Semiconductor News 20251220

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1. Samsung Unveils Industry’s First 2nm AP “Exynos 2600” and Confirms Mass Production
   Samsung has released the specifications of its Exynos 2600, the industry’s first mobile application processor based on the 2nm GAA process, and confirmed that it is ready for mass production. The new chip offers a 113% improvement in AI performance over the previous generation and is expected to be used in the upcoming Galaxy S26 flagship and Galaxy Z Flip 8. This marks TSMC’s achievement of a technological milestone in the leading-edge logic market.
2. U.S . Scrutinizes Nvidia H200 Export Risks to China, Pointing to Gap with Huawei
   The U.S. government is increasing scrutiny of Nvidia’s H200 AI chip exports to China on the risk that they could unintentionally lead to China’s AI capabilities being strengthened. The Council of the United States predicts that even under current regulations, the gap in AI chip performance between Nvidia and Huawei will widen 17-fold by late 2027, while also pointing out the dilemma of export licenses helping China achieve technological independence, highlighting the difficulty of operating regulations in the US-China technology hegemony struggle.
3. Japanese Government to Guarantee 80% of Financing for Rapidus
   The Japanese government has set up a legal framework to guarantee 80% of the financing provided by private financial institutions to Rapidus, which aims to domestically produce cutting-edge semiconductors. The government will share the risk in order to accelerate the attraction of private-sector funds to facilitate the financing of the trillions of yen needed to start mass production of 2nm chips in 2027. This indicates that Rapidus support as a national project has entered a more concrete implementation phase in terms of finance.
4. Samsung Achieves Technology Breakthrough in Sub-10nm DRAM Scaling
   Samsung Electronics announced today that it has achieved a significant breakthrough in DRAM manufacturing technology targeting the sub-10nm process node (0a and 0b nodes). As memory miniaturization approaches its physical limits, the company has paved the way for increased density and performance of next-generation DRAM by introducing new transistor technology and other new structures. This will be the fundamental technology to meet the growing memory bandwidth and capacity requirements of AI demand.
5. Taiwan Considers Export Ban to Restrict U.S. Manufacturing of TSMC’s Cutting-Edge Nodes
   The Taiwanese government is reportedly considering a new export ban on TSMC’s cutting-edge 2nm process and other manufacturing technologies that would restrict production at its factories in the United States. In order to maintain Taiwan’s strategic value as a “silicon shield,” the government may legislate a policy of lagging technology levels at overseas sites by several generations behind those at home. This could create friction with the U.S. strategy of supply chain localization.
6. SK H ynix to Set Up New Office in Seattle Near Nvidia
   South Korea’s SK Hynix will reportedly open a new office in Seattle, USA, to expand its local operations. The location is close to the home bases of major customers Nvidia and Amazon, and is intended to strengthen collaboration on products such as HBM, a memory for AI The strategy is to physically close the distance with the U.S. big tech, the core of the AI semiconductor ecosystem, and accelerate customized support and technology cooperation.
7. Texas Instruments Begins Shipping from New 300mm Plant in Texas
   Texas Instruments (TI), a leading U.S. analog semiconductor company, has begun shipping chips from its new 300mm wafer-capable plant in Sherman, Texas. This is the first step in the company’s planned major manufacturing capacity expansion, which will eventually include up to four fabs at the site. In the face of increasing geopolitical supply risks, the company will strengthen its manufacturing base in the U.S. to meet long-term demand growth for industrial equipment and automotive applications.
8. Analog Devices Plans Price Hikes of Up to 30% Starting in 2026
   Analog semiconductor giant Analog Devices (ADI) reportedly plans to raise product prices by 10% to 30% starting in February 2026, following the lead of its competitor TI. This is due to rising manufacturing costs and increased capital investment burdens caused by inflation. The semiconductor industry as a whole is moving to pass on prices, and the cost burden of materials in downstream industries such as automobiles and industrial equipment is expected to further increase in the future.
9. Rapidus President Expresses Willingness to Manufacture Nvidia Chips and Advances in Substrate Technology
   Rapidus President Koike expressed his strong desire to manufacture Nvidia’s AI chips in his own factory in the future. The company has also announced the completion of key parts of the package substrate, which determines the performance of advanced semiconductors, and is emphasizing the establishment of not only mass production technology for the 2nm process, but also total solutions, including back-end processes. We are focusing on presenting our technological credibility to win customers through venues such as SEMICON Japan.
10. China’s AMEC Considers Sizone Acquisition to Expand CMP Equipment Market
    AMEC, a leading Chinese semiconductor equipment manufacturer, is considering the acquisition of Sizone Technology, a chemical mechanical polishing (CMP) equipment manufacturer. With U.S. export restrictions limiting access to advanced equipment, China is rushing to become more self-sufficient in its domestic supply chain (in-house manufacturing). This acquisition, if completed, would expand AMEC’s product portfolio, which is strong in etch equipment, and would further integrate and strengthen the domestic manufacturing equipment ecosystem in China.

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