Semiconductor News 20260311

Today’s semiconductor news simultaneously highlights strong growth due to special AI demand and supply chain vulnerabilities, with TSMC rebounding from a seasonal slump to record revenue growth in February and SK Hynix developing next-generation “1c LPDDR6 DRAM” for AI devices, while technology evolution is accelerating On the other hand, the Samsung Electronics Workers’ Union has been pushing for the development of new products. On the other hand, the planned 18-day strike by the Samsung Electronics labor union poses a serious risk to the HBM supply chain, and the Chinese market has begun raising smartphone prices in response to soaring component prices. In addition, the market is being driven by massive capital investments to build AI infrastructure and ecosystems, including Amazon’s issuance of over 6.3 trillion yen in bonds and NVIDIA’s investment in a startup company.

TOC

Main News

  1. SK Hynix Develops 1c LPDDR6 DRAM, the Next-Generation Memory for AI
    SK Hynix announced today that it has completed development of 1c LPDDR6 DRAM for AI-based devices. The next-generation memory will begin shipping in the second half of 2026 and is expected to take the lead in the rapidly expanding AI infrastructure and edge device markets by meeting the demand for high-performance, low-power consumption memory. The company aims to take the lead in the rapidly expanding AI infrastructure and edge device markets by meeting the demand for high-performance, low-power memory.
  2. TSMC’s February Earnings Rise Over Seasonal Slump Driven by AI Demand
    TSMC, the world’s largest semiconductor foundry, announced that its February 2026 earnings rose year over year, despite a typically seasonally slow period. This exceptional growth is largely due to exploding demand for AI semiconductors for data centers and edge devices; the expansion of AI chip production capacity is powering the company’s results and continues to play a central role in building the global AI infrastructure.
  3. Samsung Labor Union Plans 18-Day Strike, Risks HBM Supply Chain
    Samsung Electronics’ labor union is planning an 18-day long strike that could have a direct impact on the company’s production facilities for high-bandwidth memory (HBM), which is seeing a surge in demand for AI servers. The risk of significant disruption to the HBM supply chain for key customers such as NVIDIA has been widely viewed by the market as a concern that could further exacerbate the global AI semiconductor supply shortage.
  4. TSMC’s Arizona Plant Turns Profitable, Supporting U.S. Semiconductor Manufacturing Push
    It was reported that the Arizona plant built by TSMC in the United States has achieved a turnaround after full-scale operations. The plant has overcome challenges such as initial start-up costs and human resource shortages, indicating that a stable production system is now in place. This turnaround is an important milestone that confirms the effectiveness of the U.S. government’s policy of returning to domestic semiconductor manufacturing, and symbolizes the progress being made in the geopolitical diversification and resiliency of the semiconductor supply chain.
  5. Smartphone Price Increases Begin in China; OPPO to Raise Prices by up to 500 Yuan
    Smartphone price increases are in full swing in the Chinese market. Leading manufacturer OPPO will reportedly adjust its product prices by up to 500 yuan starting March 16. The surge in semiconductor memory prices and rising costs throughout the supply chain are forcing manufacturers to pass these increases on to product prices. This is likely to be a major turning point for improving the profit structure in the Chinese smartphone market, where intense price competition has continued until now.
  6. Nexperia’s Chinese Subs idiary Rebels Against Dutch Headquarters, Starts 12-inch Factory
    The Chinese subsidiary of Nexperia, a semiconductor company based in the Netherlands, has reportedly started manufacturing new 12-inch chips against the wishes of its headquarters. This is a move by a domestic Chinese base to expand its own production capacity and force the supply chain to become completely homegrown and self-reliant in the face of increasing restrictions on semiconductors in China by the U.S. and Europe. This is a shocking situation that highlights the geopolitical divide between nations within global companies and the governance risks unique to the Chinese market.
  7. ROHM Acquires GaN Technology License from TSMC, Will Build Production Line by 2027
    ROHM, a Japanese semiconductor manufacturer, has acquired a license for GaN technology, a next-generation power semiconductor material, from TSMC, the world’s largest foundry. Based on this partnership, ROHM plans to build a new production line for GaN products by 2027. The strategy is to strengthen its own manufacturing base and dramatically increase its global competitiveness in the power semiconductor market, where demand is growing for AI servers and electric vehicles, which require highly efficient power conversion.
  8. Applied and Micron Partner to Accelerate Development of HBM and Next-Generation Memory
    Applied Materials, the largest supplier of semiconductor manufacturing equipment, and memory giant Micron have entered into a strategic partnership to accelerate the development of next-generation memories such as HBM, NAND and DRAM.AI As demand for high-performance memory for infrastructure explodes, the partnership aims to dramatically increase the speed of mass production by overcoming the technical hurdles in manufacturing associated with miniaturization and layering through close collaboration between equipment manufacturers and device manufacturers.
  9. Amazon Raises Over 6.3 Trillion Yen in Corporate Bonds, Accelerating Massive Investment in AI Infrastructure
    Amazon plans to raise a massive amount of over 6.3 trillion yen through the issuance of corporate bonds, it has been revealed. The huge amount of funds raised is expected to be used intensively for investment in AI infrastructure, including expansion of data centers to support the rapidly expanding generated AI services and development of proprietary AI semiconductors. As the battle for AI supremacy among giant IT companies intensifies, the race to build overwhelming infrastructure backed by astronomical financial resources is becoming even more heated.
  10. NVIDIA Invests in Former OpenAI Executive’s Startup to Support Semiconductor Ecosystem
    NVIDIA, the market leader in AI chips, has invested in a new AI startup founded by a former OpenAI executive. NVIDIA is not only supplying hardware, but also making strategic seed investments in promising AI startups to build and expand a robust AI ecosystem based on its semiconductors. This is a move that will further solidify NVIDIA’s dominance in the AI industry from both a software and hardware perspective.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Mar 10, 15:02SKハイニックス、AI搭載デバイス向けに1セルLPDDR6 DRAMを開発SK Hynix develops 1c LPDDR6 DRAM for AI deviceshttps://www.digitimes.com/news/a20260310VL213/sk-hynix-dram-lpddr-mobile-technology.html
Mar 10, 15:33TSMC、季節的な低迷を乗り越えAI需要で2026年2月の収益が上昇TSMC February 2026 revenue climb on AI demand despite seasonal diphttps://www.digitimes.com/news/a20260310VL215/tsmc-revenue-2026-demand-growth.html
Mar 10, 13:58Qualcomm、実体的なAIとロボティクス分野に進出Qualcomm makes its move into physical AI and roboticshttps://www.digitimes.com/news/a20260310VL210/qualcomm-robotics-arduino-ceo-market.html
Mar 10, 11:25Nvidia、韓国報道によれば中国の規制下でSamsungと共にRTX 3060の再生産を計画Nvidia to restart RTX 3060 with Samsung amid China curbs, Korean report sayshttps://www.digitimes.com/news/a20260310PD217/nvidia-geforce-gpu-production-samsung.html
Mar 10, 10:29独占インタビュー:Ayar LabsのCEOマーク・ウェイド、シリコンフォトニクスの大量生産能力は依然として課題と語るExclusive interview: Ayar Labs CEO Mark Wade says mass production capability remains a challenge for silicon photonicshttps://www.digitimes.com/news/a20260310PD202/siph-startup-funding-production-taiwan.html
Mar 10, 15:18堅牢デバイスメーカーWinmate、エッジAIと防衛需要が成長を後押しRugged device maker Winmate sees growth surge from edge AI and defense demandhttps://www.digitimes.com/news/a20260310PD242/winmate-rugged-pc-edge-ai-revenue-2026.html
Mar 10, 14:30Groq、AIチップ需要の急増を背景にSamsungにウェーハ生産の拡大を促すとの報道Groq reportedly urges Samsung to expand wafer production as AI chip demand surgeshttps://www.digitimes.com/news/a20260310PD236/groq-samsung-ai-chip-wafer-production.html
Mar 10, 11:51Zhen Ding、強いAI需要の中で2月の収益がわずかに4%減少Zhen Ding posts slight 4% revenue drop in February amid strong AI demandhttps://www.digitimes.com/news/a20260309PD237/zhen-ding-pcb-ai-demand-revenue.html
Mar 10, 11:44TSMCの拡大により、フィルタ素材の不足と価格急騰を引き起こすTSMC expansion triggers filter material shortage and price surgehttps://www.digitimes.com/news/a20260310PD215/tsmc-expansion-wafer-manufacturing-gases.html
Mar 10, 08:32MAtekのテスト事業、AI時代のチップ複雑化で成長するも利益は低下MAtek’s testing business grows with AI-era chip complexity, but profits fallhttps://www.digitimes.com/news/a20260309PD231/revenue-testing-business-2025-materials-analysis.html
Mar 10, 08:31Samsung労働組合、18日間のストライキを計画し、HBMサプライチェーンにリスクをもたらすSamsung union plans 18-day strike, adding risk to HBM supply chainhttps://www.digitimes.com/news/a20260309PD234/samsung-labor-strike-hbm-supply-chain.html
Mar 10, 08:28台湾・米国のメモリ、ファウンドリ、パッケージングの拡大が急増する一方、マレーシアとインドでは遅延の可能性が報じられるTaiwan-US memory, foundry, and packaging expansions surge; Malaysia and India reportedly face delayshttps://www.digitimes.com/news/a20260309PD224/taiwan-packaging-semiconductor-industry-production-capacity-2026.html
Mar 10, 08:27PCBドリルビットメーカーTopoint、高付加価値コーティングドリルの供給不足に直面し、2026年に55%の売上シェアを目指すPCB drill bit maker Topoint sees tight supply of high-end coated drills, targets 55% sales share in 2026https://www.digitimes.com/news/a20260309PD233/pcb-topoint-2026-high-end-sales.html
Mar 10, 08:27キュービットを超えて:台湾のフェーズ2量子計画、完全商業化を目指すBeyond the qubit: Taiwan’s phase 2 quantum plan targets full commercializationhttps://www.digitimes.com/news/a20260309PD228/taiwan-quantum-computing-nstc-quantum-computer-launch.html
Mar 10, 08:26解説:なぜ台湾のパネルメーカーは半導体パッケージングに軸足を移しているのかCommentary: Why Taiwan panel makers are pivoting to semiconductor packaginghttps://www.digitimes.com/news/a20260309PD220/panel-taiwan-packaging-lcd-innolux.html
Mar 10, 08:26TSMCのアリゾナ工場、黒字転換で米国チップ製造推進を実証TSMC’s Arizona fab turns profitable, validating US chipmaking pushhttps://www.digitimes.com/news/a20260309PD218/tsmc-arizona-fab-manufacturing-2025.html
日経 Tech Foresight
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マイナビニュース テックプラス
2026-03-10SK hynixが1c nmプロセスLPDDR6の開発を完了、2026年下期からの供給開始を計画https://news.mynavi.jp/techplus/article/20260310-4204586/
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2026-03-10AMD、Ryzen AI Embeddedに最大12コア製品を追加https://news.mynavi.jp/techplus/article/20260310-4201687/
TrendForce
2026-03-10中国でスマートフォンの価格上昇が始まる;OPPO、3月16日から調整で最大¥500アップと報じられるChinese Smartphone Price Hikes Begin; OPPO Adjusts From Mar. 16, Reportedly Up to ¥500https://www.trendforce.com/news/2026/03/10/news-chinese-smartphone-price-hikes-begin-oppo-announces-increases-from-mar-16-reportedly-up-to-%c2%a5500/
2026-03-10Samsung、Groqの受注が約70%増の15,000ウェハーに達する可能性;Tesla、その他のファウンドリ顧客への供給を遅延と報じられるSamsung Groq Orders May Jump ~70% to 15K Wafers; Tesla Reportedly Delays Other Foundry Clientshttps://www.trendforce.com/news/2026/03/10/news-samsung-may-see-groq-orders-jump-70-to-15k-wafers-tesla-reportedly-delays-other-foundry-clients/
2026-03-10Nexperia中国、オランダ本社に反して12インチチップの製造開始と報じられるNexperia China Reportedly Launches 12-inch Chip Production, Defying Dutch Parenthttps://www.trendforce.com/news/2026/03/10/news-nexperia-china-reportedly-launches-12-inch-chip-production-defying-dutch-parent/
2026-03-10SK hynix、33%の速度向上と20%の省エネルギーを実現した1c LPDDR6 DRAMを開発;2026年下半期に出荷SK hynix Develops 1c LPDDR6 DRAM with 33% Speed Gain, 20% Power Savings; Ships in 2H26https://www.trendforce.com/news/2026/03/10/news-sk-hynix-develops-1c-lpddr6-dram-with-33-speed-gain-20-power-savings-ships-in-2h26/
2026-03-10ROHM、TSMCからGaN技術のライセンスを獲得、2027年までに生産ラインを構築予定ROHM Secures GaN Technology License from TSMC, to Build Production Line by 2027https://www.trendforce.com/news/2026/03/10/news-rohm-secures-gan-technology-license-from-tsmc-to-build-production-line-by-2027/
Semiconductor Digest
19 hours agoNearfield Instruments、先進的3D半導体メトロロジー向けにサイドウォールイメージングモードを導入Nearfield Instruments Introduces Sidewall Imaging Mode for Advanced 3D Semiconductor Metrologyhttps://www.semiconductor-digest.com/nearfield-instruments-introduces-sidewall-imaging-mode-for-advanced-3d-semiconductor-metrology/
19 hours agoシドニーの研究者、光速で動作する超小型AIチップを開発Sydney Researchers Build Ultra-Compact AI Chip Operating at Speed of Lighthttps://www.semiconductor-digest.com/sydney-researchers-build-ultra-compact-ai-chip-operating-at-speed-of-light/
20 hours agoScaleBridge LabsとSilicon Catalyst、国防産業向け半導体革新を加速する全国的イニシアチブを開始ScaleBridge Labs and Silicon Catalyst Launch National Initiative to Accelerate Semiconductor Innovation for the Defense Industryhttps://www.semiconductor-digest.com/scalebridge-labs-and-silicon-catalyst-launch-national-initiative-to-accelerate-semiconductor-innovation-for-the-defense-industry/
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日本経済新聞
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2026-03-11加賀電子、サンワテクノス株を7.25%取得 11日付https://www.nikkei.com/article/DGXZQOUC108LD0Q6A310C2000000/
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ダイヤモンドオンライン
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Tom’s Hardware
TechPowerup
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2026-03-10T15:31:05+00:00NVIDIA、GDC 2026でローカルAIビデオ生成の新機能を発表NVIDIA Unveils Local AI Video Generation Updates at GDC 2026https://www.techpowerup.com/347234/nvidia-unveils-local-ai-video-generation-updates-at-gdc-2026
2026-03-10T15:31:02+00:00NVIDIA、GDC 2026でGeForce NOWを大幅に刷新NVIDIA Gives GeForce NOW an Overhaul at GDC 2026https://www.techpowerup.com/347232/nvidia-gives-geforce-now-an-overhaul-at-gdc-2026
2026-03-10T15:30:37+00:00NVIDIA DLSS 4.5 ダイナミックマルチフレーム生成、3月31日より利用開始NVIDIA DLSS 4.5 Dynamic Multi Frame Generation Available from March 31https://www.techpowerup.com/347230/nvidia-dlss-4-5-dynamic-multi-frame-generation-available-from-march-31
2026-03-10T15:17:22+00:00Dynabook、新型Portégé X45W 14インチ 2-in-1コンバーチブルノートパソコンを発表 – AMD搭載Dynabook Expands AMD-Powered Offerings with New Portégé X45W 14-inch 2-in-1 Convertible Laptophttps://www.techpowerup.com/347243/dynabook-expands-amd-powered-offerings-with-new-port-g-x45w-14-inch-2-in-1-convertible-laptop
2026-03-10T15:16:21+00:00Razer、ダイナミックハプティクス技術を発表Razer Introduces Dynamic Hapticshttps://www.techpowerup.com/347242/razer-introduces-dynamic-haptics
EETimes Taiwan
2026-03-10なぜインドのディープテクノロジーの発展は世界の半導体産業にとって重要なのか?為何印度深度科技發展對全球晶片產業至關重要?https://www.eettaiwan.com/20260310nt61-why-india-s-deep-tech-moment-matters-to-the-global-chip-industry/
2026-03-10AIと通信が産業の中核となる クアルコムがMWC2026で精鋭の技術を披露AI/通訊成產業主心骨 高通MWC 2026精銳盡出https://www.eettaiwan.com/20260310nt11-mwc-2026-qualcomm-showcases/
2026-03-10EUがガソリン車規制を緩和 2030年にはREEVの販売台数が倍増する見通し歐盟鬆綁燃油車禁令 2030年REEV銷量可望翻倍成長https://www.eettaiwan.com/20260310nt21-2030-reev-sales-volume/
2026-03-09AIが牽引する半導体装置への投資ブーム、2027年に歴史的記録となる見込みAI驅動晶片設備投資潮 2027年將破歷史紀錄https://www.eettaiwan.com/20260309nt31-ai-drives-capex-chip-equipment-to-record-156b-in-2027/
2026-03-09ガラス基板―半導体パッケージングの次の『素材革命』玻璃基板:晶片封裝的下一場「材料革命」https://www.eettaiwan.com/20260309nt61-glass-substrates-represent-the-next-materials-revolution/
2026-03-092026年、世界中のAIサーバー出荷台数が前年比28%以上増加2026年全球AI伺服器出貨年增逾28%https://www.eettaiwan.com/20260309nt21-2026-global-ai-server-shipment/
EETimes Asia
2026-03-10AW 2026は力強く締めくくられ、物理的AIとヒューマノイドに焦点を当てるAW 2026 Concludes on Strong, Puts Highlight on Physical AI and Humanoidshttps://www.eetasia.com/aw-2026-concludes-on-strong-puts-highlight-on-physical-ai-and-humanoids/
2026-03-10カウンターポイント:2025年、世界のスマートフォン平均DRAM容量が記録的な8.4GBに到達Counterpoint: Global Smartphone Average DRAM Hits Record 8.4GB in 2025https://www.eetasia.com/counterpoint-global-smartphone-average-dram-hits-record-8-4gb-in-2025/
2026-03-10Wolfspeed、10kV SiCパワーMOSFETを発表Wolfspeed Unveils 10kV SiC Power MOSFEThttps://www.eetasia.com/wolfspeed-unveils-10kv-sic-power-mosfet/
2026-03-10Rayenceは最新検出器シリーズでX線検査プラットフォームの機能を強化Rayence Strengthens Capabilities of X-Ray Inspection Platforms with Latest Detector Serieshttps://www.eetasia.com/rayence-strengthens-capabilities-of-x-ray-inspection-platforms-with-latest-detector-series/
2026-03-10Nordic Semiconductor、エントリーレベルのBluetooth LE SoCを発売Nordic Semiconductor Launches Entry-level Bluetooth LE SoCshttps://www.eetasia.com/nordic-semiconductor-launches-entry-level-bluetooth-le-socs/
2026-03-10省エネルギーな6Gネットワーク実現のためのワイヤレスインフラを再構築Reinventing Wireless Infrastructure for Energy-Efficient 6G Networkshttps://www.eetasia.com/reinventing-wireless-infrastructure-for-energy-efficient-6g-networks/
2026-03-09Arrow ElectronicsとInfineon、モーター制御向けリファレンスデザインで共同作業Arrow Electronics and Infineon Collaborate on Reference Design for Motor Control Applicationshttps://www.eetasia.com/arrow-electronics-and-infineon-collaborate-on-reference-design-for-motor-control-applications/
2026-03-09imecとAtlas、合成DNAを用いたデジタルデータ保存技術で連携imec and Atlas Collaborate on Synthetic DNA-based Digital Data Storagehttps://www.eetasia.com/imec-and-atlas-collaborate-on-synthetic-dna-based-digital-data-storage/
2026-03-09TI、NVIDIAと提携して次世代フィジカルAIを加速TI Partners with NVIDIA to Accelerate Next-gen Physical AIhttps://www.eetasia.com/ti-partners-with-nvidia-to-accelerate-next-gen-physical-ai/
2026-03-092025年第4四半期、トップ5 NANDフラッシュサプライヤーが前四半期比24%の売上成長を記録Top Five NAND Flash Suppliers Post 24% QoQ Revenue Growth in 4Q 2025https://www.eetasia.com/top-five-nand-flash-suppliers-post-24-qoq-revenue-growth-in-4q-2025/
2026-03-09AVイノベーションがCES 2026で主役に躍り出るAV Innovations Take Center Stage at CES 2026https://www.eetasia.com/av-innovations-take-center-stage-at-ces-2026/
EETimes India
2026-03-09MAHEがインドの量子ハードウェアエコシステムの発展を促進するための拠点を設立MAHE Establishes Hub to Advance India’s Quantum Hardware Ecosystemhttps://www.eetindia.co.in/mahe-establishes-hub-to-advance-indias-quantum-hardware-ecosystem/
ZDNET Korea
2026-03-11‘インターバッテリー 2026’開催…主要667社が総出動‘인터배터리 2026’ 개최…주요 667개 기업 총출동https://www.zdnet.co.kr/20260310214150%22%20title=%22
2026-03-11ロッテハイマート、3月安心ケアセール…家電クリーニングが最大20%割引롯데하이마트, 3월 안심케어 세일…가전 클리닝 최대 20% 할인https://www.zdnet.co.kr/20260310182926%22%20title=%22
2026-03-11イーマート、『ピコックXナムヘマヌル』の簡便食7種発売이마트, ‘피코크X남해마늘’ 간편식 7종 출시https://www.zdnet.co.kr/20260310174953%22%20title=%22
2026-03-10トスバンクで円が50%格安だって?…「内部点検のエラー」토스뱅크서 엔화 50% 싸다고?…”내부 점검 오류”https://www.zdnet.co.kr/20260310224819%22%20title=%22
2026-03-10アン・アンエ스ピー、制御網セキュリティモニタリング『アン넷NDR V2.0』でGS認証を取得앤앤에스피, 제어망 보안 모니터링 ‘앤넷NDR V2.0’ GS 인증 획득https://www.zdnet.co.kr/20260310220711%22%20title=%22
2026-03-10通話内容まで業務に反映…Zoom、AIコンパニオン3.0を公開통화 내용까지 업무 반영”…줌, AI 컴패니언 3.0 공개https://www.zdnet.co.kr/20260306160021%22%20title=%22
2026-03-10韓国SMR商用化を牽引する中核センターが初の鋤入れを行った대한민국 SMR 상용화 이끌 핵심 센터 첫 삽https://www.zdnet.co.kr/20260310215959%22%20title=%22
2026-03-10サムスン電機、3.2~4.3倍の連続ズームカメラモジュールの量産を開始삼성전기, 3.2~4.3배 연속줌 카메라 모듈 양산https://www.zdnet.co.kr/20260310213931%22%20title=%22
2026-03-10KT、31日の株主総会で…パク・ユンヨン代表取締役が就任予定KT, 31일 주총…박윤영 대표이사 선임 예정https://www.zdnet.co.kr/20260310192640%22%20title=%22
2026-03-10LS MnM、増資で2000億ウォンを確保…インドネシア製錬所への投資資金を調達LS MnM, 유증 통해 2000억원 확보…인니 제련소 투자 재원 마련https://www.zdnet.co.kr/20260310182949%22%20title=%22
2026-03-10グーグル ナノバナナ、偽の胸部X線で肺炎を92%の精度で検出구글 나노 바나나, 가짜 흉부 X선으로 폐렴 92% 정확도로 잡아냈다https://www.zdnet.co.kr/20260310185851%22%20title=%22
2026-03-10気候テック企業46社が結集…韓国気候テック協会の設立を推進기후테크 기업 46곳 뭉쳤다…한국기후테크협회 설립 추진https://www.zdnet.co.kr/20260310175401%22%20title=%22
2026-03-10DJI「ロボット掃除機のセキュリティ強化継続…バグバウンティ・第三者認証を拡大」DJI “로봇청소기 보안 강화 지속…버그바운티·제3자 인증 확대”https://www.zdnet.co.kr/20260310174040%22%20title=%22
2026-03-10中東発の石油化学大混乱の兆し…不可抗力を叫ぶ企業たち중동발 석유화학 대란 조짐…불가항력 외치는 기업들https://www.zdnet.co.kr/20260310174847%22%20title=%22
2026-03-10サムスン電子、上半期に16兆ウォンの自己株式消却計画삼성전자, 상반기 16조원 자사주 소각 계획https://www.zdnet.co.kr/20260310180145%22%20title=%22
2026-03-10DNソリューションズ、『シムト스 2026』でヘラー装置を公開DN솔루션즈, ‘심토스 2026’서 헬러 장비 공개https://www.zdnet.co.kr/20260310181405%22%20title=%22
2026-03-10コビット、NXCから239億ウォン相当の仮想資産を貸与코빗, NXC로부터 239억원 상당 가상자산 대여https://www.zdnet.co.kr/20260310174727%22%20title=%22
2026-03-10韓国人、『ゼータ』を最も長く使用…利用者数第1位は『ChatGPT』한국인, ‘제타’ 가장 오래 써…이용자 수 1위는 ‘챗GPT’https://www.zdnet.co.kr/20260310175124%22%20title=%22
2026-03-10[人事]科学技術情報通信部[인사]과학기술정보통신부https://www.zdnet.co.kr/20260310175111%22%20title=%22
2026-03-10“信頼を売ります”…スリーバックが語るコマースクリエイターの生存法“신뢰를 팝니다”…쓰리백이 말한 커머스 크리에이터 생존법https://www.zdnet.co.kr/20260310172308%22%20title=%22
中央日報
2026-03-11「AI PCシェア15%突破」…エイスース、990g超軽量ゼンブック出撃“AI PC 점유율 15% 뚫는다”…에이수스, 990g 초경량 젠북 출격https://www.joongang.co.kr/article/25410814
2026-03-11台湾は国民所得4万ドルの時代、韓国は12年連続3万ドル台대만은 국민소득 4만달러 시대, 한국은 12년째 3만달러대https://www.joongang.co.kr/article/25410769
2026-03-11『中東炎』が及ぼした原材料価格の高騰、焦燥感漂う家電業界‘중동 화염’ 옮겨붙은 원자잿값, 속타는 가전업계https://www.joongang.co.kr/article/25410768
2026-03-11好業績のサムスン電子、年収が22%急上昇…昨年平均で1億5800万ウォン호실적 삼성전자 연봉 22% 껑충…작년 평균 1억5800만원 받았다https://www.joongang.co.kr/article/25410762
2026-03-11大統領、「追加財政が必要」…桜追補予算を正式に決定이 대통령 “추가 재정 필요”…벚꽃 추경 공식화https://www.joongang.co.kr/article/25410737
2026-03-10アルミも急騰、4年ぶりの最高値…家電業界、『三重苦』の悲鳴알루미늄도 폭등, 4년 만에 최고가…가전업계 '3중고' 비명https://www.joongang.co.kr/article/25410697
BAIDU
昨天17:06半導体『カーニバル』SEMICON/FPD China 2026は3月22日に上海で開幕半导体“嘉年华”SEMICON/FPD China 2026将于3月22日在上海开幕https://baijiahao.baidu.com/s?id=1859265344260250639&wfr=spider&for=pc
昨天23:48AIが半導体の新時代を切り開く。2026年には産業規模がほぼ1兆ドルに迫るAI开启半导体新时代 2026年产业规模接近万亿美元https://www.cnstock.com/commonDetail/648180
昨天17:04半導体『カーニバル』SEMICON/FPD China 2026は3月22日に上海で開幕半导体“嘉年华”SEMICON/FPD China 2026将于3月22日在上海开幕https://www.cnstock.com/commonDetail/647854
昨天22:04瀚博半導体は、OpenClawのセキュリティ脆弱性に対応する『スマート体クラウド基盤』ソリューションを発表瀚博半导体推出“智能体云底座”方案 针对OpenClaw安全漏洞https://www.cnstock.com/commonDetail/648098
昨天22:18見解|SEMI中国社長の冯莉:AIが半導体に火をつけ、世界のチップ市場は1兆ドル規模の競争へ观点|SEMI中国总裁冯莉:AI点燃半导体,全球芯版图万亿竞速https://baijiahao.baidu.com/s?id=1859280130886537258&wfr=spider&for=pc
昨天15:27景気が好調!香港株の半導体セクターが再び強気に、天数智芯は約30%急騰景气度高企!港股半导体板块再度走强 天数智芯大涨近30%https://baijiahao.baidu.com/s?id=1859258895780209830&wfr=spider&for=pc
昨天20:47中晶科技:江蘇省皋鑫社が半導体パワーチップや各種デバイス等の製品を製造中晶科技:江苏皋鑫生产半导体功率芯片及器件等产品https://baijiahao.baidu.com/s?id=1859279217248035610&wfr=spider&for=pc
昨天18:212026年初頭、A株の半導体企業で価格問い合わせによる譲渡ラッシュが発生。7社の株主が合計で50を超える資金を現金化2026年开年A股半导体公司现询价转让潮:7家公司股东合计套现超50…https://baijiahao.baidu.com/s?id=1859270190266922173&wfr=spider&for=pc
昨天16:11恒生テクノロジー指数が2.40%上昇、半導体セクターの上昇率が先導恒生科技指数收涨2.40% 半导体板块涨幅居前https://baijiahao.baidu.com/s?id=1859261852707997197&wfr=spider&for=pc
昨天22:52絶好の買い時到来、韓国の株式投資家がワンクリックで中国のAI半導体を購入利器来了,韩国股民一键买入中国AI半导体https://baijiahao.baidu.com/s?id=1859292000556172885&wfr=spider&for=pc
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