperia-audit-collapses
TechPowerup
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2026-05-01T17:15:05+00:00Arch Linuxの5月ISO、Linux 7.0サポートと改良インストーラーを初披露Arch Linux May ISO Debuts Linux 7.0 Support and Improved Installerhttps://www.techpowerup.com/348714/arch-linux-may-iso-debuts-linux-7-0-support-and-improved-installer
2026-05-01T15:28:59+00:00AMD Ryzen AI Halo Mini-PC、6月に登場AMD Ryzen AI Halo Mini-PC to Arrive in Junehttps://www.techpowerup.com/348713/amd-ryzen-ai-halo-mini-pc-to-arrive-in-june
EETimes Taiwan
2026-04-30隠れたチャンピオンの再進化:音律電子、映像・音響設計サービスの深化と磁性部品・電源技術の戦略的展開隱形冠軍再進化:音律電子深化影音設計服務與磁性元件及電源技術布局https://www.eettaiwan.com/20260430nt41-elytone-advances-audio-video-design-service-and-supply-chain-resilience/
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2026-04-30Nortonアンプ:アナログ設計の精密さとパワーを再評価するNorton放大器:重溫類比設計的精準與動力https://www.eettaiwan.com/n20260430ta51-norton-amplifiers-precision-and-power-the-analog-way-we-remember/
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EETimes Asia
2026-05-01半導体性能を左右する貴金属の戦略的役割The Strategic Role of Precious Metals in Defining Semiconductor Performancehttps://www.eetasia.com/the-strategic-role-of-precious-metals-in-defining-semiconductor-performance/
2026-04-30NEO Semiconductor、3D X-DRAMのPoCを成功裏に実演NEO Semiconductor Successfully Demos 3D X-DRAM PoChttps://www.eetasia.com/neo-semiconductor-successfully-demos-3d-x-dram-poc/
2026-04-30Polyn、自動車用チップのテープアウトに成功Polyn Achieves Successful Tapeout of Automotive Chiphttps://www.eetasia.com/polyn-achieves-successful-tapeout-of-automotive-chip/
2026-04-302026年第1四半期、世界のシリコンウェーハ出荷台数が前年比13%増加Global Silicon Wafer Shipments Jump 13% YoY in Q1 2026https://www.eetasia.com/global-silicon-wafer-shipments-jump-13-yoy-in-q1-2026/
2026-04-30ASPEED、OCP EMEAサミットでUSB経由のOBMF-ICPソリューションを展示ASPEED to Exhibit OBMF-ICP Over USB Solution at OCP EMEA Summithttps://www.eetasia.com/aspeed-to-exhibit-obmf-icp-over-usb-solution-at-ocp-emea-summit/
2026-04-30TSMC、ライバルの技術追随を受け、AIチップ需要急増に対応すべく投資計画を拡大TSMC Ramping Up Spending Plans to Meet AI Chip Demand Surge as Rivals Narrow Technology Gaphttps://www.eetasia.com/tsmc-ramping-up-spending-plans-to-meet-ai-chip-demand-surge-as-rivals-narrow-technology-gap/
EETimes India
2026-04-30NEO Semiconductor、3D X-DRAMの概念実証(PoC)を成功裏に実施NEO Semiconductor Successfully Demos 3D X-DRAM PoChttps://www.eetindia.co.in/neo-semiconductor-successfully-demos-3d-x-dram-poc/
2026-04-30ROHM、ウェアラブル向けのコンパクトなワイヤレスパワーチップセットを発売ROHM Launches Compact Wireless Power Chipset for Wearableshttps://www.eetindia.co.in/rohm-launches-compact-wireless-power-chipset-for-wearables/
ZDNET Korea
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2026-05-02LPG価格、3か月連続上昇…中東発の費用負担で5月も値上げLPG 가격 3개월 연속 상승…중동발 비용 부담에 5월도 인상https://www.zdnet.co.kr/20260501101435%22%20title=%22
2026-05-02チップなしで脳信号を読み取る…『非侵襲』神経技術が注目される“칩 없이 뇌 신호 읽는다…’비침습’ 신경기술 뜬다”https://www.zdnet.co.kr/20260502065705%22%20title=%22
2026-05-02赤い惑星へ行く近道を見つけた [우주로 간다]붉은 행성으로 가는 지름길 찾았다 [우주로 간다]https://www.zdnet.co.kr/20260501191606%22%20title=%22
2026-05-01CMTX、ラムリサーチの特許非侵害と判断された…顧客はサムスン電子CMTX, 램리서치 특허 비침해 판단받았다…고객은 삼성전자https://www.zdnet.co.kr/20260501233056%22%20title=%22
2026-05-01[人事] 気候エネルギー環境省[인사] 기후에너지환경부https://www.zdnet.co.kr/20260501224329%22%20title=%22
2026-05-01場所の推薦・予約を一度に…ネイバー、AIタブを試してみた장소 추천·예약까지 한 번에…네이버, AI탭 써보니https://www.zdnet.co.kr/20260501144400%22%20title=%22
2026-05-01「気軽に楽しむ」…国内ミニゲーム市場の大衆化の進展“가볍게 즐긴다”…국내 미니게임 시장 대중화 속도https://www.zdnet.co.kr/20260501135556%22%20title=%22
2026-05-01『自然産なのに1万円台』…ロッテマート、大物ヒラメ刺身を割引販売“자연산인데 1만원대”…롯데마트, 대물 광어회 할인 판매https://www.zdnet.co.kr/20260501162427%22%20title=%22
2026-05-01飛行機欠航でAIが先に連絡…旅行業界に広がる『高関与AI』の流れ비행기 결항하니 AI가 먼저 연락…여행업에 부는 ‘고관여 AI’ 바람https://www.zdnet.co.kr/20260501101649%22%20title=%22
2026-05-01ドボンコリア、『ウンピョンノマウル』バザーの収益金を全額寄付더본코리아, ‘은평의마을’ 바자회 수익금 전액 기부https://www.zdnet.co.kr/20260501161753%22%20title=%22
2026-05-0111番街、eクーポン特価販売…「メガコーヒー最大30%割引」11번가, e쿠폰 특가 판매…”메가커피 최대 30% 할인”https://www.zdnet.co.kr/20260501161414%22%20title=%22
2026-05-01ヤノルジャ、グローバルAI技術交流イベント『クロードコードミートアップ』が成功裏に終了야놀자, 글로벌 AI 기술 교류 행사 ‘클로드 코드 밋업’ 성료https://www.zdnet.co.kr/20260501160748%22%20title=%22
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2026-05-01公営ホームショッピング、『採用型若者インターン』を募集공영홈쇼핑, ‘채용형 청년 인턴’ 뽑는다https://www.zdnet.co.kr/20260501154703%22%20title=%22
2026-05-01韓国情報処理学会、2026年第2回理事会を開催한국정보처리학회, 2026년 2차 이사회 개최https://www.zdnet.co.kr/20260501153443%22%20title=%22
2026-05-01SKT Tファクトリー ソンス、休息・体験スペースに改装SKT T팩토리 성수, 휴식·체험 공간으로 새단장https://www.zdnet.co.kr/20260501151834%22%20title=%22
2026-05-01EBS、新卒・中途公開採用…13日まで応募受付EBS, 신입·경력 공개채용…13일까지 접수https://www.zdnet.co.kr/20260501151216%22%20title=%22
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中央日報
2026-05-02サンバは既に1500億円の損失…5日間のストライキでは6400億円が失われる삼바 이미 1500억 손실…5일간 파업 땐 6400억 날아간다https://www.joongang.co.kr/article/25425237
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2026-05-02サムスン電子労働組合「大統領警告、LGユープラスの話」…LGユープラス労働組合「卑怯な対応、謝罪しろ」삼전노조 “대통령 경고, LG유플 얘기”…LG유플노조 “비겁한 처사, 사과하라”https://www.joongang.co.kr/article/25425211
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