Semiconductor News 20251217

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Main News

  1. Samsung Close to Capturing Over 30% in HBM4 Memory Supply Contract for Nvidia
    Samsung Electronics is close to signing a contract to be responsible for over 30% of the HBM4 (6th generation high bandwidth memory) supplied to Nvidia in 2026. The company is said to have solved the yield problem of HBM3E and succeeded in stabilizing the quality of its 12-layer products, and is trying to regain its share of the HBM market, which had been dominated by SK Hynix. The company has also begun supplying HBM4 samples for a fee, clearly marking its return to power in the AI semiconductor supply chain.
  2. Samsung Chairman Meets with AMD and Tesla Leaders to Discuss Collaboration
    Samsung Chairman Lee Jae-yong held a series of meetings with AMD CEO Lisa Su and Tesla CEO Elon Musk, where they discussed cooperation with AMD in next-generation chip manufacturing and memory technology, and with Tesla in the areas of chips for automated driving and foundries. This is a strategic move to deepen the “alliance” with Big Tech and expand the AI and automotive semiconductor business in order to compete with TSMC.
  3. Intel Reorganizes Management Team and Appoints Trump Aide in Response to U.S. Government Investment
    Intel has reorganized its management team and strengthened its policy alignment in response to a confirmed investment from the U.S. government. Notably, Intel appointed a former economic advisor to the incoming Trump administration as senior vice president in charge of government affairs. This has allowed the company to strengthen its pipeline with Washington, ensure geopolitical support, and accelerate its restructuring in terms of both manufacturing technology and political power, including the completion of acceptance testing of second-generation High-NA EUV lithography equipment.
  4. Apple braces for DRAM cost spike as Korean suppliers rev ise prices
    Apple is bracing for a spike in DRAM procurement costs heading into 2026 following contract price revisions by Korean memory suppliers such as Samsung As the amount of memory installed increases due to enhanced AI capabilities and supply shortages combined with rising prices are putting significant pressure on the component cost structure of key products such as iPhones. This is a sign that even Apple, with its strong purchasing power, cannot avoid the effects of the memory market’s “supercycle.
  5. Global Semiconductor Equipment Sales to Break Record $156 Billion in 2027
    Global semiconductor equipment sales are projected to reach $156 billion in 2027, setting a new record. The AI boom is driving demand for a wide range of equipment, from front-end to back-end processing. Industry confidence is at record levels, while concerns about tight supply chains and infrastructure shortages are becoming more acute.
  6. China Reports that Domestically Produced Equipment is Moving into the Core Technology of the 1.4nm Process
    Chinese media reported that domestically produced semiconductor manufacturing equipment is moving into the core of the 1.4nm process. While U.S. export restrictions make it difficult to obtain advanced equipment, Chinese companies such as Naura are increasing the resilience of their supply chains through M&A and technology development. If true, this would be a significant breakthrough to break through the Western technology blockade and could affect the composition of future advanced process competition.
  7. Rapidus Deploys IBM’s Manufacturing Execution System at its Hokkaido Plant
    Rapidus of Japan has installed IBM’s Manufacturing Execution System (MES) at its IIM-1 semiconductor manufacturing site in Chitose, Hokkaido. This is the core system for mass production of 2nm generation logic semiconductors, and indicates that the partnership with IBM has deepened beyond the provision of design technology to the actual manufacturing operation level.
  8. PC Makers to Raise Product Prices in Q1 2026 in Response to Rising Memory Prices Major PC makers such as Acer and ASUS will reportedly follow Dell’s lead and pass on higher memory costs to product prices in Q1 2026. The price of DRAM and SSDs has reached its limit, and hardware price hikes are inevitable. The side effects of the AI boom are beginning to have a direct impact on the consumer market, with the possibility of seasonal demand distortions in the notebook market also being noted. ,,
  9. STMicro and Space X Celebrate 10 Years of Cooperation, Supply Dedicated Starlink Chips
    STMicroelectronics and SpaceX are celebrating the 10th anniversary of their cooperation, and have reported on their technological innovations, including the supply of dedicated chips for the Starlink satellite communications network. The growing importance of semiconductor technology to withstand the harsh environment of space and the expansion of satellite constellations indicate that the space industry is becoming a growth market of a scale that semiconductor manufacturers cannot ignore.
  10. Toshiba Introduces Siemens EDA Software for Semiconductor Design Innovation
    Toshiba Corporation announced today that it will introduce Siemens electronic design automation (EDA) software to accelerate the digital transformation (DX) of its semiconductor designs. The aim is to improve design efficiency and quality of power semiconductors and automotive devices. The move is aimed at shortening development cycles and securing technological superiority in the increasingly competitive power electronics market through the use of digital twin technology and other technologies.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Dec 16, 11:10サムスン、2026年にNvidiaのHBM4メモリの30%以上を供給する契約に近づくSamsung nears deal to supply over 30% of Nvidia’s HBM4 memory in 2026https://www.digitimes.com/news/a20251216PD218/hbm4-samsung-nvidia-2026-sk-hynix.html
Dec 16, 15:00Intel、米政府投資を受けて経営陣再編で方針の整合性を強化Intel deepens policy alignment with executive reshuffle following US government investmenthttps://www.digitimes.com/news/a20251216PD232/intel-personnel-usa-investment.html
Dec 16, 12:03Baiduの昆倫芯子会社、GoogleのTPU戦略を踏襲Baidu’s Kunlunxin spinoff mirrors Google’s TPU playbookhttps://www.digitimes.com/news/a20251216PD224/baidu-nvidia-google-tpu-ai-chip.html
Dec 16, 11:01サムスン、12層HBM3Eを安定させ、より大規模なGoogle TPUの注文を狙うSamsung steadies 12-Layer HBM3E, eyes larger Google TPU ordershttps://www.digitimes.com/news/a20251216PD211/samsung-hbm3e-tpu-google-performance.html
Dec 16, 10:48中国の半導体レジリエンス:ナウラのM&AとACMのHBM推進で米国輸出規制に抗うChina’s chip resilience: Naura M&A, ACM’s HBM push defy US export controlshttps://www.digitimes.com/news/a20251216PD215/naura-technology-acm-hbm-supply-chain-china.html
Dec 16, 17:28‘イマージョンリソグラフィの父’が警告:IntelのTSMC人材引き抜きがプロセステクノロジーの精査を招く‘Father of Immersion Lithography’ warns: Intel’s TSMC talent grab invites process tech scrutinyhttps://www.digitimes.com/news/a20251216PD242/intel-tsmc-technology-talent-manufacturing.html
Dec 16, 15:38中国、メタX GPUを採用して大規模モデルを超える脳に着想を得たAIを推進China taps MetaX GPUs to advance brain-inspired AI beyond big modelshttps://www.digitimes.com/news/a20251215VL208/china-ai-gpu-hardware-efficiency.html
Dec 16, 12:18ドロフィン・セミコンダクター、HCLTechとの協業でプラットフォーム主導・混合信号IPにシフトDolphin Semiconductor shifts toward platform-led, mixed-signal IP in HCLTech collaborationhttps://www.digitimes.com/news/a20251216VL202/india-ip-design-demand-electricity-management.html
Dec 16, 12:04CMI、コスト上昇と生産能力の課題の中で安定した受注と拡大計画を概説CMI outlines stable orders and expansion plans amid rising costs and capacity challengeshttps://www.digitimes.com/news/a20251216PD204/cmi-capacity-expansion-complex-micro-production.html
Dec 16, 11:16サムスン会長の李在鎔、リサ・スーおよびイーロン・マスクと会談し可能な協業を議論Samsung Chairman Lee Jae-yong meets with Lisa Su and Elon Musk to discuss potential collaborationhttps://www.digitimes.com/news/a20251216PD220/samsung-amd-lisa-su-tesla-elon-musk.html
Dec 16, 10:37エイサーCEO、メモリ価格高騰の中で各企業のレジリエンス強化を促すAcer CEO urges firms to boost resilience amid memory price surgehttps://www.digitimes.com/news/a20251216PD217/acer-ceo-jason-chen-price-chairman.html
Dec 16, 10:22Apple、韓国サプライヤーによる契約価格改定を受けてDRAMコスト急騰に備えるApple braces for DRAM cost surge as Korean suppliers reprice contractshttps://www.digitimes.com/news/a20251216PD206/apple-samsung-dram-cost-2026.html
Dec 16, 10:00スマートフォン業界、2026年にメモリ不足と価格上昇の中でコスト課題に直面Smartphone industry faces cost challenges in 2026 amid memory shortages and rising priceshttps://www.digitimes.com/news/a20251216PD203/high-end-smartphones-camera-cost-2026.html
Dec 16, 09:44ノートパソコン市場、2026年に季節需要の歪みが2年連続で見られる可能性Notebook market may see second consecutive year of seasonal demand distortion in 2026https://www.digitimes.com/news/a20251216PD201/notebook-market-demand-memory-chips-price-2026.html
Dec 16, 07:36SenseTimeのSeko 2.0、AI動画の突破口をCambriconチップと結びつけ、中国のマルチモーダル推進を示すSenseTime’s Seko 2.0 ties AI video breakthrough to Cambricon chips, signaling China’s multimodal pushhttps://www.digitimes.com/news/a20251215VL209/sensetime-cambricon-ai-chip-hardware.html
Dec 16, 07:34韓国、COMEUP 2025で中東投資家の参加を背景に世界の半導体資本を呼び込むSouth Korea lures global chip capital at COMEUP 2025 as Middle East investors step inhttps://www.digitimes.com/news/a20251215PD234/south-korea-ai-chip-startup-investment-2025.html
日経 Tech Foresight
2025-12-17京大など、宇宙通信用の周波数変調型レーザー 超小型化https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC116960R11C25A2000000
2025-12-17光電融合で官民連携、EUや米国が本格化 防衛用途も視野https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC164AG0W5A211C2000000
マイナビニュース テックプラス
2025-12-17ルネサスが第5世代R-Car向け開発プラットフォームを拡充、R-Car X5H評価ボードを提供https://news.mynavi.jp/techplus/article/20251217-3825237/
2025-12-16Rapidus、IBMの製造実行システムを半導体製造拠点「IIM-1」に導入https://news.mynavi.jp/techplus/article/20251216-3823167/
2025-12-16SCREEN、半導体製造装置事業強化に向け米・NYに海外開発拠点を開設https://news.mynavi.jp/techplus/article/20251216-3824155/
2025-12-16DNP、TGVガラスコア基板のパイロットラインを久喜工場内に新設https://news.mynavi.jp/techplus/article/20251216-3823679/
2025-12-16STマイクロとSpaceXの協力関係が10年を迎える スターリンク専用チップで技術革新https://news.mynavi.jp/techplus/article/20251216-3823323/
2025-12-16Rapidus、北海道千歳市の半導体製造拠点「IIM-1」にIBMの製造実行システムを導入https://news.mynavi.jp/techplus/article/20251216-3823639/
2025-12-16吉川明日論の半導体放談 第358回 NVIDIA依存からの脱却を図る中国と米ビッグテックhttps://news.mynavi.jp/techplus/article/semicon-358/
2025-12-16京大と京セラ、熱を計算資源として用いるリザバーコンピューティングを実証https://news.mynavi.jp/techplus/article/20251216-3822385/
TrendForce
2025-12-16インテル、初の第2世代高NA EUV受入テストを完了;ASML、2027~2028年の量産を見据えるIntel Completes First 2nd-Gen High-NA EUV Acceptance Testing; ASML Eyes 2027–28 Mass Productionhttps://www.trendforce.com/news/2025/12/16/news-intel-completes-first-2nd-gen-high-na-euv-acceptance-testing-asml-eyes-2027-28-mass-production/
2025-12-16サムスン、厳しいNAND供給下でコンシューマ向けSATA III SSD販売停止計画を否定と報じられるSamsung Reportedly Denies Plans to Halt Consumer SATA III SSDs Amid Tight NAND Supplyhttps://www.trendforce.com/news/2025/12/16/news-samsung-reportedly-denies-plans-to-halt-consumer-sata-iii-ssds-amid-tight-nand-supply/
2025-12-16AcerとASUS、Dellに追随し、1Q26に急騰するメモリコストをPCに転嫁すると報じられるAcer and ASUS Reportedly to Pass Surging Memory Costs to PCs in 1Q26, Hot on Dell’s Heelshttps://www.trendforce.com/news/2025/12/16/news-acer-and-asus-reportedly-to-pass-surging-memory-costs-to-pcs-in-1q26-hot-on-dells-heels/
2025-12-16インテル、トランプ側の関係者を政府担当シニアVPに任命し、ワシントンとの関係をさらに深めるIntel Appoints Trump Official as Senior VP of Government Affairs, Deepening Washington Tieshttps://www.trendforce.com/news/2025/12/16/news-intel-appoints-trump-official-as-senior-vp-of-government-affairs-deepening-washington-ties/
2025-12-16SK hynixとサムスン、1Q26契約前にNVIDIAへ有償のHBM4サンプルを提供したと報じられるSK hynix, Samsung Reportedly Deliver Paid HBM4 Samples to NVIDIA Ahead of 1Q26 Contractshttps://www.trendforce.com/news/2025/12/16/news-sk-hynix-samsung-reportedly-deliver-paid-hbm4-samples-to-nvidia-ahead-of-1q26-contract-finalization/
Semiconductor Digest
56 minutes agoAIブームが半導体業界の信頼感を記録に近い水準に押し上げるも、サプライチェーンとインフラへの懸念が深刻化AI-Boom Drives Semiconductor Industry Confidence to Near-Record High, But Supply Chain and Infrastructure Concerns Intensifyhttps://www.semiconductor-digest.com/ai-boom-drives-semiconductor-industry-confidence-to-near-record-high-but-supply-chain-and-infrastructure-concerns-intensify/
1 hour agoNHanced Semiconductorsが異種ハイブリッドボンディング生産で半導体業界を牽引NHanced Semiconductors Leads the Semiconductor Industry in Heterogeneous Hybrid Bonding Productionhttps://www.semiconductor-digest.com/nhanced-semiconductors-leads-the-semiconductor-industry-in-heterogeneous-hybrid-bonding-production/
5 hours ago東芝がシーメンスのEDAソフトで半導体設計革新を加速Toshiba to Accelerate Semiconductor Design Innovation with Siemens’ EDA Softwarehttps://www.semiconductor-digest.com/toshiba-to-accelerate-semiconductor-design-innovation-with-siemens-eda-software/
5 hours agoOmdia:2025年に自動車用OLEDパネル出荷が前年同期比11.8%増加へOmdia: Automotive OLED Panel Shipments to Grow 11.8% YoY in 2025https://www.semiconductor-digest.com/omdia-automotive-oled-panel-shipments-to-grow-11-8-yoy-in-2025/
5 hours ago世界の半導体装置販売額、2027年に1,560億ドルの記録を更新する見通しGlobal Semiconductor Equipment Sales Projected to Reach a Record of $156 Billion in 2027https://www.semiconductor-digest.com/global-semiconductor-equipment-sales-projected-to-reach-a-record-of-156-billion-in-2027/
日本経済新聞
2025-12-17NYダウ続落、302ドル安 労働市場の減速を警戒https://www.nikkei.com/article/DGXZQOFL1704A0X11C25A2000000/
2025-12-17米国株15時、ダウ続落 雇用や金融政策巡る不透明感https://www.nikkei.com/article/DGXZQOFL16D3L0W5A211C2000000/
2025-12-17半導体展示会「セミコン・ジャパン」開幕 過去最大規模https://www.nikkei.com/article/DGXZQOUC167720W5A211C2000000/
2025-12-17鹿島、建設大手初の売上高3兆円へ 2015年の「一人負け」から挽回https://www.nikkei.com/article/DGXZQOUC282400Y5A121C2000000/
2025-12-17NVIDIA対Google、AI半導体競争で笑うのはTSMCかhttps://www.nikkei.com/article/DGXZQOFL159E7TV11C25A2000000/
2025-12-17セミコン・ジャパンが開幕 12月17日ビジネス主な予定https://www.nikkei.com/article/DGXZQOUC12B2O0S5A211C2000000/
2025-12-17AIデータセンター、50万人分の水がぶ飲み 米国で建設急増が招く枯渇https://www.nikkei.com/article/DGXZQOUF2705X0X21C25A1000000/
2025-12-17渡邉光一郎 私の履歴書(16)渉https://www.nikkei.com/article/DGXZQOUB23BI30T20C25A6000000/
2025-12-17世界の主要半導体11社、7〜9月の純利益最高 AI好調・車載苦戦https://www.nikkei.com/article/DGXZQOUC28ABR0Y5A121C2000000/
2025-12-17日野市にAirソーラー設置モデルハウス 東京都が費用助成https://www.nikkei.com/article/DGXZQOCC168AK0W5A211C2000000/
ダイヤモンドオンライン
Dec 16 21:25なぜ、日本の半導体メーカーはNvidia/TSMCに比べて利益にありつけないのか?https://diamond.jp/articles/-/379609
Dec 16 20:00米中「AI冷戦」の均衡いつまで続く?日本企業に迫る「2026年のリスク」とはhttps://diamond.jp/articles/-/379590
Dec 16 19:45ふくおかFGは26年以降の「金利上昇&人口減少」時代にどう挑む?五島社長が語る「FG体制の強み」とROE10%達成への道筋https://diamond.jp/articles/-/377851
Dec 16 19:05中国の対日強硬姿勢は“計算づく”、台湾問題の深刻な衝突回避で日本に重要な「4つの注意点」https://diamond.jp/articles/-/379680
Dec 16 19:00NEC“中興の祖”関本社長が「われわれは宅急便業者」と明言!インターネット前夜に宣言した「付加価値通信で日本一」の自信https://diamond.jp/articles/-/379571
Dec 15 21:00TSMC熊本第1工場は“失敗”だったのか?第2建設「中断」報道に見る困惑と期待https://diamond.jp/articles/-/379586
Dec 15 20:05AIの次の挑戦:CEOから仕事を奪うhttps://diamond.jp/articles/-/379597
Dec 15 20:00AI熱狂とドットコム・バブル、不気味な類似点https://diamond.jp/articles/-/379596
Dec 15 19:252026年のドル円は「155~160円」のレンジ相場へ、サナエノミクスとトランプ政権のバラマキ財政が作る相場の死角https://diamond.jp/articles/-/379511
Dec 14 23:55「俺の知ってるプレリュードじゃない!」24年ぶり新型が“まるで別モノ”になった驚きのワケhttps://diamond.jp/articles/-/379453
Dec 14 20:00オラクルに付きまとう「オープンAIの影」https://diamond.jp/articles/-/379467
Tom’s Hardware
2025-12-16 22:13少年、父親所有の約4,000ドル相当のSamsung M.2 NVMe SSD50台を破壊Boy breaks 50 of his father’s Samsung M.2 NVMe SSDs worth nearly $4,000https://www.tomshardware.com/pc-components/ssds/boy-breaks-50-of-his-fathers-samsung-m-2-nvme-ssds-worth-nearly-usd4-000-25-600-gb-of-storage-ruined-by-ten-year-old-oblivious-to-global-nand-crisis
2025-12-16 22:06RAMまたはSSDのアップグレードを計画しているなら、迷わずすぐに行動すべきだとキングストン担当者が警告Don’t wait if you’re planning to upgrade your RAM or SSD, Kingston rep warnshttps://www.tomshardware.com/pc-components/ram/dont-wait-if-youre-planning-to-upgrade-your-ram-or-ssd-kingston-rep-warns-says-prices-will-continue-to-go-up-nand-costs-up-246-percent
2025-12-16 21:19サファイア社担当者は、DRAM価格が今後6~8ヶ月で安定に向かうと予測するも、「望む価格ではないかもしれない」と警告Sapphire rep predicts DRAM prices will begin to stabilize in the next 6-8 months, but warns ‘it may not be the prices we want’https://www.tomshardware.com/pc-components/dram/sapphire-rep-predicts-dram-prices-will-begin-to-stabilize-in-the-next-6-8-months-but-warns-it-may-not-be-the-prices-we-want-gpu-vendor-says-memory-crisis-is-similar-to-tariff-uncertainty
2025-12-16 20:59インテル、トランプ政権の経済顧問を政府関係担当部門の責任者に任命Intel appoints Trump economic advisor as head of government affairshttps://www.tomshardware.com/tech-industry/intel-appoints-trump-economic-advisor-as-head-of-government-affairs-announces-broader-leadership-shakeup-new-interim-cto
2025-12-16 20:54AIが設計した843部品搭載のデュアルPCB Linuxコンピューター、初回起動に成功Dual-PCB Linux computer with 843 components designed by AI boots on first attempthttps://www.tomshardware.com/tech-industry/artificial-intelligence/dual-pcb-linux-computer-with-843-components-designed-by-ai-boots-on-first-attempt-project-speedrun-was-made-in-just-one-week-and-required-less-than-40-hours-of-human-work
2025-12-16 20:00データセンター冷却の現状(2025年)― AIデータセンターで熱密度需要急増、液体冷却が台頭The data center cooling state of play (2025) – Liquid cooling is on the rise as thermal density demands skyrocket in AI data centershttps://www.tomshardware.com/pc-components/cooling/the-data-center-cooling-state-of-play-2025-liquid-cooling-is-on-the-rise-thermal-density-demands-skyrocket-in-ai-data-centers-and-tsmc-leads-with-direct-to-silicon-solutions
2025-12-16 20:00RoombaメーカーiRobot、破産を発表Roomba maker iRobot announces bankruptcyhttps://www.tomshardware.com/tech-industry/roomba-maker-irobot-announces-bankruptcy-brand-will-live-on-under-ownership-of-former-supplier
TechPowerup
2025-12-16T19:36:34+00:00ラーリアンのスウェン・ヴィンケ氏、DivinityはターンベースRPGになると発言、「次のレベル」体験を示唆Larian’s Swen Vincke Says Divinity Will be Turn-based RPG, Hints About “Next Level” Experiencehttps://www.techpowerup.com/344162/larians-swen-vincke-says-divinity-will-be-turn-based-rpg-hints-about-next-level-experience
2025-12-16T18:59:54+00:00サッカーパンチプロダクションズの共同創業者が退任、新たなリーダーシップコンビが明らかにSucker Punch Productions Co-Founder Stepping Down, New Leadership Duo Revealedhttps://www.techpowerup.com/344161/sucker-punch-productions-co-founder-stepping-down-new-leadership-duo-revealed
2025-12-16T18:54:08+00:00Netflixの最も賢い競争相手、もはや月額料金不要にNetflix’s Smartest Competitor No Longer Requires a Monthly Subscriptionhttps://www.techpowerup.com/344065/netflixs-smartest-competitor-no-longer-requires-a-monthly-subscription
2025-12-16T18:48:22+00:00Core Ultra 7 365のテストサンプルがGeekbenchで評価、スコアは世代間後退を示唆Core Ultra 7 365 Test Sample Gets Geekbenched, Scores Indicate Generational Regressionhttps://www.techpowerup.com/344159/core-ultra-7-365-test-sample-gets-geekbenched-scores-indicate-generational-regression
2025-12-16T18:38:56+00:00Microsoft、XboxワイヤレスヘッドセットをBluetooth LEオーディオ対応にアップデートMicrosoft updates the Xbox Wireless Headset with Bluetooth LE Audiohttps://www.techpowerup.com/344160/microsoft-updates-the-xbox-wireless-headset-with-bluetooth-le-audio
2025-12-16T18:14:14+00:00NVIDIAがクラウドアクセラレータの約72%を支配、AMDは5.8%NVIDIA Powers Nearly 72% of Cloud Accelerator Locations, AMD at 5.8%https://www.techpowerup.com/344158/nvidia-powers-nearly-72-of-cloud-accelerator-locations-amd-at-5-8
2025-12-16T17:46:34+00:00『ブラックホールに餌を与えるゲーム』がPC(Windows & Linux)向けにリリース“A Game About Feeding A Black Hole” Available Now on PC Windows & Linux Platformshttps://www.techpowerup.com/344157/a-game-about-feeding-a-black-hole-available-now-on-pc-windows-linux-platforms
2025-12-16T17:34:27+00:00MinisforumのEU & UKストアでEOP4A OCuLink外付けGPUカードの販売が開始Minisforum EU & UK Stores Start Selling EOP4A OCuLink External GPU Cardhttps://www.techpowerup.com/344155/minisforum-eu-uk-stores-start-selling-eop4a-oculink-external-gpu-card
2025-12-16T17:24:25+00:00FSP、S210 mATXスモールタワーケースシリーズを発売FSP Launches S210 mATX Small Tower Case Serieshttps://www.techpowerup.com/344152/fsp-launches-s210-matx-small-tower-case-series
2025-12-16T17:23:58+00:00Kingston、SSD不足が今後30日間で更に悪化する可能性を警告Kingston Warns SSD Shortage Will Get Worse in the Next 30 Dayshttps://www.techpowerup.com/344154/kingston-warns-ssd-shortage-will-get-worse-in-the-next-30-days
2025-12-16T16:58:49+00:00IDCによれば、2025年第3四半期の世界サーバ市場収益は61%増加Worldwide Server Market Revenue Increased 61% in Q3 of 2025, According to IDChttps://www.techpowerup.com/344153/worldwide-server-market-revenue-increased-61-in-q3-of-2025-according-to-idc
2025-12-16T16:58:01+00:00Team Cherry、『Sea of Sorrow』を発表 ― Hollow Knight: Silksong初のエクスパンションTeam Cherry Introduces “Sea of Sorrow” – Hollow Knight: Silksong’s First Expansionhttps://www.techpowerup.com/344151/team-cherry-introduces-sea-of-sorrow-hollow-knight-silksongs-first-expansion
2025-12-16T16:46:58+00:00AMD Ryzen AI 9 465 APUがGeekbenchで測定、『Gorgon Point』は僅かな性能向上に留まるAMD Ryzen AI 9 465 APU Geekbenched, “Gorgon Point” Offers Negligible Performance Leaphttps://www.techpowerup.com/344147/amd-ryzen-ai-9-465-apu-geekbenched-gorgon-point-offers-negligible-performance-leap
2025-12-16T16:04:48+00:00Ubisoft、March of GiantsのIPと開発チームを吸収 ― 以前はAmazon MontrealのタイトルだったUbisoft Absorbs March of Giants IP & Dev Team, Formerly an Amazon Montreal Gamehttps://www.techpowerup.com/344146/ubisoft-absorbs-march-of-giants-ip-dev-team-formerly-an-amazon-montreal-game
2025-12-16T15:53:40+00:00Beelink ME Proのティーザー映像、DIYで交換可能なAMD、Arm、Intel対応ボードシステムを紹介Beelink ME Pro Teaser Showcases DIY Swappable AMD, Arm, & Intel Board Systemhttps://www.techpowerup.com/344145/beelink-me-pro-teaser-showcases-diy-swappable-amd-arm-intel-board-system
2025-12-16T15:20:42+00:00Minisforum、Ryzen 9 8945HX搭載のBD895i SE MoDT ITXマザーボードを発表Minisforum Intros BD895i SE MoDT ITX Motherboard with Ryzen 9 8945HXhttps://www.techpowerup.com/344143/minisforum-intros-bd895i-se-modt-itx-motherboard-with-ryzen-9-8945hx
2025-12-16T15:20:30+00:00Aspyr、Deus Ex Remasteredの発売を延期、既存の予約注文を返金Aspyr Postpones Launch of Deus Ex Remastered, Refunds Existing Pre-ordershttps://www.techpowerup.com/344144/aspyr-postpones-launch-of-deus-ex-remastered-refunds-existing-pre-orders
2025-12-16T15:10:18+00:00Appleの『Baltra』AIチップ、2027年に発売予定と報じられ、推論専用設計の可能性もApple’s “Baltra” AI Chip Reportedly Launching in 2027, Could be Inference-only Designhttps://www.techpowerup.com/344142/apples-baltra-ai-chip-reportedly-launching-in-2027-could-be-inference-only-design
EETimes Taiwan
2025-12-16ヒューズでAIサーバ電源の核を守る コンカー・エレクトロニクスがEE Awards Asia大賞を連続受賞以保險絲守護AI伺服器電源核心 功得電子蟬聯EE Awards Asia大獎https://www.eettaiwan.com/20251216nt41-conquer-electronics-wins-ee-awards-asia-with-ai-server-fuse-innovation/
2025-12-16高圧GaN技術の移転——台湾から米国への戦略的配置?高壓GaN技術轉移——從台灣到美國的策略佈局?https://www.eettaiwan.com/20251216nt01-a-power-reshuffle-follows-gf-tsmc-gan-tie-up/
2025-12-16低コストNiCd充電器DIY:充電レベルが一目でわかる!低成本NiCd充電器DIY:電量一目瞭然!https://www.eettaiwan.com/20251216ta51-low-cost-nicd-battery-charger-with-charge-level-indicator/
2025-12-16市場変化に対応 ams OSRAMが早期にサプライチェーンの強靭性を強化應對市場變化 ams OSRAM及早強化供應鏈韌性https://www.eettaiwan.com/20251216nt11-strengthens-supply-chain-resilience/
2025-12-16先進メモリの価格が倍増する恐れ先進記憶體價格恐將倍增https://www.eettaiwan.com/20251216nt21-advanced-memory-prices-may-double/
2025-12-15グリーンエネルギーの発展を牽引 SiCとGaNが電源技術の新時代を切り開く引領綠能發展 SiC、GaN開啟電源技術新世代https://www.eettaiwan.com/20251215nt31-sic-and-gan-usher-in-a-new-generation-of-power-technologies/
2025-12-15FPGAを用いたポスト量子暗号の実現用FPGA實現後量子加密https://www.eettaiwan.com/20251215nt51-implementing-post-quantum-encryption-using-fpga/
2025-12-15データエンジンと量子防衛線を構築 NetAppが台湾におけるAIデータ戦略を明示打造資料引擎與量子防線 NetApp揭示在台AI資料策略https://www.eettaiwan.com/20251215nt11-netapp-unveils-ai-data-and-pqc-strategy-in-taiwan/
2025-12-152025年の新エネルギー車販売台数、前年比25%増加2025年新能源車銷量年成長25%https://www.eettaiwan.com/20251215nt21-2025-nev-sales-volume/
EETimes Asia
2025-12-16シーメンスとグローバルファウンドリーズ、グローバル半導体供給強化のためAI駆動製造アライアンスを拡大Siemens and GlobalFoundries Expand AI-Driven Manufacturing Alliance to Bolster Global Semiconductor Supplyhttps://www.eetasia.com/siemens-and-globalfoundries-expand-ai-driven-manufacturing-alliance-to-bolster-global-semiconductor-supply/
2025-12-16AIデータセンターが引き起こすレーザー不足AI Data Centers Driving Laser Shortageshttps://www.eetasia.com/ai-data-centers-driving-laser-shortages/
2025-12-16SEMIFIVE、国内AIチップ設計プロジェクトを獲得SEMIFIVE Lands AI Chip Design Projects in Japanhttps://www.eetasia.com/semifive-lands-ai-chip-design-projects-in-japan/
2025-12-15Digilent、EE Awards 2025 Product Award Asiaを受賞Digilent Wins EE Awards 2025 Product Award Asiahttps://www.eetasia.com/digilent-wins-ee-awards-2025-product-award-asia/
2025-12-15Lattice、2025年GSA賞を受賞Lattice Receives 2025 GSA Awardhttps://www.eetasia.com/lattice-receives-2025-gsa-award/
2025-12-15WolfspeedのSiCコンポーネントがトヨタのEVプラットフォームを支援Wolfspeed SiC Components Powering Toyota’s EV Platformshttps://www.eetasia.com/wolfspeed-sic-components-powering-toyotas-ev-platforms/
2025-12-15ルネサスのWi-Fi 6、Wi-Fi/Bluetooth LEコンボMCU、IoT・コネクテッドホーム向けRenesas Wi-Fi 6, Wi-Fi/Bluetooth LE Combo MCUs Targeted at IoT, Connected Home Applicationshttps://www.eetasia.com/renesas-wi-fi-6-wi-fi-bluetooth-le-combo-mcus-targeted-at-iot-connected-home-applications/
2025-12-15QuickLogicのeFPGA ハードIP、Idaho Scientific向けに暗号化柔軟性を実現QuickLogic eFPGA Hard IP to Enable Crypto Agility for Idaho Scientifichttps://www.eetasia.com/quicklogic-efpga-hard-ip-to-enable-crypto-agility-for-idaho-scientific/
2025-12-15HKUSTとSEMIが初のSIIAS 2025を共催HKUST and SEMI Co-Host Inaugural SIIAS 2025https://www.eetasia.com/hkust-and-semi-co-host-inaugural-siias-2025/
EETimes India
2025-12-15インテリジェントシグナルディスプレイ:車両の意図を伝える新たな言語Intelligent Signal Displays: The New Language for Vehicle Intenthttps://www.eetindia.co.in/intelligent-signal-displays-the-new-language-for-vehicle-intent/
2025-12-15ルネサス Wi‑Fi 6、Wi‑Fi/Bluetooth LEコンボMCU:IoTおよびスマートホームアプリケーション向けRenesas Wi-Fi 6, Wi-Fi/Bluetooth LE Combo MCUs Targeted at IoT, Connected Home Applicationshttps://www.eetindia.co.in/renesas-wi-fi-6-wi-fi-bluetooth-le-combo-mcus-targeted-at-iot-connected-home-applications/
2025-12-15ウォルフスピードのSiC部品がトヨタのEVプラットフォームを支えるWolfspeed SiC Components Powering Toyota’s EV Platformshttps://www.eetindia.co.in/wolfspeed-sic-components-powering-toyotas-ev-platforms/
2025-12-15TIのイノベーションが実現する、よりスマートで環境にやさしい未来TI Innovations Powering a Smarter, Greener Futurehttps://www.eetindia.co.in/ti-innovations-powering-a-smarter-greener-future/
2025-12-15Zetwerk、インドのEMS推進に伴い、部品重視・デザイン主導の製造を推進Zetwerk Advances Component-focused, Design-led Manufacturing Amid India’s EMS Pushhttps://www.eetindia.co.in/zetwerk-advances-component-focused-design-led-manufacturing-amid-indias-ems-push/
ZDNET Korea
2025-12-17デリムバス、壁掛け一体型ビデ「ウィレン エア」特許出願대림바스, 벽걸이형 일체형비데 ‘휠렌 에어’ 특허 출원https://www.zdnet.co.kr/20251217000535%22%20title=%22
2025-12-17オテックキャリア、プサンデータセンター向け冷却装置納入事業受注오텍캐리어, 부산 데이터센터 냉각장비 납품 사업 수주https://www.zdnet.co.kr/20251217000114%22%20title=%22
2025-12-16“19日で特許登録”…知財庁、超高速審査初成果“19일 만에 특허 등록”…지재처, 초고속심사 첫 성과https://www.zdnet.co.kr/20251216235718%22%20title=%22
2025-12-16ロボット産業振興院、ロボット活用製造革新支援事業説明会로봇산업진흥원, 로봇활용 제조혁신 지원사업 설명회https://www.zdnet.co.kr/20251216235049%22%20title=%22
2025-12-16ワイトゥソリューション、バイオ持分投資・ロボットM&Aで成長軸を確保와이투솔루션, 바이오 지분투자·로봇 M&A로 성장 축 확보https://www.zdnet.co.kr/20251216234711%22%20title=%22
2025-12-16‘3D マシンビジョン’ クレロボティクス、米・日市場進出‘3D 머신비전’ 클레로보틱스, 美·日 시장 진출https://www.zdnet.co.kr/20251216234127%22%20title=%22
2025-12-16[体験] “指紋を10回余りで操作…セキュリティは堅牢だが操作も簡便”[체험] “지문 10여번 터치로 사용…보안 막강한데 쓰기도 간편”https://www.zdnet.co.kr/20251216175736%22%20title=%22
2025-12-16ロボット融合研究院、繊維機械融合研究院と製造AXイノベーションで提携로봇융합연구원, 섬유기계융합연구원과 제조 AX혁신 맞손https://www.zdnet.co.kr/20251216231335%22%20title=%22
2025-12-16パールアビス 『黒い砂漠モバイル』、新規クラス『セラフィム』アップデート펄어비스 ‘검은사막 모바일’, 신규 클래스 ‘세라핌’ 업데이트https://www.zdnet.co.kr/20251216185915%22%20title=%22
2025-12-16パク・ユンヨン KT 次期代表の課題は박윤영 KT 차기 대표 과제는https://www.zdnet.co.kr/20251216182946%22%20title=%22
2025-12-16[ZD SW Today] ソルトウェア、AWS『AIサービスコンピテンシー』コンサルティング部門獲得 他[ZD SW 투데이] 솔트웨어, AWS ‘AI 서비스 컴피턴시’ 컨설팅 부문 획득 外https://www.zdnet.co.kr/20251216190525%22%20title=%22
2025-12-16『国内企業70%がAI教育を実施…来年はさらに拡大』“국내 기업 70% AI 교육 시행…내년엔 더 늘려”https://www.zdnet.co.kr/20251216185919%22%20title=%22
2025-12-16ビサン教育、AI基盤『英語テキストマスター』を公開비상교육, AI 기반 ‘영어 지문 마스터’ 공개https://www.zdnet.co.kr/20251216185826%22%20title=%22
中央日報
2025-12-17[単独] お金だけが全てではない…好調だったクーパン開発者の裏切り、なぜ[단독] 돈만은 아니다… 잘나가던 쿠팡 개발자의 배신, 왜https://www.joongang.co.kr/article/25390627
2025-12-17「こんな銘柄は『パイパイ』」…『的確な』アナリストレポートの読み方“이런 종목은 ‘빠이빠이'”…’족집게’ 애널리스트 보고서 보는 법https://www.joongang.co.kr/article/25390624
2025-12-17[中央時評] 国家資本主義 2.0時代、韓国の選択[중앙시평] 국가자본주의 2.0시대, 한국의 선택https://www.joongang.co.kr/article/25390575
2025-12-17[時論] 米国進出は『ディアスポラ ネットワーク』構築の機会[시론] 미국 진출은 ‘디아스포라 네트워크’ 구축 기회https://www.joongang.co.kr/article/25390574
2025-12-17[ポール・ドナーバンのマーケットナウ] 2026年、世界経済が受けるAI請求書[폴 도너번의 마켓 나우] 2026년 세계경제가 받게 될 AI 청구서https://www.joongang.co.kr/article/25390571
2025-12-17国家が先端産業を育てる…来年『国民成長ファンド30兆』による資金注入국가가 첨단산업 키운다…내년 ‘국민성장펀드 30조’ 수혈https://www.joongang.co.kr/article/25390562
BAIDU
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昨天09:45半導体装置ETF(159516)、昨日の資金純流入が1.7億元を超え、AI計算力やストレージチェーンへの投資拡大半导体设备ETF(159516)昨日资金净流入超1.7亿元,布局AI算力存力链…https://baijiahao.baidu.com/s?id=1851627515877578695&wfr=spider&for=pc
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