Semiconductor News 20250603

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• 1. TSMC ‘s progress in miniaturization technology and intensifying competition TSMC’s 2nm process yield has reportedly surpassed 90%, while the 1.4nm process (Angstrom) is expected to cost as high as $45,000 per wafer, which may affect customer order consideration. While Samsung is struggling with 3nm, China’s SMIC is breaking through to 5nm, and the race to miniaturization continues.
  2. Nvidia ‘s AI Chip Strategy and Strong Performance Nvidia is reportedly developing a new AI chip for China that meets U.S. export control regulations, and revenue increased 69% despite the cost of a chip embargo against China AI infrastructure bottlenecks are driving interest in hardware startups, and Nvidia is working on a new AI chip for China that will meet U.S. export control regulations, Nvidia says “buy more, build more” for AI factories.
  3. Wolfspeed Struggles in the Silicon Carbide (SiC) Market and the Rise of China Wolfspeed is struggling with mistakes and poor performance and is feeling pressure as China is closing the gap in the SiC field, with the largest SiC plant in China now in operation and responsible for 30% of domestic supply. Japan’s Renesas has suspended its SiC production plans in response to the intensifying Chinese challenge.
  4. Impact of U.S. EDA Regulations on Chinese Semiconductor Design The United States is implementing individualized EDA regulations, which are creating dense constraints on China’s chip design pipeline. The EDA regulations expose vulnerabilities in China’s advanced semiconductor designs and may increase revenue risks in China for EDA giants such as Synopsys and Cadence.
  5. Samsung ‘s Initiatives in Semiconductor and AI Samsung Electro-Mechanics is targeting TSMC’s packaging technology lead and plans to supply glass substrate samples to U.S. companies. Samsung also plans to enter the AI gaming market through a partnership with Perplexity and deeply integrate Perplexity as the default assistant in the Galaxy S26.
  6. Intel ‘s Next-Generation CPU Roadmap Confirmed In its TCC presentation slides, Intel officially confirmed the Nova Lake-S and Nova Lake-U CPU families in addition to the P-core-only Bartlett Lake-S (for desktops) and Panther Lake (for notebooks) officially confirmed. In addition, Intel is reportedly preparing HBM (high-bandwidth memory) alternatives for AI accelerators.
  7. Xiaomi’s XRing O1 Chip and Trends in In-House SoC Development Xiaomi’s XRing O1 has sparked a debate over its “in-house” chip with Arm DNA and its own AI engine Xiaomi is reportedly quickly implementing the lessons Apple learned over 15 years of developing in-house SoCs with this chip development It is reportedly quickly putting the lessons learned into practice.
  8. Development and Application of Glass Substrate Technology Progress is being made in the glass substrate area, with Applied Materials reportedly partnering with Absolics. In addition, Samsung Electro-Mechanics is supplying glass substrate samples to U.S. companies and is targeting TSMC’s packaging technology lead.
  9. AMD Radeon RX 9060 XT Market Launch and GPU/APU Competition AMD’s Radeon RX 9060 XT GPU is listed at several retailers, and AMD says market demand is healthy, although the price difference between the 8GB and 16GB models is small. Nvidia and MediaTek have also begun development of APUs for gaming notebooks, and competition from Intel/AMD is expected.
  10. Chinese Companies Investing and Expanding in the Semiconductor Sector Multiple reports indicate that China’s GreenTong Technology has acquired a 51%+ stake in Dama Semiconductor and plans to make a strategic shift into the semiconductor sector. Huawei has also invested in more than 60 Chinese semiconductor companies to build its domestic supply chain.

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