Semiconductor News 20251212

Main News

1. Rapidus Secures Canon and SoftBank Support for 2nm Chip Development
   Japanese semiconductor manufacturing company Rapidus has reportedly secured investment and support from Canon and SoftBank for the mass production realization of cutting-edge 2nm process semiconductors. Canon is reportedly considering a multi-billion yen investment, which would also strengthen the company’s partnership with SoftBank. This move indicates that Japan’s national project to establish a manufacturing base for next-generation semiconductors and regain industrial competitiveness in the fields of AI and HPC (high performance computing) is making concrete progress with the capital and technological backing of major private companies.
2. U.S . Eases Export Restrictions on NVIDIA H200 to China, Benefiting SK Hynix
   The U.S. government has announced its intention to ease export restrictions on NVIDIA’s H200 AI chip to China. This is expected to benefit SK Hynix, a major supplier of the HBM (high bandwidth memory) used in the H200, the most. On the other hand, Chinese companies are already building their own supply networks and switching to alternative chips, and analysts have pointed out that the Chinese market may no longer require H200. This decision signals a new phase in the U.S.-China battle for technological supremacy.
3. Samsung Electronics Chairman and Elon Musk Meet, Possible “Samsung-Tesla Alliance”
   Samsung Electronics Chairman Lee Jae-yong and Tesla CEO Elon Musk reportedly met to discuss the establishment of a comprehensive cooperative relationship in the semiconductor field, the so-called “Samsung-Tesla” alliance. Plans to open an office dedicated to Tesla at Samsung’s U.S. foundry plant have also emerged, indicating a strategic move by Samsung to solidify its position as a major partner that can compete with TSMC in the manufacture of fully automated driving (FSD) chips and other products.
4. TSMC Considering Upgrading the Manufacturing Process at its Second Kumamoto Plant to 4nm to Meet AI Demand
   TSMC is reportedly considering converting the manufacturing technology at its second Kumamoto plant (JASM) to be built in Japan from the originally planned 6nm/7nm process to a more advanced 4nm process in response to rapidly increasing demand for AI-related semiconductors. If this is realized, it will enable the company to manufacture products in Japan. If realized, this will quickly raise the technology level of semiconductors that can be manufactured in Japan and will greatly enhance the company’s ability to supply advanced AI and HPC chips to Japanese customers.
5. China’ s SMIC Achieves 5nm Process Production without EUV Exposure Equipment?
   SMIC, a leading Chinese foundry, has achieved 5nm process (N+3 node) without EUV (Extreme Ultraviolet) exposure equipment, which is not available due to US sanctions, and by using existing DUV equipment, including multi-patterning technology. The company has reportedly succeeded in chip production at the 5nm process (N+3 node). While yield and cost issues may remain, if true, this is an important technological milestone that proves that China has broken through the technology blockade of the West and continues to develop advanced processes on its own.
6. Samsung and Micron to Hold Unusual CES Summit in Response to DRAM Supply Shortages
   TM Roh, head of Samsung Electronics’ mobile division, and Micron’s CEO are reportedly planning to meet at the 2025 Consumer Electronics Show (CES). In the current tight supply of DRAM for mobile devices, direct talks between competing memory giants are highly unusual, symbolizing that the surge in demand for memory due to the AI boom is beginning to seriously impact the supply chain for consumer electronics devices such as smartphones and PCs.
7. South Korea to Strengthen HBM and Fabless with $468 Billion Semiconductor Support Program
   The South Korean government has launched a massive semiconductor industry support program totaling $468 billion (over 600 trillion won). In addition to supporting the construction of new manufacturing facilities (fabs), the plan includes maintaining the country’s current leading position in the HBM (high bandwidth memory) market and drastically reforming the fabless (design) sector, which is considered a weak point. This is a long-term roadmap to strengthen the entire semiconductor ecosystem through the collective efforts of the nation and to compete with Taiwan and the United States.
8. Global Semiconductor Quarterly Sales Surpass $200 Billion for First Time; AI Drives Growth
   The global semiconductor market has surpassed the $200 billion mark in quarterly sales for the first time ever, according to a report from research firm Omdia. This historic record-breaking performance is largely due to an explosion in demand for chips for data centers, driven by the widespread adoption of generative AI, and confirms that the semiconductor industry as a whole is entering a strong growth cycle. Overall market revenue growth is expected to continue, establishing AI as the biggest driver of the electronics industry.
9. SK Hynix to Collaborate with NVIDIA to Develop Ultra-Fast “AI-NAND ”
   SK Hynix is reportedly working with NVIDIA to develop a next-generation “AI-NAND” solution that will reach processing speeds of 100 million IOPS (input/output times per second) by 2027. In addition to conventional DRAM technologies such as HBM, ultra-fast access technology optimized for AI workloads is required for NAND flash memory, the area where data is stored, indicating that memory manufacturers are beginning to focus on improving performance throughout the storage hierarchy.
10. China’s Hygon and Sugon’s $16.4 billion semiconductor merger breaks off
    Negotiations for a planned merger between Chinese semiconductor companies Hygon Information Technology and Sugon, valued at $16.4 billion (more than 2 trillion yen), have been called off and have reportedly broken off. The merger was to be implemented in China’s domestic computer industry. The merger had been touted as accelerating the reorganization of China’s domestic computing and semiconductor industries, but internal governance issues, changes in market conditions, or regulatory developments may have had an impact. The merger exposed difficulties in the reorganization of the Chinese semiconductor industry.

News List