In today’s semiconductor news, we report on the dramatic expansion of business performance due to demand for AI infrastructure and the simultaneous restructuring of the supply chain against the backdrop of turbulent global conditions, with TSMC reporting a 58 percent increase in net income in the first quarter, and ASML raising its full-year outlook, Demand for AI is strongly driving corporate performance. In addition, a number of milestones are being made in anticipation of the next generation, such as TSMC’s entry into 2nm mass production, Tesla’s dual procurement of next-generation AI chips, and Japan’s Rapidus’ development of optoelectronic fusion. At the same time, however, issues that bring uncertainty to the industry’s growth trajectory, such as concerns about a prolonged memory shortage that will last until 2027 and material supply risks due to tensions in the Middle East, are also being highlighted.

Main News
- TSMC posts record first-quarter net income up 58 percent, raises full-year outlook
Taiwan’s TSMC reported record first-quarter 2026 results, with net income up 58 percent year over year to NT$572.5 billion. Strong AI demand strongly drove revenue, and gross margin of 66.2 percent exceeded market expectations. In response, TSMC also expects second-quarter revenue to increase, and has raised its full-year revenue growth forecast to more than 30 percent, an overwhelming performance that symbolizes the booming AI market. - TSMC Enters 2nm Mass Production, Clarifies Mass Production Schedule for Arizona and Kumamoto Factories
TSMC has entered mass production of its next-generation 2nm process and is simultaneously expanding its 3nm production capacity. The company is also making steady progress in building a global manufacturing network, confirming that it plans to begin 3nm mass production at its second plant in Arizona, USA, in the second half of 2027, and at its Kumamoto plant in Japan in 2028. In order to meet the rapidly growing demand for AI chips, the company is pushing forward with the development of cutting-edge processes and the expansion of its production bases on a global scale in parallel. - Semiconductor Memory Supply Shortage to Continue until 2027; Increased Production Not Catching Up with AI Priority
It has been reported that the global semiconductor memory shortage is expected to continue until 2027, against the backdrop of surging demand for generative AI infrastructure. Three major memory manufacturers in the U.S. and South Korea are rushing to expand production capacity, but the overall pace of production increase, including general-purpose products, is not keeping pace with demand, as production of high value-added products, such as broadband memory for AI, is given top priority. This surge in memory prices is also affecting end products, such as Meta’s price hike for VR terminals. - ASML Increases Sales and Profit for Seventh Consecutive Quarter, Raises Full-Year Forecast on Surging Demand from South Korea
ASML, a leading Dutch semiconductor equipment manufacturer, has reported its seventh consecutive quarter of increased sales and profit. Demand for its manufacturing equipment from the South Korean market in particular has surged, leading the company to upwardly revise its full-year sales outlook for 2026. As competition to develop cutting-edge AI semiconductors and next-generation memory intensifies, demand for core manufacturing equipment, including extreme ultraviolet lithography equipment, is extremely strong, indicating that industry-wide capital investment remains strong. - While Samsung is Promoting Yield Improvement of HBM4, Outflow of Core Talent Poses Risk
It has been reported that Samsung Electronics is strongly promoting yield improvement by introducing advanced inspection technology and other measures in the manufacture of HBM4, the next-generation broadband memory. At the same time, however, there has been a succession of outflows of highly skilled personnel from the System LSI division, raising concerns that the future development of the proprietary Exynos processor and image sensors may be at serious risk. The company is facing a complex management challenge between technological sophistication and competition for human resources. - Tesla Suggests Dual Procurement of TSMC and Samsung for Manufacturing of Next-Generation AI Chips
It has been reported that Tesla, led by Elon Musk, has suggested a dual procurement strategy using both TSMC and Samsung Electronics foundries as manufacturing contractors as it completes the design of its next-generation AI chips that will support self-driving and other applications. The company is now considering a dual procurement strategy that would use both TSMC and Samsung Electronics as manufacturing contractors. The aim is to diversify the risk of dependence on a single manufacturing supplier and to secure a stable chip supply and price negotiation power, and the selection of foundries and promotion of competition by giant technology companies are becoming more active. - China Tightens Supply Chain Restrictions, Domestic GPU Startups Rise
The Chinese government is tightening restrictions on foreign companies cutting off supply chains. While strict U.S. export controls remain in place, Chinese domestic investment in becoming self-reliant is accelerating, and in particular, startups developing domestically produced GPUs, a key component of AI computation, are steadily strengthening their presence in the global AI chip race. The creation of a unique technology ecosystem is progressing at a rapid pace. - Rapidus to Start Full-Scale Development of Photoelectric Fusion Technology and Chiplets in Chitose, Hokkaido
Rapidus, a Japanese next-generation semiconductor manufacturer, will start full-scale development of photoelectric fusion technology to dramatically increase data transfer speeds and chiplet technology to combine multiple semiconductors for higher performance at its base in Chitose City, Hokkaido. The report said that Rapidus will start full-scale development of optoelectronic fusion technology, which dramatically increases data transfer speed, and chiplet technology, which combines multiple semiconductors to achieve higher performance. Under the leadership of the Center for Advanced Semiconductor Technology, a technical research association, the company aims to establish next-generation packaging technology indispensable in the age of AI, and is accelerating cutting-edge research and development for the revival of Japan’s semiconductor industry. - Cadence and NVIDIA Deepen AI Alliance to Innovate Chip Design and Robotics
Cadence, the leading electronic design automation software company, and NVIDIA have announced the further deepening of their strategic alliance in the area of artificial intelligence. capabilities into Cadence’s design tools to significantly streamline the complex design process of semiconductor chips, while aiming for new innovations in the field of robotics. The collaboration between the leaders in software and hardware will advance the entire ecosystem. - Escalating Conflicts in the Middle East Accelerate Restructuring and Risks in Technology Supply Chains
It has been noted that the escalating conflicts in the Middle East, such as between Iran and Israel, are further accelerating the restructuring of global technology supply chains. In addition to the risk of fluctuations in oil prices and disruptions to logistics routes, uncertainty regarding the procurement of materials and other items essential for semiconductor manufacturing is increasing. The global chain of geopolitical risks poses a direct threat to the stable supply of chips and manufacturing costs, and companies are rushing to take defensive measures such as diversifying their procurement networks.
News List
| 投稿日 | 日本語タイトル | 原語タイトル | 記事URL |
|---|---|---|---|
| DIGITIMES | |||
| Apr 16, 16:46 | TSMC、2nm量産に突入し、3nm生産能力を拡大 | TSMC enters 2nm mass production, scales 3nm capacity | https://www.digitimes.com/news/a20260416PD240/tsmc-production-capacity-3nm-capacity-expansion.html |
| Apr 16, 17:21 | TSMC、次世代LPU入札を示唆、サムスンのGroq受注継続に疑問の声 | TSMC hints at next-gen LPU bid, stokes speculation that Samsung’s Groq order may not last | https://www.digitimes.com/news/a20260416PD243/tsmc-groq-samsung-nvidia-2026.html |
| Apr 16, 16:31 | TSMC、2026年第2四半期の収益成長を15%以上に見込み、N3の利益率は平均を上回る見通し | TSMC guides over 15% 2Q26 revenue growth, N3 margins set to top average | https://www.digitimes.com/news/a20260416PD235/tsmc-revenue-growth-profit-2026.html |
| Apr 16, 16:28 | 台湾のアナログIC企業、2026年第1四半期の収益にばらつき;モーター制御とDDR5 PMICが成長を牽引 | Taiwan analog IC firms show varied 1Q26 revenue; motor control and DDR5 PMIC drive growth | https://www.digitimes.com/news/a20260415PD232/analog-ic-pmic-ddr5-revenue-growth.html |
| Apr 16, 15:22 | TSMC、AI需要に支えられ記録的な四半期を迎え、通年見通しを30%以上に引き上げ | TSMC lifts full-year outlook above 30% as AI demand powers another record quarter | https://www.digitimes.com/news/a20260416VL217/tsmc-demand-guidance-revenue-expansion.html |
| Apr 16, 16:34 | ヤジーオ、2026年第1四半期の利益が前年同期比40%増―AI需要と価格高騰が追い風に | Yageo posts 40% YoY profit rise in 1Q26, driven by AI demand, price hikes | https://www.digitimes.com/news/a20260416PD200/yageo-passive-components-profit-price-ai-demand.html |
| Apr 16, 16:18 | MCU需要の先行で第1四半期の売上が伸びるも、インフレリスクが見通しを曇らせる | MCU demand pull-in lifts first-quarter sales, inflation risk clouds outlook | https://www.digitimes.com/news/a20260415PD228/mcu-demand-electronics-revenue-2026.html |
| Apr 16, 16:12 | EZconn、出荷台数増で3月の利益が200%急増―高ファイバー数が牽引 | EZconn posts 200% profit surge in March as high-fiber count shipments boost growth | https://www.digitimes.com/news/a20260415PD233/profit-ezconn-growth-shipments-revenue.html |
| Apr 16, 16:02 | 中国、外国とのサプライチェーン切り離しに対する規制を強化 | China tightens rules against foreign supply chain decoupling | https://www.digitimes.com/news/a20260416VL215/supply-chain-government-launch-exports-market.html |
| Apr 16, 15:50 | サムスン、先端検査と最先端技術の登場によりHBM4の歩留まり向上を推進 | Samsung pushes HBM4 yields as advanced testing and cutting technologies emerge | https://www.digitimes.com/news/a20260415VL211/samsung-dram-hbm4-laser-testing.html |
| Apr 16, 14:46 | TSMC、2026年第1四半期決算―AI需要で利益が58%増、粗利益率は史上最高に | TSMC 1Q26 earnings: AI demand sends profit up 58%, gross margin to all-time high | https://www.digitimes.com/news/a20260416VL214/tsmc-earnings-revenue-demand-taiwan.html |
| Apr 16, 12:30 | 中国の国産GPUスタートアップ、世界のAIチップ競争で存在感を強める | China’s homegrown GPU startups gain ground in global AI chip race | https://www.digitimes.com/news/a20260416VL205/china-gpu-development-revenue.html |
| Apr 16, 12:17 | テスラ、AI5のテープアウトでサムスンとTSMCを併用する二重調達を示唆 | Tesla AI5 tape-out signals dual sourcing with Samsung, TSMC | https://www.digitimes.com/news/a20260416VL211/tesla-chips-design-samsung-tsmc-production.html |
| Apr 16, 12:11 | CadenceとNvidia、AI提携を深化しチップ設計とロボティクスの革新を目指す | Cadence, Nvidia deepen AI partnership to reshape chip design and robotics | https://www.digitimes.com/news/a20260416VL200/cadence-nvidia-eda-partnership-ai-agent-robotics.html |
| Apr 16, 12:02 | サムスンSystem LSIの人材流出がExynosとイメージセンサーにリスクをもたらす | Samsung System LSI talent exits raise risks for Exynos and image sensors | https://www.digitimes.com/news/a20260415PD234/samsung-lsi-exynos-cis-talent-design.html |
| Apr 16, 11:57 | メモリ供給業者、AI需要が季節的低迷を打破し2026年第1四半期の収益が記録的に伸びる | Memory suppliers post record 1Q26 revenue as AI demand defies seasonal slowdown | https://www.digitimes.com/news/a20260415PD218/revenue-demand-2026-growth-price.html |
| 日経 Tech Foresight | |||
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| マイナビニュース テックプラス | |||
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| 2026-04-16 | ASMLが7四半期連続で増収増益、韓国での需要急増で2026年通期売上高見通しを上方修正 | https://news.mynavi.jp/techplus/article/20260416-4346458/ | |
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| TrendForce | |||
| 2026-04-16 | TSMC は、Intel EMIB と競合する中で、CoWoS による業界最大のレチクルサイズパッケージングを実現していると発表;CoPoS 技術も進展 | TSMC Says CoWoS Offers Industry’s Largest Reticle-Size Packaging Amid Intel EMIB Rivalry; CoPoS Advances | https://www.trendforce.com/news/2026/04/16/news-tsmc-says-cowos-offers-industrys-largest-reticle-size-packaging-amid-intel-emib-rivalry-copos-advances/ |
| 2026-04-16 | TSMC の Terafab に関して:ファウンドリでは妥協なし;Samsung との競争中、次世代 LPU プロジェクトを確認 | TSMC on Terafab: No Shortcuts in Foundry; Confirms Next-Gen LPU Project amid Samsung Rivalry | https://www.trendforce.com/news/2026/04/16/news-tsmc-on-terafab-no-shortcuts-in-foundry-reportedly-confirms-next-gen-nvidia-lpu-project-amid-samsung-rivalry/ |
| 2026-04-16 | TSMC N3、AI需要を背景に強化;アリゾナの第2ファブで3nmの量産は2027年下半期、熊本は2028年開始予定 | TSMC N3 Tightens on AI Demand; Arizona 2nd Fab 3nm Volume Production in 2H27, Kumamoto in 2028 | https://www.trendforce.com/news/2026/04/16/news-tsmc-n3-tightens-on-ai-demand-arizona-2nd-fab-3nm-volume-production-in-2h27-kumamoto-in-2028/ |
| 2026-04-16 | TSMC、2Q 売上高が前四半期比10%増で402億ドル、利益率は65.5%~67.5%に、設備投資は520~560億ドルの上限に | TSMC Sees 2Q Sales Up 10% QoQ to $40.2B; Margins Rise to 65.5%–67.5%, Capex at Top End of $52–56B | https://www.trendforce.com/news/2026/04/16/news-tsmc-sees-2q-sales-up-10-qoq-to-40-2b-margins-rise-to-65-5-67-5-capex-at-top-end-of-52-56b/ |
| 2026-04-16 | TSMC、1Q26 純利益が前年比58%増の5725億台湾ドルの新記録、EPSが22.08台湾ドル、粗利益率は66.2%で予想を上回る | TSMC 1Q26 Net Income Soars 58% YoY to NT$572.5B Record, EPS NT$22.08; Gross Margin Beats Forecast at 66.2% | https://www.trendforce.com/news/2026/04/16/news-tsmc-1q26-net-income-soars-58-yoy-to-nt572-5b-record-eps-nt22-08-gross-margin-beats-forecast-at-66-2/ |
| Semiconductor Digest | |||
| 3 hours ago | TeradyneがTestInsightを買収 | Teradyne Acquires TestInsight | https://www.semiconductor-digest.com/teradyne-acquires-testinsight/ |
| 3 hours ago | 1T’-MoTe2/2H-MoTe2 ファンデルワールスヘテロ構造に基づく超高感度マルチバンド赤外線偏光フォトディテクター | Ultra-Sensitive Multi-Band Infrared Polarization Photodetector Based on 1T’-MoTe2/2H-MoTe2 van der Waals Heterostructure | https://www.semiconductor-digest.com/ultra-sensitive-multi-band-infrared-polarization-photodetector-based-on-1t-mote2-2h-mote2-van-der-waals-heterostructure/ |
| 4 hours ago | 2D磁性材料のウェーハスケール成長の実現 | Achieving Wafer-Scale Growth of 2D Magnetic Materials | https://www.semiconductor-digest.com/achieving-wafer-scale-growth-of-2d-magnetic-materials/ |
| 4 hours ago | Wooptix、スペインにおける新セミコンダクタークリーンルーム施設の着工 | Wooptix Breaks Ground on New Semiconductor Cleanroom Facility in Spain | https://www.semiconductor-digest.com/wooptix-breaks-ground-on-new-semiconductor-cleanroom-facility-in-spain/ |
| 日本経済新聞 | |||
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| TechPowerup | |||
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| 2026-04-16T15:41:53+00:00 | Keychron、Gシリーズゲーム用マウスにRetro G4とカーボンファイバーG5モデルを追加 | Keychron Expands G Series Gaming Mice With Retro G4 and Carbon Fiber G5 Models | https://www.techpowerup.com/348278/keychron-expands-g-series-gaming-mice-with-retro-g4-and-carbon-fiber-g5-models |
| 2026-04-16T15:36:58+00:00 | NVIDIA、PRAGMATA GeForce 596.21 WHQLゲームレディドライバーをリリース | NVIDIA Releases PRAGMATA GeForce 596.21 WHQL Game Ready Drivers | https://www.techpowerup.com/348282/nvidia-releases-pragmata-geforce-596-21-whql-game-ready-drivers |
| 2026-04-16T15:22:10+00:00 | GoDeal24春のソフトウェアセール:Windows 11とOfficeが大幅割引で入手可能! | GoDeal24 Spring Software Sale: Get Windows 11 and Office at Deep Discounts! | https://www.techpowerup.com/348140/godeal24-spring-software-sale-get-windows-11-and-office-at-deep-discounts |
| 2026-04-16T15:07:21+00:00 | Intel、新たな『Raptor Lake Refresh』LGA1700プロセッサラインを再発売 | Intel to Re-launch New Line of “Raptor Lake Refresh” LGA1700 Processors | https://www.techpowerup.com/348281/intel-to-re-launch-new-line-of-raptor-lake-refresh-lga1700-processors |
| EETimes Taiwan | |||
| 2026-04-16 | AIデータセンターの電源アーキテクチャアップグレードにおける産業サプライチェーンと技術検証の分析 | AI資料中心電源架構升級下的產業供應鏈與技術驗證分析 | https://www.eettaiwan.com/20260416nt41-ai-data-center-power-architecture-800v-hvdc/ |
| 2026-04-16 | AIが先進パッケージ競争を引爆:生産能力、技術、サプライチェーンの再編成が加速 | AI引爆先進封裝競賽:產能、技術與供應鏈加速重構 | https://www.eettaiwan.com/20260416nt31-advanced-packaging-chiplet-ai-semiconductor-market/ |
| 2026-04-16 | CES 2026直撃:Wi-Fi 7普及とWi-Fi 8技術進化の全貌を解析 | CES 2026直擊:Wi-Fi 7普及與Wi-Fi 8技術演進全解析 | https://www.eettaiwan.com/20260416nt51-ces-2026-highlights-the-dual-evolution-of-wi-fi-7-and-wi-fi-8/ |
| 2026-04-16 | 消費電力を銅ケーブルの5%に低減:Micro LED CPOがデータセンターの相互接続に新局面を切り開く | 功耗降至銅纜5% Micro LED CPO開啟資料中心互連新局 | https://www.eettaiwan.com/20260416nt21-micro-led-cpo-data-center-energy-saving/ |
| 2026-04-15 | 中東の衝突激化でテクノロジーサプライチェーンの再編が加速 | 中東衝突升溫 加速科技供應鏈重組 | https://www.eettaiwan.com/20260415nt01-middle-east-conflict-is-rewiring-global-supply-chains/ |
| 2026-04-15 | 10BASE-T1Sが牽引する車載ネットワークの未来 | 10BASE-T1S驅動車載網路未來 | https://www.eettaiwan.com/20260415nt71-the-future-of-in-vehicle-networks-starts-with-10base-t1s/ |
| 2026-04-15 | 台湾の企業70%以上が安全上の懸念からAI導入を余儀なくされる | 台灣逾七成企業被迫在安全疑慮下導入AI | https://www.eettaiwan.com/20260415nt21-ai-security/ |
| EETimes Asia | |||
| 2026-04-16 | AIワークロード向けのメモリ再割り当てがLPDDR4の供給を制約し、高性能なセルラーIoTモジュールの成長を遅らせる | Memory Reallocation to AI Workloads Constrains LPDDR4 Supply, Slowing High-end Cellular IoT Module Growth | https://www.eetasia.com/memory-reallocation-to-ai-workloads-constrains-lpddr4-supply-slowing-high-end-cellular-iot-module-growth/ |
| 2026-04-16 | Silicon Box、imecの自動車用チップレットプログラムに参加し、自動車グレードのチップレットデバイスを推進 | Silicon Box Joins imec Automotive Chiplet Program to Advance Automotive-grade Chiplet Devices | https://www.eetasia.com/silicon-box-joins-imec-automotive-chiplet-program-to-advance-automotive-grade-chiplet-devices/ |
| 2026-04-16 | 分散型インテリジェンスが予知保全を再定義、エッジAIが産業アーキテクチャを変革する | Distributed Intelligence Redefining Predictive Maintenance as Edge AI Reshapes Industrial Architectures | https://www.eetasia.com/distributed-intelligence-redefining-predictive-maintenance-as-edge-ai-reshapes-industrial-architectures/ |
| 2026-04-15 | MicrochipのDSCファミリー、高密度AIデータセンターのパワーおよびインテリジェントセンシング向けに設計 | Microchip DSC Family Designed for High-Density AI Data Center Power, Intelligent Sensing | https://www.eetasia.com/microchip-dsc-family-designed-for-high-density-ai-data-center-power-intelligent-sensing/ |
| 2026-04-15 | ASRockのAiUAC Copilot、IEC 61499オートメーションをコンセプトから実装まで加速 | ASRock AiUAC Copilot Accelerates IEC 61499 Automation from Concept to Deployment | https://www.eetasia.com/asrock-aiuac-copilot-accelerates-iec-61499-automation-from-concept-to-deployment/ |
| 2026-04-15 | Synopsys、NASAのアルテミス計画をスペーススーツ分析と通信開発で支援 | Synopsys Supports NASA’s Artemis Program with Spacesuit Analysis, Comms Development | https://www.eetasia.com/synopsys-supports-nasas-artemis-program-with-spacesuit-analysis-comms-development/ |
| 2026-04-15 | 電子システム設計業界の収益、2025年第4四半期で10%増加 | Electronic System Design Industry Revenue Up 10% in 4Q 2025 | https://www.eetasia.com/electronic-system-design-industry-revenue-up-10-in-4q-2025/ |
| 2026-04-15 | Rapidus、新たな解析センターとRapidusチップレットソリューションで開発環境を強化 | Rapidus Strengthens Development Environment with New Analysis Center, Rapidus Chiplet Solutions | https://www.eetasia.com/rapidus-strengthens-development-environment-with-new-analysis-center-rapidus-chiplet-solutions/ |
| 2026-04-15 | Arrow Electronics、モビリティの未来を切り拓く | Arrow Electronics: Driving the Future of Mobility | https://www.eetasia.com/arrow-electronics-driving-the-future-of-mobility/ |
| EETimes India | |||
| 2026-04-16 | eInfochipsがMicrosoft MarketplaceでEIC PROPELを展開し、企業向けIoT導入を効率化 | eInfochips Launches EIC PROPEL on Microsoft Marketplace to Streamline Enterprise IoT Deployment | https://www.eetindia.co.in/einfochips-launches-eic-propel-on-microsoft-marketplace-to-streamline-enterprise-iot-deployment/ |
| 2026-04-16 | Emergence AIがバンガロールに研究拠点を設立し、自律型AIシステムの進化を促進 | Emergence AI Establishes Research Hub in Bengaluru to Advance Autonomous AI Systems | https://www.eetindia.co.in/emergence-ai-establishes-research-hub-in-bengaluru-to-advance-autonomous-ai-systems/ |
| 2026-04-15 | STの機械学習ソフトウェアパックがAIを活用したモーター制御を加速 | ST Machine Learning Software Pack Accelerates AI-enhanced Motor Control | https://www.eetindia.co.in/st-machine-learning-software-pack-accelerates-ai-enhanced-motor-control/ |
| 2026-04-15 | MicrochipのハイブリッドMCUが自動車および電動モビリティ向けHMIアプリケーションを対象 | Microchip Hybrid MCU Targeted at Automotive, E-Mobility HMI Applications | https://www.eetindia.co.in/microchip-hybrid-mcu-targeted-at-automotive-e-mobility-hmi-applications/ |
| 2026-04-15 | Mouser ElectronicsがEITシリーズの第一弾を発表 | Mouser Electronics Drops First Installment of EIT Series | https://www.eetindia.co.in/mouser-electronics-drops-first-installment-of-eit-series/ |
| 2026-04-15 | Brandworks–MSH間のMoUが、インドにおけるAI駆動の電子機器製造とスタートアップの商業化を目指す | Brandworks–MSH MoU Targets AI-Driven Electronics Manufacturing, Startup Commercialization in India | https://www.eetindia.co.in/brandworks-msh-mou-targets-ai-driven-electronics-manufacturing-startup-commercialization-in-india/ |
| ZDNET Korea | |||
| 2026-04-17 | LLM、セキュリティ脆弱性の検出はまだ人間に任せられない | “LLM, 보안 취약점 탐지 아직 사람한테 안돼” | https://www.zdnet.co.kr/20260417012852” title=” |
| 2026-04-17 | プラテック、ラムリサーチの半導体部品特許無効化に失敗 | 플라텍, 램리서치 반도체 부품 특허 무효화 실패 | https://www.zdnet.co.kr/20260417010029” title=” |
| 2026-04-17 | 現存のセキュリティ体制、マルチモーダル攻撃への対応は事実上不可能 | “현존 보안 체계, 멀티모달 공격 대응 사실상 불가능” | https://www.zdnet.co.kr/20260416231657” title=” |
| 2026-04-16 | [カードニュース] ヨーロッパvsアメリカ、AI規制戦争 | [카드뉴스] 유럽vs미국, AI 규제 전쟁 | https://www.zdnet.co.kr/20260416111107” title=” |
| 2026-04-16 | 柳済明次官 「ミトス、我が社会に新たな課題を投げかける」 | 류제명 차관 “미토스, 우리 사회에 새 숙제 던져” | https://www.zdnet.co.kr/20260416224417” title=” |
| 2026-04-16 | 現代自動車労働組合、『完全月給制』のカードを出した…アトラス導入を狙う | 현대차 노조, ‘완전월급제’ 카드 꺼냈다…아틀라스 도입 정조준 | https://www.zdnet.co.kr/20260416220905” title=” |
| 2026-04-16 | AI生成コード、45%がセキュリティテストを通過しない…SCAツール等が必要 | “AI생성 코드 45% 보안테스트 통과 못해…SCA 도구 등 필요” | https://www.zdnet.co.kr/20260416204802” title=” |
| 2026-04-16 | 科学技術情報通信部、複雑なサプライチェーンのセキュリティ構築事例集を発刊 | 과기정통부, 복잡한 공급망 보안 구축 사례집발간 | https://www.zdnet.co.kr/20260416211751” title=” |
| 2026-04-16 | パスAI、’2026 FDI’が成功…新コンサルティング『FAAX』公開に注目 | 파수AI, ‘2026 FDI’ 성료…새 컨설팅 ‘FAAX’ 공개 시선 | https://www.zdnet.co.kr/20260416204235” title=” |
| 2026-04-16 | サムスン電子、労働組合が『違法な争議行為 금지』の仮処分を申請 | 삼성전자, 노조 ‘위법 쟁의행위 금지 가처분’ 신청 | https://www.zdnet.co.kr/20260416203748” title=” |
| 2026-04-16 | 情報保護産学連携が一堂に…「AI大転換、機会でありセキュリティの危機」 | 정보보호 산학연관 한자리에…”AI 대전환, 기회이자 보안 위기” | https://www.zdnet.co.kr/20260416153404” title=” |
| 2026-04-16 | BYD、’シライアン7’プラストリムを国内発売…実勢販売価格は4400万ウォン台 | BYD, ‘씨라이언7’ 플러스 트림 국내 출시…실 구매가 4400만원대 | https://www.zdnet.co.kr/20260416191955” title=” |
| 2026-04-16 | OCIパワー、インバーターの国産化を先導…ストリング・マイクロ製品事業に進出 | OCI파워, 인버터 국산화 앞장…스트링·마이크로 제품 사업 진출 | https://www.zdnet.co.kr/20260416191318” title=” |
| 2026-04-16 | [ZD SW Today] ヘヒュム、『ドッパモ』アップステージ精鋭チームに新規参加 他 | [ZD SW 투데이] 혜움, ‘독파모’ 업스테이지 정예팀 신규 참여 外 | https://www.zdnet.co.kr/20260416112631” title=” |
| 2026-04-16 | 『国家バイオ이노베이션委員会』発足…バイオ政策を総括する官民協力プラットフォーム | ‘국가바이오혁신위원회’ 출범…바이오 정책 총괄 민관협력 플랫폼 | https://www.zdnet.co.kr/20260416143508” title=” |
| 2026-04-16 | ケア人材不足、AI・IoTによる全工程対応 | 돌봄 인력 공백, AI·IoT로 전주기 대응 | https://www.zdnet.co.kr/20260416172807” title=” |
| 2026-04-16 | ペ・キョンフン 「スタンフォードAI指数、国家レベルの努力の成果」 | 배경훈 “스탠퍼드 AI지수, 국가 차원 노력 성과” | https://www.zdnet.co.kr/20260416171059” title=” |
| 2026-04-16 | KCA、黒山島でICTの社会貢献活動 | KCA, 흑산도에서 ICT 사회공헌 활동 | https://www.zdnet.co.kr/20260416174800” title=” |
| 2026-04-16 | ビジョンオックス 「アナーエ ViP方式 ウェアラブルOLED量産出荷」…世界初 | 비전옥스 “아너에 ViP 방식 웨어러블 OLED 양산 출하”…세계 최초 | https://www.zdnet.co.kr/20260416172819” title=” |
| 2026-04-16 | 高光憲 米国訪問調査委員長 「崩れた信頼を、組織改革と公正な審議で立て直す」 | 고광헌 방미심위 위원장 “무너진 신뢰, 조직 쇄신·공정 심의로 바로 세우겠다” | https://www.zdnet.co.kr/20260416171149” title=” |
| 中央日報 | |||
| 2026-04-17 | ヤノルジャの社員が「クク」と溢れ出した…グーグル出身の代表とのゾクゾクする初対面 | 야놀자 직원 “ㅋㅋ” 쏟아졌다…구글 출신 대표 아찔한 첫만남 | https://www.joongang.co.kr/article/25420934 |
| 2026-04-17 | 特に攻撃的だ…進歩党やチョグクの登場に胸が痛む理由 | 유독 더 공격적이다…진보당, 조국 등판에 속쓰린 이유 | https://www.joongang.co.kr/article/25420944 |
| 2026-04-17 | 『アルバイトすらないのに』…一人当たり0.8人の老人を扶養、若者たちの過酷な未来 | “알바도 없는데”…1명당 노인 0.8명 부양, 청년의 가혹한 미래 | https://www.joongang.co.kr/article/25420940 |
| 2026-04-17 | 主力株でさえも『商法改正』の抜け駆け策を使い…コスピ200企業を全数調査 | 대장주마저 ‘상법 개정’ 꼼수 부렸다…코스피200 기업 전수조사 | https://www.joongang.co.kr/article/25420932 |
| 2026-04-17 | 『4700%暴騰、AIがさらに押し上げる』…『ドットコムバブル悪夢』の光通信の復活 | “4700% 폭등, AI가 더 띄운다”…‘닷컴버블 악몽’ 광통신의 부활 | https://www.joongang.co.kr/article/25420920 |
| 2026-04-17 | ウサンホ「私は大統領が送った人物。政府で財政を引き上げる」 | 우상호 “난 대통령이 보낸 사람, 정부서 재정 끌어올 것” | https://www.joongang.co.kr/article/25420900 |
| BAIDU | |||
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