Semiconductor News 2020420

Today’s semiconductor news reports on a situation in which competition in the development of advanced packaging and new technologies is simultaneously being accompanied by a wave of rapid market restructuring. The evolution of back-end process technology is conspicuous, with Corning Inc. of the U.S. dominating the glass substrate field and ASE stepping up deliveries of advanced packaging equipment. In Japan, the battle for ROHM over the restructuring of power semiconductors began with Denso’s forceful takeover bid, and the industry map has begun to be rewritten. In addition, the battle between the construction of next-generation infrastructure and cost containment against the backdrop of special demand for AI is being played out on a global scale, including a surge in the related market due to expectations for photon technology for optoelectronic convergence and an attempt to destroy DDR5 prices with the emergence of a new HUDIMM memory standard.

Main News

1. Corning Leads Glass Substrate Competition; Korea’s KCC, Others Face Tough Challenges
   Corning Inc. of the United States is leading the market in the competition for glass substrates for next-generation semiconductor packaging. On the other hand, competitors such as Korea’s KCC and LX Glass are reportedly facing severe challenges in terms of technology and market share. With the increasing importance of base materials in advanced packaging technology, the battle for dominance in the glass substrate market is heating up.
2. ASE ‘s Advanced Packaging Accelerates, Boosted by Increased Deliveries from Related Equipment Manufacturers
   ASE, the world’s leading semiconductor packaging company, is further accelerating the deployment of CoPos, its advanced packaging technology. This is being supported by the increased delivery of related equipment by semiconductor equipment manufacturers such as Skytech and CMIt, which are collaborating and investing in equipment throughout the supply chain to advance the back-end process technology that is essential for improving the performance of AI semiconductors and other products.
3. Teikyo University Successfully Reads Out Quantum Bits Using GAA Transistors
   A research team from Teikyo University has successfully read out quantum bits using GAA technology, a next-generation semiconductor transistor structure. This technology has the potential to support quantum error correction and is attracting attention as a groundbreaking research achievement that combines silicon semiconductor technology, which is at the forefront of miniaturization, with next-generation quantum computing.
4. OKI Launches Design Data for Semiconductor Manufacturing Equipment, Collaborating with U.S. Startup
   It was reported that OKI has collaborated with a U.S. startup company to begin selling design data for semiconductor manufacturing equipment. By providing equipment manufacturers and component suppliers with a data platform that supports efficient design and development, OKI will contribute to the rapid startup and advancement of manufacturing lines. This is the development of a new business model to support semiconductor manufacturing infrastructure from a data business perspective.
5. Denso’s Takeover Proposal Sparks “Battle for ROHM”; Power Semiconductor Reorganization Intensifies
   It has been independently reported that a “battle for ROHM” has broken out in the Japanese power semiconductor industry, with Toyota Motor Group’s Denso forcing a takeover proposal to ROHM. In response to this, a coalition plan by ROHM, Toshiba, and Mitsubishi Electric has also emerged, and the huge industry restructuring drama over the dominance of power semiconductors, which are indispensable for decarbonization, in Japan is showing unprecedented intensity.
6. New HUDIMM Memory Specification Aims to Significantly Lower DDR5 Prices
   A new memory standard, the HUDIMM specification, has been introduced for the PC market. The new standard uses a design with only one sub-channel per memory stick to reduce manufacturing costs, and aims to significantly lower the price of expensive DDR5 memory and provide an inexpensive alternative for budget-conscious PC users at a time when RAM is in short supply. The goal is to provide an inexpensive alternative for budget-conscious PC users.
7. AI Special Demand Revives Optical Communications Market, Photon Technology Becomes Semiconductor “Lane-Changer”
   As the development of AI technology places a tremendous strain on telecommunications infrastructure, optical communications-related markets are showing signs of revival, creating a frenzy reminiscent of the dot-com bubble, with related stocks soaring 4700%. Chinese experts have also pointed out that photon technology represents a significant “lane-change supercar” opportunity to break the existing technology paradigm in the semiconductor field in the future, and expectations for optoelectronic fusion technology are growing.
8. Price hikes in the three major semiconductor mainstays are back, and product re-pricing is under way
   In the semiconductor market, a wave of price hikes in the three major mainstay products is once again underway against a backdrop of recovering demand and rising supply chain costs. Semiconductor product re-pricing is underway in response to changing market conditions, and price pass-through to downstream customers, such as set manufacturers, is in full swing. Rising chip prices are further contributing to inflationary pressures in the electronics industry as a whole.
9. TimeKu Technology Discloses Significant Asset Restructuring, Plans Full-Scale Entry into Semiconductor Memory Field
   Chinese company TimeKu Technology has disclosed a significant asset restructuring plan to the market. Through this restructuring, the company has revealed that it plans to make a full-scale entry into the new semiconductor memory sector. This is a strategic business shift in anticipation of a self-sustaining semiconductor ecosystem in China and a recovery in the memory market, and is symbolic of the growing trend of M&A and business expansion among domestic companies.
10. Cheng Cheng New Material’s 2025 Net Income Increases, Semiconductor Photoresist Business Grows at High Rate
    Chinese materials manufacturer Cheng Cheng New Material has reported an 8.86% year-on-year increase in net income for 2025, according to results released today. In particular, the photoresist business, which is a core material for semiconductor manufacturing, is showing high growth and strongly driving the company’s performance. Against the backdrop of U.S. export restrictions, demand for domestically produced semiconductor materials in China is surging, and local material suppliers are benefiting greatly from this trend.

News List