Semiconductor News 20250613

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1. AMD Unveils Next-Generation Products and Strategy in AI/HPC AMD has announced that it will launch its next-generation 256-core EPYC Venice “Zen 6” CPU in 2026 and the EPYC Verano “Zen 7” CPU and Instinct MI500 GPU in 2027. The company also plans to launch the next generation Instinct MI400 accelerator with doubled computing power in 2026, and CEO Lisa Su expects the AI data center accelerator market to grow to $500 billion by 2028. MI350 series GPUs are liquid cooled and air-cooled AI solutions, illustrating the vision for an open AI ecosystem.
2. Samsung Fails NVIDIA’s HBM3E Test for Third Time Samsung has reportedly failed NVIDIA’s 12-Hi HBM3E test for the third time and is seeking recertification in September. This suggests competition and quality control challenges among major suppliers in the HBM market, where demand is growing in the AI sector.
3. Technology Competition between the U.S. and China and China’s Self-Sufficiency Move As the U.S. targets China’s semiconductor ambitions from the design stage, China has deployed Qimeng, an AI chip design system to reduce dependence on U.S. EDA tools, and CHIPX has begun production of 6-inch photonic chips in an effort to become technology independent. In addition, rare earths have emerged as a strategic bargaining chip in the U.S.-China trade negotiations as the bargaining power of semiconductors declines.
4. Investment and Collaboration in Japan’s Semiconductor Industry TSMC’s second Kumamoto plant is scheduled to begin construction after July 2025, and TSMC and the University of Tokyo have established a joint lab to strengthen semiconductor R&D and human resource development in Japan. In addition, Honda plans to invest in Rapidus to support Japanese 2nm chip development, and Tokyo Electron plans to triple its production capacity with a $728 million smart fab.
5. Micron Announces Major Investment in the U.S. Micron and the Trump Administration have announced increased investment in advanced DRAM manufacturing and R&D in the U.S. Micron will reportedly invest an additional 4.3 trillion yen in the U.S.
6. PCIe 7.0 Standard Officially Released and Optical Solutions Now Available PCI-SIG has announced the PCIe 7.0 standard, which enables transfer rates up to 128 GT/s, and the industry’s first PCIe optical solutions based on the 7.0 standard. This is an important advancement in meeting the demand for high-speed data transfers in data centers and AI.
7. NVIDIA ‘s Concerns About AI Business Outlook in China NVIDIA is concerned about the prospects for its AI business in China if U.S. export restrictions continue, suggesting that the company may exclude the region from its revenue projections. This illustrates the extent to which geopolitical factors can impact the business strategies of major technology companies.
8. Global Semiconductor Market Expected to Grow 11.2% in 2025 The global semiconductor market is expected to grow 11.2% in 2025, after factoring in the impact of U.S. tariffs. TechInsights also reported that the semiconductor industry showed a solid recovery in May, maintaining growth in line with expectations.
9. Evolution of HBM Cooling Technology and Predicted Adoption of Immersion Technology in HBM5 With cooling being the key to HBM competition, HBM5 is expected to adopt immersion technology. This indicates that effective thermal management is essential for the stable operation and further evolution of high-performance HBM.
10. Chinese MCU Providers Focus on Humanoid Robot Field Chinese MCU providers are turning to humanoid robots in the wake of the generative AI boom. Morgan Stanley analyzes that China is leading the U.S. to “undermine” the U.S. in advanced robotics manufacturing, and competition in this area is intensifying.

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