Semiconductor News 20260129

TOC

Main News

  1. SK Hynix Reverses Samsung with Record Earnings, Invests $10 Billion in the U.S.
    SK Hynix’s 2025 financial results surpassed Samsung Electronics with record operating income of 47.2 trillion won, thanks to an explosion in demand for AI memory. In addition, the company plans to invest $10 billion to establish a U.S. subsidiary specializing in AI solutions to strengthen its AI competitiveness in Indiana and elsewhere in the U.S. This is a strategic move to significantly expand its presence in the U.S. while consolidating its leadership in the HBM market.
  2. NVIDIA Considering Outsourcing to Intel for 2028 Chip Production
    NVIDIA is reportedly considering a strategy to transfer some of its 2028 chip production to Intel and reduce its reliance on TSMC, a move that takes into account TSMC’s packaging capacity constraints and geopolitical risk diversification If realized, this would be a major step forward for Intel in the foundry market. If realized, this could have a major impact on the foundry market, and would be an extremely important turning point for Intel in its efforts to revive its manufacturing division.
  3. Samsung to Fight Back by Concentrating DRAM Production Capacity for HBM4 Mass Production
    Samsung Electronics plans to allocate most of its latest 1c-nanometer DRAM production capacity to the next-generation HBM4 in an effort to regain its share of the AI memory market lost to SK Hynix, with the goal of starting mass production in early 2026, The company aims to deliver to NVIDIA as soon as possible. In addition, as SK Hynix solidifies its exclusive supply of HBM3E to Microsoft, Samsung is betting its corporate fortunes on a turnaround with the next-generation technology.
  4. ASML Plans 1,700 Job Cuts to Boost Efficiency Despite Surge in Orders
    Dutch manufacturing equipment giant ASML has posted record 2025 earnings as orders exceeded expectations on the back of surging AI and memory demand. At the same time, however, the company is planning to cut 1,700 jobs in an effort to make its organization more efficient: demand for EUV lithography equipment is strong, but the company has shown a willingness to review its cost structure and muscle up its organization amid strong earnings to ensure sustainable long-term growth.
  5. Beijing Authorities Approve Shipment of NVIDIA H200 to Chinese IT Giants
    Authorities in Beijing, China, have approved the purchase and shipment of NVIDIA’s H200 high-performance AI chips to domestic IT giants such as ByteDance, Alibaba and Tencent. The move, which comes amid ongoing U.S. export restrictions, signals both the reality that China still needs NVIDIA chips for AI development and a pragmatic play in the technology hegemony battle between the U.S. and China. Competition for AI development in the Chinese market may be re-accelerating.
  6. Toyota, Suzuki to Adopt Chinese SoCs for In-Vehicle Semiconductors
    Japanese automakers such as Toyota Motor Corporation and Suzuki Motor Corporation are reportedly shifting their strategy to use Chinese-made SoCs (system-on-chips) for their in-vehicle semiconductors. It appears that they have decided that it is essential to introduce locally manufactured semiconductors with superior cost competitiveness and performance in order to maintain competitiveness in the Chinese market, which is leading the way in electric vehicles (EV) and automated driving technology. This event symbolizes the structural change in the supply chain of the Japanese automotive industry.
  7. Government has high hopes for NTT’s photoelectric fusion technology, eyeing collaboration with Rapidus
    The Japanese government has high hopes for NTT’s photoelectric fusion (IOWN) technology, which combines electricity and light, and NVIDIA estimates that implementing photoelectric fusion could reduce power consumption by 70%. This will be the trump card for solving the problems of AI data centers. The government hopes to use this technology in conjunction with Rapidus, which aims to mass produce cutting-edge semiconductors, as a catalyst to boost the international competitiveness of Japan’s semiconductor and infrastructure industries.
  8. OpenAI’s “200 trillion yen” investment plan for survival
    OpenAI is reportedly envisioning a huge investment plan totaling 200 trillion yen, also known as the “AI version of the Manhattan Project”. This is aimed at building AI infrastructure and securing semiconductors, with the aim of maintaining technological superiority and survival by investing funds that outstrip those of other companies. This is a move that echoes the “Stargate” project in the U.S., and the competition for AI development is entering a capital war at the national budget level.
  9. Elon Musk Reduces AI Chip Design Cycle to 9 Months
    Elon Musk has announced plans to significantly shorten the design cycle for AI chips at Tesla and xAI from the previous period to every 9 months. increasing the frequency of hardware updates to keep pace with the speed of AI technology evolution. This is aimed at increasing the frequency of hardware updates in order to keep pace with the evolution of AI technology. This is expected to further accelerate the pace of innovation in the AI semiconductor industry as the company seeks to compete with competitors such as NVIDIA in terms of development speed.
  10. Soaring Memory Prices Sharply Shift Prices to End Products, Including “Galaxy S26”
    With the soaring prices of DRAM and NAND flash, it is inevitable that prices will be shifted to smartphones and PCs for the 2026 model year. In particular, there are concerns that high-end models such as the Galaxy S26 will face a significant cost increase, coupled with an increase in memory capacity due to the implementation of AI functions. While there are concerns about the impact on consumers’ willingness to purchase, “chipflation” is underway, which provides an opportunity for memory manufacturers to expand their earnings.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Jan 28, 16:35ASMLの受注が予想を上回る一方で、1,700人の人員削減を計画ASML orders beat expectations as company plans 1,700 layoffshttps://www.digitimes.com/news/a20260128VL214/asml-demand-outlook-sales-capacity.html
Jan 28, 16:32SKハイニックス、AIメモリブームに支えられて2025年の収益が記録的な水準にSK Hynix reports record-breaking 2025 earnings driven by AI memory boomhttps://www.digitimes.com/news/a20260128VL215/2025-revenue-operating-profit-production-hbm.html
Jan 28, 12:09マスク、AIチップの設計サイクルを9ヶ月に短縮へMusk plans to cut AI chip design cycle to 9 monthshttps://www.digitimes.com/news/a20260128PD217/tesla-design-ai-chip-ceo-elon-musk.html
Jan 28, 12:06独占:Nvidia、2028年のチップ生産をIntelに移管し、TSMCの戦略を再構築へExclusive: Nvidia to reportedly shift 2028 chip production to Intel, reshaping TSMC strategyhttps://www.digitimes.com/news/a20260128PD213/tsmc-intel-nvidia-packaging-2028.html
Jan 28, 10:55分析:SKハイニックスのMicrosoft向け独占供給がHBM3E市場の統合を示唆Analysis: SK Hynix’s exclusive supply to Microsoft reflects HBM3E market consolidationhttps://www.digitimes.com/news/a20260128PD220/sk-hynix-microsoft-market-hbm3e-hbm.html
Jan 28, 17:29ASMLの幹部、2025年以降もチップ需要の堅調を予測ASML executives bet on chip demand strength past 2025https://www.digitimes.com/news/a20260128VL216/asml-demand-2025-management-capacity.html
Jan 28, 17:21SKハイニックス、米国の新AI子会社設立に100億ドルを投じ、シリコンバレーに本格進出SK Hynix bets $10B on Silicon Valley with new U.S. AI subsidiaryhttps://www.digitimes.com/news/a20260128VL217/investment-solidigm-ssd-subsidiary-data-center.html
Jan 28, 15:59PhisonのPascari SSDが世界初の月面データセンターを稼働させ、新たな信頼性基準を打ち立てるPhison’s Pascari SSDs power world’s first lunar data center, set new reliability benchmarkhttps://www.digitimes.com/news/a20260128PD223/taiwan-phison-data-center-data-nand.html
Jan 28, 15:42MetaX、収益が倍増して2億3,000万ドルに上り、損失が縮小MetaX revenue more than doubles to US$230 million as losses narrowhttps://www.digitimes.com/news/a20260128VL210/revenue-gpu-growth-2025-software.html
Jan 28, 15:25ASML、受注急増を受けて2025年の業績が記録的にASML posts record 2025 results on surging ordershttps://www.digitimes.com/news/a20260128VL213/asml-2025-sales-2026-growth.html
Jan 28, 15:02北京、Nvidia H200のByteDance、Alibaba、Tencent向け出荷を承認Beijing greenlights Nvidia H200 shipments to ByteDance, Alibaba, Tencenthttps://www.digitimes.com/news/a20260128VL212/nvidia-ai-chip-beijing-shipments.html
Jan 28, 14:55Powertech、FOPLP加速化のためNT$433億を投資し、2027年上半期の量産を目標にPowertech will invest NT$43.3 billion to accelerate FOPLP, targets mass production in 1H27https://www.digitimes.com/news/a20260128PD215/pti-foplp-packaging-demand-production-2026.html
Jan 28, 12:47Powertech、2025年第4四半期に好調な利益を記録し、2026年への成長を見込むPowertech posts 4Q25 profit high, eyes growth momentum into 2026https://www.digitimes.com/news/a20260128PD200/powertech-memory-testing-packaging-revenue.html
Jan 28, 12:35マクロンックス、MLC eMMCとNORフラッシュの生産増強のため、NT$220億の設備投資を再開Macronix restarts NT$22B capex to boost MLC eMMC and NOR flash outputhttps://www.digitimes.com/news/a20260128PD224/macronix-international-emmc-mlc-nand-flash.html
Jan 28, 11:37Mouser Electronics、2025年に63社の新規パートナーと提携し、製造業者ラインナップを拡大Mouser Electronics expands manufacturer lineup with 63 new partners in 2025https://www.digitimes.com/news/a20260128VL205/2025-industrial-automation-design-electronic-components-industrial.html
Jan 28, 10:59Samsung、1c DRAM生産能力の大部分をHBM4に充て、2026年初頭の量産を計画Samsung reportedly channels most 1c DRAM capacity into HBM4 for early 2026 mass productionhttps://www.digitimes.com/news/a20260128PD210/samsung-hbm4-production-dram-2026.html
日経 Tech Foresight
2026-01-29【特許】タツモ、半導体のD2W接合を高速かつ高精度にhttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC266U70W6A120C2000000
2026-01-29NVIDIA試算、光電融合CPOで電力7割減 コストは10分の1https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC2851S0Y6A120C2000000
2026-01-29トヨタやスズキ、半導体戦略の転換点 中国製SoC採用へhttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC284GH0Y6A120C2000000
2026-01-28NTTの光電融合「大きな商談」 政府はラピダス連携に期待https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC278JJ0X20C26A1000000
2026-01-28双方向GaN、低損失・小型・低コストで台頭 AlNも進展https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC276XA0X20C26A1000000
2026-01-28東京科学大など、自由電子生成の機序解明 IGBT損失低減https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC235XR0T20C26A1000000
2026-01-28国産の半導体量子計算機、ブルーキャット 30年に卓上型https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC2704M0X20C26A1000000
マイナビニュース テックプラス
2026-01-28MIKROE、ルネサスとマイコン向け開発ツールのサポート契約締結を発表https://news.mynavi.jp/techplus/article/20260128-4050375/
2026-01-28キオクシア、QLCベースのUFS 4.1組み込みストレージのサンプル出荷を開始https://news.mynavi.jp/techplus/article/20260128-4050099/
2026-01-28NIPPON EXPRESS、インド政府機関とインド半導体産業向け物流基盤整備に向けた協議を実施https://news.mynavi.jp/techplus/article/20260128-4049966/
2026-01-28ミネベアミツミがサンケン電気とパワーモジュールで協業、後工程や製品開発を共同実施へhttps://news.mynavi.jp/techplus/article/20260128-4049782/
2026-01-28テラプローブ、台湾での半導体テスト受託能力拡大に向けて不動産を取得https://news.mynavi.jp/techplus/article/20260128-4049647/
2026-01-28米政府がUSAレアアースにCHIPS法から16億ドルを支援へ、民間からも15億ドルの投資を獲得https://news.mynavi.jp/techplus/article/20260128-4049553/
2026-01-28小型カメラモジュール市場は2030年に490億ドル規模へと成長期待、Yole予測https://news.mynavi.jp/techplus/article/20260128-4049371/
TrendForce
2026-01-28ASML、記録的な97億ユーロのQ4売上高を発表;メモリ不足がEUV装置需要を後押しかASML Posts Record €9.7B Q4 Revenue; Memory Shortage Reportedly May Boost EUV Tool Demandhttps://www.trendforce.com/news/2026/01/28/news-asml-posts-record-e9-7b-q4-revenue-memory-shortage-reportedly-may-boost-euv-tool-demand/
2026-01-28SKハイニックス、2025年に記録更新し47.2兆ウォンの営業利益でサムスンを凌駕SK hynix Smashes Records in 2025, Beats Samsung with KRW 47.2T Operating Profithttps://www.trendforce.com/news/2026/01/28/news-sk-hynix-smashes-records-in-2025-beats-samsung-with-krw-47-2t-operating-profit/
2026-01-28[インサイツ] メモリスポット価格最新情報:DDR4/DDR5が高値を記録、買い手は慎重;DDR3は上昇傾向[Insights] Memory Spot Price Update: DDR4/DDR5 Hit Highs, Buyers Hesitant; DDR3 Sees Uptickhttps://www.trendforce.com/news/2026/01/28/insights-memory-spot-price-update-ddr4ddr5-hit-highs-buyers-hesitant-ddr3-sees-uptick/
2026-01-28中国のCmsemicon、MCUおよびNORフラッシュの価格を15~50%引き上げ;Gokeは最大80%の値上げを狙うChina’s Cmsemicon Lifts MCU, NOR Flash Prices by 15–50%; Goke Eyes Hikes of Up to 80%https://www.trendforce.com/news/2026/01/28/news-chinas-cmsemicon-lifts-mcu-nor-flash-prices-by-15-50-goke-eyes-hikes-of-up-to-80/
2026-01-28報道によると、SKハイニックスはNVIDIAのHBM4の約3分の2を供給、サムスンは早期納品を目指すSK hynix Reportedly to Supply About Two-Thirds of NVIDIA HBM4; Samsung Targets Early Deliveryhttps://www.trendforce.com/news/2026/01/28/news-sk-hynix-reportedly-to-supply-about-two-thirds-of-nvidia-hbm4-samsung-targets-early-delivery/
Semiconductor Digest
3 hours agoSKハイニックス、AIソリューション専門の米国部門を設立SK hynix to Establish U.S. Arm Specialized in AI Solutionshttps://www.semiconductor-digest.com/sk-hynix-to-establish-u-s-arm-specialized-in-ai-solutions/
3 hours agoValens Semiconductor、業務効率化計画を発表Valens Semiconductor Announces Operational Efficiency Planhttps://www.semiconductor-digest.com/valens-semiconductor-announces-operational-efficiency-plan/
3 hours agoSK keyfoundry、4世代目の200V高電圧0.18ミクロンBCDプロセスを発表SK keyfoundry Launches 4th-Generation 200V High-Voltage 0.18 micron BCD Processhttps://www.semiconductor-digest.com/sk-keyfoundry-launches-4th-generation-200v-high-voltage-0-18-micron-bcd-process/
4 hours ago新しい3Dマイクロ・ナノ製造技術が材料の限界を克服New 3D Micro and Nanofabrication Technique Overcomes Material Limitationshttps://www.semiconductor-digest.com/new-3d-micro-and-nanofabrication-technique-overcomes-material-limitations/
4 hours agoSEMI、半導体の成長、革新、サプライチェーンの安定支援に向けた2026年米国政策の優先課題を概説SEMI Outlines 2026 U.S. Policy Priorities to Support Semiconductor Growth, Innovation, and Supply Chain Stabilityhttps://www.semiconductor-digest.com/semi-outlines-2026-u-s-policy-priorities-to-support-semiconductor-growth-innovation-and-supply-chain-stability/
23 hours ago忠南国立大学、欠陥ベースの材料設計を加速するAIモデルを開発Chungnam National University Develops AI Model to Accelerate Defect-Based Material Designhttps://www.semiconductor-digest.com/chungnam-national-university-develops-ai-model-to-accelerate-defect-based-material-design/
23 hours agoLa Luce Cristallina、シリコンフォトニクスおよび先進エレクトロニクスの拡張性を強化するCMOS互換酸化物疑似基板を発表La Luce Cristallina Launches CMOS-Compatible Oxide Pseudo-Substrate, Enhancing Scalability for Silicon Photonics and Advanced Electronicshttps://www.semiconductor-digest.com/la-luce-cristallina-launches-cmos-compatible-oxide-pseudo-substrate-enhancing-scalability-for-silicon-photonics-and-advanced-electronics/
23 hours agoAmberSemi、AIデータセンター向けパワータイル垂直電力ソリューションのシリコンテープアウトを発表AmberSemi Announces Silicon Tape-Out of PowerTile Vertical Power Solution for AI Data Centershttps://www.semiconductor-digest.com/ambersemi-announces-silicon-tape-out-of-powertile-vertical-power-solution-for-ai-data-centers/
23 hours agoVeecoとimec、300mm対応プロセスを開発し、シリコンフォトニクス上へのバリウムチタン酸塩の統合を可能にするVeeco and imec Develop 300mm Compatible Process to Enable Integration of Barium Titanate on Silicon photonicshttps://www.semiconductor-digest.com/veeco-and-imec-develop-300mm-compatible-process-to-enable-integration-of-barium-titanate-on-silicon-photonics/
日本経済新聞
2026-01-29米国株15時、ダウ一進一退 FOMC結果受けhttps://www.nikkei.com/article/DGXZQOFL28CE10Y6A120C2000000/
2026-01-29ものづくり愛知で採用ミスマッチ防ぐ DPT、適性見極め就職あっせんhttps://www.nikkei.com/article/DGXZQOFD118WE0R11C25A2000000/
2026-01-29高度外国人材、日本語学べず孤立 賃金不払いや解雇の相談相次ぐhttps://www.nikkei.com/article/DGXZQOUA236YM0T20C26A1000000/
2026-01-29新型ホンダジェット、購入希望は生産能力の10倍 安売りやめ稼ぐ事業にhttps://www.nikkei.com/article/DGXZQOUC0604C0W6A100C2000000/
2026-01-29ドイツ株28日 続落、金融に売り 仏株は反落 LVMHが大幅安https://www.nikkei.com/article/DGXZQOFL28C6X0Y6A120C2000000/
2026-01-29ロンドン株28日 反落、ヘルスケア関連に売りhttps://www.nikkei.com/article/DGXZQOFL28C6K0Y6A120C2000000/
2026-01-29ASMLの25年10〜12月純利益、AI需要増で5%増 今期も増収へhttps://www.nikkei.com/article/DGXZQOGR27BNC0X20C26A1000000/
2026-01-29[社説]新たな成長生む戦略こそ競うべき本丸だhttps://www.nikkei.com/article/DGXZQOCD27BM40X20C26A1000000/
2026-01-29日米関税合意に基づく対米投融資、第1号は人工ダイヤ・送配電が候補https://www.nikkei.com/article/DGXZQOUA289T40Y6A120C2000000/
2026-01-29中国当局、NVIDIA「H200」の輸入承認 ロイター報道https://www.nikkei.com/article/DGXZQOGM289E80Y6A120C2000000/
ダイヤモンドオンライン
Jan 28 20:15欧州が備える悪夢のシナリオ:米が技術アクセス遮断https://diamond.jp/articles/-/382639
Jan 28 19:15大和ハウスの「次なる買収ターゲット」はどこなのか?芳井会長が語る、住友電設をTOBした真の狙いと“その先”《再配信》https://diamond.jp/articles/-/382489
Jan 28 12:00「あの頃は土地、いまはAI」――80年代バブルを見たプロが語る“令和バブル”の歩き方、見切り方https://diamond.jp/articles/-/382520
Jan 28 03:002月に爆上げする銘柄はどれ?あなたの予想を大募集【1カ月で1番上がる株を当てろ!第8回締切は1月30日17時】https://diamond.jp/articles/-/382485
Jan 27 20:10年始の「激震」で変わる世界https://diamond.jp/articles/-/382533
Jan 27 19:40JR東日本がJALと貨物で異例の協業!「はこビュン」拡大の狙いと物流事業の次なるコラボ相手は?https://diamond.jp/articles/-/382496
Jan 26 21:00「消費税ゼロ」に世界が失望…政治家の人気取りで日本人が背負わされる“大きすぎる代償”https://diamond.jp/articles/-/382423
Jan 26 21:00【西日本】主要国立大「就職先企業・団体」ランキング2025【全20位・完全版】https://diamond.jp/articles/-/382206
Jan 26 19:45米オープンAI「200兆円」投資計画の裏の焦り、生き残りを懸ける“AI版マンハッタン計画”の中身とは?https://diamond.jp/articles/-/382442
Jan 25 21:00年収が高い会社ランキング2025【東京除く関東地方・トップ5】1600万円超の1位は?https://diamond.jp/articles/-/382239
Tom’s Hardware
2026-01-28 20:40中国の衛星とのニアミスを受け、Starlinkが衛星の軌道高度を引き下げるChina satellite near miss prompts Starlink to reduce altitudeshttps://www.tomshardware.com/tech-industry/china-close-call-prompts-starlink-to-reduce-satellite-altitudes-more-than-4-000-satellites-pulled-to-300-mile-orbit-to-increase-space-safety
2026-01-28 20:35『熱力学コンピューティング』により、AI画像生成のエネルギー使用量が100億分の1に削減される可能性があると研究が主張‘Thermodynamic computing’ could slash energy use of AI image generation by a factor of ten billion, study claimshttps://www.tomshardware.com/tech-industry/artificial-intelligence/thermodynamic-computing-could-slash-energy-use-of-ai-image-generation-by-a-factor-of-ten-billion-study-claims-prototypes-show-promise-but-huge-task-required-to-create-hardware-that-can-rival-current-models
2026-01-28 20:20海底ケーブル切断騒動を受け、フィンランドが専用の海上監視センターを設立Undersea cable cutting shenanigans lead Finland to create a dedicated maritime surveillance centerhttps://www.tomshardware.com/networking/undersea-cable-cutting-shenanigans-lead-finland-to-create-a-dedicated-maritime-surveillance-center-russian-shadow-fleet-operations-heighten-concerns-in-the-baltic-sea
2026-01-28 20:00レトロゲームブランドが、内蔵心拍モニター搭載のPCコントローラーを公開Retro gaming outfit unveils PC controller with built-in heart rate monitorhttps://www.tomshardware.com/peripherals/controllers-gamepads/retro-gaming-outfit-unveils-pc-controller-with-built-in-heart-rate-monitor-also-features-ips-screen-1-000hz-polling-and-six-axis-gyroscope
2026-01-28 20:00RAM、ストレージ、GPUの買い替えが難しい?新しいPCケースで既存システムを刷新し、将来のアップグレードにも活用可能Can’t afford new RAM, storage, or a GPU? A new PC case can make your existing system feel fresh, and you can carry it over to a future buildhttps://www.tomshardware.com/pc-components/pc-cases/cant-afford-new-ram-storage-or-a-gpu-a-new-pc-case-can-make-your-existing-system-feel-fresh-and-you-can-carry-it-over-to-a-future-build
TechPowerup
2026-01-28T20:30:11+00:00Cooler Master、ワークステーション向け360 x 360 AIOを発表Cooler Master Debuts 360 x 360 AIO For Workstationshttps://www.techpowerup.com/345746/cooler-master-debuts-360-x-360-aio-for-workstations
2026-01-28T19:12:11+00:00Gigabyte、AI搭載のX870E AORUS XTREME X3D AI TOPマザーボードを発売開始Gigabyte AI-Powered X870E AORUS XTREME X3D AI TOP Motherboard Now Availablehttps://www.techpowerup.com/345755/gigabyte-ai-powered-x870e-aorus-xtreme-x3d-ai-top-motherboard-now-available
2026-01-28T18:43:50+00:00Deep Silver、Warhammer 40K: Dawn of War IVのオーク派閥のゲームプレイを公開Deep Silver Showcases Warhammer 40K: Dawn of War IV Ork Faction Gameplayhttps://www.techpowerup.com/345754/deep-silver-showcases-warhammer-40k-dawn-of-war-iv-ork-faction-gameplay
2026-01-28T18:34:20+00:00Hellmart、Steamで発売中 ― ホラーとスーパーマーケットシミュレーションが出会うHellmart Available Now on Steam – Where Horror Meets Supermarket Simulationhttps://www.techpowerup.com/345753/hellmart-available-now-on-steam-where-horror-meets-supermarket-simulation
2026-01-28T18:17:54+00:00Vastarmor、カスタムRadeon AI PRO R9700 32GBグラフィックスカードを公開Vastarmor Reveals “Custom” Radeon AI PRO R9700 32 GB Graphics Cardhttps://www.techpowerup.com/345752/vastarmor-reveals-custom-radeon-ai-pro-r9700-32-gb-graphics-card
2026-01-28T18:07:08+00:00Geeek Exo 1 オープンエアmicroATXケースが$69.99で発売開始Geeek Exo 1 Open-Air microATX Case Launches At $69.99https://www.techpowerup.com/345748/geeek-exo-1-open-air-microatx-case-launches-at-usd-69-99
2026-01-28T17:30:01+00:00Earth Must Dieの開発陣、見事な発売日成功と好評を祝うEarth Must Die Devs Celebrate Brilliant Launch Day & Critical Receptionhttps://www.techpowerup.com/345750/earth-must-die-devs-celebrate-brilliant-launch-day-critical-reception
2026-01-28T17:14:07+00:00Apple M6チップ、2026年後半頃の発売が噂されるApple M6 Chip Possibly Launching Around Late 2026https://www.techpowerup.com/345747/apple-m6-chip-possibly-launching-around-late-2026
2026-01-28T16:36:49+00:00Redragon、磁気ドック付き61gゲーミングマウスと2つのメカニカルキーボードを発売開始Redragon Launches 61 g Gaming Mouse with Magnetic Dock and Two Mechanical Keyboardshttps://www.techpowerup.com/345738/redragon-launches-61-g-gaming-mouse-with-magnetic-dock-and-two-mechanical-keyboards
2026-01-28T16:21:54+00:00GIGABYTE、AMDとの協力を深め、ゲーミングやクリエイション、PCビルド向けのオンデバイスAIを加速GIGABYTE Deepens Collab with AMD to Accelerate On-Device AI for Gaming, Creation, & PC Buildshttps://www.techpowerup.com/345745/gigabyte-deepens-collab-with-amd-to-accelerate-on-device-ai-for-gaming-creation-pc-builds
2026-01-28T16:12:41+00:00Bazziteクリエイター、GPDのハンドヘルドWin 5モデルへの公式サポート主張を否定Bazzite Creator Refutes GPD’s Claim of Official Support Coming to Handheld Win 5 Modelhttps://www.techpowerup.com/345744/bazzite-creator-refutes-gpds-claim-of-official-support-coming-to-handheld-win-5-model
2026-01-28T15:21:33+00:00バンダイナムコ、Code Vein IIの強力なパートナーシステムを特集Bandai Namco Covers Code Vein II’s Powerful Partner Systemhttps://www.techpowerup.com/345743/bandai-namco-covers-code-vein-iis-powerful-partner-system
2026-01-28T15:10:14+00:00Intel Arc B580、来月XeSS 3によるマルチフレーム生成対応を開始Intel Arc B580 Will Receive XeSS 3 Multi-Frame Generation Support Next Monthhttps://www.techpowerup.com/345742/intel-arc-b580-will-receive-xess-3-multi-frame-generation-support-next-month
EETimes Taiwan
2026-01-28H200チップの競争 Nvidia、中国市場に注力H200晶片角力 Nvidia押注中國市場https://www.eettaiwan.com/20260128nt01-nvidia-bets-big-on-china-with-h200-push/
2026-01-28自動車のボディコントロールネットワーク設計における6つの考慮事項設計汽車車身控制網路的六大考慮因素https://www.eettaiwan.com/20260128ta31-six-considerations-for-designing-automotive-body-control-networks/
2026-01-28組み込みプロセッサがスマートエッジにおける異種計算を加速嵌入式處理器為智慧邊緣加速異質運算https://www.eettaiwan.com/20260128nt11-amd-embedded-processors-power-intelligent-edge-heterogeneous-computing/
2026-01-28台湾四大産業、デジタル投資の三軸同時推進台灣四大產業數位投資三軸並進https://www.eettaiwan.com/20260128nt21-digital-investment-in-taiwan-s-four-major-industries/
2026-01-27VisIC CEO:革新的GaN技術でEVおよびAIデータセンター市場に注目VisIC CEO:以創新GaN技術聚焦EV與AI資料中心市場https://www.eettaiwan.com/20260127nt61-visic-focusing-on-ev-and-ai-datacenters-with-gan-technology/
2026-01-27電圧から周期への変換器は高リニアリティと迅速な動作を実現電壓-週期轉換器兼具高線性與快速運作https://www.eettaiwan.com/20260127ta51-voltage-to-period-converter-offers-high-linearity-and-fast-operation/
2026-01-27メモリコスト高騰で、2026年のスマートフォン出荷が下落する可能性記憶體成本走高 2026年智慧型手機出貨恐下滑https://www.eettaiwan.com/20260127nt21-2026-memory-costs-will-impact-smartphone-shipments/
EETimes Asia
2026-01-28Lightmatter と GUC が、AIハイパースケーラー向けのコパッケージドオプティクス(CPO)ソリューションの提供に向けて提携Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalershttps://www.eetasia.com/lightmatter-and-guc-partner-to-produce-co-packaged-optics-cpo-solutions-for-ai-hyperscalers/
2026-01-28SEMIFIVE と SAPIEN が、次世代CMOSバックプレーン技術の開発に向けたMOUに署名SEMIFIVE and SAPIEN Ink MOU to Develop Next-Gen CMOS Backplane Techhttps://www.eetasia.com/semifive-and-sapien-ink-mou-to-develop-next-gen-cmos-backplane-tech/
2026-01-28NanoXplore と STMicroelectronics が、ESCC 9030に適合した放射線耐性FPGAを提供NanoXplore and STMicroelectronics Deliver Rad-Hard FPGA Qualified to ESCC 9030https://www.eetasia.com/nanoxplore-and-stmicroelectronics-deliver-rad-hard-fpga-qualified-to-escc-9030/
2026-01-28Richard Bergman氏がQuest Globalの半導体部門グローバルビジネス責任者に任命Richard Bergman Appointed Global Business Head of Quest Global’s Semiconductor Divisionhttps://www.eetasia.com/richard-bergman-appointed-global-business-head-of-quest-globals-semiconductor-division/
2026-01-28Micron、シンガポールで新たな先進ファブの建設を開始Micron Starts Construction of New Advanced Fab in Singaporehttps://www.eetasia.com/micron-starts-construction-of-new-advanced-fab-in-singapore/
2026-01-27IonQ、18億ドル規模の取引でSkyWaterを買収へIonQ to Acquire SkyWater in $1.8B Dealhttps://www.eetasia.com/ionq-to-acquire-skywater-in-1-8b-deal/
2026-01-27中国のスマートフォン市場、2025年第4四半期に低迷China Smartphone Market Down in 4Q 2025https://www.eetasia.com/china-smartphone-market-down-in-4q-2025/
2026-01-27氷点下環境向けにトレーサビリティネットワークを頑丈化する方法How to “Ruggedize” Your Traceability Networks for Sub-Zero Environmentshttps://www.eetasia.com/how-to-ruggedize-your-traceability-networks-for-sub-zero-environments/
EETimes India
2026-01-28Nordic SoCが超コンパクトなフォームファクターで高性能を実現Nordic SoC Enables High Performance in Ultra-compact Form Factorhttps://www.eetindia.co.in/nordic-soc-enables-high-performance-in-ultra-compact-form-factor/
2026-01-28NXPがSDVの真の可能性を引き出すNXP Unlocks Full Potential of SDVshttps://www.eetindia.co.in/nxp-unlocks-full-potential-of-sdvs/
2026-01-28Synopsysがディープテック革新を目指すIgniteのスケールアッププログラムに参加Synopsys Joins Ignite’s Scale-up Program for Deep Tech Innovationhttps://www.eetindia.co.in/synopsys-joins-ignites-scale-up-program-for-deep-tech-innovation/
2026-01-28DLIスキームの普及を背景に、インドが50のファブレスチップ企業に注目India Eyes 50 Fabless Chip Firms as DLI Scheme Gains Tractionhttps://www.eetindia.co.in/india-eyes-50-fabless-chip-firms-as-dli-scheme-gains-traction/
ZDNET Korea
2026-01-28人間の目の動きを模倣するAI…中国のディープシック文書認識AI、認識率91%突破사람 눈 움직임 닮아가는 AI…중국 딥시크 문서 인식 AI, 인식률 91% 돌파https://www.zdnet.co.kr/20260128231852” title=”
2026-01-28‘CES 2026’で輝いたペルソナAI…「フィジカルAI OSで視線」‘CES 2026’서 빛난 페르소나AI…”피지컬AI OS로 시선”https://www.zdnet.co.kr/20260128231111” title=”
2026-01-28東西発電、済州の北村里の老人会館に9.6kW級太陽光発電設備を設置동서발전, 제주 북촌리 경로당에 9.6kW급 태양광 설치https://www.zdnet.co.kr/20260128214326” title=”
2026-01-28GSショップ、高機能ホームケア製品を強化GS샵, 고기능 홈케어 제품 강화https://www.zdnet.co.kr/20260128172139” title=”
2026-01-28中部発電、米テキサス州350MW規模『ルシー太陽光発電所』建設着手중부발전, 美 텍사스주 350MW 규모 ‘루시 태양광 발전소’ 건설 착수https://www.zdnet.co.kr/20260128182247” title=”
2026-01-28SKハイニックス、米に『AIカンパニー』を設立…チェ・テウォン会長が大胆な行動SK하이닉스, 美에 ‘AI 컴퍼니’ 세운다…최태원 회장 ‘광폭 행보’https://www.zdnet.co.kr/20260128175627” title=”
2026-01-28スーパーBエーアイ・ポステック 韓国のロボットAI商用化が加速슈퍼브에이아이·포스텍 韓 로봇 AI 상용화 ‘박차’https://www.zdnet.co.kr/20260128140859” title=”
2026-01-28SKT A.X K1、AI性能評価で数学・コーディング・トークン効率性の3冠を達成SKT A.X K1, AI 성능 평가서 수학·코딩·토큰 효율성 3관왕https://www.zdnet.co.kr/20260128172805” title=”
2026-01-28[ZD SWトゥデイ] カクテルアイオ-ダナクラウド、中小・中堅企業のクラウド移行加速 ほか[ZD SW 투데이] 칵테일아이오-다나클라우드, 중소·중견기업 클라우드 전환 가속 外https://www.zdnet.co.kr/20260128180605” title=”
2026-01-28「韓国のサラリーマン92%、AIを使うが個人情報保護の認識不足」“한국 직장인 92%, AI 쓰지만 개인정보 보호 인식 부족”https://www.zdnet.co.kr/20260128175205” title=”
2026-01-28SKハイニックス「今年の設備投資規模が大幅に増加」見通しSK하이닉스 “올해 설비투자 규모 상당 수준 증가” 예고https://www.zdnet.co.kr/20260128172108” title=”
中央日報
2026-01-29[issue&] 半導体検査装置産業が技術革新を牽引[issue&] 반도체 검사 장비 산업 기술 혁신 이끌어https://www.joongang.co.kr/article/25401113
2026-01-29今やギャラクシーS26さえ… AIが招いた『価格上昇』の恐怖이젠 갤럭시S26마저…AI가 부른 '가격 인상' 공포https://www.joongang.co.kr/article/25401093
2026-01-29『47兆』 ニックス‘47조’ 닉스https://www.joongang.co.kr/article/25401088
2026-01-29[シムドングのマーケットナウ] 米国株は高値、韓国株は今や中盤[심동규의 마켓 나우] 미국 증시는 고점, 한국 증시는 이제 중반https://www.joongang.co.kr/article/25401045
2026-01-29パク・ホンジュン教授・キム・ソンジョン常務、半導体『カンデウォン賞』受賞박홍준 교수·김선정 상무, 반도체 ‘강대원상’ 수상https://www.joongang.co.kr/article/25401030
2026-01-28ハイニックスが育てた『半導体』、サムスン電子の『サムヒョンジェ』を破った하이닉스 잘 키운 '반도체' 하나, 삼성전자 '삼형제' 이겼다https://www.joongang.co.kr/article/25400981
BAIDU
昨天15:18SK启方半导体が第4世代200V高圧0.18ミクロンBCDプロセスを発表、年内に量産を計画SK启方半导体推出第四代200V高压0.18微米BCD工艺,计划年内量产https://baijiahao.baidu.com/s?id=1855544827504224598&wfr=spider&for=pc
昨天19:32半導体における『インフレ』の伝播!主要2要因が明らかに(表付き)半导体“通胀”传导!核心两大原因曝光(附表格)https://baijiahao.baidu.com/s?id=1855560007436847968&wfr=spider&for=pc
昨天22:19データセンターの恩恵がより広範な半導体分野に波及、テキサス・インスツルメンツ(TXN.US)が複数社に支持される…数据中心红利扩散至更广泛半导体领域 德州仪器(TXN.US)获多家…https://baijiahao.baidu.com/s?id=1855571883668218292&wfr=spider&for=pc
昨天21:18520%の高プレミアムによる異業種買収、盈新発展は主力事業の低迷を受け半導体に賭けた転換を計画520%高溢价跨界收购,盈新发展主业颓势押注半导体谋转型https://baijiahao.baidu.com/s?id=1855566746408154593&wfr=spider&for=pc
昨天15:12『風口研報』:チップ全体で値上げの波が広がり、半導体産業チェーンの景気が向上する見込み「风口研报」芯片全线涨价潮开始蔓延 半导体产业链景气度有望提升https://baijiahao.baidu.com/s?id=1855543691815315904&wfr=spider&for=pc
昨天16:30香港株の三大指数が上昇、半導体セクターが強含む港股三大指数收涨 半导体板块走强https://www.cnstock.com/commonDetail/628045
昨天22:12米国株の変動|半導体装置・材料セクターが普段通りに上昇、テキサス・インスツルメンツ(TXN.US)が約7%上昇美股异动|半导体设备与材料板块普涨 德州仪器(TXN.US)涨近7%https://baijiahao.baidu.com/s?id=1855571034553017910&wfr=spider&for=pc
今天金庸の小説にインスパイアされ、復旦国際が初の原子層半導体軌道上検証に成功灵感源自金庸小说,复旦国际首次实现原子层半导体在轨验证http://baijiahao.baidu.com/s?id=1855576906304235542&wfr=spider&for=pc
4小时前この2次元半導体チップは、宇宙放射線にも耐えられる! 復旦『青鳥』システムが宇宙へ打上げられる这片二维半导体芯片竟然可以不惧宇宙辐射!复旦“青鸟”系统飞上太空https://baijiahao.baidu.com/s?id=1855576978773361951&wfr=spider&for=pc
昨天13:34二大半導体企業が同時に値上げ通知を発行、上流装置が恩恵を受ける見込み! 科創半導体設備ETF…两大半导体公司齐发涨价函,上游设备有望受益!科创半导体设备ETF…https://baijiahao.baidu.com/s?id=1855537597543035043&wfr=spider&for=pc
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