Semiconductor News 20260314

Today’s semiconductor news was marked by alliances and technology acquisitions between giant companies for advanced AI infrastructure, including Samsung and NVIDIA’s joint research and development of ferroelectric NAND with an eye toward 1000-layer NAND and rumors of a BESI acquisition by Applied Materials and others, The competition for the next generation of manufacturing technology is intensifying. The establishment of an optical interconnect standardization body by AMD, NVIDIA, and others also symbolizes the expansion of the AI ecosystem. On the other hand, supply chain instability remains strong, with Intel’s CPU supply shortages, price hikes by Chinese foundries, and supply concerns over the situation in the Middle East, making for a day of mixed growth and supply challenges.


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TOC

Main News

  1. Samsung and NVIDIA Partner on Ferroelectric NAND R&D, Setting the Stage for the 1000-Layer Era
    Samsung Electronics and NVIDIA have formed a partnership in the research and development of ferroelectric NAND flash, a next-generation storage technology. This collaboration is an important step toward the future of 1000-layer NAND as memory stacking approaches its physical limits, and the two companies aim to establish innovative materials and architectures to meet the demand for high-speed processing and large-capacity storage of vast amounts of data in AI data centers and other applications.
  2. Semiconductor equipment giants Applied Materials and Lam Research reportedly interested in acquiring BESI
    The Netherlands-based BESI, a leader in advanced hybrid bonding technology, has reportedly expressed interest in being acquired by semiconductor equipment giants such as Applied Materials and Lam Research. The importance of advanced packaging technology for stacking different types of chips is rapidly growing in the manufacture of AI chips and next-generation memories, and the industry is increasingly restructuring to bring companies with core technologies into their camps.
  3. Intel’s CPU Supply Shortage Affects All Customers , Especially Severely Damaging Chromebooks
    Intel has reported severe tightness in its CPU supply, and the impact has been felt by all customers. This is particularly severely damaging to Chromebook manufacturing, which supports the low-cost education and other markets. Fluctuations in global semiconductor demand combined with production line constraints have caused significant disruption and need for review in shipment planning and manufacturer supply chain management across the PC market.
  4. China’s National Development and Reform Commission Warns of Spillover of Surging Memory Prices into Supply Chain
    China’s National Development and Reform Commission (NDRC) has warned that the sharp rise in memory prices, including DRAM and NAND, is beginning to adversely affect the entire broad electronics supply chain. ai demand. The sharp increase in demand for AI and the effect of production cuts on the supply side are driving up the cost of procuring memory components, putting pressure on the profits of smartphone, PC, and consumer electronics manufacturers, causing them to pass on prices to end products and delay production plans.
  5. Apple Introduces Low-Priced Mac Neo, Aims to Maintain Market Share with Competitive Pricing
    Apple plans to introduce a new notebook PC, the Mac Neo, at a low price point of 990,000 won, in order to expand and maintain its market share. With demand for high-priced devices coming to a head, this is a strategic product designed to cut costs by reducing basic performance. However, the company has indicated that it will be difficult to maintain its dominance as a major customer of TSMC’s leading-edge processes by simply increasing shipments.
  6. AMD, NVIDIA, and Six Other Major High-Tech Companies Establish Organization to Develop Optical Interconnect Specifications for AI
    Six major high-tech companies, including AMD, NVIDIA, Broadcom, Cisco, and Intel, have jointly established a new organization, OCI MSA, to standardize optical interconnect technology for AI infrastructure. As AI models grow in scale, there is an urgent need to eliminate bottlenecks and reduce power consumption in the transmission of vast amounts of data within data centers.
  7. Chinese Foundry Nexchip to Raise Wafer Manufacturing Prices by 10% Starting in June
    Nexchip, the third largest semiconductor foundry in China, has announced plans to raise its wafer manufacturing agency prices by 10% starting in June, following the lead of SMIC and Huahong Semiconductor. Tight production capacity for mature processes and recovering demand for CIS and other products are the reasons behind this move. The wave of price pass-through in China’s domestic foundry market is also having an impact on the global semiconductor component cost structure.
  8. Middle East Confusion Hits Exports of South Korean SMEs, Rekindling Concerns about Chip Supply
    The escalating conflict in the Middle East over Iran and Israel is severely disrupting export operations at South Korean SMEs. Soaring logistics costs and transportation route restrictions caused by high oil prices are becoming more serious, and concerns over the stable procurement of chemical materials and components needed for semiconductor manufacturing are once again on the rise. Geopolitical risks are causing physical fragmentation of the supply chain, posing unpredictable supply risks to the entire high-tech industry.
  9. OpenAI’s CFO Visits Korea in Secret, Holds Strategic Meetings with SK Networks and Other Leaders
    The CFO of US-based OpenAI, a pioneer in generative AI, reportedly visited Korea in secret and met with the heads of leading Korean technology companies, including SK Networks and Upstage. It is believed that behind-the-scenes negotiations are underway for a strategic alliance for global AI dominance, including financing essential for the development and operation of a giant AI model, building AI infrastructure, and strengthening ties with the semiconductor ecosystem that Korean companies have.
  10. GlobalFoundries CEO’s Secret Visit to Taiwan Promotes Wafer Contract, Not UMC Acquisition
    It has been revealed that the CEO of GlobalFoundries made a secret visit to Taiwan. Initially, it was rumored that the visit was to negotiate the acquisition of competitor UMC, but in fact it was reportedly for the purpose of concluding a wafer manufacturing contract to supplement the company’s own production capacity. In order to diversify geopolitical risks and flexibly respond to diversifying customer needs, strategic collaboration among global foundries beyond competitive relationships is being sought.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Mar 13, 08:02アップルのMac Neoギャンビット:出荷台数だけではTSMCの王座を守れないApple’s Mac Neo gambit: when volume alone can’t hold the TSMC crownhttps://www.digitimes.com/news/a20260312VL221/apple-tsmc-google-macbook-cowos.html
Mar 13, 14:44テスラのAIチップ遅延により、韓国のNPUスタートアップDeepXの出発が6か月延期Tesla AI chip delay pushes South Korean NPU startup DeepX back six monthshttps://www.digitimes.com/news/a20260311VL207/tesla-deepx-samsung-ai-chip-startup.html
Mar 13, 11:49中東の混乱が韓国の中小企業輸出を混乱させ、チップ供給への懸念を煽るMiddle East turmoil disrupts South Korean SME exports, stokes chip supply concernshttps://www.digitimes.com/news/a20260313PD218/sme-exports-production-investment.html
Mar 13, 10:10独占:グローバルファウンダリーズCEOの秘密の台湾攻略-ウエハー取引で、UMCの買収ではないExclusive: Inside GlobalFoundries CEO’s stealth Taiwan blitz: wafer deals, not a UMC takeoverhttps://www.digitimes.com/news/a20260313PD211/globalfoundries-ceo-taiwan-acquisition-umc.html
Mar 13, 08:03月次チャート:メモリ急増とロジック低迷が台湾の2月を二極化させるMonthly Chart: memory surge vs logic slump creates polarized February in Taiwanhttps://www.digitimes.com/news/a20260312VL218/taiwan-monthly-tracker-asic-revenue-performance-2026.html
Mar 13, 15:03AI計算ブームが中国のx86チップ挑戦者を牽引する中、Hygonの収益が57%跳ね上がるHygon revenue jumps 57% as AI compute boom lifts China’s x86 chip contenderhttps://www.digitimes.com/news/a20260313VL210/china-genai-x86-revenue-demand.html
Mar 13, 15:01中国のNexchip、キャパシティ拡大とCIS成長を背景にウエハー価格の引き上げを示唆China’s Nexchip signals wafer price hikes amid capacity expansion and CIS growthhttps://www.digitimes.com/news/a20260313VL214/nexchip-wafer-cis-demand-market.html
Mar 13, 14:36ByteDanceの海外チップ戦略がワシントンを窮地に追い込むByteDance’s overseas chip play puts Washington in a bindhttps://www.digitimes.com/news/a20260313VL218/bytedance-ai-chip-technology-chips-nvidia.html
Mar 13, 14:16AIサーバートラッカー:テスト、設計サービス、レールキットにおける2月の収益ハイライトAI server tracker: February revenue highlights across testing, design services, and rail kitshttps://www.digitimes.com/news/a20260313VL209/ai-server-supply-chain-revenue-testing-design.html
Mar 13, 12:46MicroIPは欧州進出を狙い、Embedded World 2026で無人車両にスポットライトを当てるMicroIP eyes European expansion, spotlights unmanned vehicles at Embedded World 2026https://www.digitimes.com/news/a20260313PD221/microip-asic-europe-taiwan-2026.html
Mar 13, 12:32チップ材料価格が倍増、化合物半導体サプライチェーンが警戒状態Chip material prices double, compound semiconductor supply chain on alerthttps://www.digitimes.com/news/a20260313PD229/compound-semiconductor-chemical-materials-gallium-logistics-supply-chain.html
Mar 13, 12:16中国の国家発展改革委員会(NDRC)、メモリ価格急騰が電子機器サプライチェーンに広がると警告China’s NDRC warns memory price surge spreading across electronics supply chainhttps://www.digitimes.com/news/a20260310PD237/price-electronics-supply-chain-dram-2025.html
Mar 13, 11:39台湾のチップメーカー、Embedded World 2026でドローン市場を狙うTaiwanese chipmakers target drone market at Embedded World 2026https://www.digitimes.com/news/a20260313PD216/drone-taiwan-chipmakers-commercial-military-2026.html
Mar 13, 11:14独占:中東の紛争とAI需要がコスト圧力を引き起こし、サプライチェーンが調達リスクを顧客に転嫁Exclusive: Middle East conflict and AI demand drive cost pressures; supply chain shifts procurement risks to clientshttps://www.digitimes.com/news/a20260313PD219/supply-chain-cost-price-demand.html
Mar 13, 10:54T1200カーボンファイバーのアップグレードが航空宇宙、ロボティクス、先進製造業の賭け金を引き上げるT1200 carbon fiber upgrade raises stakes in aerospace, robotics, and advanced manufacturinghttps://www.digitimes.com/news/a20260313PD217/carbon-fiber-manufacturing-robotics-space-tech-materials.html
Mar 13, 10:30中国、T1200カーボンファイバーの量産化を主張し、半導体とロボティクスへの道を開くChina claims T1200 carbon fiber mass production, opening doors to semiconductors and roboticshttps://www.digitimes.com/news/a20260313PD212/carbon-fiber-equipment-production-robotics-materials.html
日経 Tech Foresight
2026-03-13NVIDIA「GTC」を先読み フィジカルAI続々、新半導体もhttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC1251M0S6A310C2000000
2026-03-13中国勢、2億画素の画像センサーでサムスンに対抗 ISSCChttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC123780S6A310C2000000
2026-03-13ラピダス、新参者の不利益補うAIツール 「3社が使用中」https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC1205X0S6A310C2000000
マイナビニュース テックプラス
2026-03-13半導体スタートアップのLENZO、三菱UFJキャピタルなどから5億円のシードラウンドを実施https://news.mynavi.jp/techplus/article/20260313-4215249/
2026-03-132025年のFPD市場は前年比2%増、スマホの減速をITと車載の伸びがカバー Counterpoint調べhttps://news.mynavi.jp/techplus/article/20260313-4215160/
2026-03-13AMDやNVIDIAなど6社、AIインフラ向け光インターコネクト仕様策定団体「OCI MSA」を設立https://news.mynavi.jp/techplus/article/20260313-4215017/
2026-03-13欧州NanoICプロジェクト、再配線層PDKとハイブリッドボンディングPDKをリリースhttps://news.mynavi.jp/techplus/article/20260313-4214171/
2026-03-13Infineon、コモンクライテリアEAL6+認証の耐量子暗号搭載車載セキュリティコントローラを発表https://news.mynavi.jp/techplus/article/20260313-4212152/
TrendForce
2026-03-13Intel、CPU供給不足が全顧客に影響 Chromebookは深刻なダメージIntel Reportedly Says CPU Supply Tightness Is Affecting All Customers; Chromebooks Hit Hardhttps://www.trendforce.com/news/2026/03/13/news-intel-reportedly-says-cpu-supply-tightness-is-affecting-all-customers-chromebooks-hit-hard/
2026-03-13ハイブリッドボンディング業界のリーダーBESI、買収関心を集める Lam社やApplied Materialsも噂にHybrid Bonding Leader BESI Reportedly Draws Takeover Interest; Lam, Applied Materials Rumoredhttps://www.trendforce.com/news/2026/03/13/news-hybrid-bonding-leader-besi-reportedly-draws-takeover-interest-lam-applied-materials-rumored/
2026-03-13中国第3位のファウンドリNexchip、SMICや華虹に続き6月から価格を10%引き上げるChina’s No.3 Foundry Nexchip to Hike Prices 10% from June, Following SMIC, Hua Honghttps://www.trendforce.com/news/2026/03/13/news-chinas-no-3-foundry-nexchip-to-hike-prices-10-from-june-following-smic-as-mature-node-supply-tightens/
2026-03-13SamsungとNVIDIAが強誘電体NANDの研究開発で提携、1000層NANDへの重要な一歩Samsung and NVIDIA Team Up on Ferroelectric NAND R&D, Key Step Toward 1000-Layer NANDhttps://www.trendforce.com/news/2026/03/13/news-samsung-and-nvidia-team-up-on-ferroelectric-nand-rd-key-step-toward-1000-layer-nand/
2026-03-13Samsungが幹部にエコノミークラス利用を求めると報じられる 一方、モバイル部門はメモリコスト増で過去最悪の第1四半期リスクに直面Samsung Reportedly Asks Execs to Fly Economy as Mobile Risks Worst-Ever Q1 on Memory Costshttps://www.trendforce.com/news/2026/03/13/news-samsung-reportedly-asks-execs-to-fly-economy-as-mobile-risks-worst-ever-q1-on-memory-costs/
Semiconductor Digest
34 minutes agoAxcelis、CFO交代を発表Axcelis Announces CFO Transitionhttps://www.semiconductor-digest.com/axcelis-announces-cfo-transition/
42 minutes ago新たなツールと技術が次世代パワー半導体としての酸化ガリウムの活用を加速New Tools and Techniques Accelerate Gallium Oxide as Next-Generation Power Semiconductorhttps://www.semiconductor-digest.com/new-tools-and-techniques-accelerate-gallium-oxide-as-next-generation-power-semiconductor/
2 hours agoAvicena、世界初のmicroLED光インターコネクト評価キットを発表Avicena Launches the World’s First microLED Optical Interconnect Evaluation Kithttps://www.semiconductor-digest.com/avicena-launches-the-worlds-first-microled-optical-interconnect-evaluation-kit/
2 hours agoSalience LabsとKeysight、初の光回路スイッチテスト環境の開発で協力Salience Labs and Keysight Collaborate to Develop First Optical Circuit Switch Testing Environmenthttps://www.semiconductor-digest.com/salience-labs-and-keysight-collaborate-to-develop-first-optical-circuit-switch-testing-environment/
3 hours agoQnity、国内製造拠点を拡大Qnity Expands Domestic Manufacturing Footprinthttps://www.semiconductor-digest.com/qnity-expands-domestic-manufacturing-footprint/
日本経済新聞
2026-03-14米国株、ダウ続落し119ドル安 中東警戒で原油高止まり ナスダックも続落https://www.nikkei.com/article/DGXZQOFL13CBU0T10C26A3000000/
2026-03-14NYダウ、続落し119ドル安 原油高止まりでリスク回避https://www.nikkei.com/article/DGXZQOFL1400U0U6A310C2000000/
2026-03-14米国株、ダウ続落 原油高止まりでリスク回避https://www.nikkei.com/article/DGXZQOFL13BOZ0T10C26A3000000/
2026-03-143月9〜13日 スタートアップ資金調達まとめ読みhttps://www.nikkei.com/article/DGXZQOUC129680S6A310C2000000/
2026-03-14富士フイルムHD後藤社長に聞く「何度でも危機乗り越えるDNA残す」https://www.nikkei.com/article/DGXZQOUC127WM0S6A310C2000000/
2026-03-14PayPay東証素通り、SBGにアームの成功体験 米国でデカコーンhttps://www.nikkei.com/article/DGXZQOUB115580R10C26A3000000/
2026-03-14イラン、GoogleやNVIDIAなど米7社「標的」 AI・クラウドにリスクhttps://www.nikkei.com/article/DGXZQOUC12CHH0S6A310C2000000/
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2026-03-14台湾IT19社、2月は12.5%増収 春節で稼働日減もAI向け堅調https://www.nikkei.com/article/DGXZQOGM10AXB0Q6A310C2000000/
2026-03-14三菱ケミカルG「化学事業でコア営業利益1000億円」 構造改革は一巡https://www.nikkei.com/article/DGXZQOUB049EI0U6A300C2000000/
ダイヤモンドオンライン
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Mar 12 23:00高額インセンティブがむしろ組織を弱くする…業績不振のサムスンが苦しむ成果主義の弊害https://diamond.jp/articles/-/384237
Mar 12 19:15原油急騰・財政拡張で世界の「インフレ基調」今後3年続く!?インフレ予測を複雑化するAI実装のデフレ要因https://diamond.jp/articles/-/385762
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Tom’s Hardware
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TechPowerup
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EETimes Taiwan
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2026-03-13Physical AIの展開:ADIがエッジAIの自律決定を推進する佈局Physical AI ADI推動邊緣AI走向自主決策https://www.eettaiwan.com/20260313nt22-adi-accelerates-autonomous-edge-ai-with-physical-ai/
2026-03-12アメリカに依存せず、ヨーロッパがデータ主権の掌握を目指す並非依賴美國 歐洲力求掌控資料主權https://www.eettaiwan.com/20260312nt61-true-data-sovereignty-requires-control-not-dependence-on-the-us/
2026-03-12GaN-on-Si RFトランジスタ技術が6G用パワーアンプの応用に道を開くGaN-on-Si RF電晶體技術為6G PA應用鋪路https://www.eettaiwan.com/20260312ta51-an-alternative-gan-on-si-rf-transistor-technology-for-6g-power-amplifiers/
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EETimes Asia
2026-03-13AW 2026で具現化AIが主役に:ラボから実用システムへ進出するヒューマノイドロボットEmbodied AI Takes Center Stage at AW 2026: Humanoid Robots Moving from Labs to Real-world Systemshttps://www.eetasia.com/embodied-ai-takes-center-stage-at-aw-2026-humanoid-robots-moving-from-labs-to-real-world-systems/
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2026-03-12InfineonとUMC、サプライチェーンの排出削減促進に向けて提携Infineon and UMC Partner to Promote Supply Chain Emissions Reductionshttps://www.eetasia.com/infineon-and-umc-partner-to-promote-supply-chain-emissions-reductions/
2026-03-12MacDermid Alpha、productronica China 2026で統合材料プラットフォームを展示MacDermid Alpha to Showcase Integrated Materials Platform at productronica China 2026https://www.eetasia.com/macdermid-alpha-to-showcase-integrated-materials-platform-at-productronica-china-2026/
2026-03-12Wolfspeedの300mm SiCプラットフォームが次世代AIおよびHPCパッケージングソリューションを実現Wolfspeed 300mm SiC Platform to Enable Next‑Gen AI and HPC Packaging Solutionshttps://www.eetasia.com/wolfspeed-300mm-sic-platform-to-enable-next%e2%80%91gen-ai-and-hpc-packaging-solutions/
2026-03-12規律ある供給戦略により、DRAMおよびHBM市場が引き締まるDisciplined Supply Strategy Keeps DRAM and HBM Markets Tighthttps://www.eetasia.com/disciplined-supply-strategy-keeps-dram-and-hbm-markets-tight/
EETimes India
ZDNET Korea
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2026-03-13[単独] オープンAI CFO、内密に韓国を訪問…SKネットワークス・アップステージのトップと一堂に会した理由は[단독] 오픈AI CFO, 남몰래 방한…SK네트웍스·업스테이지 수장과 한 자리서 만난 이유는https://www.zdnet.co.kr/20260313172722%22%20title=%22
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中央日報
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