Semiconductor News 20260128

Main News

1. Micron Begins Construction of $24 Billion NAND Manufacturing Facility in Singapore
   Micron has begun construction of a $24 billion advanced NAND flash memory manufacturing facility in Singapore. Wafer production from this expansion project is scheduled to begin in 2028, a strategic investment aimed at meeting growing AI and data center demand and significantly enhancing production capacity in Asia. On the other hand, memory shortages are also affecting supply and demand, as orders for notebook PCs are being pushed back.
2. Quantum computing company IonQ acquires foundry SkyWater for $1.8 billion
   IonQ, a quantum computing company, has agreed to acquire US-based foundry SkyWater Technology for $1.8 billion. With this acquisition, IonQ will accelerate its development roadmap for fault-tolerant quantum computing. The move is noteworthy as it aims for technological breakthroughs and faster time-to-market by vertically integrating the design and manufacturing of quantum chips.
3. Microsoft Announces Maia 200 AI Chip Using TSMC 3nm Process
   Microsoft has announced Maia 200, a new AI inference accelerator based on TSMC’s 3-nanometer process technology. The chip is intended to improve the efficiency of AI workloads and is part of the company’s in-house chip strategy to reduce its reliance on NVIDIA. In conjunction with this, SK Hynix is reportedly the sole HBM3E supplier, strengthening the collaboration in the AI semiconductor supply network.
4. Samsung and SK Hynix may raise memory prices for iPhone by up to 100%
   Samsung may raise LPDDR memory prices for iPhone by more than 80% quarter-on-quarter, and SK Hynix will reportedly raise prices by about 100%. The price hikes are also being seen in IC design and power management ICs, which will inevitably be passed on to consumers in the final product price.
5. U.S . Grants Taiwan MFN Treatment in Section 232 Trade En largement Act Tariffs , Supports TSMC Expansion
   According to Taiwanese authorities, the United States has granted Taiwan MFN treatment in its tariffs under Section 232 of the Trade Enlargement Act. This demonstrates U.S. support for Taiwanese industry. On the other hand, as TSMC and Nvidia drive AI growth and expand their supply chains, there is growing concern in Taiwan about the outflow of talented personnel, and authorities have issued a statement defending TSMC’s U.S. expansion, striking a balance between caution about industrial hollowing out and international cooperation.
6. Samsung’s HBM4 has been verified for NVIDIA’s next-generation Vera Rubin
   Samsung’s next-generation memory HBM4 has reportedly been verified for NVIDIA’s Vera Rubin AI platform, which may be demonstrated at GTC 2026. Samsung is also moving to prioritize its highly profitable memory customers and narrow its supply to the TV and consumer electronics sectors, a strategic move to reel in SK Hynix in the area of high-bandwidth memory, which is essential for improving the performance of AI semiconductors.
7. China Enters Glass Substrate Market for Semiconductors and Accelerates Acquisitions of Domestic Companies
   China has reportedly entered the glass substrate market, a hot topic in semiconductor packaging. In addition, domestic industry restructuring is gaining momentum as Yingxin Development acquired a 60% stake in Changxing Semiconductor for RMB520 million to expand into the field of encapsulation and testing of storage chips. As the visual AI market saturates, Taiwanese companies are turning their attention to the West, while China is rapidly establishing its own technology and bringing the supply chain in-house.
8. Sony G Enters Optoelectronic Fusion; NTT Expects Collaboration with Rapidus
   The Sony Group is entering the field of “optoelectronic fusion” technology, which combines electrical and optical signals. Japan has an advantage in light source technology and is expected to change the industry map. In addition, the government has high expectations for NTT’s photoelectric fusion technology in collaboration with Rapidus, which aims to mass-produce next-generation semiconductors. As a key technology for power saving in data centers, competition and cooperation in development by Japanese companies is progressing.
9. Wolfspeed Shifts to Next-Generation Manufacturing with Launch of 300mm SiC Wafers
   Wolfspeed, a leading power semiconductor company, has announced the launch of 300mm (12-inch) diameter silicon carbide (SiC) wafers. This is an important milestone that signals a manufacturing shift away from traditional small-diameter wafers, with the aim of creating a more efficient mass production system to meet the power efficiency needs of EVs (electric vehicles) and AI data centers. In the compound semiconductor market, the shift to larger diameter wafers is also strengthening cost competitiveness.
10. Apple to Launch MacBook Pro with M5 Max and Pro Chips in First Half of 2026
    Apple reportedly plans to launch MacBook Pro with next-generation silicon M5 Max and M5 Pro chips in the first half of 2026. While the PC market is experiencing a memory shortage that is preempting demand, Apple plans to maintain its refresh cycle for its in-house designed chips and increase its competitiveness in the high-end PC market.

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