Today’s semiconductor news is a vivid mix of strong growth from the accelerating AI shift and the fragility of supply chains brought about by geopolitical risks such as the situation in the Middle East As global semiconductor sales grew 3.7% in January and the market size expanded, giant tech companies like NVIDIA, Meta, and AMD are working on next-generation AI chips and the battle for market share is intensifying. Meanwhile, the hit to the supply chain has been severe, as indicated by the helium supply outage in Qatar, with prices jumping several fold due to tight memory supplies and major semiconductor manufacturers such as NXP announcing massive, simultaneous price hikes starting in April. The entire industry is teetering between intense cost increases and innovative technological development.
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Main News
- Helium Supply Outage Caused by Tensions in the Middle East Hurts Supply Chain
The effects of the Middle East conflict have rocked energy markets, and the supply risk of helium, which is essential for semiconductor manufacturing, is rapidly emerging. A helium supply shutdown in Qatar has led to a two-week restriction on the global chip supply chain, dealing a major blow to South Korean semiconductor manufacturers and others. The business environment for IC distributors is becoming increasingly severe due to the combination of disruptions in logistics networks and raw material shortages. - NXP, TI, and other semiconductor giants all plan to raise prices starting in April
A new round of price hikes is brewing in the semiconductor industry, with NXP Semiconductors reportedly set to raise prices starting April 1, and Texas Instruments (TI) and Infineon Technologies and other major companies are also planning to adjust their prices simultaneously. The wave of cost increases is spreading throughout component makers and is significantly pushing up the cost of manufacturing electronics products. - Meta Announces Four New MTIA Chips Designed Specifically for AI Inference
Meta has announced four new MTIA chips designed specifically for AI inference to enhance its AI infrastructure. anticipating a severe memory shortage expected in 2027, the company plans to release new products at six-month intervals. The company plans to release new products at six-month intervals. By accelerating the development of custom AI chips for its own use, the company aims to build an efficient computing infrastructure. - IBM and Lam Research Collaborate on Sub-1nm Logic Technology Development
IBM and Lam Research, a leading semiconductor manufacturing equipment company, announced a strategic collaboration to promote scaling of logic semiconductors below 1nm. The two companies will work together to develop materials and manufacturing processes utilizing next-generation High-NA EUV technology. This will be an important partnership to achieve further scaling and higher performance in the field of semiconductor manufacturing, which is approaching its physical limits. - Samsung Wins DRAM Supply for Foldable iPhone, Doubles Price
Samsung has reportedly won a contract to supply DRAM for Apple’s foldable iPhone. The price of the supplied 12GB LPDDR5X memory is reportedly double the previous price, symbolizing a wave of intense price hikes in the mobile memory market. The combination of increased demand for high-performance folderable devices and memory shortages is rapidly increasing the cost burden of component procurement. - NVIDIA Further Expands GPU Market Share Despite Rising Costs
NVIDIA is further expanding its dominant share of the GPU market with an increase in add-in board (AIB) shipments despite an environment of rising component procurement costs. New announcements regarding next-generation AI semiconductors and physical AI are expected at the company’s upcoming developer conference, GTC, and the entire industry is watching NVIDIA’s dominance of the AI chip market. - AMD CEO Lisa Su to Visit Korea for Talks with Samsung and Naver
AMD CEO Lisa Su is reportedly planning to visit Korea during NVIDIA’s GTC to hold talks with Samsung Electronics and Naver.As competition in the AI semiconductor market As competition in the AI semiconductor market intensifies, AMD is likely aiming to strengthen cooperation with South Korean tech giants for stable supply and technology development of next-generation AI chips, and to establish a strategic encirclement to counter NVIDIA’s solo drive. - Tight supply and prolonged price spikes in the DRAM and HBM markets
The DRAM and HBM markets continue to be severely tight as memory manufacturers pursue elaborate supply strategies focused on profitability. Some retailers have seen DDR5 memory prices jump fourfold, and some have refused to accept replacements. Hua Shuo’s co-CEOs also predict that memory shortages will continue for the next two years, and soaring memory prices, driven by AI demand, are weighing on the industry as a whole. - TSMC is developing PDK, design information, to take the lead in optoelectronic fusion technology
TSMC, the world’s largest semiconductor foundry, has begun full-scale development of PDK, fundamental information essential for chip design, to take the lead in the field of optoelectronic fusion, a next-generation technology that combines electronic and optical circuits. TSMC is rapidly building a development ecosystem for the commercialization of silicon photonics technology, which is expected to be the trump card for solving the increasing power consumption associated with massive data processing. - Global Semiconductor Sales Increase 3.7% Monthly in January, Continuing Market Growth Trend
Global semiconductor sales increased 3.7% month-over-month in January 2026, confirming a strong recovery and growth in the semiconductor market. Executives at ASE, one of the world’s leading packaging companies, noted trends in global semiconductor production value surpassing $1 trillion, with AI and growing hardware demand driving the industry. The global semiconductor industry is showing that it is firmly on track for a new super cycle
News List
| 投稿日 | 日本語タイトル | 原語タイトル | 記事URL |
|---|---|---|---|
| DIGITIMES | |||
| Mar 12, 16:11 | 中東紛争がエネルギー市場を揺るがし、IC流通業者に打撃を与える | Middle East conflict rattles energy markets, squeezes IC distributors | https://www.digitimes.com/news/a20260312PD209/ic-taiwan-inflation-financing-war.html |
| Mar 12, 16:18 | コスト上昇にもかかわらずAIB出荷が増加し、NvidiaがGPU市場でのシェアを拡大する | Nvidia expands GPU market share as AIB shipments rise despite increased costs | https://www.digitimes.com/news/a20260310VL205/nvidia-gpu-shipments-market-market-share.html |
| Mar 12, 16:10 | 中東紛争が韓国の半導体メーカーに対するヘリウム供給リスクを高める | Middle East conflict raises helium supply risks for South Korean chipmakers | https://www.digitimes.com/news/a20260312PD218/samsung-chipmakers-sk-hynix-qatar-production.html |
| Mar 12, 15:00 | Samsungが折りたたみ式iPhone向けDRAM供給契約を獲得、12GB LPDDR5Xの価格は倍増したと報じられる | Samsung reportedly wins foldable iPhone DRAM supply deal; 12GB LPDDR5X prices double | https://www.digitimes.com/news/a20260312PD228/samsung-dram-foldable-iphone-apple.html |
| Mar 12, 11:55 | アナリストによると、インドの2026年に向けた半導体増産は世界のウェーハ供給に大きな影響を与えない見込みだ | India’s 2026 semiconductor ramp unlikely to move global wafer supply needle, analysts say | https://www.digitimes.com/news/a20260312VL210.html |
| Mar 12, 16:37 | UMCとHyperLightがAIデータセンター向けのTFLNフォトニクスチップレットを量産へ | UMC, HyperLight to mass-produce TFLN photonics chiplets for AI data centers | https://www.digitimes.com/news/a20260312VL208/umc-photonics-data-startup-transmission.html |
| Mar 12, 16:20 | SemcoがSamsungファウンドリを通じてTesla向けAIチップのABF基板を供給すると見られている | Semco seen supplying ABF substrates for Tesla AI chips via Samsung foundry | https://www.digitimes.com/news/a20260312PD229/semco-tesla-chips-samsung-production.html |
| Mar 12, 16:11 | ArdentecがASICウェーハ試験の協業を開始、新たなLongtan生産能力は2026年下半期に稼働予定 | Ardentec launches ASIC wafer test collaboration; new Longtan capacity to be ready by 2H26 | https://www.digitimes.com/news/a20260310PD228/ardentec-capacity-testing-wafer-demand.html |
| Mar 12, 14:36 | Asia Opticalが技術強化を背景に2025年の利益成長を大きく伸ばす | Asia Optical posts strong 2025 profit growth led by tech upgrades | https://www.digitimes.com/news/a20260312PD219/asia-optical-2025-growth-profit-revenue.html |
| Mar 12, 12:49 | AMD CEOのLisa SuがNvidia GTC期間中にSamsungおよびNaverとの協議のため韓国訪問を計画していると報じられる | AMD CEO Lisa Su reportedly plans South Korea trip for Samsung, Naver talks during Nvidia GTC | https://www.digitimes.com/news/a20260312PD220/amd-lisa-su-naver-samsung.html |
| Mar 12, 12:17 | IBMとLam Researchが1nm未満のロジックおよびHigh-NA EUV技術の開発で協力体制を組む | IBM, Lam Research join forces on sub-1nm logic and High-NA EUV development | https://www.digitimes.com/news/a20260312VL212/ibm-lam-research-high-na-euv-materials-manufacturing.html |
| Mar 12, 11:22 | ASEのTien Wu氏:米国の半導体競争が激化する中、台湾はハードウェアの強みを活かす | ASE’s Tien Wu: Taiwan leverages hardware strength as US chip rivalry intensifies | https://www.digitimes.com/news/a20260312PD212/ase-ai-hardware-software-taiwan.html |
| Mar 12, 10:52 | ASEのTien Wu博士が、世界の半導体生産額が1兆ドルを超える中での3つの重要なトレンドを語る | ASE’s Dr. Tien Wu shares three key trends as global semiconductor output to surpass US$1 trillion | https://www.digitimes.com/news/a20260312PD213/semiconductor-industry-ase-trends-taiwan-hardware.html |
| Mar 12, 10:20 | MediaTekがハイエンドIoT向けの需要に対応するため、需要の限定を認めつつTSMCの3nm Genio Proに賭ける | MediaTek bets on TSMC 3nm Genio Pro to serve high-end IoT needs while acknowledging limited demand | https://www.digitimes.com/news/a20260312PD210/mediatek-iot-3nm-tsmc-2026.html |
| Mar 12, 10:17 | SMICがメモリおよびBCDチップの供給逼迫を示唆 | SMIC flags supply squeeze in memory, BCD chips | https://www.digitimes.com/news/a20260312VL205/smic-chips-demand-capacity-electronics.html |
| Mar 12, 09:45 | 市場が緩和の可能性を見込む中、米伊対立は短期的な衝撃と見られている | US-Iran clash seen as short-term shock as markets look toward possible de-escalation | https://www.digitimes.com/news/a20260312PD201/middle-east-military-nuclear-shipping.html |
| 日経 Tech Foresight | |||
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| 2026-03-12 | 【特許】徳蘭明海、太陽光発電の故障検出を低コストに | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC0239Y0S6A300C2000000 | |
| 2026-03-12 | TSMC、光電融合の主導権へ一手 設計情報「PDK」整備 | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC112U30R10C26A3000000 | |
| マイナビニュース テックプラス | |||
| 2026-03-13 | Infineon、コモンクライテリアEAL6+認証の耐量子暗号搭載車載セキュリティコントローラを発表 | https://news.mynavi.jp/techplus/article/20260313-4212152/ | |
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| 2026-03-12 | Infineon、自動車向けソフトバンドル「DRIVECORE」に3つのバンドルを追加 | https://news.mynavi.jp/techplus/article/20260312-4212100/ | |
| 2026-03-12 | 2025年第4四半期のファウンドリトップ10売上高は前四半期比2.6%増、AI需要がけん引 TrendForce調べ | https://news.mynavi.jp/techplus/article/20260312-4212031/ | |
| 2026-03-12 | 東広島市中心部にマイクロンが新オフィスを開設、イノベーション創出能力を加速 | https://news.mynavi.jp/techplus/article/20260312-4211855/ | |
| 2026-03-12 | ローム、スマートリングなど向けに超小型ワイヤレス給電チップセットを開発 | https://news.mynavi.jp/techplus/article/20260312-4211822/ | |
| 2026-03-12 | TI、NPUを搭載した2種類のエッジAI対応Armマイコンファミリを発表 | https://news.mynavi.jp/techplus/article/20260312-4211770/ | |
| 2026-03-12 | エプソンとManz Asia、インクジェットによる半導体製造プロセス革新へ協業 | https://news.mynavi.jp/techplus/article/20260312-4211549/ | |
| 2026-03-12 | TSMCの20026年2月売上高は前年同月比22%増で2月としての過去最高を更新 | https://news.mynavi.jp/techplus/article/20260312-4211443/ | |
| 2026-03-12 | 京大KUIASと旭化成エレクトロニクス、2μm帯赤外線フォトニック結晶レーザーの発振に成功 | https://news.mynavi.jp/techplus/article/20260312-4211306/ | |
| 2026-03-12 | NXP、NPUとトライラジオ無線を統合したアプリケーション・プロセッサ「i.MX 93W」を発表 | https://news.mynavi.jp/techplus/article/20260312-4211156/ | |
| 2026-03-12 | Intel、デスクトップPC向けプロセッサ「Core Ultra 200S Plus」を発表 | https://news.mynavi.jp/techplus/article/20260312-4211061/ | |
| 2026-03-12 | 三菱電機がエレファンテックに40億円を出資、プリント基板分野で協業 | https://news.mynavi.jp/techplus/article/20260312-4210984/ | |
| 2026-03-12 | 世界に評価されるフォトマスク測定装置は、こうして生まれた─妥協なき技術で進化を止めないDR-8000の開発物語 | https://news.mynavi.jp/techplus/kikaku/20260312-4200139/ | |
| 2026-03-12 | ルネサスが電子機器開発プラットフォーム「Renesas 365」を一般提供、第一弾としてRAマイコンが対応 | https://news.mynavi.jp/techplus/article/20260312-4208618/ | |
| 2026-03-12 | JX金属、ひたちなか新工場の半導体用スパッタリングターゲット増産に向けた投資を決定 | https://news.mynavi.jp/techplus/article/20260312-4208541/ | |
| 2026-03-12 | 吉川明日論の半導体放談 第365回 米国防総省への協力を拒否したAnthropicのCEO、ダリオ・アモディの矜持 | https://news.mynavi.jp/techplus/article/semicon-365/ | |
| 2026-03-12 | ST、第2世代MasterGaNハーフブリッジファミリ「MasterGaN6」を発表 | https://news.mynavi.jp/techplus/article/20260312-4208644/ | |
| 2026-03-12 | PFNとGMOグループ、国産AI半導体と生成AIのセキュリティを支える合弁会社を設立 | https://news.mynavi.jp/techplus/article/20260312-4208510/ | |
| TrendForce | |||
| 2026-03-12 | インド、スマートフォン輸出奨励策を検討―AppleはそこでiPhoneの25%を製造すると報じられる | India Reportedly Eyes Smartphone Export Incentives as Apple Said to Make 25% of iPhones There | https://www.trendforce.com/news/2026/03/12/news-india-reportedly-plans-new-smartphone-export-incentives-as-apple-said-to-make-a-quarter-of-iphones-there/ |
| 2026-03-12 | 急騰するTPU需要を背景に、2025年にGoogleがSamsungの主要クライアント上位5社に初めて名を連ねる | Google Makes First Appearance in Samsung’s Top Five Clients in 2025 amid Soaring TPU Demand | https://www.trendforce.com/news/2026/03/12/news-google-makes-first-appearance-in-samsungs-top-five-clients-in-2025-amid-soaring-tpu-demand/ |
| 2026-03-12 | チップ価格上昇の波:NXPが4月1日の値上げを実施、Texas InstrumentsおよびInfineonも価格を引き上げると報じられる | Chip Price Hike Wave: NXP Reportedly Sets Apr. 1 Increase as Texas Instruments, Infineon Also Raise Prices | https://www.trendforce.com/news/2026/03/12/news-chip-price-hike-wave-nxp-reportedly-sets-apr-1-increase-as-texas-instruments-infineon-also-raise-prices/ |
| 2026-03-12 | UMCとHyperLightが提携し、TFLNチップレットを大量生産、1.6Tのデータセンター帯域幅を狙う | UMC, HyperLight Team up to Mass-Produce TFLN Chiplets, Targeting 1.6T Data Center Bandwidth | https://www.trendforce.com/news/2026/03/12/news-umc-hyperlight-team-up-to-mass-produce-tfln-chiplets-targeting-1-6t-data-center-bandwidth/ |
| 2026-03-12 | Metaの自社AIチップ開発:2027年のメモリ不足を見据え、4つの新アクセラレーターが準備に入る | Meta’s In-House AI Chip Push: Four New Accelerators Gear Up Amid Memory Crunch by 2027 | https://www.trendforce.com/news/2026/03/12/news-metas-in-house-ai-chip-push-four-new-accelerators-gear-up-amid-memory-crunch-by-2027/ |
| Semiconductor Digest | |||
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| 日本経済新聞 | |||
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| 2026-03-13 | ドイツ株12日 続落、原油高が重荷 仏株も下落 | https://www.nikkei.com/article/DGXZQOFL12CEK0S6A310C2000000/ | |
| ダイヤモンドオンライン | |||
| Mar 12 19:15 | 原油急騰・財政拡張で世界の「インフレ基調」今後3年続く!?インフレ予測を複雑化するAI実装のデフレ要因 | https://diamond.jp/articles/-/385762 | |
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| Tom’s Hardware | |||
| 2026-03-12 21:58 | イランのハッキンググループが医療技術企業Strykerに対する攻撃を仕掛けたと主張 | Iran hacking group claims attack on med-tech company Stryker | https://www.tomshardware.com/tech-industry/cyber-security/iran-hacking-group-claims-attack-on-med-tech-company-stryker-says-over-200-000-devices-have-been-wiped-clean-and-over-50tb-of-data-extracted |
| 2026-03-12 19:53 | カタールでのヘリウム供給停止により、チップ供給チェーンは2週間の制約を受ける | Qatar helium shutdown puts chip supply chain on a two-week clock | https://www.tomshardware.com/tech-industry/qatar-helium-shutdown-puts-chip-supply-chain-on-a-two-week-clock |
| 2026-03-12 19:20 | MetaがAI推論向けに設計された新型MTIAチップ4種を発表 ― 6ヶ月間隔でのリリースが予定される | Meta reveals four new MTIA chips built for AI inference – to be released on a six-month cadence | https://www.tomshardware.com/tech-industry/semiconductors/meta-reveals-four-new-mtia-chips-built-for-ai-inference |
| 2026-03-12 19:00 | 小売業者、DDR5価格の4倍増加を理由にメモリ交換を否定 ― 価格上昇は顧客にとって『アップグレード』に相当すると主張 | Retailer denies memory replacement due to 4x increase in DDR5 pricing, says price increase would equate to an ‘upgrade’ for the customer | https://www.tomshardware.com/pc-components/ddr5/retailer-denies-memory-return-due-to-4x-increase-in-ddr5-pricing-says-price-increase-would-mean-an-upgrade-for-the-customer-australian-retailer-refuses-to-replace-faulty-corsair-kit |
| TechPowerup | |||
| 2026-03-12T21:27:18+00:00 | 中国のノートパソコンメーカーChuwiがAMD Ryzen 5 7430U SoCを宣伝したにも関わらず、実際には旧型のRyzen 5 5500Uを出荷 | Chinese Laptop Maker Chuwi Advertised AMD Ryzen 5 7430U SoC, but Shipped the Older Ryzen 5 5500U | https://www.techpowerup.com/347336/chinese-laptop-maker-chuwi-advertised-amd-ryzen-5-7430u-soc-but-shipped-the-older-ryzen-5-5500u |
| 2026-03-12T19:40:42+00:00 | AIインフラ向けのオープン仕様を策定するために、光学スケールアップコンソーシアムが設立された | Optical Scale-up Consortium Established to Create an Open Specification for AI Infrastructure | https://www.techpowerup.com/347335/optical-scale-up-consortium-established-to-create-an-open-specification-for-ai-infrastructure |
| 2026-03-12T19:32:45+00:00 | Microsoft 365の支払いをやめよう――最新のOfficeが140ドルで手に入る | Stop Paying for Microsoft 365—The Newest Office is $140 | https://www.techpowerup.com/347296/stop-paying-for-microsoft-365-the-newest-office-is-usd-140 |
| 2026-03-12T19:24:47+00:00 | 中国のLisuan LX 7G106 GPUが6月18日に登場、主要なAAAゲームにも対応 | Chinese Lisuan LX 7G106 GPU Arrives June 18 with Support for Major AAA Games | https://www.techpowerup.com/347334/chinese-lisuan-lx-7g106-gpu-arrives-june-18-with-support-for-major-aaa-games |
| 2026-03-12T18:59:21+00:00 | ジョン・カーペンター監督の『トキシック・コマンド』が本日発売 | John Carpenter’s Toxic Commando is Out Now | https://www.techpowerup.com/347333/john-carpenters-toxic-commando-is-out-now |
| 2026-03-12T17:13:01+00:00 | Jeff KaplanのKintsugiyamaが、『The Legend of California』と題した、スキルベースのオープンワールドFPS(オンラインマルチプレイヤー対応)を発表 | Jeff Kaplan’s Kintsugiyama Announces “The Legend of California” Skills-Based Open World FPS With Online Multiplayer | https://www.techpowerup.com/347331/jeff-kaplans-kintsugiyama-announces-the-legend-of-california-skills-based-open-world-fps-with-online-multiplayer |
| 2026-03-12T16:55:38+00:00 | Unity、正式にSteam、SteamOS、Linuxサポートを獲得 | Unity Officially Gets Steam, SteamOS, and Linux Support | https://www.techpowerup.com/347332/unity-officially-gets-steam-steamos-and-linux-support |
| 2026-03-12T16:28:42+00:00 | GoDeal24:国際女性デー記念ソフトウェアセール―必要なソフトが衝撃の価格で手に入る! | GoDeal24 Women’s Day Software Sale: Get the Software You Need at Jaw-Dropping Prices! | https://www.techpowerup.com/347142/godeal24-womens-day-software-sale-get-the-software-you-need-at-jaw-dropping-prices |
| 2026-03-12T16:01:46+00:00 | Metaが高性能推論に特化した4つのMTIAチップを発表 | Meta Unveils Four MTIA Chips Focused on High-Perfomance Inference | https://www.techpowerup.com/347328/meta-unveils-four-mtia-chips-focused-on-high-perfomance-inference |
| 2026-03-12T16:01:11+00:00 | SamaがV62カーブド・パノラマ・ガラスPCケースシリーズを発表 | Sama Introduces V62 Curved Panoramic Glass PC Case Series | https://www.techpowerup.com/347329/sama-introduces-v62-curved-panoramic-glass-pc-case-series |
| 2026-03-12T15:43:15+00:00 | SamsungがHBM4Eベースダイにおいて2nmプロセスを採用する模様 | Samsung Reportedly to Use 2 nm Process on HBM4E Base Die | https://www.techpowerup.com/347327/samsung-reportedly-to-use-2-nm-process-on-hbm4e-base-die |
| EETimes Taiwan | |||
| 2026-03-12 | アメリカに依存せず、ヨーロッパはデータ主権の掌握を目指す | 並非依賴美國 歐洲力求掌控資料主權 | https://www.eettaiwan.com/20260312nt61-true-data-sovereignty-requires-control-not-dependence-on-the-us/ |
| 2026-03-12 | 6Gパワーアンプ向けに、GaN-on-Si RFトランジスタ技術が応用の道を切り開く | GaN-on-Si RF電晶體技術為6G PA應用鋪路 | https://www.eettaiwan.com/20260312ta51-an-alternative-gan-on-si-rf-transistor-technology-for-6g-power-amplifiers/ |
| 2026-03-12 | 高機能化の傾向が収益成長を支える 2026年のスマートフォンSoC出荷量は前年比で7%減少の恐れがある | 高階化趨勢支撐營收成長 2026年智慧型手機SoC出貨量恐年減7% | https://www.eettaiwan.com/20260312nt21-2026-smartphone-soc-shipments/ |
| 2026-03-11 | 人型ロボットが実験室を飛び出す AW 2026が具現的知能技術の道筋を示す | 人形機器人走出實驗室 AW 2026透視具身智慧技術路徑 | https://www.eettaiwan.com/20260311nt11-aw2026-humanoid-robots-exit-the-lab/ |
| 2026-03-11 | エネルギー効率の問題がAI開発の足かせに 応材は材料科学で対症療法に取り組む | 能效成AI發展瓶頸 應材由材料科學「對症下藥」 | https://www.eettaiwan.com/20260311nt11-solve-bottlenecks-in-ai-development/ |
| 2026-03-11 | 世界のスマートフォンの平均販売価格が四半期で初めて400ドルを超える | 全球智慧型手機平均售價單季首度突破400美元 | https://www.eettaiwan.com/20260311nt21-global-smartphone-asp/ |
| EETimes Asia | |||
| 2026-03-12 | Digilent、高速・大帯域幅MSOを発売開始 | Digilent to Launch High-speed, High-bandwidth MSOs | https://www.eetasia.com/digilent-to-launch-high-speed-high-bandwidth-msos/ |
| 2026-03-12 | 2025年、世界のスマートフォン生産は前年比2.5%増加 | Global Smartphone Production Up 2.5% YoY in 2025 | https://www.eetasia.com/global-smartphone-production-up-2-5-yoy-in-2025/ |
| 2026-03-12 | InfineonとUMCがサプライチェーンにおける排出削減を促進するために提携 | Infineon and UMC Partner to Promote Supply Chain Emissions Reductions | https://www.eetasia.com/infineon-and-umc-partner-to-promote-supply-chain-emissions-reductions/ |
| 2026-03-12 | MacDermid Alpha、2026年中国のプロダクトロニカにて統合材料プラットフォームを展示 | MacDermid Alpha to Showcase Integrated Materials Platform at productronica China 2026 | https://www.eetasia.com/macdermid-alpha-to-showcase-integrated-materials-platform-at-productronica-china-2026/ |
| 2026-03-12 | Wolfspeedの300mm SiCプラットフォーム、次世代AIおよび高性能計算パッケージングソリューションを実現 | Wolfspeed 300mm SiC Platform to Enable Next‑Gen AI and HPC Packaging Solutions | https://www.eetasia.com/wolfspeed-300mm-sic-platform-to-enable-next%e2%80%91gen-ai-and-hpc-packaging-solutions/ |
| 2026-03-12 | 緻密な供給戦略によりDRAMおよびHBM市場が逼迫状態に | Disciplined Supply Strategy Keeps DRAM and HBM Markets Tight | https://www.eetasia.com/disciplined-supply-strategy-keeps-dram-and-hbm-markets-tight/ |
| 2026-03-11 | TI、MCUポートフォリオとソフトウェアエコシステムを強化してあらゆるデバイスでエッジAIを実現 | TI Strengthens MCU Portfolio, Software Ecosystem to Enable Edge AI in Every Device | https://www.eetasia.com/ti-strengthens-mcu-portfolio-software-ecosystem-to-enable-edge-ai-in-every-device/ |
| 2026-03-11 | IBMとLam Research、サブ1nmロジックスケーリングの進展に向け協力 | IBM and Lam Research Collaborating to Advance Sub-1nm Logic Scaling | https://www.eetasia.com/ibm-and-lam-research-collaborating-to-advance-sub-1nm-logic-scaling/ |
| 2026-03-11 | メモリアロケーション危機:AI時代の隠れたインフラボトルネック | Memory Allocation Crisis: The Hidden Infrastructure Bottleneck in the AI Era | https://www.eetasia.com/memory-allocation-crisis-the-hidden-infrastructure-bottleneck-in-the-ai-era/ |
| EETimes India | |||
| 2026-03-11 | ノルディック社、MWC 2026で最新のセルラーIoTソリューションを発表 | Nordic Launches Latest Cellular IoT Solutions at MWC 2026 | https://www.eetindia.co.in/nordic-launches-latest-cellular-iot-solutions-at-mwc-2026/ |
| 2026-03-11 | インドTWS市場、第4四半期は12%成長したものの、2025年は横ばい | India TWS Market Remains Flat in 2025 Despite 12% Growth in 4Q | https://www.eetindia.co.in/india-tws-market-remains-flat-in-2025-despite-12-growth-in-4q/ |
| 2026-03-11 | インド、電気自動車向けに国産30kW WBGベース統合駆動システムを発表 | India Launches Indigenous 30kW WBG-based Integrated Drive System for Electric Vehicles | https://www.eetindia.co.in/india-launches-indigenous-30kw-wbg-based-integrated-drive-system-for-electric-vehicles/ |
| ZDNET Korea | |||
| ヌリフレックス・ベトナム、ナイキ供給会社 チャンシンとの屋根型太陽光パイロット事業契約 | |||
| 東西発電、長寿郡・郡議会と『新規揚水発電所誘致』業務協定 | |||
| 南部発電、フュリオサAIと国産AI半導体エコシステム構築で協力 | |||
| SR、SRTユニフォームを着た『タントゥンベア』グッズ発売 | |||
| コレイルトーク列車『座席指定』、出発直前まで可能 | |||
| コレイル、上半期採用枠1,800に対し2万9,242人が応募 | |||
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| 政府、石油最高価格制度を13日施行…ガソリン1,724ウォン・軽油1,713ウォン | |||
| ヒョソン チョ・ヒョンジュン、昨年報酬151億…HSヒョソン チョ・ヒョンサンは73億 | |||
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| 文体部、ボリョンマッド・アンドンタルチュム・ジンジュユ灯などを『グローバルフェスティバル』に選定 | |||
| [カードニュース] アメリカが韓国を調査するらしい | |||
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| マイクロソフト、オラクル放棄のAIデータセンター用地に目をつける | |||
| 新韓銀行「ステーブルコイン、速度だけでは限界…銀行の役割が必要」 | |||
| ストレージアン、世界舞台でネットワーク露出制御技術を披露 | |||
| トス、ウォン建てステーブルコイン進出を予告…「発行・流通もすべて行う」 | |||
| [現場] スノーフレーク、韓国進出6年ぶりに初のオフィス…「DX・AXのパートナーとなる」 | |||
| チョン・ウィソン会長、昨年起亜で初の報酬…年54億ウォン | |||
| 2兆ウォン規模の国家GPU増強、舵を切る…『AI高速道路』始動 | |||
| 中央日報 | |||
| 2026-03-13 | 「戦争よりも危険な変数」…JPモルガンがコスピ7500を予言した警告 | “전쟁보다 위험한 변수”…코스피 7500 예언한 JP모건의 경고 | https://www.joongang.co.kr/article/25411480 |
| 2026-03-13 | [分譲フォーカス] サムスン電子P5工事再開、恩恵を受けた職住近接大規模団地 | [분양 포커스] 삼성전자 P5 공사 재개 호재 품은 직주근접 대단지 | https://www.joongang.co.kr/article/25411472 |
| 2026-03-13 | 「お金を失えば買えない」…300億を使って得た絶対収益の秘訣 | “돈 잃고 못 산다”…300억 쓰고 얻은 절대수익 비법 | https://www.joongang.co.kr/article/25411461 |
| 2026-03-13 | 同盟を揺るがす米国、スーパー301条を発動…韓国の鉄鋼・石化業界が非常事態 | 동맹 때리는 미국, 수퍼 301조 발동…한국 철강·석화 비상 | https://www.joongang.co.kr/article/25411378 |
| 2026-03-12 | 対米投資特別法の本会議での処理、李大統領「圧倒的な決断に感謝」 | 대미투자특별법 본회의 처리, 李 대통령 “대승적 결단 감사” | https://www.joongang.co.kr/article/25411338 |
| 2026-03-12 | 『核融合』を新たに導入し、AI・量子は実用性を強調…中国、5か年計画を確定 | '핵융합' 새로 넣고, AI·양자는 실용 강조…中, 5개년 규획 확정 | https://www.joongang.co.kr/article/25411337 |
| BAIDU | |||
| 昨天22:52 | 世界的に有名な半導体企業が黄浦に進出!新たな目標はロボットレース分野を狙う | 全球知名半导体企业落子黄浦!新目标瞄准机器人赛道 | https://www.jfdaily.com/sgh/detail?id=1719851 |
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| 昨天17:41 | 機関調査|AIチップ+人工知能+半導体 この企業は業績が史上最高を記録し、主力… | 机构调研丨AI芯片+人工智能+半导体 这家公司业绩创历史新高 主力… | https://baijiahao.baidu.com/s?id=1859448704020422965&wfr=spider&for=pc |
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