Semiconductor News 20251205

TOC

Main News

  1. Micron to Exit Consumer Memory Market, Focus on Enterprise
    Micron Technology plans to exit the consumer memory market by ending its consumer memory brand Crucial by February 2026. This is a strategic shift to focus management resources on profitable enterprise supply against the backdrop of surging demand for AI and structural semiconductor shortages, indicating that AI is fundamentally changing the structure of the global memory market.
  2. Samsung WinsMajorityof Nvidia’s 2026 SOCAMM2 Supply
    Samsung has reportedly won a majority of the supply contract for Nvidia’s 2026 SOCAMM2, which is expected to be used for the company’s next-generation chips. This contract award shows that Samsung has secured a significant position in the AI chip supply chain and is strengthening its competitiveness in advanced memory technologies such as HBM.
  3. NVIDIA Invests 310 Billion Yen in Synopsys to Expand AI Engineering Field
    NVIDIA has invested $2 billion (310 billion yen) in Synopsys, a leading semiconductor design automation (EDA) software company, to strengthen cooperation in the field of AI engineering. The partnership aims to unlock the potential of AI in semiconductor design and operations and revolutionize complex chip design in the AI era, and is part of NVIDIA’s strategy to build on its dominance across the software ecosystem.
  4. TSMC to Accelerate Advanced Packaging , AP7 to Go into Production in 2026
    TSMC is accelerating the deployment of advanced packaging technology, with the AP7 fab on track to go into production in 2026. The P6 fab in Arizona is being touted as a hub for advanced packaging in the U.S. As the AI boom drives demand for ultra-large chip packaging, TSMC is rushing to invest to maintain its technological edge in this area and meet customer demand.
  5. Samsung and SK Hynix Align DRAM Strategies for 2026
    Leading DRAM manufacturers Samsung and SK Hynix have reportedly aligned their DRAM production and supply strategies for 2026. The move suggests that the two companies intend to carefully adjust supply to maintain market stability and high profitability in the face of structural chip shortages caused by AI and high-performance computing (HPC).
  6. AWS Announces Graviton5, the Most Powerful and Highest Efficiency Custom CPU
    Amazon Web Services (AWS) has announced the Graviton5, the latest generation of its in-house developed CPU. It is designed for AWS’ cloud infrastructure and is billed as the “most powerful and highest efficiency CPU. This is a clear example of how the giant cloud service provider (CSP) is ramping up its investment in custom silicon development to optimize cost and performance.
  7. Quanta Warns Power Shortages Could Stall Next Wave of Server Growth
    Leading server maker Quanta warned at Tech Forum 2026 that the next wave of AI server growth could be stalled by power shortages. With the rapid expansion of AI infrastructure, there is growing concern that not only high-performance chips, but also the power supply capacity to drive them will itself become a serious bottleneck in future growth.
  8. NVIDIA CEO unsure about H200 demand after China deregulation
    NVIDIA CEO Jensen Huang said he is not sure China will buy high-performance H200 chips even if U.S. regulations are relaxed. He pointed to Beijing authorities’ preference for domestically made AI solutions as the reason for this, reflecting the current situation where geopolitical regulations are accelerating the independence of China’s domestic AI industry.
  9. AMD Radeon Confirms $10 per 8GB V RAM Price Increase
    A $10 per 8GB price increase has been confirmed for VRAM prices on AMD Radeon graphics cards. A further price increase is expected in 2026. This price increase indicates that the memory market supply shortage due to AI demand is being passed on to the consumer GPU market as a direct cost increase.
  10. GenAI Smartphones Top 500 Million Units Shipped
    The cumulative number of smartphones supporting Generated AI (GenAI) functionality has surpassed 500 million unitsshipped, according to a report. This figure indicates that AI technology is rapidly becoming the new standard for consumer devices, not only in the data center, but also in the edge device, the smartphone market.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Dec 4, 13:52解説:マイクロン、構造的な半導体不足を背景にコンシューマー向けメモリ市場から撤退Commentary: Micron exits consumer memory market as structural chip shortage hitshttps://www.digitimes.com/news/a20251204PD228/micron-market-price-business-samsung.html
Dec 4, 13:53サムスンとSKハイニックス、2026年DRAM戦略を一致させるSamsung and SK Hynix align 2026 DRAM strategieshttps://www.digitimes.com/news/a20251204PD223/samsung-dram-sk-hynix-2026-production.html
Dec 4, 11:02テックフォーラム2026:AIが世界のチップ市場を再編する中、ASICが台頭Tech Forum 2026: ASICs gain ground as AI reshapes the global chip markethttps://www.digitimes.com/news/a20251204PD207/2026-digitimes-market-gpu-asic.html
Dec 4, 10:50台湾大統領、過去のチップ規制を引用し、米国が中国向けNvidia製品の販売を検討Taiwan’s president invokes past chip curbs as US weighs Nvidia sales to Chinahttps://www.digitimes.com/news/a20251204VL205/taiwan-expansion-new-york-times-semiconductors-manufacturing.html
Dec 4, 08:06インテル、CEOリップ・ブータンが再建戦略を再考する中、NEXのスピンアウト計画を断念Intel drops NEX spin-out plan as CEO Lip-Bu Tan recalibrates turnaround strategyhttps://www.digitimes.com/news/a20251204VL200/intel-ceo-government-competitiveness-sales.html
Dec 4, 16:54トン ヤン、11月の収益が1%増加、新工場は2026年末までに完成予定Tong Yang sees 1% revenue rise in November; new plant to finish by end of 2026https://www.digitimes.com/news/a20251204PD235/tyg-revenue-oem-plant-2025.html
Dec 4, 16:44ネクスペリアの争い激化:オランダ大臣、中国訪問をキャンセル、北京は元ウィンテック会長を注目Nexperia dispute escalates: Dutch minister cancels China visit, Beijing spotlights ex-Wingtech chairhttps://www.digitimes.com/news/a20251204PD233/dutch-nexperia-chairman-subsidiary-wingtech.html
Dec 4, 16:35サムスン、ギャラクシーS26がチップ分割に反発される中、Exynos 2600をちら見せSamsung teases Exynos 2600 as Galaxy S26 faces backlash from chip splithttps://www.digitimes.com/news/a20251204VL208/samsung-exynos-galaxy-performance.html
Dec 4, 16:25サムスン、Exynos 2600を先行公開、アップルおよびクアルコムのチップに匹敵すると主張Samsung previews Exynos 2600, claims to match Apple and Qualcomm chipshttps://www.digitimes.com/news/a20251204PD226/samsung-exynos-performance-processor-mobile.html
Dec 4, 15:31報道によると、サムスンがNvidiaの2026年SOCAMM2供給の大部分を獲得Samsung reportedly wins majority of Nvidia’s 2026 SOCAMM2 supplyhttps://www.digitimes.com/news/a20251204VL207/samsung-nvidia-dram-cpu-2026.html
Dec 4, 15:13NvidiaのJetson ThorプラットフォームがエッジAIの普及を牽引、Edomは医療補助機器を主流アプリケーションとして狙うNvidia’s Jetson Thor platform drives edge-AI surge as Edom eyes medical assistive devices as mainstream applicationshttps://www.digitimes.com/news/a20251204PD227/nvidia-edom-technology-medical-electronic-components-taiwan.html
Dec 4, 13:36テラオートテック、軍事およびAI分野での成長を期待、2026年に楽観的な見方Tera Auto Tech eyes military and AI growth, optimistic for 2026https://www.digitimes.com/news/a20251204PD213/military-2026-growth-equipment-management.html
Dec 4, 12:47ITパネルメーカー、メモリ価格高騰を背景に価格を据え置くIT panel makers lock prices as memory prices surgehttps://www.digitimes.com/news/a20251204PD219/panel-price-demand-cost-ips.html
Dec 4, 12:05テックフォーラム2026:クアンタ、電力不足が次のサーバー成長の波を停滞させる可能性を警告Tech Forum 2026: Quanta warns power shortages may stall next server growth wavehttps://www.digitimes.com/news/a20251204PD211/digitimes-forum-2026-quanta-chairman-ai-server-growth.html
Dec 4, 11:15クロマ、ガバナンスと運営強化のためにイーシー・ツェンを新CEOに任命Chroma appoints I-Shih Tseng as new CEO to strengthen governance and operationshttps://www.digitimes.com/news/a20251204PD200/chroma-ate-ic-testing-equipment-governance.html
Dec 4, 11:09CXMT、DDR4の縮小を深める;ナンヤ、米国クラウド大手から関心を集めるCXMT deepens DDR4 retrenchment; Nanya draws interest from US cloud giantshttps://www.digitimes.com/news/a20251204PD220/ddr4-ddr5-dram-cxmt-nanya-technology-winbond-2026.html
日経 Tech Foresight
2025-12-05STマイクロ、マイコンに相変化メモリー ルネサス競合品https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC0446G0U5A201C2000000
2025-12-05半導体レジスト、30年ぶりの新星MOR サムスンなど採用へhttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC043JR0U5A201C2000000
マイナビニュース テックプラス
2025-12-05Micronがコンシューマブランド「Crucial」を廃止、エンタープライズに注力https://news.mynavi.jp/techplus/article/20251205-3762476/
2025-12-04onsemi、Innoscienceの200mm GaN on Siを活用した低中電圧GaN電源製品の提供を計画https://news.mynavi.jp/techplus/article/20251204-3761048/
2025-12-04リガクが原子1個分以下の精度で測定可能な半導体向け膜厚計測装置を発売、キオクシアが導入を決定https://news.mynavi.jp/techplus/article/20251204-3760879/
2025-12-042025年第3四半期のNAND市場は前四半期比16.5%増の171億ドル、キオクシアがシェアを拡大 TrendForce調べhttps://news.mynavi.jp/techplus/article/20251204-3760472/
2025-12-04吉川明日論の半導体放談 第357回 Gemini 3のリリースで頭一つ抜け出たGooglehttps://news.mynavi.jp/techplus/article/semicon-357/
2025-12-04imecがCMOS 2.0に至るロジック集積化の道筋を解説 – ITF Japan 2025https://news.mynavi.jp/techplus/article/20251204-3755989/
2025-12-04データセンターからエッジまで全方位戦略でAIのすべてを獲りに行くAMD – Advancing AI 2025 Japanhttps://news.mynavi.jp/techplus/article/20251204-3756713/
TrendForce
2025-12-04TSMCが先端パッケージングを迅速化:AP7は2026年の生産を狙い、アリゾナのP6は米国パッケージング拠点として注目TSMC Speeds Advanced Packaging: AP7 Targets 2026 Output; Arizona P6 Eyed for U.S. Packaging Hubhttps://www.trendforce.com/news/2025/12/04/news-tsmc-speeds-advanced-packaging-ap7-targets-2026-output-arizona-p6-eyed-for-u-s-packaging-hub/
2025-12-04SKハイニックス、アメリカ地域にHBM専任タスクフォースを設置した組織再編を発表SK hynix Unveils Organizational Restructure with Dedicated HBM Taskforce in the Americashttps://www.trendforce.com/news/2025/12/04/news-sk-hynix-unveils-organizational-restructure-with-dedicated-hbm-taskforce-in-the-americas/
2025-12-04Intel、スピンオフ見直しの結果、ネットワーキングおよびエッジ部門を維持へ―業績予想改善が背景Intel to Retain Networking and Edge Division After Spinoff Review as Financial Outlook Improveshttps://www.trendforce.com/news/2025/12/04/news-intel-to-retain-networking-and-edge-division-after-spinoff-review-as-financial-outlook-improves/
2025-12-04Micron、2026年2月までに主要なコンシューマー向けメモリの提供を終了し、AI需要急増を受け企業向け供給に転換Micron to End Crucial Consumer Memory by Feb 2026, Redirects Supply to Enterprise amid AI Surgehttps://www.trendforce.com/news/2025/12/04/news-micron-to-end-crucial-consumer-memory-by-feb-2026-redirects-supply-to-enterprise-amid-ai-surge/
2025-12-04中国のMTC、DFBフォトニックチップの小ロット出荷を達成China’s MTC Achieved Small-Batch Shipment of DFB Photonic Chipshttps://www.trendforce.com/news/2025/12/04/news-chinas-mtc-achieved-small-batch-shipment-of-dfb-photonic-chips/
Semiconductor Digest
35 minutes agoインフィニオンが高出力シリコンカーバイド技術でエレクトリオンの電動道路充電を強化Infineon Enhances Electreon’s Electric Road Charging with High-Power Silicon Carbide Technologyhttps://www.semiconductor-digest.com/infineon-enhances-electreons-electric-road-charging-with-high-power-silicon-carbide-technology/
38 minutes agoオンセミが消費電力の高いアプリケーションの効率化を推進するため、新たな冷却パッケージ技術を発表onsemi Launches New Cooling Packaging Technology to Drive Efficiency in Power-Hungry Applicationshttps://www.semiconductor-digest.com/onsemi-launches-new-cooling-packaging-technology-to-drive-efficiency-in-power-hungry-applications/
1 hour ago量子コンピューティングの革新を加速:ヴィーコー、MBE受注によりグローバル展開を拡大Accelerating Quantum Computing Innovation: Veeco Expands Global Footprint with MBE Winshttps://www.semiconductor-digest.com/accelerating-quantum-computing-innovation-veeco-expands-global-footprint-with-mbe-wins/
6 hours agoコンテキスト・エンジニアリング:半導体の設計と運用におけるAIの潜在能力を引き出す鍵Context Engineering: The Key to Unlocking AI’s Potential in Semiconductor Design and Operationshttps://www.semiconductor-digest.com/context-engineering-the-key-to-unlocking-ais-potential-in-semiconductor-design-and-operations/
7 hours ago長年にわたるエコシステムパートナーシップで頑強性を構築Building Resilience Through Long-Standing Ecosystem Partnershipshttps://www.semiconductor-digest.com/building-resilience-through-long-standing-ecosystem-partnerships/
7 hours ago高度な半導体チップの需要に対応:生産拡大とラボからファブへのデータギャップ解消Meeting the Demand for Advanced Semiconductor Chips: Scaling Production and Closing the Lab-to-Fab Data Gaphttps://www.semiconductor-digest.com/meeting-the-demand-for-advanced-semiconductor-chips-scaling-production-and-closing-the-lab-to-fab-data-gap/
日本経済新聞
2025-12-05Apple、創業50年を前に人材流出ショック CEO交代説もhttps://www.nikkei.com/article/DGXZQOGN04D5L0U5A201C2000000/
2025-12-05米国株、ダウ反落し31ドル安 利益確定売り優勢 ナスダックは続伸https://www.nikkei.com/article/DGXZQOFL04CSB0U5A201C2000000/
2025-12-05米国株15時、ダウ反落 利益確定売り優勢も米利下げ期待が支えhttps://www.nikkei.com/article/DGXZQOFL04CSA0U5A201C2000000/
2025-12-05OpenAIのアルトマン氏、宇宙産業への参入を検討 WSJ報道https://www.nikkei.com/article/DGXZQOGN04D4X0U5A201C2000000/
2025-12-05NVIDIA幹部「日本、もうロボット大国ではない」 AIで一変https://www.nikkei.com/article/DGXZQOUC03CFZ0T01C25A2000000/
2025-12-05世界株、5年ぶり新興国優位 「冬の時代」脱却へドル安追い風https://www.nikkei.com/article/DGXZQOUB04AT50U5A101C2000000/
2025-12-05成長戦略会議に進捗管理の分科会、体制・行程案 分野ごとにWG設置https://www.nikkei.com/article/DGXZQOUA039KD0T01C25A2000000/
2025-12-05半導体マイクロン、消費者向けメモリー撤退 経営資源をAIに集中https://www.nikkei.com/article/DGXZQOGN047DI0U5A201C2000000/
2025-12-05米国向け航空貨物運賃、高値続く 東南アジア・台湾発が下支えhttps://www.nikkei.com/article/DGXZQOUB276LM0X21C25A1000000/
2025-12-05関西経済の未来図描くデータセンター 電力網整備へ次世代原発構想もhttps://www.nikkei.com/article/DGXZQOUF106D60Q5A111C2000000/
ダイヤモンドオンライン
Dec 4 22:00日本の半導体「凋落」の要因をつくった首相と“密約”の中身https://diamond.jp/articles/-/375314
Dec 4 21:30「最後に勝つのは…」AIで仕事が消滅する会社員に残された、たった1つの“生存戦略”とは?https://diamond.jp/articles/-/378738
Dec 4 20:00エヌビディアの高い利益率、グーグルとAMDには好機https://diamond.jp/articles/-/378789
Dec 4 20:00台湾で高まる「トランプ不信」、日本も見捨てられる「最悪のシナリオ」とは?https://diamond.jp/articles/-/378723
Dec 4 04:00次世代300mm GaN半導体の実現に向けて会津工場から次世代半導体のトップメーカーを目指す――イニシアチブを握るカギは内製化と人材力https://diamond.jp/articles/-/377327
Dec 3 21:00高市発言で日中関係悪化も、上海に行って分かった「中国が強気の態度」を取る理由https://diamond.jp/articles/-/378663
Dec 3 20:10米商業不動産、割安すぎて無視できずhttps://diamond.jp/articles/-/378670
Dec 3 19:55みずほ銀行頭取が明かす「ステージが1段上がった」投資銀行部門、グローバルトップ10入りの鍵となる地域とはhttps://diamond.jp/articles/-/377845
Dec 2 20:05AIバブル対策、社債投資が不十分な理由https://diamond.jp/articles/-/378521
Dec 2 19:15高市「規模重視」総合経済対策は日本に“過大”、インフレ加速懸念で日銀はマイルドな利上げ進めるべきhttps://diamond.jp/articles/-/378489
Tom’s Hardware
2025-12-04 22:14NvidiaのCEOジェンセン・ファンは、北京が国内製AIソリューションを優先する中、規制緩和後に中国がH200チップを購入するかどうか確信が持てないと述べたNvidia CEO Jensen Huang unsure if China would buy its H200 chips if restrictions are relaxed as Beijing prioritizes homegrown AI solutionshttps://www.tomshardware.com/tech-industry/nvidia-ceo-jensen-huang-unsure-if-china-would-buy-its-h200-chips-if-restrictions-are-relaxed-as-beijing-prioritizes-homegrown-ai-solutions-we-dont-know-we-have-no-clue
TechPowerup
2025-12-04T21:19:57+00:00KeychronがK2 HEオールウッド・スペシャルエディションのワイヤレス機械式キーボードを発売Keychron Launches K2 HE All-Wood Special Edition Wireless Mechanical Keyboardhttps://www.techpowerup.com/343699/keychron-launches-k2-he-all-wood-special-edition-wireless-mechanical-keyboard
2025-12-04T20:28:19+00:00AWSが最強かつ最高効率のCPU「Graviton5」を発表AWS Introduces Graviton5, Its Most Powerful and Efficient CPUhttps://www.techpowerup.com/343697/aws-introduces-graviton5-its-most-powerful-and-efficient-cpu
2025-12-04T20:22:17+00:00Sudokooのサイバーマンデーセールが継続:高級冷却装置が最終割引中Sudokoo Cyber Monday Sale Continues: Final Discounts on High-End Cooling Gearhttps://www.techpowerup.com/343131/sudokoo-cyber-monday-sale-continues-final-discounts-on-high-end-cooling-gear
2025-12-04T20:16:14+00:00Samsungが3GB容量の40Gbps GDDR7メモリを開発Samsung Develops 40 Gbps GDDR7 Memory with 3 GB Capacityhttps://www.techpowerup.com/343696/samsung-develops-40-gbps-gddr7-memory-with-3-gb-capacity
2025-12-04T20:00:57+00:00Segotep、過剰に頑丈なピン設計によりTITANLOAD 12V-2×6ケーブルのピーク温度が低減されていると主張Segotep Claims TITANLOAD 12V-2×6 Cable’s Peak Temp Reduced Due to Overly Robust Pin Provisionshttps://www.techpowerup.com/343694/segotep-claims-titanload-12v-2×6-cables-peak-temp-reduced-due-to-overly-robust-pin-provisions
2025-12-04T18:58:04+00:00Creative Assemblyにおいて「Total War: MEDIEVAL III」がプレプロダクション段階に入るTotal War: MEDIEVAL III in Pre-production Phase at Creative Assemblyhttps://www.techpowerup.com/343693/total-war-medieval-iii-in-pre-production-phase-at-creative-assembly
2025-12-04T18:43:18+00:00AMD Ryzen AI 5 430「Gorgon Point」4コアAPUの詳細がベンチマーク結果から明らかにAMD Ryzen AI 5 430 “Gorgon Point” 4-core APU Details Emerge From Benchmark Resultshttps://www.techpowerup.com/343692/amd-ryzen-ai-5-430-gorgon-point-4-core-apu-details-emerge-from-benchmark-results
2025-12-04T18:00:53+00:00「ROUTINE」PCおよびXboxで発売中、開発者たちが共感できるSFホラー世界を構築ROUTINE Out Now on PC & Xbox Platforms, Devs Have Crafted a Relatable Sci-fi Horror Worldhttps://www.techpowerup.com/343690/routine-out-now-on-pc-xbox-platforms-devs-have-crafted-a-relatable-sci-fi-horror-world
2025-12-04T17:46:27+00:00AMD Ryzen 7 9850X3DのSKUが120W TDP評価および部品番号で出荷書類に確認されるAMD Ryzen 7 9850X3D SKU’s 120 W TDP Rating & Part No. Spotted in Shipment Dochttps://www.techpowerup.com/343687/amd-ryzen-7-9850x3d-skus-120-w-tdp-rating-part-no-spotted-in-shipment-doc
2025-12-04T17:39:50+00:00AetinaがNVIDIA RTX PRO Blackwell組み込みGPU搭載のMXMアクセラレーターモジュールを発表Aetina Unveils MXM Accelerator Module with NVIDIA RTX PRO Blackwell Embedded GPUshttps://www.techpowerup.com/343689/aetina-unveils-mxm-accelerator-module-with-nvidia-rtx-pro-blackwell-embedded-gpus
2025-12-04T17:24:58+00:00Endorfyが新型Stoneflowマウスパッドを発売Endorfy Launches New Stoneflow Mousepadshttps://www.techpowerup.com/343685/endorfy-launches-new-stoneflow-mousepads
2025-12-04T17:03:52+00:00Ubisoft+のプレミアムストリーミングライブラリに、初のアクティビジョンゲーム群が追加Ubisoft+ Premium Streaming Library Expanded with First Batch of Activision Gameshttps://www.techpowerup.com/343684/ubisoft-premium-streaming-library-expanded-with-first-batch-of-activision-games
2025-12-04T16:58:43+00:00AMD Zen 6ベースの「Medusa Point」APU、28Wと45W TDPモデルで登場AMD Zen 6-Based “Medusa Point” APU Comes in 28 W and 45 W TDPshttps://www.techpowerup.com/343682/amd-zen-6-based-medusa-point-apu-comes-in-28-w-and-45-w-tdps
2025-12-04T16:57:13+00:00NVIDIA GeForce NOWがクラウドで30の新作ゲームを追加し、ホリデーシーズンに彩りを提供NVIDIA GeForce NOW Brings Holiday Cheer With 30 New Games in the Cloudhttps://www.techpowerup.com/343683/nvidia-geforce-now-brings-holiday-cheer-with-30-new-games-in-the-cloud
2025-12-04T16:55:03+00:00Samsungが次期Exynos 2600 5GモバイルSoCをチラ見せ、内部情報で地域限定仕様が示唆されるSamsung Teases Upcoming Exynos 2600 5G Mobile SoC, Insiders Allude to Regional Exclusivityhttps://www.techpowerup.com/343681/samsung-teases-upcoming-exynos-2600-5g-mobile-soc-insiders-allude-to-regional-exclusivity
2025-12-04T16:21:01+00:00AMD Radeonの価格引き上げ、8GBあたり10ドルで確定、2026年にもさらなる上昇が見込まれるAMD Radeon Price Hike Confirmed at $10 per 8GB of VRAM, More Increases Expected in 2026https://www.techpowerup.com/343680/amd-radeon-price-hike-confirmed-at-usd-10-per-8gb-of-vram-more-increases-expected-in-2026
2025-12-04T16:09:33+00:00Clair Obscur:Expedition 33が2025年Xbox Game Passでの最大の新規サードパーティ発売にClair Obscur: Expedition 33 Biggest New 3rd-Party Launch on Xbox Game Pass in 2025https://www.techpowerup.com/343679/clair-obscur-expedition-33-biggest-new-3rd-party-launch-on-xbox-game-pass-in-2025
2025-12-04T15:59:19+00:00内部情報では、噂されるAMD Ryzen 9000 CPUの価格引き上げを否定Insiders Dismiss Rumored AMD Ryzen 9000 CPU Price Hikeshttps://www.techpowerup.com/343677/insiders-dismiss-rumored-amd-ryzen-9000-cpu-price-hikes
2025-12-04T15:19:30+00:00NVIDIAがGeForce 591.44 WHQLゲームレディドライバーをリリースNVIDIA Releases GeForce 591.44 WHQL Game Ready Driverhttps://www.techpowerup.com/343674/nvidia-releases-geforce-591-44-whql-game-ready-driver
2025-12-04T15:10:16+00:00Qolabの初の超伝導キュービットデバイス展開に、Quantum Machinesのハイブリッド制御技術が採用されるQolab’s 1st Superconducting-qubit Device Deployments Feature Quantum Machines Hybrid Control Techhttps://www.techpowerup.com/343675/qolabs-1st-superconducting-qubit-device-deployments-feature-quantum-machines-hybrid-control-tech
2025-12-04T15:00:09+00:00ASRock H610M COMBOマザーボード、DDR5およびDDR4 DIMMに対応ASRock H610M COMBO Motherboard Accepts DDR5 & DDR4 DIMMshttps://www.techpowerup.com/343672/asrock-h610m-combo-motherboard-accepts-ddr5-ddr4-dimms
EETimes Taiwan
2025-12-04AIエンジニアリング分野を拡大 Nvidia、Synopsysに20億ドルを投資擴大AI工程版圖 Nvidia投資新思20億美元https://www.eettaiwan.com/20251204nt01-nvidia-invests-2-billion-in-synopsys-targeting-broader-engineering-design-market/
2025-12-04材料の制限を突破—製造プロセスの革新が太陽熱電変換効率を押し上げる突破材料限制—製程創新推升太陽熱電效率https://www.eettaiwan.com/20251204nt51-solar-driven-teg-advances-via-fabrication-not-materials/
2025-12-04アジアのサービス拠点を構築 TRUMPF技術センターが桃園に設立打造亞洲服務樞紐 TRUMPF技術中心落腳桃園https://www.eettaiwan.com/20251204nt11-trumpf-establishes-asia-service-hub-with-new-taoyuan-tech-center/
2025-12-04GenAIスマートフォンの累計出荷台数が5億台を突破GenAI智慧型手機累積出貨突破5億支https://www.eettaiwan.com/20251204nt21-genai-smartphone-shipments/
2025-12-03通信収益モデルを再構築 Nvidia、巨額投資でNokiaに賭ける重塑電信營收模式 Nvidia重資押注Nokiahttps://www.eettaiwan.com/20251203nt01-nvidia-s-1-billion-bet-on-nokia-to-rewire-global-telecom/
2025-12-03固定電話:勢いは失われたが、依然として存在する固定式電話:風光不再但依舊在線https://www.eettaiwan.com/20251203nt51-landline-phones-going-going-but-not-at-all-gone/
2025-12-03なぜ企業は「ゼロ在庫」モデルを追求しなくなったのか?企業為何不再追求「零庫存」模式?https://www.eettaiwan.com/20251203nt61-why-are-companies-no-longer-pursuing-the-zero-inventory-model/
2025-12-03世界のヒューマノイドロボットの出荷量は、年複合成長率69.7%で上昇する見通し全球人形機器人出貨量將以69.7%年複合成長率攀升https://www.eettaiwan.com/20251203nt21-global-humanoid-robot-shipments-cagr/
EETimes Asia
2025-12-04Tescan、フェムト秒レーザープラットフォームで半導体ポートフォリオを拡充Tescan Expands Semiconductor Portfolio with Femtosecond Laser Platformhttps://www.eetasia.com/tescan-expands-semiconductor-portfolio-with-femtosecond-laser-platform/
2025-12-04MetaOptics、成長加速と世界的需要の高まりに対応すべく体制を整備MetaOptics Gearing Up to Accelerate Growth and Meet Rising Global Demandhttps://www.eetasia.com/metaoptics-gearing-up-to-accelerate-growth-and-meet-rising-global-demand/
2025-12-04MFMY、東南アジア初の製造とサービス統合拠点を開設MFMY Inaugurates First Integrated Manufacturing and Services Hub in Southeast Asiahttps://www.eetasia.com/mfmy-inaugurates-first-integrated-manufacturing-and-services-hub-in-southeast-asia/
2025-12-04GlobalFoundries、APAC担当営業副社長にヴィンセント・フェンを任命Vincent Feng Appointed VP Sales for APAC at GlobalFoundrieshttps://www.eetasia.com/vincent-feng-appointed-vp-sales-for-apac-at-globalfoundries/
2025-12-042025年第3四半期、世界のチップ装置受注高が前年同期比で11%増加Global Chip Equipment Billings Up 11% YoY in 3Q 2025https://www.eetasia.com/global-chip-equipment-billings-up-11-yoy-in-3q-2025/
2025-12-03成功を導くソフトウェア定義型医療システムSoftware-Defined Medical Systems for Successhttps://www.eetasia.com/embeddedblog-software-defined-medical-systems-for-success/
2025-12-03製造業におけるエッジAI:安全な産業未来のための即時意思決定Edge AI in Manufacturing: Instant Decision-Making for a Safer Industrial Futurehttps://www.eetasia.com/embeddedblog-edge-ai-in-manufacturing-instant-decision-making-for-a-safer-industrial-future/
2025-12-03Bluetoothチャネルサウンディング:Bluetooth革新の次なる一歩Bluetooth Channel Sounding: The Next Leap in Bluetooth Innovationhttps://www.eetasia.com/embeddedblog-bluetooth-channel-sounding-the-next-leap-in-bluetooth-innovation/
2025-12-03エッジコンピューティングSOMによる熱画像イメージングThermal Vision Imaging with Edge Computing SOMshttps://www.eetasia.com/embeddedblog-thermal-vision-imaging-with-edge-computing-soms/
2025-12-03SEEQC、台湾ITRIと提携し超伝導制御チップの製造ラインを構築SEEQC Partners with Taiwan’s ITRI to Build Manufacturing Line for Superconducting Control Chipshttps://www.eetasia.com/seeqc-partners-with-taiwans-itri-to-build-manufacturing-line-for-superconducting-control-chips/
2025-12-03NVIDIAとSynopsys、エンジニアリングと設計を革新するために協力NVIDIA and Synopsys Collaborating to Revolutionize Engineering and Designhttps://www.eetasia.com/nvidia-and-synopsys-collaborating-to-revolutionize-engineering-and-design/
2025-12-03AIブームがウルトラ大規模チップパッケージングへの需要を牽引AI Boom Drives Demand for Ultra-Large Chip Packaginghttps://www.eetasia.com/ai-boom-drives-demand-for-ultra-large-chip-packaging/
EETimes India
2025-12-03タタエレクトロニクス、インドのチップ産業の技術格差解消へ向けNIELITと覚書締結Tata Electronics Inks MoU with NIELIT to Bridge Skill Gap in India’s Chip Industryhttps://www.eetindia.co.in/tata-electronics-inks-mou-with-nielit-to-bridge-skill-gap-in-indias-chip-industry/
2025-12-03SAICEC、シーメンスと提携しチップから車両への検証プロセスを加速SAICEC Partners with Siemens to Accelerate Chip-to-vehicle Validationhttps://www.eetindia.co.in/saicec-partners-with-siemens-to-accelerate-chip-to-vehicle-validation/
2025-12-03精度を超えて―UWBが変革する屋内位置測定の展開と拡張性Beyond Accuracy: How UWB is Transforming Indoor Positioning Deployment and Scalabilityhttps://www.eetindia.co.in/beyond-accuracy-how-uwb-is-transforming-indoor-positioning-deployment-and-scalability/
2025-12-03インフィニオンのGaN技術が支える、エンフェーズ・エナジーの次世代太陽光マイクロインバーターInfineon GaN Tech Powers Enphase Energy’s Next-gen Solar Microinvertershttps://www.eetindia.co.in/infineon-gan-tech-powers-enphase-energys-next-gen-solar-microinverters/
ZDNET Korea
2025-12-05「ハッキングで揺らぐ韓国…『サイバーセキュリティ基本法』を作らねば」“해킹 휘청 한국…’사이버보안 기본법’ 만들어야”https://www.zdnet.co.kr/20251205010751%22%20title=%22
2025-12-04「病院が金を出して利用する医療専門AI、チャットGPTには及ばない」“병원들이 돈 주고 쓰는 의료 전문 AI, 챗GPT보다 못하다”https://www.zdnet.co.kr/20251204194703%22%20title=%22
2025-12-04リチャード・トン バイナンス代表「トークン化、ステーブルコイン、AI、決済が今後10年で金融市場を揺るがす」리처드 텅 바이낸스 대표 “토큰화·스테이블코인·AI·결제가 향후 10년 금융시장 뒤흔들 것”https://www.zdnet.co.kr/20251204193939%22%20title=%22
2025-12-04米国のファクトシート圧力で…アップルの地図データ持ち出しに注目美 팩트시트 압박에…애플 지도반출에 쏠리는 눈https://www.zdnet.co.kr/20251204173603%22%20title=%22
2025-12-04国家AI戦略委員会が外務省・KOICAと途上国のDX・AI能力強化について協議국가AI전략위, 외교부·KOICA와 개도국 DX·AI 역량 강화 논의https://www.zdnet.co.kr/20251204183341%22%20title=%22
2025-12-04スノーフレーク、プラットフォームに『クロード』を追加…「AI・データ分析をより簡単に」스노우플레이크, 플랫폼에 ‘클로드’ 추가…”AI·데이터 분석 더 쉽게”https://www.zdnet.co.kr/20251204180335%22%20title=%22
2025-12-04ユン・ホジュン 行政安全部大臣、アマゾン上級副会長と面会…『AI民主政府』の実現について協議윤호중 행안부 장관, 아마존 수석 부회장 접견…’AI 민주정부’ 실현 논의https://www.zdnet.co.kr/20251204174543%22%20title=%22
2025-12-04リュ・ジェミョン 次官、タイ上院常任委員長4名とAI・科学技術協力について協議류제명 차관, 태국 상원 상임위원장 4명과 AI-과기 협력 논의https://www.zdnet.co.kr/20251204175920%22%20title=%22
2025-12-04アップステージ、調達庁に初のAIサービスを供給…「公共業務支援」업스테이지, 조달청에 AI 서비스 첫 공급…”공공업무 지원”https://www.zdnet.co.kr/20251204175448%22%20title=%22
中央日報
2025-12-05エヌビディア 天下を揺さぶるビッグテック…「誰が勝とうと、K半導体の恩恵」엔비디아 천하 흔드는 빅테크들…”누가 이기든 K반도체 수혜”https://www.joongang.co.kr/article/25387650
2025-12-05[キム・サンベのパースペクティブ] 地政学の課題に直面したAI技術、外交推進体制の整備が必要[김상배의 퍼스펙티브] 지정학 이슈와 만난 AI 기술, 외교 추진체계 정비해야https://www.joongang.co.kr/article/25387595
2025-12-05多角化によって危機を乗り越えた韓国輸出、7000億ドルが見込まれる다변화로 위기 넘긴 한국 수출, 7000억 달러 보인다https://www.joongang.co.kr/article/25387579
2025-12-05この大統領『この国を築いた英雄たち』…産業界功労者90名との昼食会이 대통령 “이 나라 세운 영웅들”…산업 역군 90명과 오찬https://www.joongang.co.kr/article/25387566
2025-12-04李大統領『この国を築いた英雄たち』…産業界功労者90名を招いた昼食会李대통령 “이 나라를 세운 영웅들”…산업 역군 90명 초청 오찬https://www.joongang.co.kr/article/25387529
2025-12-04李大統領「政治界全体が正義に基づく統合のパートナー」…『内乱』という表現は使わなかった李 “정치권 모두가 정의로운 통합 동반자”…‘내란’ 표현 안썼다https://www.joongang.co.kr/article/25387528
BAIDU
昨天20:09星曜半導体が1億元を超えるCラウンドの資金調達を完了星曜半导体完成超亿元C轮融资https://baijiahao.baidu.com/s?id=1850579549736991651&wfr=spider&for=pc
1小时前朗业芯(上海)半導体材料有限公司が設立され、登録資本金は50万人民元朗业芯(上海)半导体材料有限公司成立 注册资本50万人民币https://baijiahao.baidu.com/s?id=1850611604138981564&wfr=spider&for=pc
昨天16:22新株ニュース|基本半導体が二度目の香港証券取引所への上場申請、炭化ケイ素パワー半導体の研究開発に専念…新股消息|基本半导体二次递表港交所 专注于碳化硅功率器件的研发…https://baijiahao.baidu.com/s?id=1850567856170017673&wfr=spider&for=pc
昨天21:30TCLテクノロジー:同社は半導体ディスプレイ、新エネルギー太陽光発電、半導体材料の三大分野に注力して…TCL科技:公司致力于将半导体显示、新能源光伏与半导体材料三大…https://baijiahao.baidu.com/s?id=1850584602815896959&wfr=spider&for=pc
昨天21:26江波龙:同社の半導体メモリ製品は広い応用可能性を有している江波龙:公司的半导体存储器产品具备广阔的应用空间https://baijiahao.baidu.com/s?id=1850584358457712778&wfr=spider&for=pc
1小时前上海慧晶腾微半導体科技有限公司が設立され、登録資本金は100万人民元上海慧晶腾微半导体科技有限公司成立 注册资本100万人民币https://baijiahao.baidu.com/s?id=1850611604135715093&wfr=spider&for=pc
昨天17:37産業資本が猛烈に投資!半導体株が一斉に上昇、これらの株は低評価かつ高成長产业资本疯狂“砸钱”!半导体集体走强 这些股低估值高增长https://baijiahao.baidu.com/s?id=1850569960113469882&wfr=spider&for=pc
昨天22:34美利信は12億元の資金調達を計画し、半導体などの高付加価値装備分野への投資を強化美利信拟定增募资12亿元 加码半导体等高端装备领域投入https://www.cnstock.com/commonDetail/598056
昨天17:57半導体分野、大きなニュース!多数の銘柄がストップ高半导体领域,大消息!多股涨停https://baijiahao.baidu.com/s?id=1850571780343196870&wfr=spider&for=pc
昨天20:19美利信:募資額は12億元を上限とし、半導体装備の精密構造部品建設プロジェクト等に充当する予定美利信:拟募资不超过12亿元 将用于半导体装备精密结构件建设项目等https://www.nbd.com.cn/articles/2025-12-04/4168692.html
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