Semiconductor News 20251004

Main News

1. OpenAIのサムスンおよびSKハイニックスとの大規模メモリ契約、AIチップ供給チェーンの変革を示唆 OpenAIは、サムスンおよびSKハイニックスと大規模なメモリ供給契約を結び、AIチップサプライチェーンの構造変化を引き起こしています。OpenAIは「 Stargate” investment agreement, followed by a visit to Samsung’s Pyongtek plant. This is in conjunction with AI’s invocation of the “DRAM Super-Cycle” after years of stagnation due to mass HBM adoption.
2. Taiwan Opposes U.S. Demand for 50-50 Chip Split Taiwan is strongly opposing reports that the U.S. is reportedly demanding that 50% of its semiconductor demand be produced in the U.S. Taiwan is confident in TSMC’s technological capabilities, but proposes a strategic high-tech alliance with the U.S., saying that industrial clusters are the key to the partnership. Taiwanese authorities have denied the request, claiming that TSMC is not beyond their reach.
3. Applied Materials Warns of Revenue Decline Due to Expansion of U.S. Export Ban List Semiconductor equipment giant Applied Materials has warned that its revenue will be hurt by the U.S. government’s expanded restrictions on exports to companies on the Chinese blacklist. The tighter restrictions are expected to cost Applied Materials an estimated $710 million. This is just one example of how geopolitical factors are directly impacting the performance of equipment manufacturers.
4. Fujitsu and NVIDIA Form Strategic Alliance to Develop AI Semiconductors and Build Full-Stack AI Infrastructure Fujitsu and NVIDIA announced that they have strengthened their strategic alliance and will jointly develop AI semiconductors based on Fugaku’s technology by 2030. The collaboration aims to develop AI chips for supercomputers and robotics to provide a full-stack AI infrastructure. Japan’s energy-saving technologies are also in the spotlight.
5. Microsoft to Increase Development of In -House Chips to Reduce Dependence on NVIDIA Citing development concerns, Microsoft has announced that it will increase its push to develop its own (in-house) chips to reduce its dependence on NVIDIA in the AI chip market. This reflects the move by big tech companies to adopt custom ASICs (application-specific integrated circuits) and to increase control and optimization in their AI infrastructures.
6. ASE Technology Establishes New Plant in Kaohsiung to Expand Advanced Semiconductor Packaging ASE Technology has established a new plant in Kaohsiung, Taiwan, to expand its advanced semiconductor packaging technology. The company is accelerating its investment in advanced packaging platforms targeting devices for AI and cloud infrastructure.
7. Mature Chip Price Pressure on UMC Growing, Bold Price Cuts May Backfire As Taiwanese IC design firms foresee challenging market conditions through 2026, downward price pressure on mature chips is becoming more severe for UMC. The view is that UMC’s bold price reduction strategy may in turn motivate suppliers to shift to more profitable advanced nodes, which in turn may negatively impact UMC’s business.
8. EUV Masks for Rapidus, DNP nearing completion with exception ally short delivery time DNP (Dai Nippon Printing) is reportedly in the process of completing EUV (Extreme Ultraviolet) masks, an essential exposure technology for the 2nm process that Rapidus, a Japanese semiconductor manufacturing company, is aiming to achieve, with an exceptionally short delivery time. This is a major milestone in the development of Japan’s cutting-edge semiconductor manufacturing infrastructure. This is an important milestone in the construction of Japan’s cutting-edge semiconductor manufacturing infrastructure.
9. Chip Expert Jim Keller, Intel a Candidate for Cutting-Edge Chips, but Challenges in Commercialization Noted chip designer Jim Keller said that Intel is being considered as a candidate to manufacture cutting-edge chips. However, Keller noted, “Intel still has a lot of work to do to deliver a solid product.” Keller’s company is reportedly already in discussions with TSMC, Rapidus, and Samsung about 2nm technology.
10. Automotive Semiconductor Market to Grow from $68 Billion in 2024 to $132 Billion by 2030, Yole Forecast According to Yole Intelligence forecasts, the automotive semiconductor market is expected to double in size from $68 billion in 2024 to $132 billion by 2030. This significant growth is expected to be fueled by the electrification of automobiles. This significant growth is driven by the electrification of vehicles, the shift to software-defined vehicles (SDVs), and the incorporation of AI technologies.

News List