Semiconductor News 20260515

Tight memory chip supplies and advances in advanced process technology are major industry themes in today’s semiconductor news as AI demand surges TSMC forecasts AI wafer demand will expand 11-fold from 2022 to 2026, and the size of the semiconductor market in 2030 is projected to be $1.5 trillion, according to an upwardly The company has revised its 2030 semiconductor market size upward to $1.5 trillion. Among memory manufacturers, Samsung and SK Hynix are rapidly expanding their production capacities, and Samsung is booming, with its chip business profit in the most recent quarter reaching 48 times that of the same period last year. On the other hand, NAND flash memory prices have risen more than 600% from the end of September 2025, and DRAM prices have risen nearly 400%, indicating that price hikes due to supply shortages are becoming more serious. On the technology side, efforts to realize ultra-fine processes of less than 2 nm are progressing, and companies are competing for advanced miniaturization and higher layering technologies, such as Samsung’s realization of 3-layer stacked nanosheets in CFET and Kioxia’s success in operating QLC flash memory for the first time in the world.

Main News

1. TSMC Forecasts 11X Expansion in AI Wafer Demand Between 2022 and 2026, Aiming for 24 HBM Stacked CoWoS in 2029
   TSMC has forecasted that demand for AI accelerator wafers will grow 11x between 2022 and 2026. The company is expanding its CoWoS and SoIC-related production capacity in response to the AI boom. It also aims to achieve CoWoS with 24 HBM stacks by 2029, and has revised its semiconductor market size for 2030 upward to $1.5 trillion from its previous forecast of $1 trillion.
2. AI Memory Chip Supply Shortages Worsening, Memory Makers and Consumer Electronics Makers Split the Light and Dark
   The prolonged global supply shortage of memory chips associated with the AI investment boom has led to a wide disparity in corporate performance and stock prices. Memory makers such as Micron, Samsung Electronics, and SK Hynix have seen their stock prices reach record highs on the back of strong performance, and Samsung’s business profit grew 48 times year-on-year in the latest quarter, with a market capitalization of over $1 trillion. The outlook is for prices to continue to rise until 2027.
3. Samsung, Intel, IBM, and TSMC to Present Advanced CMOS Technologies Accelerating Efforts to Achieve Sub-2nm Processes
   Five Notable Papers in the Field of Advanced CMOS Technologies Selected at 2026 VLSI Symposium Samsung presents 3-layer for both n-FET and p-FET on the same wafer Samsung will present a 3D stacked FET (CFET) with 3-layer stacked nanosheet channels in both n-FET and p-FET on the same wafer, demonstrating the most aggressive CFET scaling practicable at a minimum gate pitch of 42 nm. Intel Foundry, IBM Research, and TSMC are also scheduled to announce technologies to achieve ultra-fine processes below 2nm.
4. Samsung SSD Prices in Japan Rise up to 300%, Tight Memory Supplies Drive Market Differentiation
   Tight memory supplies are having the biggest impact on the consumer and retail segment as Samsung SSD prices in the Japanese market have surged up to 300%, according to a report from Tom’s Hardware. the market differentiation among manufacturers is accelerating, with several memory vendors warning of even tighter memory supplies into 2027, and Kioxia also recording price increases.
5. Kioxia and SanDisk Achieve World’s First Successful QLC Flash Memory Operation Advances High-Density Stacked Memory Technology
   2026 Five Notable Papers Selected for VLSI Symposium in Semiconductor Memory Technology Kioxia and SanDisk succeeded in the world’s first QLC operation of directly wafer-bonded multi-stacked cell array (MSA) COMS, overcoming cell current degradation and wafer warpage, which are challenges in highly stacked 3D flash memory; SAIMEMORY, Samsung, and SK Hynix also announced high SAIMEMORY, Samsung, and SK Hynix will also announce stacking technologies for high integration.
6. Samsung, SK Hynix Pursue Capacity Expansion to Meet Surging Demand for Memory for AI
   Samsung and SK Hynix are expanding their high bandwidth memory (HBM) and DRAM production capacity to meet surging memory demand. In the face of rapidly increasing demand for memory for AI accelerators, the two companies are accelerating investment in production facilities to remain competitive and further strengthen their oligopoly in the industry.
7. Celebrus , a rising star in AI semiconductors, listed on the U.S. market, soaring to double its offering price and challenging NVIDIA
   AI semiconductor maker Celebrus listed on the U.S. market, with its share price soaring to more than double its offering price. The market is excited about the company as an AI semiconductor company that will follow in the footsteps of NVIDIA, and investment in emerging makers has been on the rise.
8. TSMC Significantly Expands CoWoS and SoIC Production Capacity in Response to AI Boom
   TSMC is expanding its CoWoS (Chip on Wafer on Substrate) and SoIC (System on Integrated Chips) chiplet technologies to meet growing AI demand. packaging production capacity. As the demand for advanced packaging technology rapidly increases, strengthening production capacity is key to TSMC’s ability to maintain its competitiveness.
9. TSMC Symposium Focuses on AI Expansion and Advanced Packaging Demands
   The expansion of AI-related business and the importance of advanced packaging technologies were key themes at a symposium held by TSMC. Issues and future directions in semiconductor design and manufacturing in the AI era, including chiplet/multi-die design and HBM integration technologies, were discussed.
10. Samsung Labor Dispute Highlights Differences between Taiwanese and Korean Semiconductor Workforce Models
    An analysis of the Samsung labor dispute reveals structural differences between the Taiwanese and Korean semiconductor industry labor force models. The differences in working environment and employment patterns have been highlighted as factors affecting production efficiency and corporate competitiveness.

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