Semiconductor News 20260217

Main News

1. DRAM Prices Soar “Parabolic” on AI Demand, Memory Shortage Grows Serious
   DRAM prices are surging uncontrollably on the back of strong demand for AI servers, leading to what has been dubbed “RAMmageddon”. The price increase is accelerating at a parabolic rather than linear pace, and supply shortages are spreading throughout the electronics industry, affecting the NAND flash market as well, resulting in serious “chipflation” that is shaking electronics manufacturers’ cost structures to their very foundations.
2. Apple Agrees to Double NAND Prices from Kioxia, Changes Contract Format
   Apple has reportedly agreed to double its procurement prices from Kioxia in order to secure the NAND flash memory needed for iPhone and Mac production. In addition, the company appears to have shifted its pricing mechanism to a quarterly contract basis. This highlights the situation in which even Apple, with its enormous purchasing power, is forced to accept a significant cost increase to ensure a stable supply amid the global memory shortage.
3. U.S. Department of Defense Removes YMTC and CXMT from Sanctions List and Adds Alibaba and Others
   The U.S. Department of Defense has updated its list of Chinese military companies (1260H List), removing Chinese memory giants YMTC (長江存儲) and CXMT (長鑫存儲). On the other hand, new companies Alibaba, Baidu, and BYD were added. While a pragmatic decision to ease restrictions on Chinese memory may have been made as the memory shortage is beginning to have a negative impact on the U.S. economy, we are conversely becoming more wary of the tech giants with AI technology.
4. TSMC to invest an additional $100 billion in its Arizona facility to build four new fabs.
   TSMC is reportedly preparing plans to invest an additional $100 billion in its Arizona manufacturing facility and add four new fabs to its Arizona, USA, facility. If realized, this will dramatically expand the company’s state-of-the-art semiconductor manufacturing capacity in the U.S. This is a huge project that will meet the growing demand for AI chips, diversify geopolitical risks, and meet the needs of the U.S. government.
5. Sony may delay PlayStation 6 launch to 2028 or later due to soaring memory costs
   Sony is reportedly considering delaying the launch of its next-generation PlayStation 6 game console to 2028 or 2029, later than originally expected, due to GDDR6 and other Memory shortages due to AI demand are also directly delaying the roadmap for consumer entertainment products.
6. India Declares Challenge to Manufacture “2nm Semiconductors” within a Few Years
   The Indian government has declared its intention to challenge the manufacturing of 2-nanometer (nm) process semiconductors within a few years and transform itself into an advanced manufacturing nation. Currently, the local ecosystem is being built, with a focus on RISC-V architecture and a hard-line stance such as fining Intel. Backed by huge domestic demand and strong government support, the company has set ambitious goals to become a global hub not only for legacy but also for cutting-edge processes.
7. Rapidus to Install Second EUV Exposure System to Accelerate Preparation for 2nm Mass Production
   Japan’s Rapidus plans to install a second extreme ultraviolet (EUV) exposure system at its plant in Chitose, Hokkaido. In Japan, Micron’s Hiroshima Plant and others are also introducing EUV, and Rapidus is hurrying to establish a manufacturing process for mass production of 2nm generation in 2027.
8. Intel Restarts AI PC Strategy, Endorses New Memory Technology ZAM
   Intel has restructured its strategy to regain leadership in the AI PC market, endorsing a new memory technology, ZAM (Z-Alignment Memory), to replace HBM (High Bandwidth Memory). With HBM3 and HBM4 supplies held by SK Hynix and Samsung, Intel aims to eliminate bottlenecks and regain cost competitiveness in AI computing by betting on a new technology that could be a game changer.
9. Memory Prices Soar 600%+, Hurting Procurement of Telecom Infrastructure Equipment
   Prices for some legacy and application-specific memory have soared more than 600%, dealing a serious blow to telecom operators’ procurement of broadband equipment. In the shadow of special demand for AI, the supply chain for equipment that supports social infrastructure is coming under pressure.
10. TSMC and Intel vie for ASML’s next-generation EUV for 2027 mass production
    Major companies such as Intel, Samsung, SK Hynix, and TSMC are vying for ASML’s next-generation “High-NA EUV” lithography equipment for the 2027 to 2028 mass production timing. The competition for introduction of this technology is intensifying. This equipment, which is the key to breaking through the limits of miniaturization, is extremely expensive per unit, but each company is investing large sums of money in it as an essential investment for the next generation of AI semiconductor hegemony.

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