Semiconductor News 20260429

Today’s semiconductor news is a mix of the frenzy brought on by explosive AI demand and the market friction and caution that is brewing behind the scenes: Omdia has revised its 2026 market growth rate upward to 62.7%, TSMC’s advanced packaging prices have flirted with the 7nm level, and record activity continues due to tight supply. The market continues to experience record-breaking activity due to the tight supply. The companies continue to invest aggressively in the development of next-generation memory CXLs and the expansion of their bases in India. At the same time, however, geopolitical risks are deepening, including a fine against Tokyo Electron due to a confidentiality leak incident at TSMC and a massive $38 billion investment in Wuhan, China. Furthermore, uncertainty about the sustainability of growth is rapidly increasing, as semiconductor stocks have fallen across the board due to concerns about OpenAI’s earnings.

TOC

Main News

  1. Omdia Revises Upward Semiconductor Market Forecast for 2026, 62.7% Year-Over-Year Growth on Soaring Memory Prices
    Market research firm Omdia has revised its semiconductor market growth forecast for 2026 sharply upward to 62.7% year-on-year growth. The explosive growth in demand for artificial intelligence infrastructure is the main reason for the soaring prices and growing supply shortages of high-performance memory used in data centers and other applications. The semiconductor market as a whole is entering into an unprecedentedly rapid growth cycle, which is having a tremendous impact on the industry’s overall capital investment and production plans.
  2. U.S. Chip Packaging Capacity to Reach 10% by 2032
    The U.S. share of the global semiconductor packaging market is projected to reach 10% by 2032. The current heavy reliance on Asia for back-end manufacturing capacity is increasingly shifting back to the continental U.S. Amkor’s strong performance, TSMC’s Arizona plant expansion, and other economic security-driven supply chain realignments are paying off with massive investments in home-grown production of advanced packaging. The huge investment in home production of advanced packaging is bearing fruit.
  3. TEL Fined NT$150 Million in TSMC 2nm Confidentiality Leak Case
    A NT$150 million fine has been levied against Tokyo Electron Limited (TEL) in connection with a confidentiality leak case involving Taiwan TSMC’s cutting-edge 2nm process. Although the company claims that no confidential data was leaked and is still in discussions, this issue is being analyzed as having a deeper background than a simple data leak. In the intensifying competition for technological supremacy, the information management systems and economic and security governance of semiconductor equipment manufacturers are being severely questioned.
  4. Samsung is rapidly building a new semiconductor plant in Pyongtaek to mass produce HBM4
    Samsung Electronics of Korea is rapidly building a new semiconductor plant in Pyongtaek to establish the superiority of HBM4, the next-generation broadband memory, and to secure a dominant position in the AI memory market. In the HBM market, which is indispensable for improving the performance of data centers, Samsung Electronics is poised to win the fierce battle for supremacy by quickly establishing a mass production system for next-generation products through massive capital investment in order to keep pace with rivals and other companies.
  5. Nvidia Signs Largest-Ever Office Lease in Bangalore, India
    Nvidia, the U.S. company with a dominant share of the AI semiconductor market, has reportedly signed its largest-ever office lease in Bangalore, India. Nvidia has positioned India as an important strategic base against the backdrop of the rapidly growing AI boom in the country and the government’s support for infrastructure development. The company is further accelerating its global business development to secure talented engineers and expand its presence in the huge emerging market.
  6. Intel’s Xeon Priority Causes CPU Shortage, Providing Market Opportunity for AMD and MediaTek
    Intel’s priority on producing its highly profitable Xeon data center processors has created a supply shortage in the CPU market for general PCs and other applications. The surge in demand for AI inference is upsetting the supply-demand balance in the processor market, creating a major ripple effect on companies’ product strategies and market share battles.
  7. Wuhan City in China Announces US$38 Billion Plan; YMTC and XMC to Lead Memory Expansion
    The Chinese city of Wuhan has announced a massive US$38 billion investment plan to strengthen its semiconductor industry. In particular, YMTC and XMC, the country’s leading memory manufacturers, will take the lead in significantly expanding production capacity for flash memory and other products. While under siege by strict U.S. export controls, China continues to invest enormous amounts of money at the national level and is furiously working to make its semiconductor supply chain fully independent and raise the level of its technological capabilities.
  8. TSMC’s CoWoS Wafer ASPs Close to 7nm Levels, Advanced Packaging Becomes Major Revenue Source
    It has been reported that the average selling price (ASP) per wafer for CoWoS, an advanced packaging technology offered by TSMC, has soared to nearly the level of the front-end 7nm process. The value of back-end technology, which is essential for improving the performance of AI chips, has skyrocketed, transforming advanced packaging into an extremely important major source of revenue for the company. The increasing sophistication of packaging technology is shifting the center of gravity of value-added semiconductor manufacturing.
  9. CXL is the Next-Generation Battleground After HBM; Samsung Announces 10X Performance Improvement System
    Compute Express Link (CXL) is emerging as the next-generation memory interface technology to follow wide-bandwidth memory (HBM) as the new battleground. Samsung Electronics has reportedly announced a new system that leverages this CXL technology to achieve a 10x performance improvement over previous systems.With the explosive growth of AI data processing, the race to develop next-generation architectures to break through memory capacity and bandwidth barriers is already heating up.
  10. U.S. Dow continues to fall on reports of OpenAI missing revenue targets, semiconductor-related stocks all lower
    The Dow Jones Industrial Average continued to fall in the U.S. stock market following reports that OpenAI, a leader in AI development, is concerned that it has missed its revenue targets. The news raised market caution about the sustainability of the AI boom, causing semiconductor-related stocks, which had been the market’s main driver to date, to fall across the board. The delay in monetizing AI in the real economy is perceived as a risk that could throw cold water on the semiconductor industry’s massive investment cycle.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Apr 28, 12:022032年までに米国のチップパッケージング能力が10%に達すると予測されるUS chip packaging capacity to hit 10% by 2032https://www.digitimes.com/news/a20260428PD216/capacity-packaging-osat-reshoring-tsmc.html
Apr 28, 15:35Nanya、LPDDRでNvidiaのAIメモリエコシステムに参入Nanya breaks into Nvidia’s AI memory ecosystem with LPDDRhttps://www.digitimes.com/news/a20260428VL218/nvidia-rubin-dram-packaging-production.html
Apr 28, 15:01Amkor、2026年第1四半期で堅調な業績を記録、先進パッケージングは前年比3倍に成長すると予想Amkor records strong 1Q26, advanced packaging expected to triple YoYhttps://www.digitimes.com/news/a20260428VL214/amkor-packaging-revenue-2026-arizona.html
Apr 28, 11:37Intel、Xeonを優先;CPU不足がAMDおよびMediaTekにチャンスをもたらすIntel prioritizes Xeon; CPU shortage opens door for AMD and MediaTekhttps://www.digitimes.com/news/a20260428PD208/intel-cpu-gpu-genai-demand-amd-mediatek.html
Apr 28, 07:33TSMCの2nm漏洩事件、TELに1億5000万ニュー台湾ドルの罰金;同社は機密データ漏洩はなかったとし、協議中TSMC 2nm leak case results in NT$150M fine for TEL; company says no confidential data was leaked and discussions are underwayhttps://www.digitimes.com/news/a20260427PD239/tokyo-electron-tsmc-2nm-taiwan-subsidiary.html
Apr 28, 16:42Nvidia、インドのAIブーム加速を背景に、バンガロールオフィスの過去最高リース契約を締結Nvidia signs record Bengaluru office lease as India AI push accelerateshttps://www.digitimes.com/news/a20260428VL217/nvidia-india-expansion-infrastructure-technology.html
Apr 28, 15:15台湾、AIが電子機器ブームを牽引し、2026年の輸出額が8000億米ドルを超える見込みTaiwan’s 2026 exports set to top US$800 billion as AI fuels electronics surgehttps://www.digitimes.com/news/a20260428PD241/exports-taiwan-2026-electronics-demand.html
Apr 28, 15:13ASE、半導体防衛強化のため国家研究所とサイバーセキュリティに関するMOUを締結ASE signs cybersecurity MOU with national institute to shore up semiconductor defenseshttps://www.digitimes.com/news/a20260428PD240/ase-cybersecurity-semi-technology.html
Apr 28, 14:44Empyrean、利益減に伴い個人投資家から資金流入、これが中国のEDA企業の評価を試すEmpyrean draws retail inflows while profit falls, testing China EDA valuationshttps://www.digitimes.com/news/a20260428VL212/eda-profit-retail-software-design.html
Apr 28, 14:42Macronix、2026年第1四半期に利益を回復、供給逼迫とメモリ価格高騰を背景にMacronix returns to profit in 1Q26, citing tighter supply and higher memory priceshttps://www.digitimes.com/news/a20260428PD214/2026-profit-nand-revenue-growth.html
Apr 28, 13:49エージェンティックAIがCPU需要を急増させ、ASICやニッチチップメーカーを後押しするAgentic AI sparks CPU demand surge, boosting ASIC and niche chip makershttps://www.digitimes.com/news/a20260428PD230/ai-agent-asic-cpu-demand.html
Apr 28, 12:26分析:東京エレクトロンの中国問題は単なるデータ漏洩以上の深刻な背景があるAnalysis: Why Tokyo Electron’s China problem goes deeper than a data breachhttps://www.digitimes.com/news/a20260428PD206/tokyo-electron-supply-chain-equipment-governance-investment.html
Apr 28, 12:22Samsung、HBM4の利点をAIメモリ規模に変えるため、ピョンテクの工場建設を急ピッチで進めるSamsung fast-tracks Pyeongtaek fabs to turn HBM4 edge into AI memory scalehttps://www.digitimes.com/news/a20260428VL209/samsung-hbm4-fab-capacity-dram.html
Apr 28, 12:12中国のGPUメーカーLisuan、6nmチップでMicrosoft WHQL認証を取得Chinese GPU maker Lisuan secures Microsoft WHQL certification for 6nm chiphttps://www.digitimes.com/news/a20260428PD219/6nm-gpu-microsoft-windows-certification.html
Apr 28, 12:02Nvidia、GPUの割り当ては最高入札者ではなく先着順で行われると説明Nvidia says GPU allocation follows first-come, first-served principle, not highest bidderhttps://www.digitimes.com/news/a20260428PD221/nvidia-jensen-huang-gpu-demand-2026.html
Apr 28, 10:51武漢、380億米ドル規模の計画を発表;YMTCとXMCがメモリ拡大を牽引Wuhan unveils US$38 billion plan; YMTC and XMC lead memory expansionhttps://www.digitimes.com/news/a20260428PD211/ymtc-xmc-memory-chips-expansion-investment-2026.html
日経 Tech Foresight
マイナビニュース テックプラス
2026-04-28ソニー半導体事業率いた清水照士氏、AI Powerに参画 次世代セキュリティ半導体ATOM展開へhttps://news.mynavi.jp/techplus/article/20260428-4396951/
2026-04-282026年の半導体市場はメモリ高騰で前年比62.7%増へ、Omdiaが予測を上方修正https://news.mynavi.jp/techplus/article/20260428-4396635/
2026-04-28日立、フィジカルAI支える独自の半導体開発 省電力で現場実装も視野にhttps://news.mynavi.jp/techplus/article/20260428-4393163/
TrendForce
2026-04-28Xiaomiの次世代折りたたみ端末、自社開発のXRING O3チップ搭載の可能性、3nmプロセス採用も検討Xiaomi’s Next Foldable Reportedly to Feature Self-Developed XRING O3 Chip, May Use 3nm Processhttps://www.trendforce.com/news/2026/04/28/news-xiaomis-next-foldable-reportedly-to-feature-self-developed-xring-o3-chip-may-use-3nm-process/
2026-04-28CXLがHBM後の新たな戦場に?Samsung、10倍の性能向上を実現するシステムを発表と報じられるCXL May Emerge as Post-HBM Battleground; Samsung Reportedly Presents System with 10× Performance Gainhttps://www.trendforce.com/news/2026/04/28/news-cxl-may-emerge-as-post-hbm-battleground-samsung-reportedly-presents-system-with-10x-performance-gain/
2026-04-28TSMCのCoWoSウェーハASP、7nm水準に迫ると報じられ—先進パッケージングが主要な収益源にTSMC CoWoS Wafer ASP Reportedly Nears 7nm; Advanced Packaging to Become a Key Profit Driverhttps://www.trendforce.com/news/2026/04/28/news-tsmc-cowos-wafer-asp-reportedly-nears-7nm-levels-advanced-packaging-poised-to-become-a-key-profit-driver/
2026-04-28MacronixのNAND売上、SamsungのMLC撤退で前年同期比382%急増—深刻化する供給逼迫の中、月次価格制へ移行Macronix NAND Sales Jump 382% YoY on Samsung’s MLC Exit, Shifts to Monthly Pricing Amid Deepening Crunchhttps://www.trendforce.com/news/2026/04/28/news-macronix-nand-revenue-jumps-382-yoy-on-samsungs-mlc-exit-shifts-to-monthly-pricing-amid-deepening-crunch/
2026-04-28中国の推論GPU企業Sunrise、10億元以上の資金調達を達成—評価額は100億元を超えると報じられるChina Inference GPU Firm Sunrise Secures Over RMB 1B in Funding, Valuation Reportedly Exceeds RMB 10Bhttps://www.trendforce.com/news/2026/04/28/news-china-inference-gpu-firm-sunrise-secures-over-rmb-1b-in-funding-valuation-reportedly-exceeds-rmb-10b/
Semiconductor Digest
26 minutes agoNEO Semiconductor、3D X-DRAMの概念実証を実施し、AIメモリ向上のための戦略的投資を確保NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memoryhttps://www.semiconductor-digest.com/neo-semiconductor-demonstrates-3d-x-dram-proof-of-concept-secures-strategic-investment-to-advance-ai-memory/
36 minutes agoKopin、Fabric.AIと協力しAIインフラ向けの画期的なMicroLEDベース光インターコネクト技術を発表Kopin Announces Breakthrough MicroLED-Based Optical Interconnect Technology for AI Infrastructure in Collaboration with Fabric.AIhttps://www.semiconductor-digest.com/kopin-announces-breakthrough-microled-based-optical-interconnect-technology-for-ai-infrastructure-in-collaboration-with-fabric-ai/
45 minutes agoAtomera、Synopsysとの協力関係を拡大Atomera Extends Collaboration With Synopsyshttps://www.semiconductor-digest.com/atomera-extends-collaboration-with-synopsys/
48 minutes agoIntelとFPT、デジタル製造プラットフォームを活用しAI駆動型自律工場の実現に向け協力Intel and FPT Collaborate to Advance AI-Driven Autonomous Factories with Digital Manufacturing Platformshttps://www.semiconductor-digest.com/intel-and-fpt-collaborate-to-advance-ai-driven-autonomous-factories-with-digital-manufacturing-platforms/
日本経済新聞
2026-04-29米国株、ダウ続落し25ドル安 半導体関連が全面安、オープンAIの収益懸念でhttps://www.nikkei.com/article/DGXZQOFL28C8P0Y6A420C2000000/
2026-04-29NYダウは続落 OpenAIの収益目標未達観測、半導体関連が全面安https://www.nikkei.com/article/DGXZQOFL290020Z20C26A4000000/
2026-04-29米国株、ダウ続落 半導体関連が全面安、好業績銘柄の買いは支えhttps://www.nikkei.com/article/DGXZQOFL28C8O0Y6A420C2000000/
2026-04-29ラピダス、半導体敗戦の歴史を繰り返さず 勝ち残りへ3つの反省https://www.nikkei.com/article/DGXZQOUC276MJ0X20C26A3000000/
2026-04-29OpenAI、売上高の目標未達と米報道 ハイテク株下落https://www.nikkei.com/article/DGXZQOGN28CNG0Y6A420C2000000/
2026-04-29ドイツ株28日 続落、米イラン協議の停滞を意識 仏株も下落https://www.nikkei.com/article/DGXZQOFL28COX0Y6A420C2000000/
2026-04-29三菱マテリアル、工具に使うタングステン製品を値上げ 最大3倍以上https://www.nikkei.com/article/DGXZQOUC28B0V0Y6A420C2000000/
2026-04-29ベトナムのAI開発支援、高市首相が表明へ アジアの言語モデル構築https://www.nikkei.com/article/DGXZQOUA28AAP0Y6A420C2000000/
2026-04-29デンソー、半導体で「同盟」再考も投資止めず ローム買収案取り下げhttps://www.nikkei.com/article/DGXZQOFD278BI0X20C26A4000000/
2026-04-29ソフトバンクG、事業説明に「AI・半導体」 社外取締役も2人交代https://www.nikkei.com/article/DGXZQOUC287XH0Y6A420C2000000/
ダイヤモンドオンライン
Apr 28 19:15三菱電機とホンハイが自動車事業で異例のタッグへ、「非トヨタ系」で手を組んだ日台大手メーカー2社それぞれの思惑とは?https://diamond.jp/articles/-/389231
Apr 28 10:30AI時代のデータセンターの需要急増に対応し、地域活性化につなげる「ワット・ビット連携」とは何か。https://diamond.jp/articles/-/388746
Apr 27 21:00日経平均6万円突破に浮かれる人が気づいていない「景気後退のシグナル」https://diamond.jp/articles/-/389101
Apr 27 20:00米国でひそかに進む製造業ブーム、その真相はhttps://diamond.jp/articles/-/389151
Apr 27 19:45ゲーム・アパレル・その他製造業界「3年後の予測年収」45社ランキング【2026年版】任天堂、バンダイナムコ、アシックスは何位?https://diamond.jp/articles/-/389124
Apr 26 22:00「スマホ化」が進行する産業用ロボット、自動車産業。日本企業の生き残りのカギとは?〈PR〉https://diamond.jp/articles/-/388395
Apr 26 19:35【JT・味の素・明治・日清食品】年収の浮沈で「損をした世代」は?若手が勝ち組のJT・明治・日清、味の素だけOB優位《20年間の年収推移を5世代別に独自試算・2026年版》https://diamond.jp/articles/-/382311
Apr 26 09:00沖電気工業の50代後半、課長級の年収は?【5000件の口コミ情報データ】https://diamond.jp/articles/-/389020
Apr 26 05:55孫正義やスティーブ・ジョブズ、アラン・ケイはどのように未来を思考したのか?https://diamond.jp/articles/-/388834
Apr 25 21:30子どもの「お金のセンス」を育てる“たった1つのコツ”【元外資系トレーダーママが教える】https://diamond.jp/articles/-/385462
Tom’s Hardware
2026-04-28 20:20科学者たちが500度セルシウスから絶対零度までの極限温度下でも確実に動作する電子機器を開発Scientists create electronic devices that function reliably at extreme temps ranging from 500 degrees Celcuis to absolute zerohttps://www.tomshardware.com/tech-industry/scientists-create-electronic-devices-that-function-reliably-at-extreme-temperatures-using-advanced-silicon-doped-beta-gallium-oxide-semiconductor-material
2026-04-28 20:04数十年前のスタックスネット以前に開発されたサイバー破壊ツールが正体を現し、NSAは『注目する必要はない』と記載していたDecades-old pre-Stuxnet cyber sabotage tool breaks cover, NSA listed it as ‘nothing to see here’https://www.tomshardware.com/software/security-software/decades-old-pre-stuxnet-cyber-sabotage-tool-breaks-cover-nsa-listed-it-as-nothing-to-see-here-fast16-targeted-nuclear-reactors-dam-design-and-other-high-precision-civil-engineering-software-years-before-stuxnet-broke-cover
2026-04-28 20:00EXPO 1.2は後日600シリーズのAM5マザーボードに搭載されるが、技術的理由によりCUDIMMサポートは部分的なものに留まるEXPO 1.2 will come to 600-series AM5 motherboards later, tech only enables partial CUDIMM supporthttps://www.tomshardware.com/pc-components/motherboards/expo-1-2-only-brings-partial-cudimm-support-due-to-lack-of-native-imc-compatibility-asus-also-working-on-updating-older-b650-and-x670-boards-with-expo-1-2
TechPowerup
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2026-04-28T20:19:36+00:00なぜUPDFが現時点で最も実用的なAdobeの代替手段の一つであるのかWhy UPDF Is One of the Most Practical Adobe Alternatives Right Nowhttps://www.techpowerup.com/348420/why-updf-is-one-of-the-most-practical-adobe-alternatives-right-now
2026-04-28T20:08:59+00:00Denuvo、Day-Zero DRMハイパーバイザーのクラッキングに対応:「すでに新たなセキュリティバージョンの開発を進めています」Denuvo Responds to Day-Zero DRM Hypervisor Crack: “We’re Already Working on Updated Security Versions”https://www.techpowerup.com/348609/denuvo-responds-to-day-zero-drm-hypervisor-crack-were-already-working-on-updated-security-versions
2026-04-28T19:08:19+00:00The Blood of Dawnwalkerが新たなストーリートレーラー、PC向けシステム要件、発売日を発表The Blood of Dawnwalker Gets New Story Trailer, PC System Requirements and Release Datehttps://www.techpowerup.com/348612/the-blood-of-dawnwalker-gets-new-story-trailer-pc-system-requirements-and-release-date
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2026-04-28T16:20:08+00:00Logitech、新型G512 X TMRアナログ/メカニカルゲーミングキーボードを発表Logitech Introduces G512 X TMR Analog/Mechanical Gaming Keyboardhttps://www.techpowerup.com/348607/logitech-introduces-g512-x-tmr-analog-mechanical-gaming-keyboard
2026-04-28T15:48:06+00:00EU、100Wまでの新型ラップトップにUSB-C充電を必須化EU Now Requires USB-C Charging for New Laptops Up to 100 Whttps://www.techpowerup.com/348604/eu-now-requires-usb-c-charging-for-new-laptops-up-to-100-w
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2026-04-28T15:15:22+00:00MicrosoftのShader Model 6.10が、GPUのAIエンジンへ直接アクセスできるようにMicrosoft’s Shader Model 6.10 Opens Direct Access to GPU AI Engineshttps://www.techpowerup.com/348601/microsofts-shader-model-6-10-opens-direct-access-to-gpu-ai-engines
2026-04-28T15:14:26+00:00原子力宇宙戦闘シミュレーター『In The Black』が5月5日に発売Nuclear-Powered Space Combat Simulator In The Black Launches May 5https://www.techpowerup.com/348600/nuclear-powered-space-combat-simulator-in-the-black-launches-may-5
2026-04-28T15:02:43+00:00SapphireがNITRO+ PhantomLink Polar Editionを発売Sapphire Launches NITRO+ PhantomLink Polar Editionhttps://www.techpowerup.com/348599/sapphire-launches-nitro-phantomlink-polar-edition
EETimes Taiwan
2026-04-28AI算力狂騒が電力革命を呼び起こす―インフィニオンがデータセンターの高圧直流アーキテクチャを推進AI算力狂潮引發電力革命 英飛凌推動資料中心邁向高壓直流架構https://www.eettaiwan.com/20260428nt41-infineon-ai-data-center-power-architecture-hvdc-wbg/
2026-04-28歴史は繰り返される―AIが初級プログラマーを取って代わるのか?歷史正在重演 AI取代初級「碼農」?https://www.eettaiwan.com/20260428nt61-software-engineering-has-been-commoditized-and-automated-what-s-next/
2026-04-28FCSAはどのようにしてAIデータセンターのチップレット異種統合システムの基盤となるのか?FCSA如何成為AI資料中心chiplet異質整合系統基礎?https://www.eettaiwan.com/20260428nt31-fcsa-chiplet-heterogeneous-integration-ai-datacenter/
2026-04-282026年、折りたたみスマートフォン市場は年率20%増加2026年摺疊式智慧型手機市場年增20%https://www.eettaiwan.com/20260428nt21-foldable-smartphone-market-2026-apple-iphone-fold-trends/
2026-04-27リモート操作は自動運転車にどのような影響を与えるのか?遠端操控將如何影響自動駕駛車?https://www.eettaiwan.com/20260427nt31-teleoperation-how-will-it-impact-avs/
2026-04-27スマート製造の転換が加速―ロックウェルがAI運用の青写真を描く智慧製造加速轉型 Rockwell勾勒AI營運藍圖https://www.eettaiwan.com/20260427nt11-rockwell-outlines-ai-blueprint-for-smart-manufacturing-transformation/
2026-04-272026年、世界の新エネルギー車販売台数は年率14%増加2026年全球新能源車銷量年增14%https://www.eettaiwan.com/20260427nt21-global-ev-market-sales-forecast-2026-byd-tesla-geely/
EETimes Asia
2026-04-28ST、エントリーレベルMCUの性能と価値を再定義ST Redefines Entry-level MCU Performance and Valuehttps://www.eetasia.com/st-redefines-entry-level-mcu-performance-and-value/
2026-04-28ソウル・ヴァイオシス、600億ドル規模のAIデータセンター向け光通信市場に本格参入Seoul Viosys Gearing Up for $60B AI Data Center Optical Communications Markethttps://www.eetasia.com/seoul-viosys-gearing-up-for-60b-ai-data-center-optical-communications-market/
2026-04-28世界のスマートフォン出荷台数、メモリ不足の影響で2026年第1四半期に4%減少Global Smartphone Shipments Down 4% in 1Q 2026 Amid Memory Constraintshttps://www.eetasia.com/global-smartphone-shipments-down-4-in-1q-2026-amid-memory-constraints/
2026-04-28ファウンドリ優位の再考:4020億ドル規模の半導体製造市場における3つの重大な誤解Rethinking Foundry Dominance: Three Critical Misconceptions in the $402B Semiconductor Manufacturing Landscapehttps://www.eetasia.com/rethinking-foundry-dominance-three-critical-misconceptions-in-the-402b-semiconductor-manufacturing-landscape/
2026-04-27RambusのSOCAMM2サーバーモジュールチップセット、低消費電力AIプラットフォームを実現Rambus SOCAMM2 Server Module Chipset Enables Power-efficient AI Platformshttps://www.eetasia.com/rambus-socamm2-server-module-chipset-enables-power-efficient-ai-platforms/
2026-04-27T-Global、VC蒸気室の大量生産を強化し、第3四半期に新ベトナム工場でグローバル展開を拡大T-Global to Strengthen Strengthening VC Vapor Chamber Mass Production and Expand Global Footprint with New Vietnam Facility in Q3https://www.eetasia.com/t-global-to-strengthen-strengthening-vc-vapor-chamber-mass-production-and-expand-global-footprint-with-new-vietnam-facility-in-q3/
2026-04-27Omdia、2026年の半導体売上成長予測を上方修正Omdia Raises 2026 Semiconductor Revenue Growth Forecasthttps://www.eetasia.com/omdia-raises-2026-semiconductor-revenue-growth-forecast/
2026-04-27ASE、2025年の優秀サプライヤーを表彰ASE Recognizes Outstanding Suppliers of 2025https://www.eetasia.com/ase-recognizes-outstanding-suppliers-of-2025/
2026-04-27MZT、JSTの次世代エッジAI半導体研究開発プログラムに参加MZT Joins JST’s Next-gen Edge AI Semiconductor R&D Programhttps://www.eetasia.com/mzt-joins-jsts-next-gen-edge-ai-semiconductor-rd-program/
EETimes India
2026-04-282025年、インドのスマートフォン生産が前年比8%増加India Smartphone Production Up 8% YoY in 2025https://www.eetindia.co.in/india-smartphone-production-up-8-yoy-in-2025
2026-04-28STがエントリーレベルMCUの性能と価値を再定義ST Redefines Entry-level MCU Performance and Valuehttps://www.eetindia.co.in/st-redefines-entry-level-mcu-performance-and-value/
2026-04-28ソウル・ヴィオシス、600億ドル規模のAIデータセンター光通信市場に向けて準備中Seoul Viosys Gearing Up for $60B AI Data Center Optical Communications Markethttps://www.eetindia.co.in/seoul-viosys-gearing-up-for-60b-ai-data-center-optical-communications-market/
2026-04-28Rambus SOCAMM2サーバーモジュールチップセットが、省電力なAIプラットフォームを可能にするRambus SOCAMM2 Server Module Chipset Enables Power-efficient AI Platformshttps://www.eetindia.co.in/rambus-socamm2-server-module-chipset-enables-power-efficient-ai-platforms/
2026-04-27MeitYがインド独自のシリコンフォトニクス技術ソリューションを発表MeitY Unveils India’s Indigenously Developed Silicon Photonics Technology Solutionshttps://www.eetindia.co.in/meity-unveils-indias-indigenously-developed-silicon-photonics-technology-solutions/
2026-04-27半導体業界のベテラン Ravi Kumar Chirugudu がTessolveの社長兼COOに就任Semiconductor Industry Veteran Ravi Kumar Chirugudu Appointed President & COO of Tessolvehttps://www.eetindia.co.in/semiconductor-industry-veteran-ravi-kumar-chirugudu-appointed-president-coo-of-tessolve/
2026-04-27ST、2026年第1四半期の売上増加とマージン改善を報告ST Reports Revenue Growth, Improved Margins for 1Q 2026https://www.eetindia.co.in/st-reports-revenue-growth-improved-margins-for-1q-2026/
2026-04-27MacDermid AlphaのRavi BhatkalがINEMI理事会の副会長に選出MacDermid Alpha’s Ravi Bhatkal Elected Vice Chairman of INEMI Boardhttps://www.eetindia.co.in/macdermid-alphas-ravi-bhatkal-elected-vice-chairman-of-inemi-board/
ZDNET Korea
2026-04-29ドゥサンテスナ, 1909億ウォンの半導体テスト装置買収…ピョンテク2工場への投資再開두산테스나, 1909억원 반도체 테스트 장비 인수…평택 2공장 투자 재개https://www.zdnet.co.kr/20260429004504” title=”
2026-04-28ペ副総理「韓国政府もミトステスト…AIがセキュリティ規則を変える」배 부총리 “한국정부도 미토스 테스트…AI가 보안 규칙 바꿔”https://www.zdnet.co.kr/20260428223213” title=”
2026-04-28「ノートパソコンOLED供給過剰、2029年マックブックエア発売後に解消見通し」“노트북 OLED 공급과잉, 2029년 맥북에어 출시 후 해소 전망”https://www.zdnet.co.kr/20260428215202” title=”
2026-04-28「サイバーと宇宙連携」…S2W、テレピックスとのMOU“사이버와 우주 연계”…S2W, 텔레픽스와 MOUhttps://www.zdnet.co.kr/20260428205155” title=”
2026-04-28ハンギテ、AIコンピューティングセンターの開所…「実務型AI人材育成」한기대, AI 컴퓨팅센터 개소…”실무형 AI 인재 양성”https://www.zdnet.co.kr/20260428203852” title=”
2026-04-28イ大統領、ハジョング AI未来企画首席の辞表を再承認李대통령, 하정우 AI미래기획수석 사표 재가https://www.zdnet.co.kr/20260428203514” title=”
2026-04-28昨年のAIベンチャー投資は1兆3000億ウォン…全体の19.6%を占める작년 AI 벤처투자 1조3000억…전체 19.6% 차지https://www.zdnet.co.kr/20260428195410” title=”
2026-04-28「第3四半期だけ黒字」ハンファソリューション、米国太陽光事業が本格的に反発期待‘3분기만 흑전’ 한화솔루션, 美 태양광 사업 본격 반등 기대https://www.zdnet.co.kr/20260428162530” title=”
2026-04-28昨年、公共機関847カ所が中期製品で126兆ウォンを購入작년 공공기관 847곳 중기 제품 126조 구매https://www.zdnet.co.kr/20260428185744” title=”
2026-04-28サムソン電機「AI時代、協力会社と差別化技術を開発」…共生協力デーを開催삼성전기 “AI 시대, 협력사와 차별화 기술 개발”…상생협력데이 개최https://www.zdnet.co.kr/20260428184509” title=”
2026-04-28サムソン電子、一部の家電事業を外注生産へ転換を推進삼성전자, 가전사업 일부 외주생산 전환 추진https://www.zdnet.co.kr/20260428182406” title=”
2026-04-28サムソン電子「エクシノス2600、AI基盤『ENSS』を適用し性能と効率を確保」삼성전자 “엑시노스2600, AI 기반 ‘ENSS’ 적용해 성능·효율 확보”https://www.zdnet.co.kr/20260428181543” title=”
2026-04-28UNIST「複雑なマイクロ・エッフェル塔も60秒で3Dプリント」UNIST “복잡한 마이크로 에펠탑도 60초만에 3D 프린팅”https://www.zdnet.co.kr/20260428181830” title=”
2026-04-28マスワークス、シミュリンクにAIコパイロットを搭載…設計・検証の自動化매스웍스, 시뮬링크에 AI 코파일럿 심었다…설계·검증 자동화https://www.zdnet.co.kr/20260428181205” title=”
2026-04-28『コピペ翻訳は終わり』…グローバルを狙うカカオワーク、チャット画面でAI翻訳を『即時実行』“복붙 번역 끝”…글로벌 노린 카카오워크, 채팅창서 AI 번역 ‘즉시 실행’https://www.zdnet.co.kr/20260428180713” title=”
2026-04-28インテルPC購入でAIマーケティングツールが付属…サイバーリンク、グローバルパートナーシップを締結인텔 PC 사면 AI 마케팅 툴 딸려온다…사이버링크, 글로벌 파트너십 체결https://www.zdnet.co.kr/20260428175704” title=”
2026-04-28[現場] 『K-AI国家代表チーム』発足…「AIエコシステムの構築からグローバル輸出まで」[현장] ‘K-AI 국가대표팀’ 출범…”AI 생태계 조성부터 글로벌 수출까지”https://www.zdnet.co.kr/20260428174905” title=”
2026-04-28メタ、マヌス買収に『事後ブレーキ』がかかった…中国「AI技術を譲れない」메타, 마누스 인수 ‘사후 제동’ 걸렸다…中 “AI 기술 못 넘겨”https://www.zdnet.co.kr/20260428173654” title=”
2026-04-28ジョイシティ『フリースタイルフットボールZ』、新モード『クラシック大戦』をアップデート조이시티 ‘프리스타일풋볼Z’, 신규 모드 ‘클래식 대전’ 업데이트https://www.zdnet.co.kr/20260428175030” title=”
2026-04-28ソルトウェア「クラウドを超え、AI・データプラットフォーム企業へ成長」솔트웨어 “클라우드 넘어 AI·데이터 플랫폼 기업으로 성장”https://www.zdnet.co.kr/20260428174923” title=”
中央日報
2026-04-29[大韓民国の中心、忠清] 都心インフラ構築、大規模投資誘致で活気が戻る[대한민국의 중심 충청] 도심 인프라 구축, 대규모 투자 유치로 살맛 난다https://www.joongang.co.kr/article/25424254
2026-04-29[大韓民国の中心、忠清] SKハイニックス工場誘致…中部地方の先端産業のメッカとして浮上[대한민국의 중심 충청] SK하이닉스 공장 유치…중부권 첨단산업 메카로 부상https://www.joongang.co.kr/article/25424244
2026-04-29「大統領、よくやったキム・ヨンナム」「地元の人、ユ・ウィドン」「祖国が頑張って」[ピョンテクの民意]“대통령 잘하니 김용남” “지역사람 유의동” “조국이 열심히 해” [평택을 민심]https://www.joongang.co.kr/article/25424229
2026-04-29[キム・ドンホの直撃インタビュー] 組織率13%の労働組合、全労働者代表となることで共生の道が開く[김동호의 직격인터뷰] 조직률 13% 노조, 전체 근로자 대표해야 상생 길 열린다https://www.joongang.co.kr/article/25424189
2026-04-29サムスン電子・バイオ労働組合委員長、総ストライキを目前に海外旅行の論争삼성전자·바이오 노조위원장, 총파업 앞두고 해외여행 논란https://www.joongang.co.kr/article/25424177
2026-04-29「株式比率15%さらに増やせる」…退職年金債券ミックスETFが14兆を突破“주식 비중 15% 더 늘릴 수 있다”…퇴직연금 채권혼합 ETF 14조 돌파https://www.joongang.co.kr/article/25424181
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