Semiconductor News 20260324

Today’s semiconductor news is marked by intensifying competition in the development and procurement of semiconductors and memory for AI, and supply chain restructuring against a backdrop of geopolitical risk: SK Hynix is aiming to consolidate its leadership position by using TSMC’s 3nm technology in its next-generation HBM4E, while Samsung is in talks with Google and Microsoft are discussing long-term memory supply contracts. In addition, huge investments in infrastructure continue, including forecasts that HBM demand for AI servers will grow 35-fold by 2028 and Elon Musk’s plans for mass production of AI semiconductors. Meanwhile, the wave of supply network blocking and independence is further accelerating in China, as AI GPUs become more self-sufficient, Huawei’s new AI products are introduced, and STMicro’s microcontrollers are being mass-produced locally.

TOC

Main News

  1. SK Hynix to Adopt TSMC’s 3nm Technology for HBM4E to Compete with Samsung
    SK Hynix is reportedly planning to adopt TSMC’s cutting-edge 3nm process for the production of its next-generation wide-band memory, HBM4E. This is seen as a strategic decision to secure a technological edge over its largest competitor, Samsung Electronics, with the aim of deepening cooperation with top foundries in advanced packaging technology, which determines the performance of AI chips, and further solidifying its leadership position in the rapidly expanding AI memory market.
  2. Samsung Electronics in talks with Google and Microsoft for long-term memory supply contracts
    Samsung Electronics is reportedly in talks with giant technology companies such as Google and Microsoft regarding long-term memory semiconductor supply contracts. With demand for high-performance memory such as HBM exploding as generative AI infrastructures are built, this is a strategic move to secure the giant cloud vendors as direct customers and simultaneously aim for a stable revenue base and a larger share of the AI memory market.
  3. China’s AI GPU self-sufficiency to reach 80% by 2030, highlighting challenges for Nvidia
    China’s self-sufficiency in GPUs for AI is expected to reach 80% by 2030. Against the backdrop of strict U.S. export restrictions, semiconductor development in China is rapidly accelerating. This rapid move toward self-sufficiency clearly highlights future business challenges for Nvidia, which has dominated the AI chip market to date, including the risk of losing the huge Chinese market and the rise of powerful competitors originating from China.
  4. STMicro Launches STM32 Microcontrollers Locally Manufactured in China in Partnership with Huahong
    Semiconductor giant STMicroelectronics has begun mass production and delivery of STM32 microcontrollers manufactured in China through a partnership with Chinese foundry Huahong Hongli. Amidst the growing risk of geopolitical fragmentation, this is a strategic move to localize the supply chain and establish a stable component supply system for customers in the huge Chinese market, in order to maintain and expand market share while meeting the needs for domestic production.
  5. Huawei Unveils Atlas 350 with Proprietary HBM to Showcase AI Performance
    Huawei has unveiled its new AI product, Atlas 350, for the Ascend 950PR, which is powered by in-house proprietary HBM. The product is claimed to be 2.8 times more powerful than Nvidia’s H20 AI chip for China. The event is symbolic of the rapid progress Chinese companies are making in self-manufacturing the processor and memory technology needed for state-of-the-art AI computing infrastructure, even under strong U.S. technology sanctions.
  6. Elon Musk Announces Terafab, a Plan to Mass Produce AI-Specific Semiconductors on His Own
    Elon Musk, the leader of Tesla and other companies, has announced the Terafab project, a large-scale plan to mass produce AI-specific semiconductor chips on his own. The aim is to directly control the computing resources that are essential to the company’s own AI development and automated driving, without relying on the production quotas and technology roadmaps of existing giant foundries. This move toward vertical integration may create a stir in the future semiconductor manufacturing supply chain and business models.
  7. Helium Shortage Caused by Situation in Qatar Hits South Korea; Samsung and TSMC Also on Watch
    The shortage of helium, a special gas essential for semiconductor manufacturing, is seriously hitting South Korea’s semiconductor industry due to the unrest around Qatar in the Middle East and other factors. Not only memory giants such as Samsung Electronics and SK Hynix, but also global chipmakers such as TSMC are on high alert for this material supply crisis. Physical disruptions in the supply chain due to geopolitical risks are threatening the stable operation of manufacturing sites.
  8. Demand for HBM in ASICs for AI Servers Predicted to Grow 35x by 2028
    The explosion in computational demand associated with the spread of generative AI is expected to drive demand for HBM (high-bandwidth memory) in ASICs (application-specific integrated circuits) for AI server computation to an astounding 35x its current size by 2028. This tremendous demand forecast is a result of the growing demand for HBM in AI server compute ASICs. This tremendous demand forecast supports the trend of memory manufacturers’ massive conversion of existing general-purpose DRAM production lines for HBM, which is dramatically changing the investment structure of the semiconductor industry.
  9. Enterprise SSD Market to Reach $9.9 Billion in Q4 2025, Up 52% QoQ
    TrendForce research shows that the enterprise SSD market size reached $9.9 billion in Q4 2025, a significant 52% increase from the previous quarter. The market is strongly driven by a surge in demand for high-capacity storage due to the construction of AI data centers and the expansion of cloud services. This strong growth is helping to boost memory manufacturers’ revenues and continue the industry’s overall strong cycle.
  10. Rapidus CTO Ishimaru Mentions “ Six Months ” Difference” from TSMC in Development of 1-nanometer Sem iconductors
    CTO Ishimaru of Rapidus, Japan’s leading-edge semiconductor manufacturer, has stated that the company has closed the technological gap with TSMC, the world’s largest foundry, to “six months” in the development of next-generation 1-nanometer semiconductors. The company has indicated that it has narrowed the technological gap with TSMC, the world’s largest foundry, to “six months. The national project to revive Japan’s semiconductor industry is making steady progress on its technology roadmap, demonstrating that it is closing in on the world’s top runner on the frontiers of ultrafine technology.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Mar 23, 15:47解説:なぜNvidiaのGroq LPUがSamsungのシリコン上で動作するのか — Groqの規模と推論戦略Explainer: Why Nvidia’s Groq LPU runs on Samsung silicon— Groq’s scale and inference strategyhttps://www.digitimes.com/news/a20260323PD214/nvidia-samsung-groq-tsmc-ceo.html
Mar 23, 17:14インドの外国直接投資政策の見直しが、半導体サプライチェーンにおける中国の参加を制御された形で可能にするIndia’s FDI reset opens controlled door to Chinese participation in semiconductor supply chainshttps://www.digitimes.com/news/a20260323VL208/india-fdi-investment-policy-manufacturing-china.html
Mar 23, 12:32中国が海外の半導体投資を求める中、Samsung会長が北京フォーラムに参加Samsung chairman joins Beijing forum as China seeks foreign chip investmenthttps://www.digitimes.com/news/a20260323VL206/samsung-chairman-beijing-investment.html
Mar 23, 11:42Nvidiaは、カスタムチップの競争相手に対抗するため、AI推論への取り組みを強化Nvidia pushes deeper into AI inference to counter custom chip rivalshttps://www.digitimes.com/news/a20260323PD207/nvidia-gtc-2026-asic-cost.html
Mar 23, 11:13SKハイニックスは、Samsungに対する優位性を得るために、TSMCの3nm技術をHBM4Eに採用する計画SK Hynix plans TSMC 3nm adoption for HBM4E edge over Samsunghttps://www.digitimes.com/news/a20260322PD201/sk-hynix-tsmc-samsung-3nm-hbm4.html
Mar 23, 17:45Inergy Technologyは、AIによる電力需要増加を受け、HVDC市場向けのSiC拡大を狙うInergy Technology eyes SiC expansion for HVDC as AI power demand riseshttps://www.digitimes.com/news/a20260323PD210/inergy-technology-power-semiconductors-sic-design-growth.html
Mar 23, 17:17AIチップのブームにより、Chunghwa Precision Testにおけるテスト需要が急増AI chip boom drives surge in demand for testing at Chunghwa Precision Testhttps://www.digitimes.com/news/a20260323PD232/testing-demand-supplier-capacity-expansion.html
Mar 23, 16:37報道によると、SamsungはGoogleやMicrosoftと長期のメモリ供給契約に関して協議中Samsung reportedly in talks with Google, Microsoft on long-term memory supply agreementshttps://www.digitimes.com/news/a20260323VL207/samsung-google-microsoft-hbm-demand.html
Mar 23, 15:41GTC 2026で、Jensen Huangと台湾を橋渡しするデュオを紹介Meet the duo bridging Jensen Huang to Taiwan at GTC 2026https://www.digitimes.com/news/a20260323PD225/nvidia-gtc-2026-taiwan-jensen-huang.html
Mar 23, 15:31Advanced Echemは、世界のチップ製造の進展に対応するため、DUV、パッケージング、光学材料の供給を拡充するAdvanced Echem expands DUV, packaging, and optical materials to serve global chip progresshttps://www.digitimes.com/news/a20260323PD203/aemc-duv-expansion-materials-packaging.html
Mar 23, 15:042030年までに中国のAI GPU自給率が80%に達する見込みが、Nvidiaにとっての課題を浮き彫りにするChina’s AI GPU self-sufficiency to hit 80% by 2030 highlights growing challenges for Nvidiahttps://www.digitimes.com/news/a20260323PD224/china-ai-gpu-self-sufficiency-nvidia.html
Mar 23, 14:00Zenitronは、メモリ不足が世界中の技術系サプライチェーンに波及すると警告するZenitron warns memory shortages will reverberate across global tech supply chainshttps://www.digitimes.com/news/a20260323PD201/zenitron-ai-server-data-demand.html
Mar 23, 13:21中国はハイエンドフォトレジスト生産に乗り出しており、Dinglongが生産を強化し、YMTCが支援を提供China moves into high-end photoresist production: Dinglong ramps up, YMTC lends supporthttps://www.digitimes.com/news/a20260323PD208/production-photoresist-ymtc-high-end-supply-chain.html
Mar 23, 12:39Tescanは、AIメモリおよび先進パッケージング向け顧客のテストを迅速化するため、ソウルのデモラボを統合するTescan integrates Seoul demo lab to speed testing for AI memory and advanced packaging customershttps://www.digitimes.com/news/a20260323PD204/testing-packaging-expansion-demand-equipment.html
Mar 23, 12:06メモリ供給不足が、IPCの利益に悪影響を及ぼすMemory supply squeeze dents IPC profitshttps://www.digitimes.com/news/a20260323PD205/ipc-memory-chips-price-market-2026.html
Mar 23, 11:41TSMCは、サプライチェーンリスクを低減するため、地元サプライヤーを支援するTSMC supports local suppliers to reduce supply chain riskshttps://www.digitimes.com/news/a20260323PD211/tsmc-supply-chain-ntust-taiwan.html
日経 Tech Foresight
2026-03-24ラピダス「10年後の基盤」 CTO直下に技術戦略室や知財部https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC231I80T20C26A3000000
2026-03-23ラピダス、1ナノ半導体でTSMCと「半年差に」 石丸CTOhttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC1928C0Z10C26A3000000
2026-03-23「脳模倣エッジAI処理」「宇宙向け量子計算」 海外動向https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC1818I0Y6A310C2000000
マイナビニュース テックプラス
2026-03-23ADIがタイに新たな後工程拠点を開設、グローバル製造ネットワークの柔軟性を向上https://news.mynavi.jp/techplus/article/20260323-4251707/
2026-03-23ルネサス、AIデータセンターなどでの活用可能な650V耐圧GaN双方向スイッチを発売https://news.mynavi.jp/techplus/article/20260323-4251599/
2026-03-23ルネサス、産業・IoT機器向けに500W電力供給が可能なGaNベース半波整流LLCを開発https://news.mynavi.jp/techplus/article/20260323-4251574/
2026-03-23早大、光電流を約340倍に増幅する超小型・高感度光回路モニタを開発https://news.mynavi.jp/techplus/article/20260323-4251404/
2026-03-23キオクシアがTSOPパッケージの低容量NAND製品をEOLか? 海外メディア報道https://news.mynavi.jp/techplus/article/20260323-4250433/
2026-03-232025年第4四半期のエンタープライズSSD市場規模は前四半期比52%増の99億ドル、TrendForce調べhttps://news.mynavi.jp/techplus/article/20260323-4250296/
2026-03-23ゲットワークス、新潟のデータセンターでIBM InstanaによるGPU可視化を実証 – AI時代の運用高度化に手応えhttps://news.mynavi.jp/techplus/article/20260323-4237887/
TrendForce
2026-03-23STマイクロエレクトロニクス、華虹とのパートナーシップを通じて中国で現地生産のSTM32 MCUを発売STMicroelectronics Launches Locally Made STM32 MCUs in China via Huahong Partnershiphttps://www.trendforce.com/news/2026/03/23/news-stmicroelectronics-launches-locally-made-stm32-mcus-in-china-via-huahong-partnership/
2026-03-23マイクロン、将来の自動運転車には300GB以上のDRAMが必要になると報じ、HBFの見通しには慎重な姿勢Micron Reportedly Expects Future Autonomous Cars to Require 300GB+ DRAM, Cautious on HBF Outlookhttps://www.trendforce.com/news/2026/03/23/news-micron-reportedly-expects-future-autonomous-cars-to-require-300gb-dram-cautious-on-hbf-outlook/
2026-03-23カタールの影響下で:ヘリウム不足が韓国をより深刻に襲い、サムスン、SKハイニックス、TSMCが注目されるUnder Qatar’s Shadow: Helium Crunch Hits South Korea Harder, Putting Samsung, SK hynix, TSMC in Spotlighthttps://www.trendforce.com/news/2026/03/23/news-under-qatars-shadow-helium-crunch-hits-south-korea-harder-putting-samsung-sk-hynix-tsmc-in-spotlight/
2026-03-23マスク氏のテラファブビジョンがTSMCへの影響に疑問を投げかけ、先進パッケージングが最適な参入点となり得るMusk’s Terafab Vision Raises Questions Over TSMC Impact; Advanced Packaging May be Best Entry Pointhttps://www.trendforce.com/news/2026/03/23/news-musks-terafab-vision-raises-questions-over-tsmc-impact-advanced-packaging-may-be-best-entry-point/
2026-03-23Huawei、社内開発HBMを搭載したAscend 950PR向けAtlas 350を初披露し、2.8倍のH20性能を謳うHuawei Debuts Atlas 350 on Ascend 950PR with In-house HBM, Touting 2.8X H20 Performancehttps://www.trendforce.com/news/2026/03/23/news-huawei-debuts-atlas-350-on-ascend-950pr-with-in-house-hbm-touting-2-8x-h20-performance/
Semiconductor Digest
2 hours agoSTマイクロエレクトロニクス、中国製STM32マイクロコントローラー、量産開始STMicroelectronics China-Manufactured STM32 Microcontrollers Begin Volume Productionhttps://www.semiconductor-digest.com/stmicroelectronics-china-manufactured-stm32-microcontrollers-begin-volume-production/
2 hours ago東芝、APEC 2026で先進パワー半導体ソリューションを披露Toshiba Showcases Advanced Power Semiconductor Solutions at APEC 2026https://www.semiconductor-digest.com/toshiba-showcases-advanced-power-semiconductor-solutions-at-apec-2026/
3 hours ago効率20%以上のノンドープ青色OLEDの実現Enabling Non-Doped Blue OLEDs With Efficiency Exceeding 20%https://www.semiconductor-digest.com/enabling-non-doped-blue-oleds-with-efficiency-exceeding-20/
3 hours ago3D統合とGAA採用がALD/CVD前駆体の構造的成長を牽引3D Integration and GAA Adoption Drive Structural Growth in ALD/CVD Precursorshttps://www.semiconductor-digest.com/3d-integration-and-gaa-adoption-drive-structural-growth-in-ald-cvd-precursors-2/
日本経済新聞
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2026-03-24米国株、ダウ反発 「イラン発電所の攻撃延期」表明で買いhttps://www.nikkei.com/article/DGXZQOFL23A8D0T20C26A3000000/
2026-03-24OpenAI、核融合新興の電力調達へ データセンター向けhttps://www.nikkei.com/article/DGXZQOGN23AR90T20C26A3000000/
2026-03-24日本板硝子、規模の呪縛が招いた転落 ペロブスカイトに再建託すhttps://www.nikkei.com/article/DGXZQOUC186PG0Y6A310C2000000/
2026-03-24「新金融」へ政治主導、即時決済・トークン経済圏 自民が議論着手へhttps://www.nikkei.com/article/DGXZQOUA195KA0Z10C26A3000000/
2026-03-24AIが人間に「差別された」と主張 中傷文書を公開、自信家設定で暴走https://www.nikkei.com/article/DGXZQOUC024MA0S6A300C2000000/
2026-03-24米国、レアアース大国へグランドデザイン 供給網や備蓄など包括戦略https://www.nikkei.com/article/DGXZQOGN194E90Z10C26A2000000/
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ダイヤモンドオンライン
Mar 23 21:00外国人が2.4兆円も爆買い。日本人には手が届かない不動産・地価に迫る「下落」の足音https://diamond.jp/articles/-/386497
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Tom’s Hardware
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TechPowerup
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EETimes Taiwan
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EETimes Asia
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2026-03-23なぜデータセンター向けチップは自動車環境で故障するのかWhy Data Center Chips Fail in Automotive Environmentshttps://www.eetasia.com/why-data-center-chips-fail-in-automotive-environments/
2026-03-232028年までに、AIサーバー向け計算ASICのHBM需要が35倍に成長すると予測されるHBM Demand for AI Server Compute ASICs Forcast to Grow 35x by 2028https://www.eetasia.com/hbm-demand-for-ai-server-compute-asics-forcast-to-grow-35x-by-2028/
2026-03-23SamsungとAMD、次世代AIメモリソリューションにおける連携を強化Samsung and AMD Strengthen Collaboration on Next-Gen AI Memory Solutionshttps://www.eetasia.com/samsung-and-amd-strengthen-collaboration-on-next-gen-ai-memory-solutions/
2026-03-23pSemi、APEC 2026において急速充電対応モバイル機器および次世代ヒューマノイドロボット向けのパワーソリューションを展示pSemi Showcases Power Solutions for Fast‑charging Mobile Devices, Next‑Gen Humanoid Robotics at APEC 2026https://www.eetasia.com/psemi-showcases-power-solutions-for-fast%e2%80%91charging-mobile-devices-next%e2%80%91gen-humanoid-robotics-at-apec-2026/
2026-03-23Applied Angstrom Technology、AIハードウェア開発のためシンガポールにR&Dセンターを開設Applied Angstrom Technology Opens Singapore R&D Center for AI Hardware Developmenthttps://www.eetasia.com/applied-angstrom-technology-opens-singapore-rd-center-for-ai-hardware-development/
EETimes India
2026-03-23AEMとASE Inkの提携でAIおよびHPCテストの革新を加速AEM and ASE Ink Partnership to Accelerate AI and HPC Test Innovationhttps://www.eetindia.co.in/aem-and-ase-ink-partnership-to-accelerate-ai-and-hpc-test-innovation/
2026-03-23Digilent、高速・高帯域幅のMSOを発売Digilent to Launch High-speed, High-bandwidth MSOshttps://www.eetindia.co.in/digilent-to-launch-high-speed-high-bandwidth-msos/
2026-03-23InfineonとUMCがサプライチェーンの排出削減を促進するために提携Infineon and UMC Partner to Promote Supply Chain Emissions Reductionshttps://www.eetindia.co.in/infineon-and-umc-partner-to-promote-supply-chain-emissions-reductions/
2026-03-23Wolfspeedの300mm SiCプラットフォームで次世代AIおよびHPCパッケージングソリューションを実現Wolfspeed 300mm SiC Platform to Enable Next‑Gen AI and HPC Packaging Solutionshttps://www.eetindia.co.in/wolfspeed-300mm-sic-platform-to-enable-next%e2%80%91gen-ai-and-hpc-packaging-solutions/
2026-03-23インド、Semicon Indiaおよび新たなイノベーションプログラムを通じて半導体研究開発の取り組みを拡大India Expands Semiconductor R&D Push Through Semicon India and New Innovation Programshttps://www.eetindia.co.in/india-expands-semiconductor-rd-push-through-semicon-india-and-new-innovation-programs/
ZDNET Korea
2026-03-23“金融機関の脆弱性評価を869件に拡大”…金融情報院、情報共有セミナー“금융기관 취약점 평가 869개로 확대”…금보원, 정보공유 세미나https://www.zdnet.co.kr/20260323231723” title=”
2026-03-23フォーティネット、‘RSAC 2026’に参加…エージェンティックAI搭載の統合セキュリティ公開포티넷, ‘RSAC 2026’ 참가…에이전틱AI 기반 통합보안 공개https://www.zdnet.co.kr/20260323220508” title=”
2026-03-23カスペルスキー、市場調査機関QKSに選定され『企業サイバーセキュリティリーダー』に選ばれる카스퍼스키, 시장조사기관 QKS 선정 ‘기업 사이버보안 리더’ 뽑혀https://www.zdnet.co.kr/20260323215647” title=”
2026-03-23CSOT、サムスンディ스プレイに対して特許訴訟を提起…OLED特許3件の侵害を主張CSOT, 삼성디스플레이 상대 특허소송 제기…OLED 특허 3건 침해 주장https://www.zdnet.co.kr/20260323210003” title=”
2026-03-23IITP、‘MWC26’テクニカルレビュー報告書を刊行IITP, ‘MWC26’ 테크니컬 리뷰 보고서 발간https://www.zdnet.co.kr/20260323213850” title=”
2026-03-23米国国防省「アントロピック・クロードを6ヶ月以内に代替する」と宣言…現場の兵士たちは反発미 국방부 “앤트로픽 클로드 6개월 내 대체” 자신…현장 군인들은 반발https://www.zdnet.co.kr/20260323212422” title=”
2026-03-23韓国情報産業連合会「WTOの電子送信の無関税猶予を延長すべき」한국정보산업연합회 “WTO 전자적 전송 무관세 유예 연장해야”https://www.zdnet.co.kr/20260323205031” title=”
2026-03-23KAIST、中部圏と3特区でグローバルメガバレーの育成KAIST, 중부권·3특에 글로벌 메가밸리 육성https://www.zdnet.co.kr/20260323200314” title=”
2026-03-23LG化学、ヨ스 NCC第2工場の生産を停止…中東戦争の影響LG화학, 여수 NCC 2공장 생산 중단…중동 전쟁 여파https://www.zdnet.co.kr/20260323183554” title=”
2026-03-23[人事] 産業通商部[인사] 산업통상부https://www.zdnet.co.kr/20260323184651” title=”
2026-03-23“人材か事業か”…国内のAI上場企業、極端に異なる生存戦略“인력이냐 사업이냐”…국내 AI 상장사, 극과 극 갈린 생존 전략https://www.zdnet.co.kr/20260323182733” title=”
2026-03-23ヨンドク風力発電機、今回も火災… 作業員1名死亡、2名行方不明영덕 풍력 발전기 이번엔 화재… 작업자 1명 숨지고 2명 실종https://www.zdnet.co.kr/20260323181400” title=”
2026-03-23[今のAI] 芸能界を一変させるAI…俳優・歌手の雇用はなくなるのか[AI는 지금] 연예계 판 바꾸는 AI…배우·가수 일자리 사라질까https://www.zdnet.co.kr/20260323175829” title=”
2026-03-23[ZD SWトゥデイ] KOSA、SW・ICT機器・情報保護需要予報説明会など開催[ZD SW 투데이] KOSA, SW·ICT장비·정보보호 수요예보 설명회 개최 外https://www.zdnet.co.kr/20260323180128” title=”
2026-03-23キム・ナンド教授「フランチャイズには『ケンタウロス型人材』が必要だ」김난도 교수 “프랜차이즈에 ‘켄타우로스형 인재’ 필요해”https://www.zdnet.co.kr/20260323174643” title=”
2026-03-23国産フィジカルAI技術で製造競争力を拡大…輸出も狙う토종 피지컬AI 기술로 제조 경쟁력 확대…수출까지 넘본다https://www.zdnet.co.kr/20260323174820” title=”
2026-03-23K-POP公演の中継もNetflixが独占するのかK팝 공연 중계도 넷플릭스가 쓸어담을까https://www.zdnet.co.kr/20260323172345” title=”
2026-03-23専門家ら「個人情報保護のパラダイムを予防中心に切り替えるべきだ」전문가들 “개인정보보호 패러다임 사전예방 중심 바꿔야”https://www.zdnet.co.kr/20260323160113” title=”
2026-03-23Wemade『Legend of Mir』、フィリピンで利用者招待イベントを終了위메이드 ‘레전드오브이미르’, 필리핀서 이용자 초청 행사 마무리https://www.zdnet.co.kr/20260323174128” title=”
2026-03-23Cafe24、30億ウォン規模の自社株買い消却…「株主価値の向上」카페24, 30억원 규모 자사주 소각…”주주가치 제고”https://www.zdnet.co.kr/20260323173251” title=”
中央日報
2026-03-24[ライフトレンド] 半導体材料・装置の独自技術でグローバル市場を攻略[라이프 트렌드] 반도체 소재·장비 독자 기술력으로 글로벌 시장 공략https://www.joongang.co.kr/article/25414227
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2026-03-24Uターンする海外投資家に恩恵を与える口座が登場…為替の落ち着きに効果はあるのか유턴하는 서학개미 혜택 주는 계좌 출시…환율 진정 효과 볼까https://www.joongang.co.kr/article/25414155
2026-03-24LGイノテック 「基板をフル稼働中…車載分野も今年20%伸ばす」LG이노텍 “기판 풀가동 중…전장도 올 20% 키울 것”https://www.joongang.co.kr/article/25414150
2026-03-24JPモルガン 「激動する韓国株式市場、バリューアップがゲームチェンジャー」JP모건 “널뛰는 한국 증시, 밸류업이 게임 체인저”https://www.joongang.co.kr/article/25414154
2026-03-23症状を入力すれば病院の予約まで… NAVERが全サービスに『特化型AIアシスタント』を導入 [ペックプル]증상 치면 병원 예약까지… 네이버 모든 서비스에 ‘특화 AI 비서’ 심는다 [팩플]https://www.joongang.co.kr/article/25414064
BAIDU
昨天22:25STマイクロエレクトロニクス:华虹宏力が委託製造した最初のSTM32ウェハ製品の納品が開始されました意法半导体:首批由华虹宏力代工的STM32晶圆产品已开启交付https://baijiahao.baidu.com/s?id=1860463772978211783&wfr=spider&for=pc
昨天17:40STマイクロエレクトロニクス:中国国内で製造されたSTM32マイコンの納品が開始されました意法半导体:中国本地造STM32微控制器已开启交付https://baijiahao.baidu.com/s?id=1860445247599178364&wfr=spider&for=pc
昨天16:06STマイクロエレクトロニクス(STM.US)、华虹と連携し現地でSTM32を納品、MCUの国産サプライチェーンに新たな章を開く意法半导体(STM.US)联手华虹本地交付STM32 开启MCU国产供应链新篇章https://baijiahao.baidu.com/s?id=1860443012636298461&wfr=spider&for=pc
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昨天20:38イーロン・マスク、AI半導体量産計画を発表马斯克宣布AI半导体量产计划https://baijiahao.baidu.com/s?id=1860457009400931132&wfr=spider&for=pc
昨天16:50インテルが買収できなかった高塔半導体の時価総額が急上昇し、イスラエルで3番目の上場企業となる英特尔没能买下的高塔半导体市值飙升,成以色列第三大上市公司https://baijiahao.baidu.com/s?id=1860442104857633501&wfr=spider&for=pc
昨天23:54龙图光罩、資金調達額を14.6億元以内に設定し、40nm〜28nmの半導体マスク版の生産能力を展開龙图光罩拟募资不超14.6亿元 布局40nm—28nm半导体掩模版产能https://baijiahao.baidu.com/s?id=1860469119363296133&wfr=spider&for=pc
昨天16:53深圳华强:华强半導体が昇騰モジュールソリューションを携え、ファーウェイのパートナーカンファレンスに登場深圳华强:华强半导体携昇腾模组解决方案亮相华为合作伙伴大会https://www.stcn.com/article/detail/3692417.html
昨天14:5720cm速達|科創チップETF(国泰(589100))が約5%下落、半導体チップ業界の長期的な動向は…20cm速递|科创芯片ETF国泰(589100)跌近5%,半导体芯片行业长期趋势…https://baijiahao.baidu.com/s?id=1860435115980806573&wfr=spider&for=pc
3小时前今月中に約350の上場企業が機関投資家の調査を受け、半導体や新エネルギー分野などが注目される月内近350家上市公司获机构调研 半导体、新能源等赛道受青睐http://news.10jqka.com.cn/20260324/c675491864.shtml
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