Semiconductor News 20260421

In today’s semiconductor news, we report on the dramatic reorganization of the supply chain and the race to develop next-generation technologies simultaneously on a global scale, driven by rapidly growing demand for AI. The explosive growth in demand for memory for AI has caused a reversal in ASML’s first quarter results, with memory revenue outpacing logic revenue. In addition, Qualcomm is considering adopting Samsung’s 2nm technology, and DRAM makers in China are merging. Meanwhile, the impact of the massive earthquake in Japan on supply chains such as Cioxia is being closely watched, and moves to diversify risk and strengthen the ecosystem are becoming more prominent, such as the start of construction of a 3D packaging plant in India and cooperative creation by 12 Japanese and US companies.

Main News

1. ASML Q1 Results Show Memory Revenue Surpasses Logic on AI Demand
   In its Q1 2026 results, Dutch semiconductor equipment giant ASML announced that its revenue for memory has surpassed that of its logic division. The reversal is driven by a surge in demand for high-bandwidth memory, driven by the rapid expansion of artificial intelligence infrastructures. the ai boom is significantly changing the demand structure of the manufacturing equipment market, and memory manufacturers are strongly driving capex spending.
2. Samsung to Expand NAND Business at P5 Plant as AI Demand Boosts Prices
   Samsung Electronics Co. of Korea is reportedly planning to expand the production capacity of its NAND flash memory business at its P5 plant in Pyeongtaek against the backdrop of rising prices associated with growing demand for AI. With the memory market booming due to a sharp increase in demand for high-capacity storage required for AI data centers, etc., the company is aiming to expand its market share and maximize earnings through aggressive capital investment, further solidifying its supply structure for next-generation memory.
3. Qualcomm CEO Visits South Korea, Considering Samsung’s 2nm Technology and Partnership with SK Hynix
   The CEO of Qualcomm Inc. visited South Korea and is considering using Samsung Electronics’ cutting-edge 2nm process technology in the manufacture of its next-generation Snapdragon 8 Elite 2 processor for mobile The visit revealed that the company is considering using Samsung Electronics’ cutting-edge 2nm process technology in the manufacture of its next-generation mobile processor, the Snapdragon 8 Elite 2. He also reportedly met with SK Hynix executives regarding the procurement of memory chips, as the company is rapidly strengthening strategic ties with key suppliers to meet the demand for advanced performance in AI smartphones and other products.
4. Fujitsu to Develop Sovereign AI Globally with its Next CPU, Looking to Collaborate with Rapidus
   Fujitsu is accelerating its strategy for the global development of its next CPU in order to capture the demand for Sovereign AI, which focuses on national and regional security. It has been reported that the company is poised to build a cooperative relationship with Rapidus, a Japanese next-generation semiconductor manufacturer, as an ally in the manufacture of these next-generation processors. By combining Japanese technological capabilities to design and manufacture high-performance proprietary chips in Japan, we aim to expand our presence in the global AI infrastructure market and strengthen our economic security.
5. China’ s GigaDevice Partners with CXMT to Enter DRAM Market, Accelerate Integration
   GigaDevice, a Chinese flash memory manufacturer, is making a full-scale entry into the new DRAM market through a strategic alliance with CXMT, the country’s leading DRAM company. This move accelerates the integration and independence of the semiconductor ecosystem in China, and amid increasing pressure from U.S. export controls and other factors, Chinese companies are further strengthening their efforts to forge strong alliances with each other and increase their own supply chain competitiveness in the memory market.
6. Samsung Expands MRAM Technology to 8nm, to Directly Compete with TSMC in 2027 with 5nm
   It has been reported that Samsung Electronics is expanding its next-generation nonvolatile memory, MRAM (magnetoresistive memory) technology by scaling it down to an 8nm process. Furthermore, Samsung Electronics is poised to directly compete with TSMC, the world’s largest foundry, by introducing MRAM using cutting-edge 5nm technology in 2027. In the next-generation memory field, where demand is growing for automotive semiconductors and IoT devices, the fierce battle for supremacy among top manufacturers over miniaturization technology has entered a new phase.
7. Magnitude 7.7 Japan Earthquake Draws Attention to Impact on Supply Chain, Including Kioxia and TEL
   A massive magnitude 7.7 earthquake hit Japan, drawing attention to the possible impact on major semiconductor-related company locations in Japan, including Kioxia, Tokyo Electron, and even photoresist manufacturers. There is a growing focus on the possibility that major semiconductor-related companies in Japan, including Kioxia, Tokyo Electron, and even photoresist manufacturers, may have been affected. Currently, the impact on the global semiconductor supply chain is mixed, and there is an urgent need to confirm the extent of damage at each company and to restore production lines. The risk of physical supply chain disruptions caused by natural disasters has once again been highlighted.
8. 12 Japanese and U.S. Companies, Including Resonac, Collaborate to Develop Next-generation Semiconductor Packaging; “US-JOINT ” Now in Full-Scale Operation
   Resonac and 12 other U.S. and Japanese semiconductor materials and equipment manufacturers have joined forces to jointly promote the development of next-generation semiconductor packaging technology. The consortium aims to strengthen competitiveness in the global advanced packaging market by establishing a powerful open innovation ecosystem that transcends company boundaries to promote technological innovation in back-end processes, which is becoming increasingly important in areas such as AI semiconductors.
9. Micron Enters 3GB GDDR7 Memory Race; Production Advances but Speed Challenges
   Micron Technology, Inc. has entered the race to develop 3GB of GDDR7, the next generation of memory for graphics, in earnest. The market for high-bandwidth memory, which is required for AI and advanced gaming applications, has been the subject of intense competition over technology development and timing of market launches. The competition in the market for high-bandwidth memory, which is required for AI and advanced gaming applications, is fierce.
10. Intel-Backed Company Begins Construction of India’s First 3D Packaging Plant to Produce Glass Substrates
    A startup company backed by Intel Corporation of America has announced that it has held a groundbreaking ceremony for the construction of its first advanced 3D packaging plant in India. The new plant is targeted to produce approximately 70,000 glass substrates per year, which are expected to be used as next-generation semiconductor packaging materials. As the global supply chain becomes increasingly decentralized, India is rapidly emerging as a new semiconductor manufacturing and back-end hub, and investment in building an ecosystem is accelerating.

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