Semiconductor News 20260211

Main News

1. U. S. Considers Tariff Exemption on TSMC Chips for Tech Giants
   The U.S. government is reportedly considering a tariff exemption on TSMC chips imported by U.S. technology giants such as Amazon, Google, and Microsoft in exchange for TSMC’s commitment to expand its production capacity in the U.S. The government is reportedly considering a tariff exemption for TSMC chips imported by U.S. technology giants such as Amazon, Google, and Microsoft in exchange for a commitment to expand U.S. domestic production capacity. This is seen as a strategic policy adjustment designed to balance two objectives: promoting domestic manufacturing and reducing the cost burden on homegrown companies that are in a hurry to build AI infrastructure.
2. SK Hynix to Ship HBM4 for Nvidia’s Vera Rubin this Month
   SK Hynix plans to ship its first HBM4, a high-bandwidth memory that will be used in Nvidia’s next-generation AI accelerator Vera Rubin, this month. The commercialization of next-generation memory, which is essential for improving the performance of AI semiconductors, is progressing faster than expected.
3. TSMC Reports 37% January Sales Growth and Massive $45 Billion Investment Plan
   TSMC’s January 2026 sales jumped 36.8% y/y on the back of strong AI demand. In response to this strong performance, the company has set its capital expenditure plan (CapEx) for 2026 at $45 billion, and intends to accelerate its expansion of advanced processes and transition to next-generation technologies. Backed by its overwhelming financial strength, the company is poised for a solo run in the foundry market.
4. China ‘s CXMT to Commit 20% of Production Capacity to HBM3 Mass Production
   While Korean firms are moving to HBM4, Chinese memory maker CXMT (Changjiang Zunyue) reportedly plans to devote about 20% of its production capacity in 2026 to HBM3 mass production. While U.S. regulations restrict access to advanced equipment, the company is making maximum use of its existing facilities to promote domestic production of memory for AI, and is trying to build a supply system to meet domestic demand for AI chips in China.
5. ASML’s Next-Generation “Hyper-NA” EUV to Go into Mass Production in 2027-2028
   The CEO of ASML, the largest semiconductor lithography equipment manufacturer, has indicated that the mass production of its next-generation “Hyper-NA” EUV equipment, which exceeds the current High-NA EUV technology, is expected around 2027 to 2028. This technology, which will enable further miniaturization, is expected to be available in 2027 to 2028. This technology, which will enable further miniaturization, is expected to be the foundation for the semiconductor roadmap in the 2030s, and the schedule for the long-term technology development race has been clarified.
6. Renesas, after falling into the red for the first time in six years, is now making a comeback by starting operations of its Indian plant in September.
   Renesas Electronics has posted its first final loss in six years, but is clearly focusing on the Chinese and Indian markets as a recovery measure. In particular, the semiconductor plant in India, in which the company has invested, is scheduled to start operations in September, achieving the long-held goal of local production. In addition, there are reports of a move to sell its timing device business to SiTime of the U.S. as part of efforts to optimize its business portfolio, and the company is proceeding with the selection and concentration of its management resources.
7. Memory Prices Soar, Trending Higher in 2026 on AI Demand
   Prices continue to soar in the memory market, with some reports indicating that prices have risen nearly 90% since Q4 2025 Demand for AI servers is putting pressure on supply, and this bull market is expected to continue through 2026. The bull market is expected to continue through 2026. There are also price increases in passive components such as chip resistors, which is increasing upward pressure on component costs throughout the electronics industry.
8. Google ‘s Parent Company Issues Unprecedented “100-Year Bond” for AI Investment
   Alphabet, the parent company of Google, has issued an unprecedented ultra-long-term bond with a maturity of 100 years to secure funds for long-term AI infrastructure investment. The bond is analyzed as a catalyst for the inflow of AI funds in the Asian market, and in anticipation of a long-term competition in AI development, Alphabet has demonstrated its commitment to continue investment in data centers and semiconductors by raising funds on a scale that is larger than any other company in terms of financials.
9. Europe Launches Pilot Line to Develop AI Chips Below 2nm
   Europe is rolling out a “NanoIC” pilot line to accelerate the development of AI chips using process technologies below 2 nanometers. Led by research institute imec and others, the project aims to establish design and manufacturing technologies for next-generation semiconductors by establishing a state-of-the-art clean room infrastructure. In addition to attracting manufacturing bases, this initiative is also an effort to increase Europe’s presence in the research and development of next-generation technologies.
10. India Targets 75% Self-Sufficiency with Four Semiconductor Factories
    The Indian government has significantly strengthened its domestic chip production capacity with the startup of four new semiconductor factories. With this move, the government has set an ambitious goal of raising the domestic production ratio of semiconductor products to 75%. At the same time, it is strengthening its design ecosystem, including the opening of a pre-silicon verification facility, as it seeks to establish itself as a global semiconductor hub in terms of both manufacturing and design.

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