Semiconductor News 20260123

Main News

1. Nvidia overtakes Apple to become TSMC’s largest customer
   Nvidia has overtaken Apple to become TSMC’s largest customer. This represents a complete shift in the industry’s center of gravity from the smartphone era to the AI computing era. the GlobalWafers chairman also noted that the AI trend is irreversible, reaffirming the dominance of Taiwan’s semiconductor ecosystem. to AI chips. The explosive demand for AI chips is dramatically changing the customer mix and revenue structure of foundries.
2. Keoxia and Nanya warn of memory shortages through 2027
   Keoxia warns that the tight supply of NAND flash will continue through 2027, and Taiwan’s Nanya predicts shortages will continue through a similar period due to surging DRAM demand, though driven by demand for AI data centers, The ripple effect has reportedly caused Samsung distributors to raise prices by 80%, and widespread “chipflation” is beginning to squeeze the market.
3. U.S. Government Hints at 100% Tariffs on Memory Firms Without Domestic Production
   U.S. Lutnick warned that it may impose 100% tariffs on memory chip makers that do not produce in the U.S. This would put strong pressure on Samsung and SK Hynix to invest in the US. Meanwhile, an agreement on tariffs has been reached between the U.S. and Taiwan, and some observers believe that one element of uncertainty for semiconductor manufacturers has been eliminated, and trade policy is influencing the strategies of these companies.
4. Micron to Acquire PSMC Plant, Increase DRAM Supply in 2027
   Micron has agreed to acquire the Causeway Plant of Taiwan’s PSMC. This strategic move is expected to result in an upward revision of global DRAM supply capacity by 2027; PSMC is also strengthening its DRAM processes to meet rising demand. Since this will allow for quicker capacity availability than new construction, industry restructuring and production system enhancements are accelerating in order to resolve memory shortages caused by special demand for AI.
5. Rapidus Targets 2026 Orders and Hon Hai/Sharp AI Server Plans
   Japan’s Rapidus is aiming to receive its first orders in 2026 and is trying to capture the growing AI semiconductor market. In this connection, it was also reported that Rapidus is joining the AI server domestic production plan by Hon Hai and Sharp. In addition, JX Nippon Mining & Metals is planning to invest in Rapidus and supply materials to the company.
6. Taiwanese Companies Prepare for Silicon Photonics and CPO Technologies
   With the continued growth of AI data centers, Taiwanese companies are preparing for opportunities in silicon photonics and Co-Packaged Optics (CPO) packaging. This optoelectronic fusion technology, which pushes the limits of electrical wiring, is overcoming the challenges of inspection technology (alignment and repeatability) and will be key to the next generation of high-speed communications infrastructure. 2026 is expected to be a critical year as these new technologies move into the commercial phase.
7. Shortage of High-Grade Fiberglass Cloth Plagues Global Giant
   A tight supply of high-grade fiberglass cloth, essential for substrates for AI servers, is plaguing global tech giants. A shortage of just one piece of cloth has become a bottleneck in the manufacture of cutting-edge AI hardware. The supply chain’s dependence on specific components is being highlighted, making the stable procurement of packaging and substrate materials, as well as the semiconductor chips themselves, a critical issue.
8. Samsung and SK Hynix Earnings Results, HBM4 and Capital Expenditures in Focus
   As Samsung Electronics and SK Hynix are about to announce their earnings results, the market is focusing on profits, capital expenditures (CAPEX), and the race to develop next-generation memory HBM4. As Samsung is accelerating the start-up of its Taylor plant in Texas, U.S., and is reportedly introducing domestically made EUV pellicles, the technology roadmap and investment strategy of the two companies in the memory field, the center of the battle for AI supremacy, will be the touchstone for the market trend in 2026.
9. Intel Announces Glass Core Substrate Technology and Wins Department of Defense Contract
   Intel has announced its innovative “Glass Core Substrate” with EMIB multi-chip connectivity. This will push the limits of miniaturization and packaging. The company also announced its fourth quarter financial results and was awarded a contract for the SHIELD program by the U.S. Department of Defense Missile Defense Agency. The company is moving forward as the core of the U.S. semiconductor strategy, both in terms of innovation in manufacturing technology and in key projects related to national security.
10. China’s Semiconductor Industry Sees Rush of IPOs and Start of Large-Scale Projects
    Fundraising is active in China, with four semiconductor companies completing IPOs in Hong Kong by the end of the year. In Guangzhou, the fourth phase project of Yuehua Yuehua Semiconductor, with a total investment of RMB 25.2 billion, has started. While tensions in Japan-China relations have focused attention on materials such as photoresists, China is rapidly moving toward domestic production of manufacturing equipment and materials. It continues to counter U.S. regulations and is massively expanding its own supply chain and production capacity.

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