Semiconductor News 20260423

Today’s semiconductor news is a mix of intense inflationary pressures brought on by AI demand and dynamic investment competition among Japan, the U.S., South Korea, and other countries for next-generation technology hegemony. The enormous special demand is driving companies to start construction of a new packaging plant. On the other hand, physical and technological constraints on the supply side are also becoming apparent, such as NAND supply concerns due to the earthquake in Japan and reduced output due to Samsung’s transition to next-generation NAND. Against this backdrop, new moves to build new ecosystems are accelerating, such as Fujitsu and Rapidus’ collaboration on chips for Sovereign AI, and Applied and Advantest’s collaboration.

Main News

1. Japan Earthquake Increases Conc erns Over Chioxia Supply, Suspends NAND Pricing
   The earthquake in Japan has increased concerns over the supply of Chioxia’s NAND flash memory. In response, SanDisk and Phison have taken steps to temporarily suspend NAND pricing. The risk of physical supply chain disruptions due to natural disasters has once again become apparent, adding further uncertainty to the already tight supply and pricing trends in the memory market.
2. Fujitsu’s Next CPU Aimed at Sovereign AI, to be Developed Globally, in Cooperation with Rapidus
   Fujitsu has announced a strategy to develop its next-generation CPU globally in order to capture the demand for “Sovereign AI,” which focuses on national and regional security. In manufacturing these next-generation chips, the company intends to build a cooperative system with Rapidus, a domestic next-generation semiconductor manufacturer, as an ally. By completing the entire process of designing and manufacturing advanced semiconductors domestically, we aim to strengthen Japan’s economic security and improve its competitiveness in the global market.
3. SK Hynix Begins Mass Production of 192GB SOCAMM2 for NVIDIA
   SK Hynix of Korea has begun mass production of 192GB SOCAMM2, a next-generation memory standard that will dramatically increase the performance of AI infrastructure, ahead of the industry. This high-capacity memory module will be offered for NVIDIA’s next-generation architecture, the Vera Rubin platform, which is rapidly developing and enhancing its supply of cutting-edge memory to meet the enormous data processing requirements of increasingly sophisticated AI.
4. SK Hynix Begins Construction of Advanced Packaging Plant for AI Memory in Cheongju, Korea
   SK Hynix has begun construction of a new advanced packaging plant for AI memory, P&T7, in Cheongju, Korea, with the aim of significantly expanding production capacity for high value-added products such as broadband memory, which is essential for AI semiconductors. The plant aims to significantly expand production capacity for high value-added products such as broadband memory, which is essential for AI semiconductors. We also plan to expand mass production of wafer-level packaging toward 2028, solidifying our technological advantage in the market through massive investment in back-end process technology.
5. Samsung’s Xi’an NAND Plant Output Declines as Shift to 200+ Layers
   The production output of NAND flash memory at Samsung Electronics Korea’s Xi’an plant in China is reportedly declining by 5 to 6 percent as the company shifts to a next-generation 3D NAND manufacturing process with 200+ layers. Adjustments to manufacturing lines due to the introduction of advanced stacking technology are having an impact, and the supply chain impact of this lower output could extend into next year. As demand for high-capacity storage increases, there is concern about temporary supply constraints brought about by more sophisticated manufacturing processes.
6. Intel and SAIMEMORY Selected for NEDO Project to Develop Next-Generation Memory “ZAM ”
   Intel and Japan’s SAIMEMORY have been selected for a New Energy and Industrial Technology Development Organization (NEDO) project in the joint development of ZAM, a next-generation memory technology for the AI era. The project aims to commercialize a new technology that breaks through the limitations of conventional memory structures to enable ultra-large capacity and high-speed data access, and is expected to fundamentally improve the performance of AI infrastructure through collaboration between Japanese and U.S. companies.
7. Applied Materials Selects Advantest as EPIC Platform Partner
   Applied Materials, the world’s largest provider of semiconductor manufacturing equipment, has announced Japanese inspection equipment Advantest, a leading Japanese inspection equipment manufacturer, as a strategic partner for the EPIC Platform, the company’s Silicon Valley innovation hub. By closely integrating front-end manufacturing processes and back-end test technologies, the two companies will work together to shorten the development time of next-generation semiconductors, improve yields, and solve technical challenges in the implementation of complex AI chips.
8. Server CPU Prices Rise up to 20 Percent; Intel Considers Further Price Hikes
   Server CPU prices have risen up to 20 percent since March amid surging demand for data centers and AI infrastructure. In addition, it has emerged that Intel may raise prices another 8 to 10 percent in the second half of 2026, as the AI boom continues to tighten the supply of high-performance chips, putting intense upward cost pressure on cloud providers and electronics companies.
9. ROHM Develops Fifth-Generation SiC MOSFET with 30 Percent Lower On-Resistance
   ROHM, a leading Japanese power semiconductor company, has developed a fifth-generation SiC MOSFET that offers highly efficient power conversion for electric vehicles and industrial equipment. By adopting the latest device structure, ROHM has succeeded in reducing on-resistance during high temperature operation by 30 percent compared to previous products. This will further advance power saving and miniaturization of equipment and greatly improve the competitiveness of Japanese companies in the power semiconductor market, which is expected to grow.
10. Fellowtech to Establish New Company in China for Recycled Wafer Business, Investing 46.6 Billion Yen
    Fellowtech, a manufacturer of components for semiconductor manufacturing equipment, has announced the establishment of a new company in China to develop a recycled wafer business used for testing semiconductors, and a large-scale investment totaling 46.6 billion yen. Fellotec is a leading manufacturer of semiconductor wafers in China. The company aims to capture robust demand from China’s rapidly expanding semiconductor manufacturing base, and despite the country’s ongoing geopolitical divisions, is strongly pursuing the establishment of a local supply chain and business expansion in the huge market.

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