Semiconductor News 20260304

TOC

Main News

  1. AI Demand Spikes DRAM Prices, Memory Market Enters Super Cycle
    AI server demand has caused DRAM big-ticket prices to double in a month, with some predicting prices to rise up to 70% in Q2 2026, and Nvidia’s GTC 2026 is expected to accelerate this AI memory is expected to further accelerate this AI memory boom. In response to this super cycle, Samsung Electronics and SK Hynix are moving to hire more related talent, and the memory market is entering a period of record revenue growth.
  2. Rapidus Raises Funds for Mass Production of 2nm Semiconductors in Partnership with Canon and Others
    Rapidus, a Japanese next-generation semiconductor manufacturer, has successfully raised $1.7 billion in funding and DNP (DNP) has joined to accelerate mass production of 2nm semiconductors through 2027. In addition, we are the first major Japanese customer to announce a partnership with Canon for 2nm image processing chips. With these developments, moves toward the establishment of a manufacturing base and supply chain for Japan’s most advanced logic semiconductors are in full swing.
  3. China’s A-Share Semiconductor Companies Raise Prices Simultaneously, Up to 80% Increase in Power Semiconductors
    Several semiconductor companies listed on China’s A-share market have given notice of simultaneous increases in product prices, as AI becomes a key driver and production capacity is strained amid surging downstream demand. The rush to raise prices is particularly noticeable in the power semiconductor sector, where intense upward cost pressure is spilling over into the entire supply chain, with up to 80% price increases reported in some cases.
  4. U.S. Government to Ban Procurement of China-Related Chips, Conflict Between Congress and Industry
    The U.S. government is moving to ban the federal government’s procurement of China-related semiconductors. The move is part of a regulatory effort against China for security reasons, but it is also causing a heated confrontation with U.S. industry over strict requirements for new semiconductor security mandates proposed by Congress. The policy goals of de-Chinaizing the supply chain and protecting domestic industry are clearly placing a heavy burden on companies’ practical procurement and cost structures.
  5. Former TSMC Executive Under Investigation for Alleged Leakage of Key Semiconductor Technology
    A former executive of Taiwan’s TSMC, the world’s largest foundry, is under investigation for allegedly leaking his company’s core semiconductor technology. The leak of information to Intel and other companies has been discussed, and the case has caused ripples throughout the semiconductor industry as it demonstrates how difficult and important it is to protect cutting-edge manufacturing know-how and trade secrets amid the intensifying competition among companies for technological supremacy.
  6. Nvidia and MediaTek accelerate silicon photonics-related investments
    Nvidia has invested in US-based Lumentum to advance AI optical technology, and MediaTek has also invested US$90 million in silicon photonics startup Ayar Labs. TSMC is also leading local procurement of the same technology in Taiwan. semiconductor giants are making a series of huge investments in optical communication technology, which is key to faster data transfer and lower power consumption in AI infrastructure, to take the lead in the next generation.
  7. SK Hynix Explores New HBM4 Packaging, Denies Rumors of Japan Expansion
    SK Hynix is exploring the introduction of new HBM4 packaging technology for AI chips that improves performance by narrowing gaps between DRAMs. While accelerating the development of next-generation memory technology, the company has officially denied some rumors that it is moving its memory manufacturing plant to Japan. The company intends to prioritize the establishment of and investment in front-end manufacturing facilities in the U.S. over Japan, clarifying the direction of its global manufacturing strategy.
  8. Samsung’s Foundry Profitability Targets Moved Up and Mass Production Delayed at New U.S. Plant
    Samsung Electronics has reportedly moved up the target for its foundry business to become profitable (break-even point) from its initial assumption and set the date for 2026. On the other hand, however, a new plant under construction in Taylor, Texas, U.S.A., is experiencing schedule delays, and the start of mass production is expected to be delayed to 2027. This delay has also raised concerns about the business plans of Tesla, which is expected to be a customer of the plant.
  9. Rapid Growth of AI Rewrites Semiconductor Industry M&A Strategies, Hurting Memory Sector
    The rapid development of the AI field is fundamentally rewriting mergers and acquisitions (M&A) strategies in the semiconductor industry. In particular, the memory sector has been the most affected, with industry restructuring and alliances gaining momentum in order to acquire next-generation technologies such as high bandwidth memory (HBM), which is essential for building AI infrastructures. Collaboration among companies to secure technological advantages and to meet new market demands is rapidly advancing.
  10. Hokkaido University and others develop lead-free indium bromide crystals with delayed and bicolor luminescence
    A research group led by Hokkaido University and others has announced the development of a new material with delayed and bicolor luminescence properties in lead-free indium bromide crystals. The new material is expected to be applied as a luminescent material with low environmental impact. The development of such new materials in the field of basic research is an important achievement that will contribute to future innovations in semiconductor-related technologies, such as next-generation displays and optoelectronic devices.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Mar 3, 15:49メモリ価格が「時間単位」にシフト、巨大企業が支配する中で中小企業が生き残りをかけるMemory pricing shifts to ‘hourly’ as giants dominate, SMEs fight for survivalhttps://www.digitimes.com/news/a20260303PD231/price-demand-growth-market-development.html
Mar 3, 16:07Qualcommの6G推進は、デバイスと産業界全体におけるAIと無線通信の優先順位の大幅な変化を示唆するQualcomm’s 6G push signals broader shifts in AI and wireless priorities for devices and industryhttps://www.digitimes.com/news/a20260303PD207/qualcomm-6g-wireless-mwc-2026.html
Mar 3, 15:46報道によると、サムスンはファウンドリの採算分岐点目標を2026年に前倒ししたSamsung reportedly moves up foundry break-even target to 2026https://www.digitimes.com/news/a20260303VL210/samsung-2026-production-2025-price.html
Mar 3, 14:56TSMC元幹部、主要なチップ技術流出疑惑で捜査対象にFormer TSMC executive under investigation for leaking core chip technologyhttps://www.digitimes.com/news/a20260303PD218/tsmc-technology-investigation-taiwan-intel-2025.html
Mar 3, 13:58米国、政府による中国関連チップの調達を禁止へUS moves to bar federal purchases of China-linked chipshttps://www.digitimes.com/news/a20260303VL206/usa-china-semiconductors-commercial-ban.html
Mar 3, 15:37米議会と産業界、新たな半導体セキュリティ義務を巡り対立US Congress and industry clash over new semiconductor security mandateshttps://www.digitimes.com/news/a20260303VL204/security-sales-military-chips-technology.html
Mar 3, 15:36ローム、バックエンド工程をインドのSuchi Semiconに外注Rohm outsources back-end processes to India’s Suchi Semiconhttps://www.digitimes.com/news/a20260303VL211/rohm-semicon-manufacturing-outsourcing-partnership.html
Mar 3, 14:21ヤジオ子会社ケメット、AIサーバ需要の堅調を受けタントルムコンデンサ価格を3度目に引き上げYageo subsidiary Kemet hikes tantalum capacitor prices for third time as strong AI server demand continueshttps://www.digitimes.com/news/a20260302PD239/yageo-tantalum-capacitor-price-increase-ai-server-demand.html
Mar 3, 14:11Nasdaq上場のAIチップメーカーBlaize、主権エッジ推論の成長を狙いインドに期待Nasdaq-listed AI chipmaker Blaize bets on India for sovereign edge inference growthhttps://www.digitimes.com/news/a20260303VL207/india-ai-inference-training-processor-semiconductor-industry-infrastructure.html
Mar 3, 12:31Rapidus、2nm画像処理チップでキヤノンと提携、供給と投資に影響Rapidus to partner with Canon on 2nm image-processing chips, raising supply and investment implicationshttps://www.digitimes.com/news/a20260303VL208/rapidus-canon-2nm-chips-investment.html
Mar 3, 12:28サムスンとSKハイニックス、HBM・DRAM需要のスーパーサイクル突入を受け採用拡大Samsung, SK Hynix expand hiring as HBM, DRAM demand enters supercyclehttps://www.digitimes.com/news/a20260303PD227/samsung-sk-hynix-semiconductor-industry-talent-demand.html
Mar 3, 11:19ホルムズ海峡の脅威が、韓国のメモリ回復に試練を与えるStrait of Hormuz threat tests South Korea’s memory recoveryhttps://www.digitimes.com/news/a20260303PD216/memory-chips-production-recovery-middle-east-south-korea.html
Mar 3, 10:49TSMC、台湾におけるSiPh機器と材料の地元調達を主導TSMC to lead SiPh equipment and materials localization in Taiwanhttps://www.digitimes.com/news/a20260303PD215/taiwan-siph-equipment-tsmc-materials.html
Mar 3, 10:36MediaTek、SiPhスタートアップAyar Labsに9000万米ドルを投資MediaTek invests US$90M in SiPh startup Ayar Labshttps://www.digitimes.com/news/a20260303PD214/mediatek-siph-startup-cpo-cloud-ai.html
Mar 3, 10:102026年第2四半期にDRAM価格が最大70%急騰、Nvidia GTC 2026がAIメモリブームを引き起こすDRAM prices to surge up to 70% in 2Q26; Nvidia GTC 2026 ignites AI memory rallyhttps://www.digitimes.com/news/a20260303PD201/dram-hbm-expansion-nvidia-gtc-2026.html
Mar 3, 08:55Nvidia、AI光学技術の進展を目指しLumentumに投資Nvidia invests in Lumentum to advance AI optics technologyhttps://www.digitimes.com/news/a20260303VL200/nvidia-optics-investment-partnership-infrastructure.html
日経 Tech Foresight
2026-03-04北大など、遅延・2色発光の臭化インジウム結晶 非鉛系https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC2761C0X20C26A2000000
2026-03-03ニコン背水の半導体、新社長に託す ASML互換で追う背中https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC024220S6A300C2000000
マイナビニュース テックプラス
2026-03-03東大発半導体スタートアップのGaianixx、シリーズC 1stラウンドとして総額20億円を調達https://news.mynavi.jp/techplus/article/20260303-4181258/
2026-03-03田中貴金属工業、複雑な半導体にも“金バンプ”形成できる転写技術を確立https://news.mynavi.jp/techplus/article/20260303-4180948/
2026-03-03キヤノンと日本シノプシス、NEDO採択の次世代半導体設計技術開発事業に参画https://news.mynavi.jp/techplus/article/20260303-4181065/
2026-03-03NTTなど、陽子と中性子による半導体障害発生率の同一性を初めて実証https://news.mynavi.jp/techplus/article/20260303-4180693/
2026-03-03ローム、印Suchi Semiconとインドにおける半導体製造パートナーシップを締結https://news.mynavi.jp/techplus/article/20260303-4180741/
2026-03-03TowerとSalience Labs、次世代データセンター向け大規模光回路スイッチ量産で提携https://news.mynavi.jp/techplus/article/20260303-4180695/
2026-03-03TowerとXanadu、商用規模対応の光量子品ピューティング向け製造基盤構築で協業https://news.mynavi.jp/techplus/article/20260303-4180649/
2026-03-03AlteraがNECやBroadcomと提携、高性能無線ソリューションの開発を支援https://news.mynavi.jp/techplus/article/20260303-4180273/
2026-03-032025年第4四半期の半導体企業売上高ランキングトップ20、日本企業は3社がランクイン SI調べhttps://news.mynavi.jp/techplus/article/20260303-4180231/
2026-03-03CES2026 大画面TV主役交代の現場 – 中国LCDが主導権、韓国はハイエンドの再定義、そしてAI×QDが描く次章https://news.mynavi.jp/techplus/article/20260303-4178713/
2026-03-03SK hynixがメモリ工場の日本進出のうわさを否定、米国での前工程進出を優先か?https://news.mynavi.jp/techplus/article/20260303-4178617/
TrendForce
2026-03-03SKハイニックス、狭いDRAM間隔を活かして性能向上を図る新型HBM4パッケージングを模索していると報じられるSK hynix Reportedly Explores New HBM4 Packaging, Boosting Performance via Tight DRAM Gapshttps://www.trendforce.com/news/2026/03/03/news-sk-hynix-reportedly-explores-new-hbm4-packaging-boosting-performance-via-tight-dram-gaps/
2026-03-03SKC、ガラス基板の早期実用化を加速するため、1兆ウォンの資本増強の半分以上をAbsolicsに投入していると報じられるSKC Reportedly Channels Over Half of ₩1T Capital Increase Into Absolics to Fast-Track Glass Substrateshttps://www.trendforce.com/news/2026/03/03/news-skc-reportedly-channels-over-half-of-%e2%82%a91t-capital-increase-into-absolics-to-fast-track-glass-substrates/
2026-03-03サムスンのTaylorにおける遅延で大量生産が2027年にずれ込み、テスラへの懸念が高まっていると報じられるDelay at Samsung’s Taylor Reportedly Slips Mass Production to 2027, Raising Concerns for Teslahttps://www.trendforce.com/news/2026/03/03/news-delay-at-samsungs-taylor-reportedly-slips-mass-production-to-2027-raising-concerns-for-tesla/
2026-03-03イスラエルでの騒乱がタワーを混乱させ、受注がVanguardやPSMCに移行し、成熟ノードの価格が上昇していると報じられるIsrael Unrest Disrupts Tower; Orders Reportedly Shift to Vanguard, PSMC, Lifting Mature-Node Pricinghttps://www.trendforce.com/news/2026/03/03/news-israel-unrest-disrupts-tower-orders-reportedly-shift-to-vanguard-psmc-lifting-mature-node-pricing/
2026-03-03インテル、MWCで18AチップレットデザインとFoveros Direct 3Dを採用したXeon 6+ Clearwater Forestを発表Intel Unveils Xeon 6+ Clearwater Forest at MWC with 18A Chiplet Design and Foveros Direct 3Dhttps://www.trendforce.com/news/2026/03/03/news-intel-unveils-xeon-6-clearwater-forest-at-mwc-with-18a-chiplet-design-and-foveros-direct-3d/
Semiconductor Digest
6 hours agoAIが半導体M&Aの戦略を書き換える ― メモリ部門が最も大きな衝撃を受けるAI is Rewriting the Semiconductor M&A Playbook – Memory is Where it Hits Hardesthttps://www.semiconductor-digest.com/ai-is-rewriting-the-semiconductor-ma-playbook-memory-is-where-it-hits-hardest/
6 hours agoMenlo MicroとPurdue大学、スケーラブルな量子コンピューティング向け商業用極低温スイッチング技術を推進Menlo Micro and Purdue Advance Commercial Cryogenic Switching for Scalable Quantum Computinghttps://www.semiconductor-digest.com/menlo-micro-and-purdue-advance-commercial-cryogenic-switching-for-scalable-quantum-computing/
8 hours agoTANAKA、焼結金ボンディング技術用の移転技術を確立TANAKA Establishes Transfer Technology for its Sintered Gold Bonding Technologyhttps://www.semiconductor-digest.com/tanaka-establishes-transfer-technology-for-its-sintered-gold-bonding-technology/
日本経済新聞
2026-03-04米国株15時、ダウ続落 下げ幅縮め303ドル安 イラン攻撃の長期化懸念が重荷https://www.nikkei.com/article/DGXZQOFL03BX30T00C26A3000000/
2026-03-04未経験でもエンジニアに UT系など製造派遣、派遣先と共同で育成https://www.nikkei.com/article/DGXZQOUC169XE0W6A210C2000000/
2026-03-04西鉄、国際物流網拡大でトルコに事務所 人口増のアフリカ拠点も視野https://www.nikkei.com/article/DGXZQOJC282BU0Y6A220C2000000/
2026-03-04ダイキン、下方修正でも北米シェア増 エアコン不況に負けぬ地盤固めhttps://www.nikkei.com/article/DGXZQOUF091UU0Z00C26A2000000/
2026-03-04平田機工の次期社長「AI半導体みな強気」 売上高1000億円に挑むhttps://www.nikkei.com/article/DGXZQOJC263J00W6A220C2000000/
2026-03-04ドイツ株3日 続落、3%安 エネルギー高を警戒 仏株も3%安https://www.nikkei.com/article/DGXZQOFL03CFU0T00C26A3000000/
2026-03-04Appleが新型MacBook Air、18万4800円から AIの処理4倍速くhttps://www.nikkei.com/article/DGXZQOGN03C3B0T00C26A3000000/
2026-03-04DRAM大口取引価格、1カ月で2倍に急騰 AI需要急増で品薄にhttps://www.nikkei.com/article/DGXZQOUB069YL0W6A200C2000000/
2026-03-04ラピダスの顧客候補にキヤノン 国内大手初、2ナノ半導体を生産委託https://www.nikkei.com/article/DGXZQOUC169XP0W6A110C2000000/
2026-03-04生保大手4社、営業拠点5年連続で縮小へ コスト削減で営業効率を向上https://www.nikkei.com/article/DGXZQOUB159VS0V10C26A1000000/
ダイヤモンドオンライン
Mar 3 19:35化学業界「3年後の予測年収」88社ランキング【2026年版】三菱ケミカル、旭化成、富士フイルムは何位?https://diamond.jp/articles/-/385022
Mar 3 19:10三井化学の次期社長レース「3人の候補」の実名!“本命・対抗”シナリオが浮き彫りにする石油化学業界大再編の行方《再配信》https://diamond.jp/articles/-/384987
Mar 2 21:00まさか日本が鍵なんて…中国「レアアース禁輸」で窮地のアメリカが欲しがる「技術」とは?〈再配信〉https://diamond.jp/articles/-/384126
Mar 2 19:30高市首相が人口減・高齢化「日本列島を強く豊かに」実現の王道、サッチャー氏に見習うべきミクロ問題の徹底解決https://diamond.jp/articles/-/384895
Mar 1 22:00年収が高い会社ランキング2025【中国&四国地方・トップ5】中国電力が4位、1位の世界的大企業は?https://diamond.jp/articles/-/384741
Mar 1 21:00年収が高い会社ランキング2025【中国&四国地方・106社完全版】マツダ・サンマルク・青山商事は何位?https://diamond.jp/articles/-/384739
Mar 1 20:00エヌビディア株が大幅安、投資家は好決算に反応鈍くhttps://diamond.jp/articles/-/384825
Mar 1 19:55社長交代のキヤノン御手洗氏「30年の功罪」を徹底分析!“企業価値向上度”でライバル富士フイルムと比較、軍配はどちらに?https://diamond.jp/articles/-/384812
Feb 28 22:05【知っておきたいビジネス科学】取り組む企業の数が“最も多い”量子コンピュータの実現方法とは?https://diamond.jp/articles/-/384780
Tom’s Hardware
TechPowerup
2026-03-03T20:35:43+00:00AIサーバーのストレージ需要が急増;主要5大NANDフラッシュサプライヤー、2025年第4四半期に23.8%の四半期比収益成長を記録AI Server Storage Demand Surges; Top Five NAND Flash Suppliers Post 23.8% QoQ Revenue Growth in 4Q25https://www.techpowerup.com/347012/ai-server-storage-demand-surges-top-five-nand-flash-suppliers-post-23-8-qoq-revenue-growth-in-4q25
2026-03-03T20:28:56+00:00Seagate、44TB容量を備えた次世代Mozaic 4+ハードドライブを発表Seagate Delivers Next-Generation Mozaic 4+ Hard Drives with 44 TB Capacityhttps://www.techpowerup.com/347011/seagate-delivers-next-generation-mozaic-4-hard-drives-with-44-tb-capacity
2026-03-03T20:21:17+00:00MSI、24GB VRAM搭載のGeForce RTX 5090D v2 Lightningが登場MSI GeForce RTX 5090D v2 Lightning Appears with 24 GB VRAMhttps://www.techpowerup.com/347009/msi-geforce-rtx-5090d-v2-lightning-appears-with-24-gb-vram
2026-03-03T20:15:13+00:00ACEMAGIC K1 Mini PC (Core i5-12600H)―高性能を手頃な価格で実現ACEMAGIC K1 Mini PC (Core i5-12600H)—Premium Performance Without the Premium Pricehttps://www.techpowerup.com/346734/acemagic-k1-mini-pc-core-i5-12600h-premium-performance-without-the-premium-price
2026-03-03T20:09:09+00:00AMDのCEOリサ・スー氏、サーバーCPUの需要が予想を大幅に上回り、供給が逼迫していると述べるAMD CEO Lisa Su Says Server CPU Demand “Far Exceeded” Expectations, Supply Now Tighteninghttps://www.techpowerup.com/347008/amd-ceo-lisa-su-says-server-cpu-demand-far-exceeded-expectations-supply-now-tightening
2026-03-03T18:25:11+00:00Apple、M5 ProおよびM5 Maxが新たな「M-Core」層とSoIC 2.5Dパッケージングを初披露Apple M5 Pro and M5 Max Debut New “M-Core” Tier and SoIC 2.5D Packaginghttps://www.techpowerup.com/347005/apple-m5-pro-and-m5-max-debut-new-m-core-tier-and-soic-2-5d-packaging
2026-03-03T18:13:51+00:00Intuit QuickBooks、永久ライセンスを提供開始―現在セール中Intuit QuickBooks Now Offers a Lifetime License, and It’s on Salehttps://www.techpowerup.com/346953/intuit-quickbooks-now-offers-a-lifetime-license-and-its-on-sale
2026-03-03T18:02:31+00:00Keychron、B11 Proポケットサイズのアリス配列エルゴノミックキーボードを発売Keychron Launches B11 Pro Pocketable Alice Layout Ergonomic Keyboardhttps://www.techpowerup.com/347004/keychron-launches-b11-pro-pocketable-alice-layout-ergonomic-keyboard
2026-03-03T16:58:25+00:00NVIDIAのCEOジェンセン・ファンと世界の技術リーダーがGTC 2026でAI時代を披露NVIDIA CEO Jensen Huang and Global Technology Leaders to Showcase Age of AI at GTC 2026https://www.techpowerup.com/347001/nvidia-ceo-jensen-huang-and-global-technology-leaders-to-showcase-age-of-ai-at-gtc-2026
2026-03-03T16:08:29+00:00Micron、データセンター向けインフラ用に世界初の大容量256GB LPDRAM SOCAMM2を発表Micron Releases World’s First High-Capacity 256 GB LPDRAM SOCAMM2 for Data Center Infrastructurehttps://www.techpowerup.com/346999/micron-releases-worlds-first-high-capacity-256-gb-lpdram-socamm2-for-data-center-infrastructure
2026-03-03T16:05:03+00:00VIA Labs、Embedded World 2026で産業用USB 5Gbpsおよび10Gbpsハブコントローラーを発表VIA Labs Announces Industrial-Grade USB 5Gbps and 10Gbps Hub Controllers at Embedded World 2026https://www.techpowerup.com/346998/via-labs-announces-industrial-grade-usb-5gbps-and-10gbps-hub-controllers-at-embedded-world-2026
2026-03-03T15:54:14+00:00QuectelとMediaTek、MWC 2026で次世代5G-AおよびWi-Fi 8対応のインテリジェントCPEリファレンスデザインを公開Quectel and MediaTek Unveil Next Generation 5G-A and Wi-Fi 8 Intelligent CPE Reference Design at MWC 2026https://www.techpowerup.com/346996/quectel-and-mediatek-unveil-next-generation-5g-a-and-wi-fi-8-intelligent-cpe-reference-design-at-mwc-2026
2026-03-03T15:47:02+00:00Elgato、Wave Nextオーディオソフトウェアおよびハードウェアエコシステムを発表Elgato Announces Its Wave Next Audio Software and Hardware Ecosystemhttps://www.techpowerup.com/346995/elgato-announces-its-wave-next-audio-software-and-hardware-ecosystem
EETimes Taiwan
2026-03-03産業4.0:PLCを廃止せず統合・監視を行う工業4.0:對PLC進行整合和監控而非淘汰https://www.eettaiwan.com/20260303nt31-industry-4-0-don-t-rip-out-legacy-plcs-integrate-and-monitor-them/
2026-03-03衛星通信が3GPP標準を採用:専有孤島からグローバル規模へ衛星通訊採用3GPP標準:從專有孤島邁向全球規模https://www.eettaiwan.com/20260303nt71-satcom-adopting-3gpp-standards-from-proprietary-silos-to-global-scale/
2026-03-03メモリ価格が全面的に引き上げられ、各種製品の四半期伸び率が史上最高に記憶體價格全面上修 各類產品季增幅度將創歷史新高https://www.eettaiwan.com/20260303nt21-prices-of-all-kinds-of-products-will-reach-record-highs/
2026-03-02AIがメモリ市場をどのように変革するかAI如何重塑記憶體市場https://www.eettaiwan.com/20260302nt61-hbm-dram-and-nand-how-ai-is-reshaping-the-memory-market/
2026-03-02エージェント型AIで自律エッジを構築する以代理式AI打造自主邊緣https://www.eettaiwan.com/20260302nt31-building-the-autonomous-edge-with-agentic-ai/
2026-03-02新製品の価格改定が販売に衝撃、第2四半期からスマートフォン生産が明らかに圧迫される新機調價衝擊銷售 第二季起智慧型手機生產明顯承壓https://www.eettaiwan.com/20260302nt21-q2-smartphone-production/
EETimes Asia
2026-03-03TrendForce:価格ラリーが2025年第4四半期のDRAM収益を30%増加させるTrendForce: Price Rally Drives 4Q 2025 DRAM Revenue Up 30%https://www.eetasia.com/trendforce-price-rally-drives-4q-2025-dram-revenue-up-30/
2026-03-03STの最新センサー、医療用ウェアラブルで精度とバッテリー寿命を向上ST’s Latest Sensor Enhances Precision, Battery Life in Medical Wearableshttps://www.eetasia.com/sts-latest-sensor-enhances-precision-battery-life-in-medical-wearables/
2026-03-03SK hynixとSandisk、次世代メモリHBFのグローバル標準化で協力SK hynix, Sandisk Collaborating on Global Standardization of Next-Gen Memory HBFhttps://www.eetasia.com/sk-hynix-sandisk-collaborating-on-global-standardization-of-next-gen-memory-hbf/
2026-03-03ASE、AIパッケージング需要の急増を背景に投資を強化ASE Ramps Up Investment as AI Packaging Demand Accelerateshttps://www.eetasia.com/ase-ramps-up-investment-as-ai-packaging-demand-accelerates/
2026-03-03Rapidus、17億ドルの資金調達に成功Rapidus Raises $1.7B in Fundinghttps://www.eetasia.com/rapidus-raises-1-7b-in-funding/
2026-03-02メモリ危機の深刻化を背景に、2026年のスマートフォン出荷台数が記録的な急落に見舞われる2026 Smartphone Shipments to See Sharpest Decline on Record Amid Deepening Memory Crisishttps://www.eetasia.com/2026-smartphone-shipments-to-see-sharpest-decline-on-record-amid-deepening-memory-crisis/
2026-03-02DNP、Rapidusの資金調達ラウンドに参加し、2027年までに2nm半導体の大量生産を加速DNP Joins Rapidus Funding Round to Accelerate 2nm Semiconductor Mass Production by 2027https://www.eetasia.com/dnp-joins-rapidus-funding-round-to-accelerate-2nm-semiconductor-mass-production-by-2027/
2026-03-02JEDEC、UFSおよびメモリインターフェース規格の更新を発表JEDEC Releases Updates to UFS and Memory Interface Standardshttps://www.eetasia.com/jedec-releases-updates-to-ufs-and-memory-interface-standards/
2026-03-02Ceva、2025年をAIライセンスと実機でのAI採用における画期的な年と位置づけるCeva Highlights Breakthrough Year for AI Licensing, Physical AI Adoption in 2025https://www.eetasia.com/ceva-highlights-breakthrough-year-for-ai-licensing-physical-ai-adoption-in-2025/
2026-03-02限界を打破する:なぜマルチカラーシリコンフォトニクスが2026年のAI拡大の鍵となるのかEscaping the Limits: Why Multicolor Silicon Photonics are the Missing Link for Scaling AI in 2026https://www.eetasia.com/escaping-the-limits-why-multicolor-silicon-photonics-are-the-missing-link-for-scaling-ai-in-2026/
EETimes India
2026-03-02Ceva、2025年におけるAIライセンスおよび実機AI導入で画期的な成果を強調Ceva Highlights Breakthrough Year for AI Licensing, Physical AI Adoption in 2025https://www.eetindia.co.in/ceva-highlights-breakthrough-year-for-ai-licensing-physical-ai-adoption-in-2025/
2026-03-02ルネサス、強化されたリーダーシップによりインドと中国戦略を推進Renesas Advances Its India and China Strategy with Strengthened Leadershiphttps://www.eetindia.co.in/renesas-advances-its-india-and-china-strategy-with-strengthened-leadership/
2026-03-02クアルコム、インドでの自動車用モジュール製造にタタエレクトロニクスを起用Qualcomm Taps Tata Electronics for Automotive Module Manufacture in Indiahttps://www.eetindia.co.in/qualcomm-taps-tata-electronics-for-automotive-module-manufacture-in-india/
ZDNET Korea
2026-03-0410年前の価格で…イマート、ゴレイトフェスタ2週目突入10년 전 가격으로…이마트, 고래잇 페스타 2주차 돌입https://www.zdnet.co.kr/20260303173240%22%20title=%22
2026-03-04AIネットワーク?…サムスン電子「10年前から準備していた」AI 네트워크?…삼성전자 “10년 전부터 준비됐다”https://www.zdnet.co.kr/20260304005351%22%20title=%22
2026-03-03エアコン火災が2年で急増…消費者院、安全点検キャンペーン에어컨 화재 2년새 급증…소비자원, 안전점검 캠페인https://www.zdnet.co.kr/20260303220106%22%20title=%22
2026-03-03デドン、2026年協力会社パートナーシップデー開催대동, 2026 협력사 파트너십데이 개최https://www.zdnet.co.kr/20260303215424%22%20title=%22
2026-03-03病院のアンケートが対話形式に変わる…GPTが患者の問診票の代わりに作成する時代병원 설문지가 대화로 바뀐다…GPT가 환자 문진표 대신 작성하는 시대https://www.zdnet.co.kr/20260303215144%22%20title=%22
2026-03-03メモリ供給難が直撃…スマートフォン出荷量が12%減少と予測메모리 공급난 직격탄…스마트폰 출하량 12% 감소 전망https://www.zdnet.co.kr/20260303215041%22%20title=%22
2026-03-03チャットGPTが小説を吸収して成長する…AI学習データに隠された『フィクションの秘密』챗GPT가 소설을 먹고 자란다…AI 학습 데이터에 숨겨진 ‘픽션의 비밀’https://www.zdnet.co.kr/20260303215038%22%20title=%22
2026-03-03LIGネックスワン、上半期に大規模な新卒採用LIG넥스원, 상반기 대규모 공채https://www.zdnet.co.kr/20260303214344%22%20title=%22
2026-03-03[カードニュース] ホルムズ海峡が封鎖されました[카드뉴스] 호르무즈 해협이 막혔어요https://www.zdnet.co.kr/20260303104301%22%20title=%22
2026-03-03技術発展に追いつけない通信網…ファーウェイ「AIは待ってくれない」기술발전 못따르는 통신망…화웨이 “AI는 기다려주지 않는다”https://www.zdnet.co.kr/20260303205812%22%20title=%22
2026-03-03「デジタル政策の断片化…イノベーション・投資・包摂を阻む」“디지털 정책 파편화…혁신·투자·포용 막는다”https://www.zdnet.co.kr/20260303195053%22%20title=%22
2026-03-03科学技術労組、NST推進の共通行政専門化中断を要求…「特定分野の統合に反対しているわけではない」과기노조, NST 추진 공통행정 전문화 중단 요구…”특정분야 통합에 반대하는 건 아냐”https://www.zdnet.co.kr/20260303175125%22%20title=%22
2026-03-03ファーウェイ、SuperPoD基盤のAI・汎用コンピューティングソリューションを公開화웨이, SuperPoD 기반 AI·범용 컴퓨팅 솔루션 공개https://www.zdnet.co.kr/20260303191528%22%20title=%22
2026-03-03「TCO30%削減、混雑か?」…ファーウェイ、モバイルソリューションをアップグレード“TCO 30% 절감, 혼잡인지”…화웨이, 모바일 솔루션 업그레이드https://www.zdnet.co.kr/20260303190533%22%20title=%22
2026-03-03コビット、保有しているビットコインとイーサリアム72億ウォン相当を売却코빗, 보유 중인 비트코인 이더리움 72억원 어치 매도https://www.zdnet.co.kr/20260303185838%22%20title=%22
2026-03-0319周年のバディフランド、AIヘルスケアロボット『グローバルスタンダードの元年』を宣言19주년 바디프랜드, AI헬스케어로봇 ‘글로벌 표준 원년’ 선언https://www.zdnet.co.kr/20260303185109%22%20title=%22
2026-03-03NHNデータ ソーシャルビズ、インスタグラムデータに基づく分析サービスを開始NHN데이터 소셜비즈, 인스타그램 데이터 기반 분석 서비스 출시https://www.zdnet.co.kr/20260303183452%22%20title=%22
2026-03-03アースアライアンス、サイダー経済・『ドンチュルナム』のキム・ギョンピルと協力어스얼라이언스, 사이다경제·’돈쭐남’ 김경필과 협업https://www.zdnet.co.kr/20260303183057%22%20title=%22
2026-03-03CJフレッシュウェイ、レジャー・コンセッションの飲食施設で春の季節限定新メニューを発売CJ프레시웨이, 레저·컨세션 식음시설서 봄 제철 신메뉴 출시https://www.zdnet.co.kr/20260303182821%22%20title=%22
2026-03-03CJオンスタイル、「2026 CJオンキュベイティング」110億ウォンのファンドを設立CJ온스타일, ‘2026 CJ온큐베이팅’ 110억 펀드 조성https://www.zdnet.co.kr/20260303182008%22%20title=%22
中央日報
2026-03-04その日、機械科の学生が専攻を変え、AIで人生を一変、『アルパゴ キッズ』[アルパゴ ショック 10年]그날 기계과 학생 전공 바꿨다, AI로 인생 튼 '알파고 키즈' [알파고 쇼크 10년]https://www.joongang.co.kr/article/25408981
2026-03-04[社説] 対米投資特別法、あなたの非難論争をやめ、超党派的に対処せよ[사설] 대미투자특별법, 네 탓 공방 멈추고 초당적으로 처리하라https://www.joongang.co.kr/article/25408955
2026-03-04空に届く通信…『6G時代』を垣間見る하늘에 닿은 통신…‘6G 시대’를 엿보다https://www.joongang.co.kr/article/25408928
2026-03-04アップル、記憶容量を2倍増、価格据え置き…S26に対抗するコストパフォーマンス戦略애플, 저장용량 2배 늘리고 가격 그대로…S26 맞서 가성비 전략https://www.joongang.co.kr/article/25408921
2026-03-04先端人材誘致のため『トップティアビザ』…教授・研究者まで対象を拡大첨단인력 유치 ‘톱티어 비자’…교수·연구원까지 대상 넓힌다https://www.joongang.co.kr/article/25408893
2026-03-03チョン・ソンホ「人口減少地域の労働者拡大、先端人材確保のための移民政策を策定」정성호 “인구감소지역 노동자 확대, 첨단인력 확보 위한 이민정책 마련”https://www.joongang.co.kr/article/25408837
BAIDU
昨天19:55A株半導体企業が一斉に値上げ通知を発行、最高で80%の上昇A股半导体公司集体发涨价函,最高涨80%https://baijiahao.baidu.com/s?id=1858641893948215940&wfr=spider&for=pc
昨天15:59パワー半導体の値上げラッシュ到来、A株企業が次々と価格改定功率半导体涨价潮来袭 A股多企业密集调价https://baijiahao.baidu.com/s?id=1858630882872385292&wfr=spider&for=pc
昨天19:00最大80%の値上げ!A株半導体企業が一斉に値上げ通知を発行最高涨80%!A股半导体公司集体发涨价函https://baijiahao.baidu.com/s?id=1858638370749903218&wfr=spider&for=pc
昨天18:30最大80%の値上げ!A株半導体業界に値上げラッシュ、AIが主要推進力に最高涨80%!A股半导体涨价潮来袭,AI成核心推手https://baijiahao.baidu.com/s?id=1858636422336316223&wfr=spider&for=pc
昨天18:03臻宝テクノロジー、科創板IPOがまもなく審査に乗る―国産半導体部品分野の全供給チェーン統合を目指す…臻宝科技科创板IPO即将上会 打造国产半导体零部件领域全链条综合…https://baijiahao.baidu.com/s?id=1858634849488988516&wfr=spider&for=pc
昨天21:53先鋒精科、転換社債発行で最大7.5億元の資金調達を計画―半導体先端プロセスの中核へ…先锋精科拟发行可转债募资不超7.5亿元 用于半导体先进制程核心…https://baijiahao.baidu.com/s?id=1858649631482664415&wfr=spider&for=pc
昨天20:01中砥半導体、無錫雲林からのAラウンド投資を獲得中砥半导体获无锡云林A轮投资https://baijiahao.baidu.com/s?id=1858672373343957446&wfr=spider&for=pc
昨天19:04先鋒精科:転換社債発行による最大7.5億元の資金調達計画―半導体先端プロセスの中核へ…先锋精科:拟发行可转债募资不超7.5亿元 用于半导体先进制程核心…http://www.nbd.com.cn/articles/2026-03-03/4277389.html
昨天19:04先鋒精科:転換社債発行で最大7.5億元の資金調達を計画―半導体先端プロセスの中核へ…先锋精科:拟发行可转债募资不超7.5亿元 用于半导体先进制程核心…https://baijiahao.baidu.com/s?id=1858638402050217070&wfr=spider&for=pc
昨天18:46半導体産業チェーン全体が調整に入り、易方达(159558)の半導体装置ETFや科創芯片に注目芯片产业链集体回调,关注半导体设备ETF易方达(159558)、科创芯片…http://www.nbd.com.cn/articles/2026-03-03/4277346.html
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