Semiconductor News 20260127

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1. Samsung to Begin Shipping HBM4 to NVIDIA and AMD in February
   Samsung will officially begin shipping its next-generation memory, HBM4, to NVIDIA and AMD in February.As competition in the AI chip market intensifies, the availability of high-bandwidth memory (HBM) is key to the battle for market share. With this move, Samsung aims to regain ground in a market where SK Hynix and others have taken the lead, as well as capitalize on explosive growth in demand for AI servers.
2. Rising Memory Prices Hit Smartphone Market, Samsung Plans Major Price Hikes
   Rising memory prices are prompting a restructuring of the smartphone supply chain, with increased costs expected to reduce AMOLED shipments in 2026.Samsung is reportedly planning to increase consumer DRAM and SSD prices by The “chipflation” caused by AI demand is beginning to put pressure on the consumer electronics market, severely impacting end-product prices and shipment plans.
3. TSMC plans to build a group of more than 10 huge factories in the U.S.
   It has become clear that TSMC has a plan to build a group of more than 10 huge semiconductor factories in the U.S. in the future. While TSMC is building factories in Japan, its investment in the U.S. is likely to far outstrip that in Japan, pointing to a strategic difference in temperature between the two locations. To meet geopolitical imperatives and the demands of its largest customers, the US tech companies, the company intends to expand its production capacity in the US on a long-term, large-scale basis.
4. IonQ Acquires SkyWater for $1.8 Billion to Integrate Quantum Vertical
   Quantum computing company IonQ has acquired U.S. foundry SkyWater Technology for $1.8 billion. This will create a “quantum vertical platform” that integrates the design and manufacturing of quantum chips, a strategic move that aims to accelerate the speed of quantum processor development, commercialize quantum computing, and establish market leadership by incorporating SkyWater’s manufacturing capabilities SkyWater is a leading provider of quantum computing solutions for the electronics industry.
5. The industry map of optoelectronic convergence technology is becoming clearer, with Sony joining the fray.
   The industry map of “optoelectronic convergence” technology, which will enable data centers to save power and increase speed, is actively shifting with the entry of the Sony Group and other companies. Thirty-seven companies, including Japanese companies with strengths in light source technology, are competing to develop the technology from their respective standpoints. 2026 is also attracting attention for overseas trends such as cooling technology using optical chips and optimized SLM, and competition is intensifying toward practical application as a fundamental technology supporting next-generation computing infrastructures. The competition for practical application of this technology is intensifying.
6. NVIDIA Plans Arm-Based SoC for PCs, Lenovo Among Early Adopters
   NVIDIA is planning to introduce a system-on-chip (SoC) for PCs based on the Arm architecture, and Lenovo and Dell are reportedly among the early adopters. With chips with enhanced AI processing capabilities, NVIDIA is poised to compete with Intel and AMD’s x86 architecture in the Windows PC market, potentially reshaping the processor market, the heart of the PC, in anticipation of the expansion of the AI PC market.
7. AMD CEO Lisa Su’ s Decision to Discontinue Server Road map
   AMD CEO Lisa Su has reportedly made the “most difficult decision” to discontinue the company’s server roadmap. Details have not been disclosed, but it is possible that this is a strategic shift to focus resources on areas of higher growth potential and more efficient architectures in the face of intensifying AI chip competition and competition from Intel. It is being watched closely as a decision that will have a significant impact on future product development and market strategy.
8. Intel Announces Thick-Core Glass Substrate Technology for AI Data Centers
   Intel has reportedly announced the first thick-core glass substrate with Embedded Multi-die Interconnect Bridge (EMIB) technology for AI data centers. Compared to conventional organic substrates, glass substrates have superior flatness and thermal stability, enabling finer circuit formation and larger packages. Packaging technology is an important differentiating factor in the manufacture of next-generation high-performance AI chips.
9. China Unveils Flexible Fiber Chip Alternative to Traditional Silicon
   A Chinese research team has unveiled a “flexible fiber chip” alternative to traditional silicon architecture. This is a new approach in semiconductor technology that could have applications in wearable devices and computing in special environments. With U.S. export restrictions limiting access to advanced silicon technology, China is accelerating the development of alternative technologies and new materials in search of technological breakthroughs.
10. Wolfspeed Accelerates Manufacturing Shift with Launch of 300mm SiC Wafer
    Wolfspeed, a leading power semiconductor company, has announced the launch of a 300mm (12-inch) diameter silicon carbide (SiC) wafer. This is an important milestone for cost reduction and capacity expansion of SiC power semiconductors, demand for which is rapidly increasing for use in electric vehicles (EVs) and industrial equipment, and signals a shift to next-generation manufacturing processes. The transition to the next-generation manufacturing process is also indicated.

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