Today’s semiconductor news was a day of vivid intersections between intensifying competition among companies for AI infrastructure supremacy and the physical constraints of the supply chain. Inflationary pressure from tight supply and demand is spilling over into end products, as Broadcom warns of a TSMC capacity bottleneck in 2026 and ASUS announces a major PC price hike due to soaring component prices. Meanwhile, the shift to in-house semiconductor production and business models by giant companies is rapidly accelerating, as seen in Arm’s entry into the silicon business with AI chips for data centers and Tesla’s pulling out of TSMC personnel in Taiwan. In addition, as demonstrated by Huawei’s announcement of its new AI chip, the industry’s power structure has also been shaken significantly by the shift to self-reliance against the backdrop of geopolitical risks.
TOC
Main News
- Broadcom Warns of TSMC Capacity Bottleneck in 2026
Broadcom has warned that TSMC’s production capacity will be a critical bottleneck in semiconductor manufacturing in 2026.As foundry supply tightens due to surging demand for AI semiconductors, related components such as lasers and PCBs The entire supply chain supporting the construction of AI infrastructure will be severely impacted by delays in component procurement and increased manufacturing costs. - TSMC to Start 3nm Mass Production in Late 2027 at Second Arizona Plant
TSMC is now considering starting mass production of its state-of-the-art 3nm process in late 2027 at its second plant under construction in Arizona, USA. According to press reports, the four plants to be built in the U.S. are already fully booked by customers. Against the backdrop of strong demand for cutting-edge semiconductors and the U.S. government’s strong policy of returning to domestic manufacturing, the establishment of supply chains and expansion of production capacity in the U.S. mainland is progressing at a faster-than-expected pace. - SK Hynix Accelerates M15X Plant Startup, Makes Huge Investment in ASML
SK Hynix has accelerated the startup of its M15X plant and opened a second clean room ahead of schedule in order to meet the rapidly growing demand for memory. In addition, SK Hynix has decided to invest a massive $8 billion in ASML’s EUV lithography equipment by 2027 in order to consolidate its dominance in the AI memory market. The company aims to significantly increase its next-generation memory production capacity and establish a competitive advantage over its competitors. - Arm Enters Silicon Business for the First Time with AGI CPU for Data Centers
Semiconductor design giant Arm has entered its own silicon business for the first time with the announcement of a CPU specifically designed for general-purpose artificial intelligence processing in data centers. This marks a historic shift in the competitive landscape of the AI hardware market. - Tesla Boosts Hiring for TeraFab in Taiwan, Targeting TSMC Talent
Tesla, led by Elon Musk, is rapidly expanding its recruitment efforts in Taiwan to promote its own semiconductor manufacturing project, TeraFab. The move by the IT giant to manufacture its own semiconductors for AI and vertically integrate its supply chain is causing a major stir in Taiwan’s semiconductor talent market. - Envidia Opens Server Racks to Competitive Chips to Focus on the Inference Era
Envidia has announced plans to open its server rack designs to competitive chips in anticipation of the next generation AI era, in which inference processing will take center stage. Going beyond simply providing GPUs, Envidia is restructuring its strategic partnerships to dominate the entire data center infrastructure. As the AI industry’s focus shifts from a race for hardware performance to the economics of inference costs, the company aims to further expand its role in cloud infrastructure. - Huawei Announces New AI Chip Ascend 950PR, 3 Times More Powerful than H20
China’s Huawei has announced a new AI compute processor, the Ascend 950PR. The chip is said to be about three times more powerful than NVIDIA’s H20 AI chip for China. It is a strategic product that fills the gap in AI computing power within China created by strict U.S. export controls, a move that demonstrates the tremendous speed at which AI semiconductor independence and technology development in China is progressing. - Trump Administration’ s “Pax Silica” Fund to Strengthen Global Semiconductor Supply Chain
The Trump Administration plans to establish a new “Pax Silica” fund aimed at strengthening the global semiconductor and AI supply chain. The strategic investment fund is designed to strengthen the foundation of the U.S. and its allies’ high-tech industries from an economic security perspective in the face of heightened geopolitical tensions. This massive government investment is expected to have a significant impact on the global semiconductor manufacturing base and the R&D ecosystem for next-generation technologies. - ASUS Warns of 25-30% PC Price Hike; Soaring CPU and Memory Prices to Hit
ASUS Taiwan has warned that PC prices could jump 25-30% in the second quarter on the back of soaring procurement costs for CPUs and semiconductor memory. The tight supply of components due to AI demand is pushing up the manufacturing cost of final products significantly, creating a strong inflationary wave in the consumer electronics market. - Tata Semiconductor Secures $735 Million for Chip Plant in India
India’s Tata Semiconductor has secured $735 million under strict financing terms for a new semiconductor manufacturing plant being built in Dholera, a large next-generation smart industrial city being developed in Gujarat The company has secured As the Indian government strengthens incentives to attract the semiconductor industry, this is an important step in the establishment of a full-scale semiconductor supply chain in the country. For related companies in Taiwan and elsewhere, opportunities for capital investment and technological cooperation in this new giant market are also expanding.
Tata Electronics semiconductor plant construction site (from DICDL website)
News List
| 投稿日 | 日本語タイトル | 原語タイトル | 記事URL |
|---|---|---|---|
| DIGITIMES | |||
| Mar 24, 08:03 | チップ格差：中国のAI競争において、アリババがテンセントをどのように引き離しているか | The chip gap: How Alibaba is pulling away from Tencent in China’s AI arms race | https://www.digitimes.com/news/a20260323PD228/alibaba-tencent-development-chips-investment.html |
| Mar 24, 14:38 | 分析：エヌビディアが推論時代に向けてパートナーを再編成する方法 | Analysis: How Nvidia is reshuffling partners for the inference era | https://www.digitimes.com/news/a20260324VL213/2023-groq-tsmc-samsung-gtc.html |
| Mar 24, 12:28 | 報道によると、SKハイニックスはM15Xの始動を前倒しで進め、2号クリーンルームを予定より早く開設した | SK Hynix reportedly advances M15X ramp, opens second cleanroom ahead of schedule | https://www.digitimes.com/news/a20260324VL210/sk-hynix-cleanroom-dram-production-demand.html |
| Mar 24, 10:47 | タタ・セミコンダクターが厳格な融資条件のもと、ドホレラのチップ工場向けに7億3500万ドルを確保 | Tata Semiconductor secures US$735 million for Dholera chip fab with strict lender conditions | https://www.digitimes.com/news/a20260324VL204/fab-loan-brand-production-subsidiary.html |
| Mar 24, 08:01 | サムスンとTSMC向けにウェーハを揺らす韓国企業を紹介 | Meet the South Korean firm wafer wobbling for Samsung and TSMC | https://www.digitimes.com/news/a20260323PD216/wafer-samsung-tsmc-equipment-data.html |
| Mar 24, 14:38 | ネクスペリアの混乱が現地化を加速；パンジットが世界のMOS市場で5%のシェアを狙う | Nexperia turmoil accelerates localization; Panjit targets 5% global MOS market share | https://www.digitimes.com/news/a20260324PD217/panjit-international-mosfet-mature-process-localization-2026-revenue.html |
| Mar 24, 12:47 | ハンファセミテックのSKハイニックスとのTCB取引が1,000億ウォンの保証を巡り注目を集める | Hanwha Semitech’s SK Hynix TCB deal draws scrutiny over KRW100 billion guarantee | https://www.digitimes.com/news/a20260324PD214/hanwha-equipment-sk-hynix-2025-hbm.html |
| Mar 24, 12:46 | MediaTekのAirohaが光通信DSPチップ分野で米大手に挑む | MediaTek’s Airoha takes on US giants in optical comms DSP chip arena | https://www.digitimes.com/news/a20260324PD219/airoha-expansion-data-mediatek-chips.html |
| Mar 24, 12:26 | 中国のAI GPUは装置とソフトウェアの制約に直面しているが、システムレベル設計が自立性を高める | China’s AI GPUs face equipment and software constraints, but system-level design boosts self-reliance | https://www.digitimes.com/news/a20260323PD229/equipment-wafer-design-software-ai-gpu.html |
| Mar 24, 11:58 | アリババ、玄鉄 C950およびC925を発表し、RISC-VをAIおよびエッジコンピューティングへ前進させる | Alibaba unveils XuanTie C950 and C925, advancing RISC-V into AI and edge computing | https://www.digitimes.com/news/a20260324VL212/alibaba-risc-v-flagship-processor-performance.html |
| Mar 24, 11:23 | トランプ政権の『Pax Silica』基金、世界の半導体およびAIサプライチェーンを強化へ | Trump administration’s ‘Pax Silica’ fund to strengthen global semiconductor and AI supply chains | https://www.digitimes.com/news/a20260324VL206/usa-semiconductors-investment-geopolitics.html |
| Mar 24, 10:50 | エヌビディア、自社サーバーラックを競合チップ向けに開放し、クラウドインフラの役割を拡大 | Nvidia opens server racks to rival chips, expanding cloud infrastructure role | https://www.digitimes.com/news/a20260324VL208/nvidia-server-rack-chips-design-cloud-infrastructure.html |
| Mar 24, 10:33 | ファーウェイのAscend 950PR、H20の約3倍の性能でデビューし、中国のAI計算能力格差を狙う | Huawei’s Ascend 950PR debuts with nearly 3x H20 performance, targets China’s AI compute gap | https://www.digitimes.com/news/a20260324PD210/huawei-ascend-performance-2026.html |
| Mar 24, 09:20 | 台湾のサプライチェーンに影響―インドが半導体支援策を強化 | Taiwanese supply-chain implications as India doubles down on semiconductor incentives | https://www.digitimes.com/news/a20260324PD201/india-electronics-materials-incentives-taiwan.html |
| Mar 24, 08:04 | ツァイス、台湾での投資を深化させ、半導体部門の新責任者をGMに起用 | Zeiss deepens Taiwan investment, taps new semiconductor lead as GM | https://www.digitimes.com/news/a20260323PD233/taiwan-investment-development-business-acquisition.html |
| Mar 24, 08:04 | 解説：チップ性能から推論経済学へ、ジェンセン・ファンがGTCでAI業界の動向を塗り替える | Commentary: From chip performance to inference economics, Jensen Huang rewrites AI industry trends at GTC | https://www.digitimes.com/news/a20260323VL214/nvidia-gtc-jensen-huang-ai-performance.html |
| 日経 Tech Foresight | |||
| 2026-03-24 | ラピダス「10年後の基盤」 CTO直下に技術戦略室や知財部 | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC231I80T20C26A3000000 | |
| マイナビニュース テックプラス | |||
| TrendForce | |||
| 2026-03-24 | ブロードコム、TSMCの生産能力を2026年のボトルネックと警告 ― レーザーやPCBも苦境に | Broadcom Reportedly Flags TSMC Capacity as 2026 Bottleneck, With Lasers and PCBs Also in the Squeeze | https://www.trendforce.com/news/2026/03/24/news-broadcom-reportedly-flags-tsmc-capacity-as-2026-bottleneck-with-lasers-and-pcbs-also-in-the-squeeze/ |
| 2026-03-24 | TSMC、アリゾナ第2ファブで2027年下半期からの3nm量産を検討 ― 米国の4工場は既に予約で埋まっている | TSMC Reportedly Eyes 2H27 3nm Mass Production at Arizona Fab 2; Four U.S. Fabs Said to Be Fully Booked | https://www.trendforce.com/news/2026/03/24/news-tsmc-reportedly-eyes-2h27-3nm-mass-production-at-arizona-fab-2-four-u-s-fabs-said-to-be-fully-booked/ |
| 2026-03-24 | SKハイニックス、AIメモリ覇権狙いで2027年までにASMLのEUV装置へ80億ドル投資を決定 | SK hynix Commits $8B to ASML EUV Equipment by 2027 in Push for AI Memory Dominance | https://www.trendforce.com/news/2026/03/24/news-sk-hynix-commits-8b-to-asml-euv-equipment-by-2027-in-push-for-ai-memory-dominance/ |
| 2026-03-24 | テスラ、台湾のTeraFabにおける採用を強化 ― TSMC出身の人材が主なターゲットと見られる | Tesla Reportedly Ramps TeraFab Hiring in Taiwan; TSMC Talent Seen as Primary Target | https://www.trendforce.com/news/2026/03/24/news-tesla-reportedly-ramps-terafab-hiring-in-taiwan-tsmc-talent-seen-as-primary-target/ |
| 2026-03-24 | ASUS、CPUとメモリ価格高騰を背景に、2QでPC価格が25〜30%上昇、3Q以降も更なる値上げの可能性を警告 | ASUS Reportedly Warns PC Prices Could Jump 25–30% in 2Q, Rising Further in 3Q Amid CPU, Memory Costs | https://www.trendforce.com/news/2026/03/24/news-asus-reportedly-warns-pc-prices-could-jump-25-30-in-2q-rising-further-in-3q-amid-cpu-memory-costs/ |
| Semiconductor Digest | |||
| 5 hours ago | Keysight、大学向け実習型半導体教育ラボを導入 | Keysight Introduces Hands-On Semiconductor Teaching Labs for Universities | https://www.semiconductor-digest.com/keysight-introduces-hands-on-semiconductor-teaching-labs-for-universities/ |
| 5 hours ago | Arm、シリコン製品向けにコンピュートプラットフォームを拡大 | Arm Expands Compute Platform to Silicon Products | https://www.semiconductor-digest.com/arm-expands-compute-platform-to-silicon-products/ |
| 5 hours ago | HKUの技術者、200GPaの硬さを持つインチスケールの超硬ダイヤモンドウェハーを設計・製造 | HKU Engineers Designed and Fabricated Inch-Scale Ultrahard Diamond Wafers with 200 GPa Hardness | https://www.semiconductor-digest.com/hku-engineers-designed-and-fabricated-inch-scale-ultrahard-diamond-wafers-with-200-gpa-hardness/ |
| 5 hours ago | プログラム可能な「スマートスタンプ」、微小チップを転写して3D回路を構築 | Programmable ‘Smart Stamp’ Transfers Microscopic Chips to Build 3D Circuits | https://www.semiconductor-digest.com/programmable-smart-stamp-transfers-microscopic-chips-to-build-3d-circuits/ |
| 5 hours ago | ASMPT、カメラモジュールの全コンポーネント向けにピック＆プレースシステムDALAを導入 | ASMPT Introduces Pick & Place System DALA For All Camera Module Components | https://www.semiconductor-digest.com/asmpt-introduces-pick-place-system-dala-for-all-camera-module-components/ |
| 日本経済新聞 | |||
| 2026-03-25 | 今日の株価材料（新聞など、25日）豊田織、TOBが成立 国内M&A最大の5.9兆円 | https://www.nikkei.com/article/DGXZQOFL24AA70U6A320C2000000/ | |
| 2026-03-25 | 米国株、ダウ反落し84ドル安 中東緊迫の長期化を懸念、停戦合意期待は支え | https://www.nikkei.com/article/DGXZQOFL24B6Z0U6A320C2000000/ | |
| 2026-03-25 | NYダウ小幅反落、84ドル安 イラン問題とAI不安が重荷 | https://www.nikkei.com/article/DGXZQOFL2500G0V20C26A3000000/ | |
| 2026-03-25 | 米国株、ダウ反落 中東緊迫の長期化を懸念、停戦交渉への期待は支え | https://www.nikkei.com/article/DGXZQOFL24B6U0U6A320C2000000/ | |
| 2026-03-25 | 北海電工社長「関東でM&A検討」 人材確保へ新研修施設建設も | https://www.nikkei.com/article/DGXZQOFC27AID0X20C26A2000000/ | |
| 2026-03-25 | 「レアアース版OPEC」唱えた中国 40年の計で価格支配、内外差4倍 | https://www.nikkei.com/article/DGXZQOUB104IE0Q6A210C2000000/ | |
| 2026-03-25 | 膨らむ低価格スマホのコスト メモリー代4倍、売価の9割に | https://www.nikkei.com/article/DGXZQOUB1849U0Y6A210C2000000/ | |
| 2026-03-25 | ホルムズ海峡から消えた船舶 中東緊迫、世界貿易減速へ | https://www.nikkei.com/article/DGXZQOCB220PU0S6A320C2000000/ | |
| 2026-03-25 | 能登の自給自足「現代集落」、ドコモなど参加へ 過疎対策の集積地に | https://www.nikkei.com/article/DGXZQOCC220OK0S6A320C2000000/ | |
| 2026-03-25 | アーム、半導体の自前開発に参入 メタやオープンAIに直接供給 | https://www.nikkei.com/article/DGXZQOGN24BUG0U6A320C2000000/ | |
| ダイヤモンドオンライン | |||
| Mar 23 21:00 | 外国人が2.4兆円も爆買い。日本人には手が届かない不動産・地価に迫る「下落」の足音 | https://diamond.jp/articles/-/386497 | |
| Mar 23 20:00 | 最悪のタイミングでも「外交的勝利」…日米首脳会談で高市首相がトランプを納得させた理由 | https://diamond.jp/articles/-/386505 | |
| Mar 23 19:55 | 知られざる好待遇メーカー横河電機が「5年でキャリア採用を4倍」に！社員の9割は武蔵野市勤務で転勤が少なく、離職率も低い理由とは？ | https://diamond.jp/articles/-/375585 | |
| Mar 23 19:10 | ロームに買収提案したデンソーが、あえて「子会社化という強硬策」に打って出た理由とは…2兆円規模に膨らみかねない買収資金の準備状況は？ | https://diamond.jp/articles/-/386521 | |
| Mar 23 04:00 | 【IRレポート／オイレス工業】摩擦・摩耗・振動技術で「すべり軸受」の業界トップランナー！ 株主優待拡充も発表！ | https://diamond.jp/articles/-/385587 | |
| Mar 22 20:05 | GPS空白地帯が拡大、次なる航法技術は | https://diamond.jp/articles/-/386358 | |
| Mar 21 23:00 | 【衝撃の1000億円投資】世界を変える量子コンピュータの“ダークホース”は結局何がすごいのか？ | https://diamond.jp/articles/-/386331 | |
| Tom’s Hardware | |||
| TechPowerup | |||
| 2026-03-24T22:23:02+00:00 | デノン、新型デノン ホーム200、400、600スピーカーを発表 | Denon Announces the New Denon Home 200, 400 & 600 Speakers | https://www.techpowerup.com/347681/denon-announces-the-new-denon-home-200-400-600-speakers |
| 2026-03-24T20:35:55+00:00 | エピックゲームズ、フォートナイトの低迷を受け1,000人を解雇 | Epic Games Lays Off 1,000 Workers Amid Fortnite Downturn | https://www.techpowerup.com/347671/epic-games-lays-off-1-000-workers-amid-fortnite-downturn |
| 2026-03-24T20:23:43+00:00 | ASUS、台湾でPC価格を30%引き上げ、他OEMも追随へ | ASUS Plans 30% PC Price Increase in Taiwan, Other OEMs to Follow | https://www.techpowerup.com/347679/asus-plans-30-pc-price-increase-in-taiwan-other-oems-to-follow |
| 2026-03-24T19:09:42+00:00 | AMD「Medusa Point」APUにRDNA 4m向けGPUターゲット「GFX1171」と「GFX1172」を搭載 | AMD “Medusa Point” APU Gets “GFX1171” and “GFX1172” RDNA 4m GPU Targets | https://www.techpowerup.com/347676/amd-medusa-point-apu-gets-gfx1171-and-gfx1172-rdna-4m-gpu-targets |
| 2026-03-24T18:03:14+00:00 | FCC、米国市場での新規外国製Wi‑Fiルーター販売を禁止 | FCC Bans New Foreign-Made Wi-Fi Routers From the U.S. Market | https://www.techpowerup.com/347672/fcc-bans-new-foreign-made-wi-fi-routers-from-the-u-s-market |
| 2026-03-24T17:33:35+00:00 | Arm、データセンター向けAGI CPUで初のシリコン事業参入 | Arm Enters Silicon Business for the First Time with Data Center AGI CPU | https://www.techpowerup.com/347670/arm-enters-silicon-business-for-the-first-time-with-data-center-agi-cpu |
| 2026-03-24T17:15:45+00:00 | Firefox 149.0安定版、分割表示、無料VPN、改善されたPDF性能を搭載してリリース | Firefox 149.0 Stable Launches With Split View, Free VPN, Improved PDF Performance | https://www.techpowerup.com/347669/firefox-149-0-stable-launches-with-split-view-free-vpn-improved-pdf-performance |
| 2026-03-24T16:24:07+00:00 | 米国での販売低迷により、Nintendo Switch 2の生産を33%削減 | Nintendo Switch 2 Production Cut by 33% Due To Softening US Sales | https://www.techpowerup.com/347664/nintendo-switch-2-production-cut-by-33-due-to-softening-us-sales |
| 2026-03-24T16:03:12+00:00 | Razer、新型Viper V4 ProとGigantus V2 Proを発表 | Razer Unveils the Viper V4 Pro and Gigantus V2 Pro | https://www.techpowerup.com/347667/razer-unveils-the-viper-v4-pro-and-gigantus-v2-pro |
| 2026-03-24T15:35:32+00:00 | JEDEC、モード切替サポートを強化した改訂版LPDDR5/5X SPD規格を発表 | JEDEC Releases Updated LPDDR5/5X SPD Standard with Enhanced Mode‑Switching Support | https://www.techpowerup.com/347666/jedec-releases-updated-lpddr5-5x-spd-standard-with-enhanced-mode-switching-support |
| 2026-03-24T15:14:56+00:00 | Ayaneo、部品価格の高騰を理由に次期2モデルの携帯型端末販売を停止 | Ayaneo Suspends Next 2 Handheld Sales as Component Pricing Becomes “Unsustainable” | https://www.techpowerup.com/347665/ayaneo-suspends-next-2-handheld-sales-as-component-pricing-becomes-unsustainable |
| 2026-03-24T15:02:46+00:00 | Chuwi、CoreBookシリーズCPU問題に対応し、購入者へ返金措置を実施 | Chuwi Responds to CoreBook Series CPU Debacle with Refunds for Affected Buyers | https://www.techpowerup.com/347661/chuwi-responds-to-corebook-series-cpu-debacle-with-refunds-for-affected-buyers |
| EETimes Taiwan | |||
| 2026-03-24 | Apple ‘米国製’のチップも台湾の先進封装に依存 | Apple「美國製造」晶片仍依賴台灣先進封裝 | https://www.eettaiwan.com/20260324nt01-apple-s-first-made-in-u-s-chips-fall-short-of-claim/ |
| 2026-03-24 | 中東の硝煙の中で変貌を遂げる電子産業 | 中東硝煙下的電子產業變局 | https://www.eettaiwan.com/20260324nt61-the-transformation-of-the-electronics-industry-amidst-the-middle-east-conflict/ |
| 2026-03-24 | 動力のボトルネックを打破する鍵、固体電池がヒューマノイドロボットの商用化を支援 | 成突破動力瓶頸關鍵 固態電池助人形機器人邁向商用化 | https://www.eettaiwan.com/20260324nt21-solid-state-batteries-are-key-to-the-commercialization-of-humanoid-robots/ |
| 2026-03-23 | Itenest、DesignCon 2026で初登壇 | Itenest首次亮相DesignCon 2026 | https://www.eettaiwan.com/20260323nt41-itenest/ |
| 2026-03-23 | MWC 2026：通信業界、高リスクで『IQ時代』に挑む | MWC 2026：電信業高風險押注「IQ時代」 | https://www.eettaiwan.com/20260323nt01-mwc-2026-telecom-high-stakes-bet-on-the-iq-era/ |
| 2026-03-23 | 広いバンドギャップ半導体の新たな戦局：SiCとGaNがパワーエレクトロニクスの地図を塗り替える | 寬能隙半導體新戰局：SiC與GaN改寫功率版圖 | https://www.eettaiwan.com/20260323nt51-the-evolving-landscape-of-sic-and-gan-markets/ |
| 2026-03-23 | 大手企業の後押しにより、2026年の世界ARグラス出荷数は95万台に達する | 大廠推波助瀾 2026年全球AR眼鏡出貨將達95萬台 | https://www.eettaiwan.com/20260323nt21-2026-global-ar-glasses/ |
| EETimes Asia | |||
| 2026-03-24 | 5GとエッジAIの成長が5Gチップセット市場を2031年までに930億ドル超に押し上げる | 5G and Edge AI Growth to Drive 5G Chipset Market to Cross $93B by 2031 | https://www.eetasia.com/5g-and-edge-ai-growth-to-drive-5g-chipset-market-to-cross-93b-by-2031/ |
| 2026-03-24 | TI、新型パワーモジュールでデータセンターおよび電気自動車向けのパワー密度を向上 | TI Advances Power Density in Data Centers, EVs with New Power Modules | https://www.eetasia.com/ti-advances-power-density-in-data-centers-evs-with-new-power-modules/ |
| 2026-03-24 | アナログ・デバイセズ、タイ新拠点でアジアにおけるプレゼンスを強化 | Analog Devices Strengthens Presence in Asia with New Thailand Facility | https://www.eetasia.com/analog-devices-strengthens-presence-in-asia-with-new-thailand-facility/ |
| 2026-03-24 | Keysight、新たに1.6Tインターコネクト検証技術を強化 | Keysight Enhances 1.6T Interconnect Validation Tech | https://www.eetasia.com/keysight-enhances-1-6t-interconnect-validation-tech/ |
| 2026-03-23 | AEMとASE、AIおよびHPCテスト革新を加速するためのパートナーシップを締結 | AEM and ASE Ink Partnership to Accelerate AI and HPC Test Innovation | https://www.eetasia.com/aem-and-ase-ink-partnership-to-accelerate-ai-and-hpc-test-innovation/ |
| 2026-03-23 | なぜデータセンター用チップは自動車環境で失敗するのか | Why Data Center Chips Fail in Automotive Environments | https://www.eetasia.com/why-data-center-chips-fail-in-automotive-environments/ |
| 2026-03-23 | AIサーバー向けコンピュートASIC用HBM需要、2028年までに35倍に成長すると予測 | HBM Demand for AI Server Compute ASICs Forcast to Grow 35x by 2028 | https://www.eetasia.com/hbm-demand-for-ai-server-compute-asics-forcast-to-grow-35x-by-2028/ |
| 2026-03-23 | SamsungとAMD、次世代AIメモリソリューションでの連携を強化 | Samsung and AMD Strengthen Collaboration on Next-Gen AI Memory Solutions | https://www.eetasia.com/samsung-and-amd-strengthen-collaboration-on-next-gen-ai-memory-solutions/ |
| 2026-03-23 | pSemi、APEC 2026で急速充電モバイルデバイス用パワーソリューションと次世代ヒューマノイドロボットを披露 | pSemi Showcases Power Solutions for Fast‑charging Mobile Devices, Next‑Gen Humanoid Robotics at APEC 2026 | https://www.eetasia.com/psemi-showcases-power-solutions-for-fast%e2%80%91charging-mobile-devices-next%e2%80%91gen-humanoid-robotics-at-apec-2026/ |
| 2026-03-23 | Applied Angstrom Technology、AIハードウェア開発向けシンガポールR&Dセンターを開設 | Applied Angstrom Technology Opens Singapore R&D Center for AI Hardware Development | https://www.eetasia.com/applied-angstrom-technology-opens-singapore-rd-center-for-ai-hardware-development/ |
| EETimes India | |||
| 2026-03-23 | AEM と ASE、AI および HPC テスト革新を加速するためのインクパートナーシップ | AEM and ASE Ink Partnership to Accelerate AI and HPC Test Innovation | https://www.eetindia.co.in/aem-and-ase-ink-partnership-to-accelerate-ai-and-hpc-test-innovation/ |
| 2026-03-23 | Digilent、高速・大帯域幅のMSOを発売 | Digilent to Launch High-speed, High-bandwidth MSOs | https://www.eetindia.co.in/digilent-to-launch-high-speed-high-bandwidth-msos/ |
| 2026-03-23 | Infineon と UMCがサプライチェーンの排出削減を推進するために協力 | Infineon and UMC Partner to Promote Supply Chain Emissions Reductions | https://www.eetindia.co.in/infineon-and-umc-partner-to-promote-supply-chain-emissions-reductions/ |
| 2026-03-23 | Wolfspeed、300mm SiCプラットフォームで次世代AIおよびHPCパッケージングソリューションを実現 | Wolfspeed 300mm SiC Platform to Enable Next‑Gen AI and HPC Packaging Solutions | https://www.eetindia.co.in/wolfspeed-300mm-sic-platform-to-enable-next%e2%80%91gen-ai-and-hpc-packaging-solutions/ |
| 2026-03-23 | インド、Semicon Indiaと新たなイノベーションプログラムを通じて半導体研究開発を強化 | India Expands Semiconductor R&D Push Through Semicon India and New Innovation Programs | https://www.eetindia.co.in/india-expands-semiconductor-rd-push-through-semicon-india-and-new-innovation-programs/ |
| ZDNET Korea | |||
| 2026-03-25 | [1分健康] 春季の微細粉塵と乾燥した空気中の『角膜』損傷に注意 | [1분건강] 봄철 미세먼지·건조한 공기 속 ‘각막’ 손상 주의 | https://www.zdnet.co.kr/20260324163237%22%20title=%22 |
| 2026-03-25 | Arm、サーバー向けCPU供給に乗り出す…エイジェンティックAI狙い『AGI CPU』公開 | Arm, 서버용 CPU 공급 나선다…에이전틱 AI 겨냥 ‘AGI CPU’ 공개 | https://www.zdnet.co.kr/20260325065057%22%20title=%22 |
| 2026-03-25 | ハンファセミテックとサムスン電子、SMT特許の共同出願が9件に増加 | 한화세미텍-삼성전자, SMT 특허 공동출원 9건으로 증가 | https://www.zdnet.co.kr/20260325012213%22%20title=%22 |
| 2026-03-24 | セルトリオン、ソンドに18万リットル規模の第4・5工場を増設…1兆2千億ウォン投資 | 셀트리온, 송도에 18만 리터 규모 4·5공장 증설…1조2천억원 투자 | https://www.zdnet.co.kr/20260324155930%22%20title=%22 |
| 2026-03-24 | バーニー・サンダース vs クロード、サンダースがAIのおべっか性向を引き出す | 버니 샌더스 vs 클로드, 샌더스가 AI의 아첨 성향을 이끌어내다 | https://www.zdnet.co.kr/20260324204511%22%20title=%22 |
| 2026-03-24 | パールアビス『赤い砂漠』、発売4日で300万本販売…採算分岐点突破が予想される | 펄어비스 ‘붉은사막’, 출시 나흘 만에 300만장 판매…손익분기점 돌파 예상 | https://www.zdnet.co.kr/20260324201442%22%20title=%22 |
| 2026-03-24 | 電気自動車充電の認証と決済を一度に…国民の利便性向上を狙う自動決済導入が協議される | 전기차 충전 인증·결제 한 번에…국민 편의 높이는 자동결제 도입 논의 | https://www.zdnet.co.kr/20260324190655%22%20title=%22 |
| 2026-03-24 | チェ・ユンボム、考慮亜鉛の経営権を守る…議決権処理方式の法廷論争の火種が残る | 최윤범, 고려아연 경영권 사수…표 처리 방식 법정공방 불씨 남아 | https://www.zdnet.co.kr/20260324175428%22%20title=%22 |
| 2026-03-24 | ビッサム、営業停止処分の取消訴訟…執行指導も合わせて申請 | 빗썸, 영업정지 처분 취소소송…집행정지도 함께 신청 | https://www.zdnet.co.kr/20260324185127%22%20title=%22 |
| 2026-03-24 | [人事] 産業通商部 | [인사] 산업통상부 | https://www.zdnet.co.kr/20260324181748%22%20title=%22 |
| 2026-03-24 | ザ・ピンクポングカンパニー全YouTubeチャンネルの登録者数が3億人を超える | 더핑크퐁컴퍼니 전체 유튜브 채널 구독자 3억명 넘어 | https://www.zdnet.co.kr/20260324180916%22%20title=%22 |
| 2026-03-24 | 『ヘッビッソドゥクマウル』全国展開を本格推進…年内に500件選定 | ‘햇빛소득마을’ 전국 확산 본격 추진…연내 500개 선정 | https://www.zdnet.co.kr/20260324180930%22%20title=%22 |
| 2026-03-24 | ウムトリー、コストコ入店で北米攻略 | 움트리, 코스트코 입점으로 북미 공략 | https://www.zdnet.co.kr/20260324180105%22%20title=%22 |
| 2026-03-24 | クーパンプレイ、『F1日本グランプリ』を4K生中継 | 쿠팡플레이, ‘F1 일본 그랑프리’ 4K 생중계 | https://www.zdnet.co.kr/20260324164745%22%20title=%22 |
| 2026-03-24 | コスダック1000時代に取り残されたHR業界…株主価値向上のための『特命』 | 코스닥 1000시대 소외된 HR업계…주주 가치 제고 ‘특명’ | https://www.zdnet.co.kr/20260324172409%22%20title=%22 |
| 2026-03-24 | 米ナ스ダックに続きNYSEも参入…ジードラゴン所属会社、グローバル資本市場を狙う | 美 나스닥 이어 NYSE도 간다…지드래곤 소속사, 글로벌 자본시장 정조준 | https://www.zdnet.co.kr/20260324170716%22%20title=%22 |
| 2026-03-24 | ハンジン、ノサムソク代表を再任…AI転換・グローバル拡大を推進 | 한진, 노삼석 대표 재선임…AI 전환·글로벌 확장 추진 | https://www.zdnet.co.kr/20260324173150%22%20title=%22 |
| 2026-03-24 | メガMGCコーヒー、『メガコンサート』第2フェーズ プリクエンシー開始 | 메가MGC커피, ‘메가콘서트’ 2차 프리퀀시 시작 | https://www.zdnet.co.kr/20260324173429%22%20title=%22 |
| 2026-03-24 | LG CNS、取締役会会長にイ・ホヨン（社外取締役）を任命…責任経営を強化 | LG CNS, 이사회 의장에 이호영 사외이사 선임…책임경영 강화 | https://www.zdnet.co.kr/20260324174011%22%20title=%22 |
| 2026-03-24 | 食品価格は次々と下がるが…原価負担による『瞬間効果』が懸念される | 식품값 줄줄이 내리지만…원가 부담에 ‘반짝 효과’ 우려 | https://www.zdnet.co.kr/20260324170126%22%20title=%22 |
| 中央日報 | |||
| 2026-03-25 | [教育が未来だ] 人類の未来を設計するグローバル研究中心大学としてそび立つ | [교육이 미래다] 인류 미래 설계하는 글로벌 연구중심대로 우뚝 | https://www.joongang.co.kr/article/25414573 |
| 2026-03-25 | [教育が未来だ] AXイノベーションを牽引する研究中心大学として飛躍する | [교육이 미래다] AX 혁신 선도하는 연구 중심 대학으로 도약 | https://www.joongang.co.kr/article/25414566 |
| 2026-03-25 | サムソンが4人去るとき、エヌビディアは1人…従業員を縛り付ける『黄金の鎖』 | 삼전 4명 나갈때 엔비디아는 1명…직원 붙드는 '황금 족쇄' | https://www.joongang.co.kr/article/25414559 |
| 2026-03-25 | “5兆を失うほど成果給が急かしいのか” サムスン電子労働組合員の質問 | “5조 날릴만큼 성과급 급한가” 삼성전자 노조원의 질문 | https://www.joongang.co.kr/article/25414555 |
| 2026-03-25 | 「総100発を受け、血を流している」不動産の不敗を終わらせる4つの兆候 | “총 100발 맞고 피 흘리는 중” 부동산 불패 끝낼 4가지 신호 | https://www.joongang.co.kr/article/25414547 |
| 2026-03-25 | [通商フォーラム] 米国関税ショックは常に…企業は生産性を向上させて突破すべきだ | [통상포럼] 미국 관세 쇼크는 상수…기업 생산성 높여서 돌파해야 | https://www.joongang.co.kr/article/25414525 |
| BAIDU | |||
| 昨天21:28 | 東微半導体：4.08億元を投じて慧能泰半導体会社の53.09％の株式取得を計画 | 东微半导:拟4.08亿元收购慧能泰半导体公司53.09%股权 | https://www.cnstock.com/commonDetail/655695 |
| 昨天19:35 | 上場前に競合他社から訴えられ、傅里叶半導体の香港IPOが直前で難航する | 上市前遭竞品起诉,傅里叶半导体港股IPO临阵遇阻 | https://baijiahao.baidu.com/s?id=1860543107980702973&wfr=spider&for=pc |
| 昨天19:23 | 東微半導体：4.08亿元を投じて慧能泰半導体会社の53.09％の株式取得を計画 | 东微半导:拟4.08亿元收购慧能泰半导体公司53.09%股权 | https://baijiahao.baidu.com/s?id=1860542415684294299&wfr=spider&for=pc |
| 昨天19:02 | 東微半導体：4.08億元を投じて慧能泰半導体会社の53.09％の株式取得を計画 | 东微半导:拟4.08亿元收购慧能泰半导体公司53.09%股权 | https://baijiahao.baidu.com/s?id=1860542384089614011&wfr=spider&for=pc |
| 昨天20:48 | 東微半導体、4.08億元を投じて慧能泰半導体会社の53.09%の株式買収を検討 | 东微半导拟斥资4.08亿元收购慧能泰半导体公司53.09%股权 | https://baijiahao.baidu.com/s?id=1860548080698217286&wfr=spider&for=pc |
| 昨天18:28 | 半導体業界会議SEMICON Chinaが上海で正式に開幕 | 半导体行业大会SEMICON China在上海正式开幕 | https://baijiahao.baidu.com/s?id=1860538860745777262&wfr=spider&for=pc |
| 昨天18:26 | 上海のEDA企業、芯和半導体が転換、EDAツールソフトからシステムレベルのプラットフォームへシフト | 上海EDA企业芯和半导体转型,从EDA工具软件转向系统级平台 | https://baijiahao.baidu.com/s?id=1860538829717457424&wfr=spider&for=pc |
| 44分钟前 | 東大、世界初のチップで半導体大賞を受賞 | 东大全球首创芯片斩获半导体大奖 | https://baijiahao.baidu.com/s?id=1860581466349509066&wfr=spider&for=pc |
| 昨天19:31 | 国産半導体産業は積極的に発展しており、集積回路ETF国泰(159546)が1.6%以上上昇 | 国产半导体产业发展较为积极,集成电路ETF国泰(159546)收涨超1.6% | https://baijiahao.baidu.com/s?id=1860542952420987161&wfr=spider&for=pc |
| 昨天21:03 | 公告精选：複数のA株企業が寛大な配当を実施、東微半導体が慧能泰半導体の支配権買収を検討 | 公告精选:多家A股公司慷慨分红;东微半导拟收购控股慧能泰半导体公司 | https://baijiahao.baidu.com/s?id=1860548711789128276&wfr=spider&for=pc |
