Semiconductor News 20251023

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1. Geopolitical Tensions Over Nexperia Disrupt Auto Supply Chain Dutch Minister Holds Conference Call with Beijing Amid Rising Tensions Over Ansei Semiconductor (Nexperia) Asset Freeze The Chinese side has urged the Netherlands to quickly resolve the Ansei Semiconductor issue. The Nexperia “runaway” has torn apart the global automotive industry chain and is causing serious concerns about the procurement of in-vehicle semiconductors, with Volkswagen (VW) planning to temporarily halt Golf production.
2. NVIDIA H100 GPU Goes to Space, Leveraging Solar Power and Vacuum for AI Data Center Initiative NVIDIA’s H100 AI chip will be the first AI accelerator in space to go into orbit. The project aims to pioneer an AI computing cloud data center free of terrestrial constraints by harnessing infinite solar power and utilizing the vacuum of deep space as a “celestial” heat sink. This move represents a new frontier for AI infrastructure.
3. OpenAI Diversifies Chip Suppliers to Challenge NVIDIA’s Inf rastructure Dominance OpenAI has adopted a strategy of diversifying its chip suppliers in order to challenge NVIDIA’s dominant position in infrastructure. This strategy is said to be based on “good match combinations” where the best chips are sourced from multiple companies. In addition, Broadcom and Marvell have won orders for AI accelerators from major customers such as AWS and Google, intensifying infrastructure competition in the AI market.
4. TSMC Strengthens Foundry Leadership on Robust AI Chip Packaging Demand TSMC is strengthening its leadership in “Foundry 2.0” on the back of robust demand for AI chip packaging. TSMC continues to play a central role in high-performance chip manufacturing in the AI era through advances in advanced packaging technology.
5. Samsung Unveils HBM4 Memory, Showcasing Competition with SK Hynix and Mic ron Samsung has made it clear that it will go head-to-head with SK Hynix and Micron in the AI data center memory market by unveiling its next-generation, high-performance memory, HBM4, to the public for the first time. Samsung also announced that it will be the first company to showcase its next-generation, high-performance HBM4 memory. In addition, Micron offers the industry’s highest capacity SOCAMM2 standard low-power DRAM for AI data centers, and JEDEC has announced that the SOCAMM2 standard is nearly complete, indicating that standardization and competition for high-performance memory is gaining momentum.
6. TSMC May Raise 2nm Prices; Customers Switching to Samsung Prematurely There are indications that TSMC may raise the price of its 2nm process, and whether major customers such as Qualcomm and MediaTek will switch some of their orders to Samsung Foundry However, supply chain sources are not sure whether the price of the 2nm process will be raised in the near future. However, supply chain sources believe that it is unlikely that both companies will switch their 2nm chip orders to Samsung due to timing and manufacturing constraints at this time.
7. High-Voltage GaN Acc elerates AI Data Center Transformation , Deploying 800VDC Architecture in Partnership with NVIDIA As high-voltage gallium nitride (GaN) technology accelerates the transformation of AI data centers, Power Integrations (PI) is working with NVIDIA to develop a more power efficient GaN enables highly efficient power conversion, solves the power consumption challenges of AI servers, and is seen as a critical technology for data center cooling and power density.
8. Competition for Supply of CCL Materials Intensifies as Demand for AI Server PCBs Intensifies Demand for PCBs (printed circuit boards) for AI servers is growing rapidly against the backdrop of strong demand for AI servers, and competition for the supply of CCL (copper-clad laminate) materials needed to manufacture them is intensifying. In response to this AI-driven PCB industry revolution, Ventec has announced next-generation PCB materials for AI servers and green electronics, and competition in technology development among material suppliers is also intensifying.
9. Chinese DRAM Giant CXMT Plans Shanghai IPO Aiming for US$42 B illion Valuation Chinese DRAM giant CXMT (Changxin Existence Profit Technology) is reportedly planning an IPO on the Shanghai Stock Exchange, aiming for a US$42 billion valuation. This move demonstrates China’s strong will to become self-sufficient and technologically “awakened” in the semiconductor and especially memory sectors. In addition, China’s ZJeagles continues to invest heavily in AI-related technologies, including breaking VCSEL’s funding record.
10. Intel’s Next-Generation “Nova Lake” CPUs to Feature 6th-Generation NPUs, Reinforcing AI PC Strategy Intel’s next-generation “Nova Lake” processors are expected to feature 6th-generation NPUs (neural processing units) and offer AI performance one generation ahead of “Panther Lake”. This is expected to accelerate the shift to AI PCs. This will accelerate the shift to AI PCs, while Intel will reportedly raise the price of existing Raptor Lake CPUs by 10%, citing “underperformance” of AI PCs.

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