Semiconductor News 20260415

Today’s semiconductor news was strongly marked by the tremors in the memory market caused by the explosive expansion of AI infrastructure and the rise of next-generation packaging technologies: the surge in AI demand has caused DRAM prices to soar by more than 70 percent, while the NAND shortage has exacerbated the profits of related manufacturers by several times In the technology sector, Intel has been the leader in the development of new technologies. On the technology front, Intel announced the world’s thinnest GaN chiplet, and back-end process innovation is accelerating with the practical application of glass substrates and CPO. On the other hand, the complex intertwining of geopolitical risks and the struggle for supremacy among companies is highlighted by the sluggish yield of Samsung’s 2nm process, Arm’s deployment of its own chips, and China’s strong subsidy investment in AI performance that has made the U.S. a frontrunner.

Main News

1. Samsung’s 2nm Yield Slumping, Qualcomm Considering TSMC Adoption
   Samsung’s 2nm process yield is reported to be below mass production standards at only about 55 percent. This sluggish yield has raised the possibility that Qualcomm, a major customer, may consider moving to TSMC for the production of its next-generation chips. As competition among foundries in the development of cutting-edge processes intensifies, improving yield is an urgent issue for securing market superiority.
2. AI Demand Driving Memory Shortages, Dramatically Increasing Profits
   The AI infrastructure boom is causing severe memory shortages, with Nanya Technology recording a profit of NT$26 billion in the first quarter of 2026 due to a more than 70 percent spike in DRAM prices.Silicon Motion also noted a 2- to 3-fold increase in profits due to NAND shortages, while Samsung raised the price of its HBM4 logic die by 40 to 50 percent on the back of AI demand, leading to a surge in profits across the market.
3. Intel Shares Surge 51 Percent in Eight Days, Market Capitalization Increases Significantly
   Intel’s stock price has surged 51 percent in eight days, one of the largest ever, and its market capitalization has increased by more than $100 billion, according to a new report released today. The surge was attributed to a rapid increase in investors’ expectations for new strategies and next-generation technologies in the market for semiconductors for AI infrastructure. The market’s recognition of the company’s long-term rebuilding of its foundry business and deployment of proprietary technologies is powerfully driving the overall bullish trend in semiconductor stocks.
4. China Invests 3.6 Times More in Semiconductor Subsidies than U.S. in Past Decade
   It is now clear that over the past decade, China has invested 3.6 times more in semiconductor manufacturing subsidies than the United States. This is the result of China’s rapid progress in establishing its own supply chain and technological independence in response to U.S. export restrictions. Backed by enormous state support, China’s semiconductor ecosystem is rapidly strengthening and continues to have an extremely significant impact on global chip manufacturing capacity and the geopolitical race for technological supremacy.
5. Rapidus Starts Back-end Prototyping Line, Advances Toward Integrated Production
   Rapidus, Japan’s next-generation semiconductor manufacturer, has started operating a prototype line for back-end processes in semiconductor manufacturing. This marks an important step toward the company’s dream of establishing an integrated production system from front-end to back-end processes. The establishment of advanced packaging technology is essential for the manufacture of high-performance chips such as AI semiconductors, and efforts to revive Japan’s semiconductor industry have progressed to a more practical stage.
6. Intel Announces World’s First and Thinnest Ga N Chiplet
   Intel has announced the world’s first and thinnest GaN chiplet. This innovative technology simultaneously improves power efficiency and reduces overall system size, making a significant contribution to power savings in data centers and improved performance in mobile devices. Incorporating GaN technology, which plays a key role in next-generation power management and high-frequency devices, into the chiplet structure opens up new possibilities for semiconductor design.
7. Glass Substrate and CPO Technologies Capture AI Packaging Demand
   As AI packaging becomes more advanced, Intel, Samsung Electro-Mechanics, and others are stepping up efforts to mass produce glass substrates. JCET is also working to capture AI demand through advanced CPO and glass substrate technologies. The transition from conventional substrate materials to next-generation materials and the practical application of optical transmission technologies are rapidly advancing in order to break through the limits of data transfer speed and power efficiency.
8. Samsung Electro-Mechanics Expands AI Packaging in Vietnam
   Samsung Electro-Mechanics is reportedly expanding its semiconductor packaging business for AI by utilizing MLCC embedded substrate lines at its manufacturing facility in Vietnam.AI The move is aimed at meeting the growing demand for advanced packaging technology, which is essential for improving the performance of chips. By stepping up investment in Vietnam, a strategic location with abundant labor, we are further enhancing our competitiveness in the global back-end supply chain.
9. China’s AI Performance Closes Gap with U.S., Meets Anth ropic
   A report from Stanford University reveals that China has nearly closed the gap with the United States in terms of AI performance. Even against Anthropic, the world’s premier AI model, the performance gap has narrowed to just 2.7 percent. Despite strict U.S. restrictions on chip exports, China’s AI technology is evolving at an astonishing pace, and the global AI development race has entered a new phase.
10. Arm’s Development of Proprietary Semiconductors, Concerns and Ripples over “ Forbidden Move”
    The decision by U.K.-based Arm, a leading semiconductor design architecture company, to develop its own semiconductors in addition to licensing them has been called “forbidden” by some in the industry. This strategic shift to enter the hardware market at the risk of competing directly with existing customers may create friction within the company’s robust ecosystem, and the future of the business model and its impact on the industry structure is attracting attention.

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