Semiconductor News 20251117

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1. Samsung Plans Record Investment of 450 Trillion Won in 5 Years in Japan Samsung Electronics plans to make a record-breaking investment of 450 trillion won in total in the country (Korea) over the next five years. This massive investment plan includes the expansion of its semiconductor business, and in particular, the start of construction of a P5 plant at its Pyeongtaek campus. This is a strategic move to maintain and strengthen Samsung’s global competitiveness in next-generation semiconductor technology, especially in the areas of memory and foundry, and to accelerate the future business promoted by Chairman Lee Jae-yong.
2. NVIDIA’s Earnings Announcement Will Be a Crucial Test for the Sustainability of the AI Market and Japanese Stocks NVIDIA’s earnings announcement is being watched globally as a test of whether or not the current AI boom will continue. The results will have a significant impact on sentiment in the technology market as a whole. In Japan, the earnings results are seen as a key factor in determining whether the Nikkei Stock Average will settle at the 50,000-yen level, and market expectations and concerns about the sustainability of the AI-driven stock rally are mixed.
3. Broadcom Introduces Third-Generation CPO with Optoelectronic Fusion Leveraging TSMC Technology Broadcom has introduced to the market its third-generation co-packaged optics (CPO) solution using optoelectronic fusion technology. TSMC’s manufacturing technology is used to realize this advanced technology, CPO is a next-generation packaging technology that dramatically improves power efficiency and speed by integrating chips and optical transmission modules in the same package to handle the explosive data processing volumes in AI data centers. This is extremely important.
4. Semco Seeks Large Deals with Major Technology Companies for Next-Generation Glass Substrate Technology Semco (Samsung Electro-Mechanics) is seeking to secure large deals with major technology companies such as Apple and Broadcom in the area of glass substrates, a key next-generation semiconductor packaging technology. Demand for glass substrates is expected to skyrocket, especially for high-performance AI chips and HPC (High Performance Computing) applications, as they can offer higher integration and better electrical properties compared to traditional organic substrates.
5. Canon Making Steady Progress Toward Commercialization of Nanoimprint Technology Canon Inc. is reportedly making “steady progress” toward the commercialization of nanoimprint lithography (NIL), a next-generation semiconductor manufacturing technology that is expected to be a low-cost, high-resolution alternative to expensive extreme ultraviolet (EUV) lithography equipment, especially in the manufacture of memory semiconductors such as DRAM. NIL is expected to be a low-cost, high-resolution alternative to expensive EUV (Extreme Ultraviolet) lithography equipment, especially in the manufacture of memory semiconductors such as DRAM. This initiative signals the diversification of technologies and the potential for a new manufacturing paradigm in the semiconductor production equipment market.
6. Intel’s Next-Generation Granite Rap ids-WS Server CPU Lineup Leaked Intel’s next-generation Granite Rapids-WS server CPU lineup for workstations has been leaked. The leaked information includes an 18-core chip, the Xeon 654, which showed solid numbers in early Geekbench benchmarks. This confirms Intel’s commitment to higher performance in its next generation of Xeon processors in order to maintain and strengthen its competitive advantage in the AI and data center markets.
7. Google to Invest 21 Trillion Won in India to Create Global Data Center Hub Google has announced plans to make a major investment of 21 trillion won (approximately $15.75 billion) in digital infrastructure in India. The purpose of this investment is to establish India as a global data center hub, strengthening its global infrastructure to meet the rapidly expanding digital demands of the Asian market, especially AI-related computing demands.
8. AI Becomes Key Competitive Area for Cloud Service Providers For major cloud service providers (CSPs), AI technology has become a key battleground in the cloud market, and interviews with key personnel at Amazon reveal that the company has made AI a top priority in its strategy to defend its cloud throne. It is clear that the company has made AI a top priority in its strategy to defend its cloud throne. This indicates that the company’s ability to provide AI models and services, rather than just infrastructure, will be a determining factor in its future share of the cloud market.
9. SK Key Foundry Enters SiC Wafer Found ry Market , Aims to Introduce 1200V Process Technology SK Key Foundry (SK启方半導体), a member of the SK Group, has entered the SiC (silicon carbide) wafer foundry (contract manufacturing) market. The company aims to introduce 1200V process technology by the end of this year. This move is intended to strengthen its manufacturing capabilities for power semiconductors, for which demand is rapidly increasing in the electric vehicle (EV) and industrial power sectors, where high efficiency is required, and to establish a position in this high-growth market.
10. U.S. and Japan Proposed to Strengthen Cooperation in Semiconductor and AI War Against China Economic historian Chris Miller has made a recommendation that it is essential for Japan and the United States to work closely together in the competition with China over semiconductor and AI technologies. The recommendation emphasizes the importance of geopolitical and strategic coordination to strengthen supply chains and prevent the outflow of advanced technologies, and analyzes that cooperation with Japan, which holds 30% of the global market share in the field of semiconductor production equipment, is key.

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