Semiconductor News 20251213

TOC

Main News

  1. Rapidus Secures Large-Scale Financial Support from Major Japanese Firms and Banks
    Japan’s Rapidus has secured support from major Japanese banks and firms for its project to mass produce 2nm generation semiconductors through large-scale loans and new investments. This move solidifies the financial foundation for the domestic production of next-generation semiconductors and indicates that the establishment of a manufacturing base and technology development to catch up with TSMC, Samsung, and other leading companies will be accelerated under the national support system.
  2. TSMC Considering 4nm Conversion of Kumamoto Plant 2 to Meet AI Demand and Suspending Construction
    TSMC has reportedly suspended construction work at its Plant 2 (JASM) in Kumamoto and is considering upgrading its manufacturing process from its original plan to a 4nm process for AI chips. This is in response to a surge in global demand for AI semiconductors, which, if realized, would significantly raise the technology level of chips that can be manufactured in Japan and enhance the company’s ability to supply advanced products to Japanese customers.
  3. U.S .-led AI Alliance “Pax Silica ” Launched; Eight Countries, Including Japan and South Korea, Join
    The United States has launched Pax Silica, an AI alliance involving eight countries, including Japan and South Korea, with the aim of maintaining AI technology hegemony and checking China. This framework is designed to strengthen cooperation in areas ranging from securing semiconductor supply networks to developing AI models, and aims to solidify the dominance of Western nations in the global AI development race by deepening technological enclosure and security coordination.
  4. China Considers $70 Billion Semiconductor Investment, Largest in History
    The Chinese government is considering the largest-ever investment of approximately $70 billion (over 10 trillion yen) to strengthen its domestic semiconductor industry in response to US sanctions, The government is aiming to build a unique ecosystem that can compete with U.S. companies such as NVIDIA, and is strongly promoting self-sufficiency in manufacturing capacity and technological innovation under the leadership of the government.
  5. Samsung Chairman and Musk Meet to Establish Dedicated T esla Workspace in Factory
    Samsung Chairman Lee Jae-yong and Tesla CEO Elon Musk have reportedly met and agreed to provide a dedicated Tesla workspace in the U.S. Tesla plant. This strengthened collaboration, also known as the “Samtae Alliance,” is a sign that Samsung has established itself as a major partner to TSMC in the manufacture of fully automated driving chips and other products, and is deepening its relationship with the big tech company.
  6. Intel Tests Manufacturing Equipment from Sanctioned Chinese Companies for 14A
    Intel is reportedly testing and evaluating semiconductor manufacturing equipment (e.g., wet etch equipment) from Chinese companies that are subject to U.S. sanctions for its next-generation 14A process. The move, which may be aimed at reducing costs and securing the supply chain, has caused a stir within the industry, potentially raising political and national security concerns.
  7. Samsung Accelerates Expansion of Pyeongtaek Plant for HBM4 and Next-Generation DRAM
    Samsung Electronics is accelerating the expansion of its Pyeongtaek, Korea, plant to increase production capacity for HBM4 (6th generation high-bandwidth memory) and 1c nm process DRAM. To meet the explosive demand for memory from AI data centers, the company’s strategy is to quickly establish a supply structure for next-generation memory and secure market leadership in the face of an increasingly fierce market share battle with SK Hynix.
  8. Huawei and SMIC Chips Reach Milestone but Fall Short of TSMC’s 5nm
    An analysis reported that chips developed by Huawei and SMIC have achieved a technological milestone but still lag behind TSMC’s 5nm process technology in terms of performance. China is developing advanced processes without EUV lithography equipment, but yield and efficiency issues remain, highlighting the fact that it will still take time to close the gap with the West’s most advanced technology.
  9. Broadcom Doubles Custom Chip Business on Surge in AI Demand; Anthropic Also a Client
    Following record financial results, Broadcom predicted that demand for AI chips will continue to surge. The company’s custom AI chip (ASIC) business has doubled, with AI company Anthropic emerging as a new “mega-client”. This is indicative of the growing base of the AI infrastructure market, as not only hyperscalers but also AI model developers are expanding their own hardware procurement.
  10. Apple Plans to Unveil AI Glass with Enhanced Camera and Siri in 2026
    Apple is reportedly planning to unveil its first “AI Glass” with camera capabilities and Siri upgrades in 2026. This is a move to develop the wearable device market as a new platform after smartphones and is part of Apple’s long-term strategy to create new consumer experiences that highly integrate visual information and AI assistants.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Dec 12, 14:28Huawei–SMICチップ、節目を達成するもTSMCの5nmには依然として劣るHuawei–SMIC chip hits milestone, still lags TSMC’s 5nmhttps://www.digitimes.com/news/a20251212VL208/huawei-smic-5nm-tsmc-ddr5.html
Dec 12, 16:27日本の大手銀行と企業、大規模な資金提供と新たな投資でRapidusを支援Japan’s major banks and corporations back Rapidus with massive financing and new investmentshttps://www.digitimes.com/news/a20251212PD232/rapidus-financing-2nm-production.html
Dec 12, 15:23TSMC、AIチップ生産への転換の可能性を背景に、二号熊本ウェハーファブの作業を一時停止TSMC pauses work on second Kumamoto wafer fab amid potential shift to AI chip productionhttps://www.digitimes.com/news/a20251212PD227/tsmc-kumamoto-fab-ai-chip-production.html
Dec 12, 12:46独占インタビュー:元TSMC R&D副社長が語る先進パッケージ技術とMorris ChangのビジョンExclusive: Ex-TSMC R&D VP on advanced packaging and Morris Chang’s visionhttps://www.digitimes.com/news/a20251212PD212/tsmc-3d-packaging-morris-chang-development.html
Dec 12, 11:35Broadcom、記録的な第4四半期決算を受け、AIチップ需要の急増を予測Broadcom forecasts surging AI chip demand after record fourth quarter resultshttps://www.digitimes.com/news/a20251212VL200/broadcom-ai-chip-revenue-demand-2025.html
Dec 12, 20:07Intel、制裁対象中国企業に関連するチップツールを14A向けにテスト中と報じられるIntel reportedly tests chip tools linked to sanctioned Chinese firms for 14Ahttps://www.digitimes.com/news/a20251212VL209/intel-equipment-manufacturing-acm-supplier.html
Dec 12, 16:29エッジコンピューティング台頭に伴い、AIハードウェア市場がGPUからNPUへとシフトAI hardware landscape shifts from GPUs to NPUs as edge computing gains groundhttps://www.digitimes.com/news/a20251210PD203/gpu-npu-cost-kneron-training-data.html
Dec 12, 15:31VPEC、2026年に光学部品に注力VPEC will focus on optical components in 2026https://www.digitimes.com/news/a20251212PD219/vpec-optical-components-demand-growth-2026.html
Dec 12, 15:24台湾企業、AIサーバー用PCBドリルの供給網支配を強化Taiwan firms tighten hold on AI-server PCB drilling supply chainhttps://www.digitimes.com/news/a20251210PD234/pcb-infrastructure-investment-high-end-demand.html
Dec 12, 15:14HuaweiとYMTC、Micron撤退を受け韓国のコンシューマーSSD市場に進出Huawei and YMTC expand into South Korea’s consumer SSD market following Micron’s exithttps://www.digitimes.com/news/a20251211PD220/huawei-ssd-market-micron-ymtc.html
Dec 12, 14:46Phison、NAND不足とウェハー価格高騰を背景に3つの供給戦略を打ち出すPhison sets 3 supply strategies amid NAND shortage and wafer price surgehttps://www.digitimes.com/news/a20251211PD213/nand-cloud-price-phison-wafer.html
Dec 12, 14:39Advantest、AI向け次世代メモリハンドラーを発表、2026年第2四半期に顧客展開を目指すAdvantest unveils next-gen memory handler for AI, targets customer rollout in 2Q26https://www.digitimes.com/news/a20251212PD200/advantest-equipment-launch-ai-applications-testing.html
Dec 12, 14:25フォトニクス部品サプライヤー、CPOムーブメントで台湾の半導体成長ランキングを牽引Photonics suppliers dominate Taiwan’s semiconductor growth rankings on CPO momentumhttps://www.digitimes.com/news/a20251211VL213/photonics-growth-taiwan-cpo-manufacturing.html
Dec 12, 14:25WT Microelectronics、AI主導のデータセンターと光学需要でNT$1兆の売上を達成WT Microelectronics hits NT$1 trillion revenue on AI-driven data center, optical demandhttps://www.digitimes.com/news/a20251210PD248/revenue-demand-data-center-wt-2025.html
Dec 12, 13:57Samsung、HBM4および1c DRAM生産増強のため平沢(Pyeongtaek)拡張を加速と報じられるSamsung reportedly accelerates Pyeongtaek expansion to ramp up HBM4 and 1c DRAM productionhttps://www.digitimes.com/news/a20251212PD218/samsung-dram-hbm4-production-expansion.html
Dec 12, 10:35Broadcom、カスタムAIチップ事業が倍増する中で5代目ASIC顧客を確認Broadcom confirms fifth ASIC customer as custom AI chip business doubleshttps://www.digitimes.com/news/a20251212VL201/broadcom-ai-chip-accelerator-asic-business.html
日経 Tech Foresight
2025-12-12【特許】米SST、不揮発性メモリーの読み取り信頼性向上https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC107R10Q5A211C2000000
2025-12-12マイニング用半導体 日本の新興2社、中国独走に待ったhttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC1130X0R11C25A2000000
2025-12-12半導体五輪ISSCC、躍進続く中国と沈む米国 注目論文8選https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC090KZ0Z01C25A2000000
マイナビニュース テックプラス
2025-12-12InfineonのHYPERRAMメモリとコントローラーIP、AMDのSpartan UltraScale+評価キット上での動作を確認https://news.mynavi.jp/techplus/article/20251212-3802465/
2025-12-12AMD、AI駆動のネットワークや産業用システム向け製品「EPYC Embedded 2005シリーズ」を発表https://news.mynavi.jp/techplus/article/20251212-3802220/
2025-12-12アドバンテスト、コンパクトな次世代空冷式テストシステムを年内発売へhttps://news.mynavi.jp/techplus/article/20251212-3802148/
2025-12-12三菱ケミカル、次世代半導体デバイスに不可欠な「熱マネジメント」の事業化でBoston Materialsに追加投資https://news.mynavi.jp/techplus/article/20251212-3801642/
2025-12-12ニコン、ウェハ貼り合わせ精度を向上させる新製品「Litho Booster 1000」開発https://news.mynavi.jp/techplus/article/20251212-3801444/
2025-12-12imec、EUVリソ活用による300mmウェハスケール固体ナノポア製作に成功https://news.mynavi.jp/techplus/article/20251212-3800970/
2025-12-12imec、300mm CMOSウェハのメタサーフェイス上にコロイド状量子ドットフォトダイオード集積に成功https://news.mynavi.jp/techplus/article/20251212-3800881/
2025-12-12ディスコ、高精度研削が可能なφ300mm対応フルオートグラインダを開発https://news.mynavi.jp/techplus/article/20251212-3791521/
2025-12-12ディスコ、小チップデバイス向けのドライポリッシングホイールを開発https://news.mynavi.jp/techplus/article/20251212-3792160/
2025-12-12中国半導体業界で注目集めるふたつのマスク技術 日系企業の商機にもhttps://news.mynavi.jp/techplus/article/20251212-3800630/
TrendForce
2025-12-12SKハイニックス、Hanmi–Hanwha特許紛争の中でASMPTにHBM4 TCボンダーの発注を実施したと報じられるSK hynix Reportedly Places HBM4 TC Bonder Order With ASMPT Amid Hanmi–Hanwha Patent Clashhttps://www.trendforce.com/news/2025/12/12/news-sk-hynix-reportedly-places-hbm4-tc-bonder-order-with-asmpt-as-hanmi-hanwha-patent-clash-heats-up/
2025-12-12Anthropic、Broadcomの巨大クライアントとして浮上;今後は採算性の課題が待ち受けるAnthropic Emerges as Broadcom’s Mega-Client; Margin Challenges Aheadhttps://www.trendforce.com/news/2025/12/12/news-anthropic-emerges-as-broadcoms-mega-client-margin-challenges-ahead/
2025-12-12Samsung会長、Muskと会談し、Tesla CEOにTaylor Fabで専用ワークスペースを提供したと報じられるSamsung Chairman Reportedly Meets Musk, Granting Tesla CEO Dedicated Workspace at Taylor Fabhttps://www.trendforce.com/news/2025/12/12/news-samsung-chairman-reportedly-meets-musk-granting-tesla-ceo-dedicated-workspace-at-taylor-fab/
2025-12-12中国のAppleサプライヤーLens Tech、AI分野に舵を切り、NVIDIA認証サーバーラックメーカーを買収China’s Apple Supplier Lens Tech Pivots to AI, Acquires NVIDIA-Certified Server Rack Makerhttps://www.trendforce.com/news/2025/12/12/news-chinas-apple-supplier-lens-tech-pivots-to-ai-acquires-nvidia-certified-server-rack-maker/
2025-12-12Apple、カメラやSiriのアップグレードなどを搭載した2026年AIグラスの初公開を計画と報じられるApple Reportedly Plans 2026 AI Glasses Debut — With Cameras, Siri Upgrades, and Morehttps://www.trendforce.com/news/2025/12/12/news-apple-reportedly-plans-2026-ai-glasses-debut-with-cameras-siri-upgrades-and-more/
Semiconductor Digest
10 hours ago田中のハイブリッド銀接着ペースト、SiC/GaNパワーモジュールの信頼性を再定義TANAKA’s Hybrid Silver Adhesive Paste Redefines Reliability for SiC/GaN Power Moduleshttps://www.semiconductor-digest.com/tanakas-hybrid-silver-adhesive-paste-redefines-reliability-for-sic-gan-power-modules/
4 hours agoSEMIFIVE、国内でAI半導体設計プロジェクトを獲得SEMIFIVE Secures AI Semiconductor Design Projects in Japanhttps://www.semiconductor-digest.com/semifive-secures-ai-semiconductor-design-projects-in-japan/
4 hours agoCityUHK、3DIC半導体パッケージング材料における画期的ブレークスルーを先導CityUHK Pioneers Breakthrough in 3DIC Semiconductor Packaging Materialshttps://www.semiconductor-digest.com/cityuhk-pioneers-breakthrough-in-3dic-semiconductor-packaging-materials/
10 hours ago田中のハイブリッド銀接着ペースト、SiC/GaNパワーモジュールの信頼性を再定義TANAKA’s Hybrid Silver Adhesive Paste Redefines Reliability for SiC/GaN Power Moduleshttps://www.semiconductor-digest.com/tanakas-hybrid-silver-adhesive-paste-redefines-reliability-for-sic-gan-power-modules/
5 hours agoArteris、Cycuity買収によりポートフォリオを拡大へArteris to Expand Portfolio with Acquisition of Cycuityhttps://www.semiconductor-digest.com/arteris-to-expand-portfolio-with-acquisition-of-cycuity/
5 hours agoOMAとNIMS、半導体技術者認定資格導入に向け提携OMA and NIMS Partner to Launch Semiconductor Technician Credentialshttps://www.semiconductor-digest.com/oma-and-nims-partner-to-launch-semiconductor-technician-credentials/
日本経済新聞
2025-12-13米国株、変わらぬ強気 FRBが演出する流動性相場https://www.nikkei.com/article/DGXZQOFL130530T11C25A2000000/
2025-12-13米国株、ダウ反落し245ドル安 ブロードコムとオラクルが下げ主導 ナスダックは続落https://www.nikkei.com/article/DGXZQOFL12D680S5A211C2000000/
2025-12-13NYダウ、反落し245ドル安 ブロードコムは11%安https://www.nikkei.com/article/DGXZQOFL1302H0T11C25A2000000/
2025-12-13米国株15時、ダウ反落 一時360ドル超安 ハイテクに売りhttps://www.nikkei.com/article/DGXZQOFL12CPZ0S5A211C2000000/
2025-12-13米国のAI投資、ITバブル再来は本当か データで検証https://www.nikkei.com/article/DGXZQOGN09C1V0Z01C25A2000000/
2025-12-13レゾナックCHROが求める新卒「熱意持ち取り組んだ経験がある人」https://www.nikkei.com/article/DGXZQOUC03B7H0T01C25A2000000/
2025-12-13「中国版NVIDIA」大型合併が破談 国産政策で株高も、米規制緩和に思惑https://www.nikkei.com/article/DGXZQOFL11AWSTR11C25A2000000/
2025-12-13ドイツ株12日 反落、半導体インフィニオンやシーメンス・エナジーに売りhttps://www.nikkei.com/article/DGXZQOFL12CI20S5A211C2000000/
2025-12-13米オラクル、OpenAI向けデータセンターの完成遅れか 株価一時6%安https://www.nikkei.com/article/DGXZQOGN12CZG0S5A211C2000000/
2025-12-13ブロードコム、AI半導体「TPU」の黒子で脚光 時価総額2兆ドル迫るhttps://www.nikkei.com/article/DGXZQOGN11DC90R11C25A2000000/
ダイヤモンドオンライン
Dec 12 19:35株も金も過去最高連発!マネー爆増を後押しする「5つの構造要因」を大解剖、26年も最高値更新はある?【大図解】https://diamond.jp/articles/-/378250
Dec 11 20:05中国AIに賭ける米投資家、議会の懸念よそにhttps://diamond.jp/articles/-/379338
Dec 11 20:00米ハイテク業界、トランプ氏にAI州法の制限働きかけhttps://diamond.jp/articles/-/379337
Dec 11 19:50トランプ米大統領“実質指名”のFRB新議長で「過剰利下げ」懸念、中間選挙見据え関税引き下げも!?【米国経済対談・後編】https://diamond.jp/articles/-/378249
Dec 11 19:47自動運転が今度こそ普及!?今までと大きく違う2つの理由と「レベル4」で注目すべき7社の名前https://diamond.jp/articles/-/378978
Dec 10 21:00住友倉庫×三菱地所×JR九州も!物流施設の「共同開発」が増えるウラ事情【専門紙が解説】https://diamond.jp/articles/-/379083
Dec 10 21:002026年の物流不動産市場を大予測!賃料アップの一方で、深刻な「見えない空室」問題とは?https://diamond.jp/articles/-/379082
Dec 10 20:10エヌビディア巡るトランプ氏の心変わり、中国のAI開発促進https://diamond.jp/articles/-/379229
Dec 10 19:30【米国株】高値圏も上値余地は十分、アルファベットや“量子復権”でインテルの「評価替え」にも期待https://diamond.jp/articles/-/379062
Dec 10 19:2526年に米テック株から物色広がる4業種は?AI投資と消費堅調で企業業績拡大の注目セクターhttps://diamond.jp/articles/-/379165
Dec 10 04:00経営危機からのV字回復を実現したNEC、「人の力を最大化する」変革とはhttps://diamond.jp/articles/-/377676
Dec 10 04:00海外拠点を拡充、人と挑戦を大切にする化学品総合物流企業https://diamond.jp/articles/-/376320
Dec 10 04:00デジタルクリエーション産業に注力し、AI事業と人材育成を加速するhttps://diamond.jp/articles/-/375432
Dec 10 04:00人間主導の生産システムを追求。モノづくりを支える生産設備メーカーhttps://diamond.jp/articles/-/375279
Dec 10 04:00「世界的すきま発想。」で人々の暮らしや、さまざまな産業を支えるhttps://diamond.jp/articles/-/375272
Tom’s Hardware
2025-12-12 23:15報道によると、Intelは制裁対象の中国向けツールメーカーのチップ製造ツールをテスト中Intel tests chipmaking tools from sanctioned China-focused tool maker, report claimshttps://www.tomshardware.com/tech-industry/semiconductors/intel-tests-chipmaking-tools-from-sanctioned-china-focused-tool-maker-report-claims-move-could-raise-political-and-national-security-concerns-firm-was-backed-by-ceo-lip-bu-tans-investment-firm
2025-12-12 22:07中国は700億ドル規模の国内チップ製造投資を検討中で、政府による半導体投資として史上最大規模になる見込みChina mulls $70 billion domestic chip fabrication injection, would be largest of any government semiconductor investmenthttps://www.tomshardware.com/tech-industry/china-mulls-usd70-billion-domestic-chip-fabrication-injection-would-be-largest-of-any-government-semiconductor-investment-huawei-and-cambricon-among-candidates-in-push-to-compete-with-nvidia-other-u-s-firms
2025-12-12 20:30Rivian、独自開発のRAP1 AIチップとACM3自動運転プラットフォームを発表Rivian unveils its own in-house RAP1 AI chip and ACM3 self-driving platformhttps://www.tomshardware.com/tech-industry/rivian-unveils-its-own-in-house-rap1-ai-chip-and-acm3-self-driving-platform-automaker-one-ups-tesla-with-lidar-support
2025-12-12 20:25TSMC、2号の日本工場を4nmプロセスにアップグレードする可能性を検討TSMC ponders upgrading 2nd Japan fab to 4nmhttps://www.tomshardware.com/tech-industry/semiconductors/tmsc-ponders-upgrading-2nd-japan-fab-to-4nm-could-pave-the-way-for-more-advanced-chips-for-japanese-customers
TechPowerup
2025-12-12T20:05:50+00:00公式PMFパッケージでAMD『Ryzen AI 400シリーズ』が確認されるAMD “Ryzen AI 400 Series” Spotted in Official PMF Packagehttps://www.techpowerup.com/344050/amd-ryzen-ai-400-series-spotted-in-official-pmf-package
2025-12-12T19:46:54+00:00『Lords of the Fallen II』の初回ゲームプレイ映像が新トレーラーで公開Lords of the Fallen II First Gameplay Revealed in New Trailerhttps://www.techpowerup.com/344049/lords-of-the-fallen-ii-first-gameplay-revealed-in-new-trailer
2025-12-12T19:32:10+00:00『スター・ウォーズ:ギャラクティック・レーサー』、2026年に発売Star Wars: Galactic Racer launches in 2026https://www.techpowerup.com/344047/star-wars-galactic-racer-launches-in-2026
2025-12-12T19:30:07+00:00『モンスターハンター・ワイルズ』開発者がPC向け改善点を詳細解説、まずはSteam版からMonster Hunter Wilds Devs Detail PC-specific Improvements, Starting with Steam Versionhttps://www.techpowerup.com/344046/monster-hunter-wilds-devs-detail-pc-specific-improvements-starting-with-steam-version
2025-12-12T19:12:23+00:00ASRockのAGESA BIOS 1.2.7.1のリリースノートで、今後のRyzen CPUとの互換性に言及ASRock’s AGESA BIOS 1.2.7.1 Notes Mention Compatibility with Upcoming Ryzen CPUshttps://www.techpowerup.com/344045/asrocks-agesa-bios-1-2-7-1-notes-mention-compatibility-with-upcoming-ryzen-cpus
2025-12-12T18:30:29+00:00『Terminator 2D: NO FATE』、PC&コンソールで即発売、後にレトロプラットフォームへ展開Terminator 2D: NO FATE Available Now on PC & Consoles, Coming to Retro Platforms Later Onhttps://www.techpowerup.com/344044/terminator-2d-no-fate-available-now-on-pc-consoles-coming-to-retro-platforms-later-on
2025-12-12T18:20:33+00:00ASUS、次世代Zenbook Duoモデルでデュアルバッテリー構成に言及ASUS Hints About Dual Battery Config in Next-gen Zenbook Duo Modelhttps://www.techpowerup.com/344042/asus-hints-about-dual-battery-config-in-next-gen-zenbook-duo-model
2025-12-12T17:57:41+00:00Akasa、ファンレス・薄型Mini-ITX業務用ケース『Euler TX3』を発売Akasa Launches Euler TX3 Fanless Thin Mini-ITX Industrial Casehttps://www.techpowerup.com/344043/akasa-launches-euler-tx3-fanless-thin-mini-itx-industrial-case
2025-12-12T17:29:17+00:00SIEとBad Robot Games、4人協力型新作シューター『4:LOOP』を発表SIE & Bad Robot Games Announce 4:LOOP – a New Four-player Co-op Shooterhttps://www.techpowerup.com/344041/sie-bad-robot-games-announce-4-loop-a-new-four-player-co-op-shooter
2025-12-12T17:15:07+00:00AMD AIBが、パッシブクーリングのRadeon AI PRO R9700S&R9600Dカスタムカードを発表AMD AIBs Reveal Passively-cooled Radeon AI PRO R9700S & R9600D Custom Cardshttps://www.techpowerup.com/344037/amd-aibs-reveal-passively-cooled-radeon-ai-pro-r9700s-r9600d-custom-cards
2025-12-12T16:37:30+00:00Larian Studios、次作の大型RPG『Divinity』を発表Larian Studios Reveals Its Next Major RPG: Divinityhttps://www.techpowerup.com/344038/larian-studios-reveals-its-next-major-rpg-divinity
2025-12-12T16:26:21+00:00Retro Games、『THEQUICKSHOT II』を発表Retro Games Announces THEQUICKSHOT IIhttps://www.techpowerup.com/344036/retro-games-announces-thequickshot-ii
2025-12-12T16:12:27+00:00RebellionsとRed Hat、Rebellions NPU搭載のRed Hat OpenShift AIを発表Rebellions and Red Hat Introduce Red Hat OpenShift AI Powered by Rebellions NPUshttps://www.techpowerup.com/344035/rebellions-and-red-hat-introduce-red-hat-openshift-ai-powered-by-rebellions-npus
2025-12-12T15:59:55+00:00ジョン・カーペンターの『Toxic Commando』、TGAsで発売日が確認され、2026年3月12日発売John Carpenter’s Toxic Commando Release Date Confirmed During TGAs: March 12, 2026https://www.techpowerup.com/344034/john-carpenters-toxic-commando-release-date-confirmed-during-tgas-march-12-2026
2025-12-12T15:49:18+00:00Intel、14Aノード向けに中国系サプライヤーのウェットエッチ装置を評価Intel Evaluates Wet Etch Equipment from China-Linked Supplier for 14A Nodehttps://www.techpowerup.com/344031/intel-evaluates-wet-etch-equipment-from-china-linked-supplier-for-14a-node
2025-12-12T15:49:14+00:00ショップでCore Ultra 200K Plus SKUが流出、『Arrow Lake-S Refresh』の仕様も明らかにCore Ultra 200K Plus SKUs Leaked by Shop, Listings Divulge “Arrow Lake-S Refresh” Specshttps://www.techpowerup.com/344030/core-ultra-200k-plus-skus-leaked-by-shop-listings-divulge-arrow-lake-s-refresh-specs
2025-12-12T15:15:44+00:00Capcomの新IP『PRAGMATA』が2026年4月24日に発売予定Capcom’s All-new IP PRAGMATA to Launch on April 24, 2026https://www.techpowerup.com/344028/capcoms-all-new-ip-pragmata-to-launch-on-april-24-2026
2025-12-12T15:08:30+00:00Frictional Games、新作『ONTOS』を発表 ― 『SOMA』の精神的続編Frictional Games Unveils ONTOS, a Spiritual Successor to SOMAhttps://www.techpowerup.com/344027/frictional-games-unveils-ontos-a-spiritual-successor-to-soma
EETimes Taiwan
2025-12-12SDRに量子級の信頼根を注入、華邦W77TがEE Award Asia技術プラットフォーム大賞を獲得為SDR注入量子級信任根 華邦W77T勇奪EE Award Asia技術平台大獎https://www.eettaiwan.com/20251212nt41-winbond-w77t-wins-ee-award-asia-for-technology-platform-with-quantum-grade-security/
2025-12-12量子淘金熱:誰が量子時代のNvidiaになる可能性が最も高いのか?量子淘金熱:誰最有機會成為量子時代的Nvidia?https://www.eettaiwan.com/20251212nt01-race-to-find-the-next-nvidia-in-quantum-computing/
2025-12-12電柱倒壊の警鐘:我々の電力インフラはいつまで持つのか?電桿倒塌警鐘:我們的電力基礎設施還能撐多久?https://www.eettaiwan.com/20251212nt51-power-pole-collapse/
2025-12-12ポスト・クック時代:誰がAppleを率いるのか?後庫克時代:誰將執掌蘋果?https://www.eettaiwan.com/20251212nt61-who-will-lead-apple-in-the-future/
2025-12-12身分安全こそ、ROIが最も高いデータセキュリティ投資である身分安全是ROI最高的資料安全投資https://www.eettaiwan.com/20251212nt21-identity-security-roi/
2025-12-11晶門科技:革新によって次世代ディスプレイ技術を推進晶門科技:以創新驅動次世代顯示技術https://www.eettaiwan.com/20251211nt43-solomon-systech-powering-display-innovation/
2025-12-11技術実力が評価され、尼克森がEE Awards Asia 最優秀パワー半導体賞を獲得技術實力獲肯定 尼克森勇奪EE Awards Asia 最佳功率半導體獎https://www.eettaiwan.com/20251211nt42-niko-sem-ee-awards-asia-2025/
2025-12-11Alta Sicuro Technology (高密科技)は全スタックのサイバーセキュリティプラットフォームでAI時代の新たな基盤を築き、2025 EE Awardsで「ベストセキュリティ技術プラットフォーム」を獲得Alta Sicuro Technology (高密科技)以全棧資安平台定義AI時代新基礎 奪下2025 EE Awards「最佳資安技術平台」https://www.eettaiwan.com/20251211nt41-alta-sicuro-wins-best-security-technology-platform-at-ee-awards-asia-2025/
2025-12-11imec、300mm GaN先進パワーエレクトロニクス開発プログラムを開始imec啟動300mm GaN先進電力電子開發計畫https://www.eettaiwan.com/20251211nt31-imec-launches-300mm-gan-development-program-for-advanced-power-electronics/
2025-12-11スマートリングは私を『超人類』にしてくれるのか?智慧戒指能讓我成為「超人類」嗎?https://www.eettaiwan.com/20251211nt51-can-a-smart-ring-make-me-an-ultrahuman-being/
2025-12-11導入拠点および試験場として、アジア太平洋地域が世界のAI発展を牽引成導入熱點與試驗場 亞太地區引領全球AI發展https://www.eettaiwan.com/20251211nt22-asia-pacific-region-leads-global-ai-development/
2025-12-11ケーブルレス化と高HDI層構造の推進により、PCB産業が計算能力の中核となる無纜化與高HDI層架構驅動 PCB產業成算力核心https://www.eettaiwan.com/20251211nt21-pcb-industry-becomes-the-core-of-computing-power/
EETimes Asia
2025-12-12原子スケールの洞察が半導体革新を促進:MA-tekのY.F. Hsieh氏がEE Awards Asia年間エグゼクティブ賞に選ばれるAtomic-Scale Insights Drive Semiconductor Innovation: MA-tek’s Y.F. Hsieh Named EE Awards Asia Executive of the Yearhttps://www.eetasia.com/atomic-scale-insights-drive-semiconductor-innovation-ma-teks-y-f-hsieh-named-ee-awards-asia-executive-of-the-year/
2025-12-11インテリジェント・シグナル・ディスプレイ:車両意図を表現する新たな言語Intelligent Signal Displays: The New Language for Vehicle Intenthttps://www.eetasia.com/intelligent-signal-displays-the-new-language-for-vehicle-intent/
2025-12-11ソロモン・システック:ディスプレイ革新を駆動Solomon Systech: Powering Display Innovationhttps://www.eetasia.com/solomon-systech-powering-display-innovation/
2025-12-11SMART、ウェアラブル超音波画像システム開発のための研究センターを開設SMART Launches Research Center to Develop Wearable Ultrasound Imaging Systemhttps://www.eetasia.com/smart-launches-research-center-to-develop-wearable-ultrasound-imaging-system/
2025-12-112025年第3四半期、世界の折りたたみスマートフォン市場が過去最高の出荷台数を記録Global Foldable Smartphone Market Hits Record Shipments in 3Q 2025https://www.eetasia.com/global-foldable-smartphone-market-hits-record-shipments-in-3q-2025/
2025-12-11SiTime、ルネサスのタイミングコンポーネント部門を狙っていると報じられるSiTime Reportedly Eyeing Renesas’ Timing Components Unithttps://www.eetasia.com/sitime-reportedly-eyeing-renesas-timing-components-unit/
EETimes India
2025-12-11Cyient Semiconductors、半導体研究所モハリ改修プロジェクトの主要入札に適格Cyient Semiconductors Qualifies for Key Bid in Semi-Conductor Laboratory-Mohali Revamphttps://www.eetindia.co.in/cyient-semiconductors-qualifies-for-key-bid-in-semi-conductor-laboratory-mohali-revamp/
ZDNET Korea
2025-12-12グラビティ、ラグナロクIPの『新しい未来』を提示…核心新作4種を公開그라비티, 라그나로크 IP의 ‘새로운 미래’ 제시…핵심 신작 4종 공개https://www.zdnet.co.kr/20251212203938%22%20title=%22
2025-12-12生成型AI利用者、1年で2倍急増…ニュース制作には依然として懐疑的생성형 AI 사용자 1년새 2배 급증… 뉴스 제작엔 여전히 ‘회의적’https://www.zdnet.co.kr/20251212191819%22%20title=%22
2025-12-12グラビティのCOO ヨシノリ「グラビティがまさにラグナロク…2026年をグローバル飛躍の元年とする」그라비티 요시노리 COO “그라비티가 곧 라그나로크…2026년 글로벌 도약 원년으로”https://www.zdnet.co.kr/20251212190835%22%20title=%22
2025-12-12産業知能化協会「産業DX・AX生態系先導プラットフォームへの飛躍」산업지능화협회 “산업 DX·AX 생태계 선도 플랫폼 도약”https://www.zdnet.co.kr/20251212190127%22%20title=%22
2025-12-12ジクバン、グッドデザインアワードでAIドアロック全モデルが受賞직방, 굿디자인어워드서 AI도어록 전 모델 수상https://www.zdnet.co.kr/20251212181932%22%20title=%22
2025-12-12中小企業部、『オープンデータ×AIチャレンジ』を開幕…実生活に役立つAIを発掘중기부, ‘오픈 데이터 X AI 챌린지’ 개막…실생활 도움 AI 발굴https://www.zdnet.co.kr/20251212175923%22%20title=%22
2025-12-12ティーエックスアルロボティクス、トゥモロロボティクスとフィジカルAIで協力티엑스알로보틱스, 투모로로보틱스와 피지컬AI 협력https://www.zdnet.co.kr/20251212165324%22%20title=%22
2025-12-12エイスース、ヨンナムドンに『ROGワイファイ7ゲーミングゾーン』をオープン에이수스, 연남동에 ‘ROG 와이파이7 게이밍존’ 오픈https://www.zdnet.co.kr/20251212164542%22%20title=%22
中央日報
2025-12-13「忠清地方の土地価格が急騰するだろう」都市学者が注目した『拡大カンナム』“충청 이 지역 땅값 뛸 거다” 도시학자가 주목한 ‘확장 강남’https://www.joongang.co.kr/article/25389768
2025-12-13米国、AI同盟『パックスシリカ』発足…韓国・日本ほか8カ国が参加、中国を牽制미, AI 동맹 ‘팍스 실리카’ 출범…한·일 등 8개국 참여, 중국 견제https://www.joongang.co.kr/article/25389747
2025-12-13科学技術情報通信部「来年、世界トップ10に入るAIモデルを開発…2030年までにGPU26万枚を確保」과기부 “내년 세계 10위권 AI 모델 개발…2030년까지 GPU 26만장 확보”https://www.joongang.co.kr/article/25389745
2025-12-13初の7000億ドル輸出の裏側…半導体が20%上昇する際、バッテリーは12%後退수출 첫 7000억 달러의 이면…반도체 20% 뛸 때 배터리 12% 역성장https://www.joongang.co.kr/article/25389733
2025-12-13[社説] 企業寄りのメッセージが溢れているが、企業は更に苦しい[사설] 친기업 메시지 넘치는데 기업은 더 힘들다https://www.joongang.co.kr/article/25389717
2025-12-13[社説] 企業寄りのメッセージが溢れているが、企業は更に苦しい[사설] 친기업 메시지 넘치는데 기업은 더 힘들다https://www.joongang.co.kr/article/25389716
BAIDU
5е∞ПжЧґеЙН累計で179件の取引が成立し、6%の上昇を記録зІѓе°ФеНКеѓЉдљУеҐЮиµДиЗ≥179дЇњеЕГ,еҐЮеєЕзЇ¶6%http://www.eeo.com.cn/2025/1213/772687.shtml
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жШ®е§©18:56ADIが新型プロセッサーを搭載した革新的な製品を発表з≤ЊжµЛзФµе≠РдЄОADIиЊЊжИРжЈ±еЇ¶еРИдљЬ еЄГе±АжШЊз§ЇгАБеНКеѓЉдљУеПКжЦ∞иГљжЇРжµЛиѓХhttps://baijiahao.baidu.com/s?id=1851299773196184666&wfr=spider&for=pc
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2е∞ПжЧґеЙНETF取引が4.5%増加し、主要なETFとして注目されているеНКеѓЉдљУETFжФґиЈМиґЕ4.5%,йҐЖиЈМзЊОиВ°и°МдЄЪETFhttps://baijiahao.baidu.com/s?id=1851338519724932756&wfr=spider&for=pc
жШ®е§©18:55ADIが新型プロセッサーを搭載した革新的な製品を発表з≤ЊжµЛзФµе≠РдЄОADIиЊЊжИРжЈ±еЇ¶еРИдљЬ еЄГе±АжШЊз§ЇгАБеНКеѓЉдљУеПКжЦ∞иГљжЇРжµЛиѓХhttps://www.stcn.com/article/detail/3538425.html
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