Semiconductor News 20260716

Today’s semiconductor news highlighted the practical implementation of cutting-edge process technologies and the restructuring of supply chains against the backdrop of geopolitical risks. In particular, Intel announced that it has incorporated ASML’s high-NA EUV lithography systems into its “Intel 18A” process and has begun mass production of “Panther Lake.”Furthermore, reports indicate that for the next-generation “Nova Lake,” Intel plans to bring up to 90% of its Compute Tiles back in-house, accelerating the strengthening of its foundry business.Meanwhile, Chinese companies are rushing to develop their own 3.5D “Infinity Chiplet” and 3D DRAM technologies to overcome HBM supply constraints caused by U.S. export restrictions, seeking to achieve self-reliance in their domestic supply chains.Furthermore, hardware competition in the AI era is intensifying even further, as evidenced by the strategic partnership between Sony and TSMC for the joint production of image sensors and NVIDIA CEO Jensen Huang’s efforts to promote physical AI in Japan.Meanwhile, at the industry’s grassroots level, issues such as allegations of intellectual property leaks following the departure of TSMC executives and uncertainty surrounding Samsung’s HBM4 orders for NVIDIA are contributing to technology leaks and shifts in the competitive landscape.

Main News

1. Intel Adopts High-NA EUV for Intel 18A Mass Production Line, to Be Used in Panther Lake Manufacturing
   ASML announced that its high-NA EUV lithography system, the “EXE Platform,” has been adopted for the first time in mass production of logic products for Intel Foundry’s Intel 18A process.This technology is being used for select products in the “Intel Core Ultra Series 3 (Panther Lake)” lineup and achieves yields equivalent to those of conventional EUV systems. Intel plans to continue collaborating with ASML across future process generations to maintain its competitive edge in cutting-edge manufacturing technology.
2. Intel to Manufacture Up to 90% of Nova Lake Compute Tiles In-House Using the 18A Process
   According to the latest supply chain information, Intel plans to manufacture 80 to 90 percent of the Compute Tiles for its next-generation “Nova Lake” processors at its own foundry.This represents a significant reduction from the originally planned outsourcing ratio to TSMC and suggests that Intel has strong confidence in the recovery of its in-house manufacturing capabilities and the profitability of its foundry business.
3. China Develops First 3.5D Infinity Chiplet and 3D DRAM Technologies Using Domestic AI Supply Chain
   China’s DFSX has announced the “DF1000,” a 3D AI chip built entirely using domestic supply chains to circumvent HBM supply constraints caused by U.S. export restrictions.This is a software-defined in-memory computing accelerator that employs a proprietary 3.5D “Infinity Chiplet” architecture and 3D DRAM technology. The aim is to break free from external dependencies and strengthen the foundation of the domestic AI industry.
4. Second round: Chinese companies obtain US approval to procure NVIDIA H200 and AMD’s high-end AI chips
   It has been reported that Chinese companies have cleared U.S. export controls and obtained procurement permits for NVIDIA’s H200 and AMD’s high-end AI chips. However, U.S. export controls remain strict, and uncertainty remains about whether sufficient quantities will actually be delivered. China’s domestic AI development environment still faces instability in chip supply.
5. The Prospects and Challenges of Joint Semiconductor Image Sensor Production Through the Sony-TSMC Partnership
   The Sony Group and TSMC have begun discussions toward the joint production of CMOS image sensors.Sony is pursuing a “factory streamlining” strategy to curb excessive investment in its own factories, and aims to significantly reduce capital expenditures by leveraging TSMC’s manufacturing capacity. The partnership between the two companies represents a key strategic shift to maintain competitiveness in the increasingly fierce image sensor market.
6. Jensen Huang arrives in Japan, the birthplace of humanoid robots – NVIDIA launches the era of physical AI.
   NVIDIA CEO Jensen Huang visited Japan and held meetings with Japanese robotics partners. Mr. Huang emphasized the importance of “physical AI,” where AI functions not only in the digital space but also in the physical world. The aim is to lead the next generation of automation market by combining Japan’s strengths in the robotics industry with AI technology, centered around NVIDIA’s robotics platform “Isaac.”
7. Dealsite Report: Samsung Has Not Yet Secured Mass Production Orders for HBM4 from NVIDIA
   It has been reported that Samsung Electronics has not yet secured mass production orders for next-generation HBM4 (High Bandwidth Memory) from NVIDIA.With competitors SK Hynix and Micron taking the lead in HBM—which is essential to the AI semiconductor market—Samsung faces an urgent need to improve quality certification and yield rates. Establishing a supply relationship with NVIDIA is the top priority for Samsung’s semiconductor division as it works to recover its performance.
8. Taiwan removes TSMC executive from ITRI website after he moves to Intel following intellectual property allegations.
   Following the departure of Wei-Jen Lo, former Senior Vice President of TSMC and leader of the 2nm process development, to Intel, Taiwan’s Industrial Technology Research Institute (ITRI) removed his records from its website. He is under investigation for allegedly leaking TSMC’s trade secrets to Intel, and Taiwanese authorities are strengthening their stance to prevent technology leaks.
9. NVIDIA has taken notice of a South Korean semiconductor startup… LB Investment has also invested $10 million.
   LB Investment has invested $10 million in a South Korean semiconductor startup that NVIDIA is keeping a close eye on. Investment in South Korean companies with AI semiconductor-related technologies is becoming more active, and expectations for South Korea’s technological capabilities are rising as part of NVIDIA’s supply chain strategy. This investment is expected to boost the evolution of next-generation AI chip design and packaging technologies.
10. Intel certifies high-NA EUV for Panther Lake, ASML prepares for the next wave, working with TSMC and Samsung.
    While Intel has completed certification of high-NA EUV for Panther Lake, equipment supplier ASML is also preparing to introduce high-NA EUV to its next customers, TSMC and Samsung. High-NA EUV is an essential technology for the transition to next-generation processes, and ASML is strengthening its collaboration with major foundries to promote the standardization of exposure technology.

News List (212 items)

This article is delivered every morning via an automated collection and AI-generated system. Number of items collected: 212 | Last updated: July 16, 2026

Editor’s Note: This article utilizes AI to summarize and organize news content. While every effort has been made to be as accurate as possible, it may contain errors in background explanation or interpretation of causal relationships. Please always check the source article for details and accurate context.