Semiconductor News 20260310

TOC

Main News

  1. Nvidia to halt production of H200 for China and shift TSMC capacity to Vera Rubin
    Nvidia has decided to halt production of its H200 AI chip for China and shift TSMC’s valuable production capacity to its next-generation Vera Rubin chip. With the continued strict U.S. export restrictions on China, the strategy is to review production for the highly uncertain Chinese market and concentrate resources on mass production of next-generation architectures, for which demand is tightening worldwide. This is expected to further accelerate the competition among companies for AI supremacy.
  2. Global Semiconductor Market Reaches Record High in January 2026 with 46% Yo Y Growth
    According to a survey by the Semiconductor Industry Association (SIA), global semiconductor sales in January 2026 recorded a significant 46% YoY growth, reaching a record high for a single month. If this momentum continues, the annual market size is expected to reach $1 trillion. The data confirms that the industry as a whole is entering a new phase of growth beyond the silicon cycle.
  3. Samsung and SK Hynix Selected as NVIDIA’s HBM4 Suppliers, Shipping in March
    Samsung Electronics and SK Hynix have reportedly been named as suppliers of HBM4, the next-generation memory that will determine the performance of AI chips, for NVIDIA’s next-generation chip, Rubin. Shipments are expected to begin as early as March, and as the memory market enters a super-cycle due to exploding demand for AI infrastructure, both companies are rushing to expand production capacity in order to take the lead in the HBM market, and a fierce development and mass production race is in full swing.
  4. Texas Instruments to Increase Prices by up to 85% Starting April 1
    Semiconductor giant Texas Instruments (TI) reportedly plans to raise product prices again starting April 1. According to reports, the increase could be up to 85%, as surging demand for AI, rising raw material costs, and geopolitical risks are driving price pass-through across the semiconductor industry, which is feared to have a significant impact on the supply chain for electronics products and the cost of manufacturing final products. There are concerns that this will have a significant impact on the supply chain of electronics products and the manufacturing costs of final products.
  5. U. S. Considers Global Export License to Prevent AI Chip Leakage via Third Countries
    The U.S. government is considering introducing a global AI chip export license to curb the flow of cutting-edge AI semiconductors through third countries to countries of concern such as China. Even allied and friendly countries in the Middle East and Asia may be subject to rigorous screening, creating new constraints on the global semiconductor supply chain. This hard-line measure to prevent the risk of military diversion of technology will be watched closely as a move to further strengthen the U.S.-led government’s efforts to maintain its technological hegemony.
  6. Tensions in the Middle East have caused tungsten prices to soar sixfold, increasing chip supply risks
    Geopolitical risks, including energy turmoil in the Middle East and the situation in Iran, are hitting the semiconductor industry hard. Chinese export restrictions combined with tensions with Japan have also caused the price of tungsten, an essential material for semiconductor manufacturing, to soar almost six-fold. Concerns have also arisen over TSMC’s electricity usage and the supply of bromine needed for DRAM manufacturing, and the combination of increased logistics costs and raw material shortages is rapidly increasing the risk of disruptions in the global semiconductor supply chain.
  7. Apple Increases iPhone Fold Inventory by 20%, Suppliers to Benefit
    Apple is reportedly showing strong confidence in its ability to bring the company’s first foldable smartphone, the iPhone Fold, to market and has increased its initial inventory buildup by 20% more than planned. This bullish production plan will greatly benefit its main supplier, Taiwan’s Foxconn, as well as related companies such as TSMC, which is responsible for manufacturing cutting-edge chips. Expectations are high as to whether this will be a new catalyst for the smartphone market, which has been in a state of stagnation.
  8. Mitsui & Co. form alliance with Kaynes and others to support OSAT business in India
    Mitsui & Co. of Japan has formed an alliance with Kaynes, a local company, and AOI Electronics of Japan to support the back-end semiconductor (assembly and testing: OSAT) business in India. As the Indian government strongly promotes the development of the semiconductor industry and the attraction of multinational companies to India, this is a move by Japanese companies to become deeply involved in the construction of the local supply chain by leveraging their technological and financial strengths, further deepening the strategic high-tech industrial collaboration between Japan and India.
  9. China Warns that Dispute with Nexperia Could Cause New Global Semiconductor Shortage
    The Chinese government has strongly warned that a dispute over Nexperia (Ansei Semiconductor), a semiconductor company based in the Netherlands, could cause a new global semiconductor shortage. This is a form of China’s hard-line stance to protect its own supply chain and the interests of related companies amid tightening restrictions on semiconductors in China by Europe and the United States. High-tech friction between nations has led to direct intervention in the business activities of individual companies, causing ripples in the global market.
  10. SUBARU and Infineon collaborate on design of in-vehicle microcontrollers for control-integrated ECUs
    Automaker SUBARU and leading semiconductor manufacturer Infineon Technologies have announced that they will collaborate on the design of in-vehicle microcontrollers for control-integrated electronic control units (ECUs) that will be essential for next-generation vehicles. As the architecture of in-vehicle systems undergoes major changes in line with increasingly sophisticated electric vehicle (EV) and automated driving technologies, the two companies aim to ensure stable procurement of safe and efficient components through collaboration between automakers and semiconductor manufacturers from the early development stage.

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News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Mar 9, 10:47マイクロン:LPDRAMサーバー需要が市場を凌駕、台湾が主要生産拠点にMicron: LPDRAM server demand to outpace market; Taiwan key production basehttps://www.digitimes.com/news/a20260306PD204/expansion-micron-production-market-demand.html
Mar 9, 11:15韓国のIC設計、需要と地元ファウンドリの橋渡しを目指すSouth Korea’s IC design moves to bridge demand and local foundrieshttps://www.digitimes.com/news/a20260308PD201/ic-design-demand-production-samsung-manufacturing.html
Mar 9, 11:10業界、20層スタック向けにより厚いHBM規格の採用を検討Industry mulls thicker HBM standards for 20-layer stackshttps://www.digitimes.com/news/a20260306VL208/hbm-dram-hbm4-samsung-chips.html
Mar 9, 10:53AW 2026:アドバンテック、物理AIの「混乱」から脱出する道を模索AW 2026: Advantech sees a way out of physical AI’s ‘chaos’https://www.digitimes.com/news/a20260307VL201/advantech-2026-silicon-market-hardware.html
Mar 9, 10:39Nvidia、中国向けH200生産を停止、TSMCの生産能力をヴェラ・ルービンに振り向けるNvidia halts China-bound H200 production, shifts TSMC capacity to Vera Rubinhttps://www.digitimes.com/news/a20260309VL202/nvidia-rubin-chips-production-capacity-china.html
Mar 9, 15:21デュポンのスピンオフ企業Qnity、台湾で先進チップ材料生産拡大に6150万ドルを投資DuPont spin-off Qnity invests US$61.5M to expand advanced chip material production in Taiwanhttps://www.digitimes.com/news/a20260309PD229/taiwan-production-materials-capacity-manufacturing.html
Mar 9, 15:01中国、Nexperiaとの争いが新たな世界的半導体不足を招く可能性があると警告China warns Nexperia dispute could trigger new global chip shortagehttps://www.digitimes.com/news/a20260309VL210/nexperia-dutch-production-subsidiary-beijing.html
Mar 9, 12:15三井物産、Kaynes社およびAOIエレクトロニクスと提携し、インドのOSAT事業を支援Mitsui partners with Kaynes and AOI Electronics to support Indian OSAT businesshttps://www.digitimes.com/news/a20260309VL204/mitsui-aoi-osat-india-partnership.html
Mar 9, 11:14タングステン価格、中国の輸出規制と日本との地政学的緊張の中でほぼ6倍に急騰Tungsten prices surge nearly 6x amid China export controls and geopolitical tensions with Japanhttps://www.digitimes.com/news/a20260309PD216/rare-earth-pcb-drill-demand-price-2025.html
Mar 9, 11:09低軌道衛星ブーム、出荷増加に伴い台湾のPCBサプライヤーに圧力LEO satellite boom pressures Taiwanese PCB suppliers as shipments ramp uphttps://www.digitimes.com/news/a20260309PD202/pcb-leo-shipments-compeq-manufacturing-2026.html
Mar 9, 10:59米国、第三国への流出を抑制するためにグローバルなAIチップ輸出ライセンスを検討US weighs global AI chip export licensing to curb third-country diversionhttps://www.digitimes.com/news/a20260309PD209/usa-ai-chip-exports-licensing-policy-nvidia.html
Mar 9, 10:36リッチウェーブ、2025年第4四半期の収益減にもかかわらずWi‑Fi 7需要は堅調、2028年にWi‑Fi 8を展開予定RichWave sees steady Wi-Fi 7 demand despite 4Q25 revenue dip, Wi‑Fi 8 eyed for 2028 rollouthttps://www.digitimes.com/news/a20260309PD201/richwave-revenue-wi-fi-7-demand-2025.html
Mar 9, 09:24週間ニュースまとめ:TSMCの調査、AIブーム、メモリ価格の急騰Weekly news roundup: TSMC probe, AI boom, and memory price surgehttps://www.digitimes.com/news/a20260309VL200/digitimes-asia-weekly-news-roundup-tsmc-investigation-memory-price.html
Mar 9, 08:58インドまとめ:半導体および技術投資拡大の中で、日本と韓国が取り組みを深化India roundup: Japan, South Korea deepen push as semiconductor and tech investments expandhttps://www.digitimes.com/news/a20260307VL200/technology-materials-manufacturing-semicon-micron.html
Mar 9, 07:49LCDテレビパネル価格、需要堅調の1Q26に上昇LCD TV panel prices rise in 1Q26 as demand stays stronghttps://www.digitimes.com/news/a20260306PD217/lcd-tv-panel-demand-panel-tv-inventory.html
Mar 9, 07:48台湾、米国の投資約束を堅持し、法的変化の中で戦略的ハイテクパートナーシップを追求Taiwan stands firm on US investment commitments, pursuing strategic high-tech partnership amid legal shiftshttps://www.digitimes.com/news/a20260306PD216/taiwan-investment-partnership-legal-supreme.html
日経 Tech Foresight
2026-03-10宇宙×半導体、参入ハードル下げる成果 NTTと北大https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC0681B0W6A300C2000000
2026-03-10東京科学大学など、横型熱電発電に有望な材料 高耐久化https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC054RU0V00C26A3000000
2026-03-09「DNAと半導体でメモリー」「HBMの次はHBF」 海外動向https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC051KE0V00C26A3000000
マイナビニュース テックプラス
2026-03-09SUBARUとインフィニオン、制御統合ECU向け車載マイコンの設計で協業https://news.mynavi.jp/techplus/article/20260309-4200542/
2026-03-09富士通、8GHzの周波数帯で電力変換効率74.3%のGaNパワーアンプを開発https://news.mynavi.jp/techplus/article/20260309-4200238/
2026-03-092026年1月の半導体市場は前年同月比46%増で過去最高を更新、年間での1兆ドル到達に期待 SIA調べhttps://news.mynavi.jp/techplus/article/20260309-4199812/
2026-03-09イラン情勢から読み解く地政学リスク 半導体業界や製造業への影響は?https://news.mynavi.jp/techplus/article/20260309-4199606/
TrendForce
2026-03-09テキサス・インスツルメンツ、4月1日から再び価格を引き上げへ―最大85%の上昇率の可能性Texas Instruments Reportedly Set to Raise Prices Again from April 1, Hikes Could Reach 85%https://www.trendforce.com/news/2026/03/09/news-texas-instruments-reportedly-set-to-raise-prices-again-from-april-1-hikes-could-reach-85/
2026-03-09アップル、強い自信の中でiPhone Foldの在庫積み増しを20%拡大、FoxconnとTSMCも恩恵を受けるApple Reportedly Boosts iPhone Fold Inventory Build 20% Amid Strong Confidence, Lifting Foxconn, TSMChttps://www.trendforce.com/news/2026/03/09/news-apple-reportedly-boosts-iphone-fold-inventory-build-20-amid-strong-confidence-lifting-foxconn-tsmc/
2026-03-09NAND大手YMTC、独自のXtackingフラッシュを採用した初の商用PCIe 5.0 SSDを初公開NAND Giant YMTC Reportedly Debuts First Commercial PCIe 5.0 SSD Using In-house Xtacking Flashhttps://www.trendforce.com/news/2026/03/09/news-nand-giant-ymtc-reportedly-debuts-first-commercial-pcie-5-0-ssd-using-in-house-xtacking-flash/
2026-03-09中東のエネルギー混乱がチップリスクを増大、TSMCの電力使用とDRAM向け臭素に注目Middle East Energy Turmoil Raises Chip Risks, Spotlight on TSMC Power Use and Bromine for DRAMhttps://www.trendforce.com/news/2026/03/09/news-middle-east-energy-turmoil-raises-chip-risks-spotlight-on-tsmc-power-use-and-bromine-for-dram/
2026-03-09サムスンとSKハイニックス、NVIDIAのRubin HBM4供給先に指名―3月から出荷開始の可能性Samsung, SK hynix Reportedly Tapped as NVIDIA Rubin HBM4 Suppliers; Shipments Could Start in Marchhttps://www.trendforce.com/news/2026/03/09/news-samsung-sk%e2%80%afhynix-reportedly-tapped-as-nvidia-rubin-hbm4-suppliers-shipments-could-start-in-march/
Semiconductor Digest
21 hours agoACM Researchが複数の先進パッケージング装置の受注を獲得ACM Research Receives Multiple Advanced Packaging Equipment Ordershttps://www.semiconductor-digest.com/acm-research-receives-multiple-advanced-packaging-equipment-orders/
22 hours agoSiemensがQuesta OneにおけるエージェンティックAIで集積回路の設計・検証を加速Siemens Accelerates Integrated Circuit Design and Verification with Agentic AI in Questa Onehttps://www.semiconductor-digest.com/siemens-accelerates-integrated-circuit-design-and-verification-with-agentic-ai-in-questa-one/
22 hours agoPhotonICが自社プラットフォームに基づく製品ポートフォリオを発表―光エレクトロニクスチップのサプライチェーンの強靭性を実現PhotonIC Debuts Product Portfolio Based Upon Its Platform: Resiliency of Optoelectronic Chip Supply-Chainhttps://www.semiconductor-digest.com/photonic-debuts-product-portfolio-based-upon-its-platform-resiliency-of-optoelectronic-chip-supply-chain/
日本経済新聞
2026-03-10プリファードの大規模言語モデル、「国産AI」で性能と安全性を両立https://www.nikkei.com/article/DGXZQOUC10BRL0Q6A210C2000000/
2026-03-10低電力「スピントロニクス」日本で進化 AI向け新型チップも視野https://www.nikkei.com/article/DGXZQOSG053EU0V00C26A3000000/
2026-03-10ローム、岐路に立つ独立経営 デンソー傘下で探るパワー半導体の進化https://www.nikkei.com/article/DGXZQOUF062690W6A300C2000000/
2026-03-10農研機構と東京工科大、包括連携協定を締結 ドローンで獣害防止https://www.nikkei.com/article/DGXZQOSG127HX0S6A210C2000000/
2026-03-10(人事・機械)東京精密https://www.nikkei.com/article/DGKKZO94894560Z00C26A3TJR000/
2026-03-10ミライアルの26年1月期、純利益39%減 半導体向け回復遅れでhttps://www.nikkei.com/article/DGXZQOUC096EV0Z00C26A3000000/
2026-03-10ソニー、自動運転・ヒト型ロボの「AIの眼」需要拡大 スマホ依存脱却へhttps://www.nikkei.com/article/DGXZQOUC244PV0U6A220C2000000/
2026-03-10半導体8兆円市場、大手行が融資開拓 みずほは九州に日台連携の拠点https://www.nikkei.com/article/DGXZQOUB2443O0U6A220C2000000/
2026-03-10オキサイド、量子コンピューター向けレーザー光源 初号機を出荷https://www.nikkei.com/article/DGXZQOCC0929Z0Z00C26A3000000/
2026-03-10日経平均終値2892円安 吹き飛んだ「イラン楽観シナリオ」https://www.nikkei.com/article/DGXZQOUB090GZTZ00C26A3000000/
ダイヤモンドオンライン
Mar 9 21:00トランプのイラン攻撃で円安・株安・債券安が加速!想像を絶する「悪夢のシナリオ」に震えるhttps://diamond.jp/articles/-/385510
Mar 8 20:05ブロードコム、AI半導体事業は好調もそれ以外は複雑https://diamond.jp/articles/-/385386
Mar 8 19:55資産300億円超の投資家・片山晃氏ロングインタビュー、「日本株は数十年に一度の黄金期」の根拠とは?狙うべき王道銘柄の条件や投資アイデアが満載!https://diamond.jp/articles/-/385280
Mar 7 19:55ロシアGDP「急減速」目立ち始めた戦争の代償、軍事部門は2桁成長も自動車産業は大幅マイナスhttps://diamond.jp/articles/-/385312
Tom’s Hardware
TechPowerup
2026-03-09T20:20:10+00:00AMD、Ryzen チップセットドライバー 8.02.18.557 をリリースAMD Releases Ryzen Chipset Driver 8.02.18.557https://www.techpowerup.com/347208/amd-releases-ryzen-chipset-driver-8-02-18-557
2026-03-09T18:27:30+00:00Intel、リアルタイム性能を備えたCore Series 2プロセッサを発売し、エッジAIポートフォリオを拡充Intel Launches Core Series 2 Processor with Real-Time Performance and Expands Edge AI Portfoliohttps://www.techpowerup.com/347205/intel-launches-core-series-2-processor-with-real-time-performance-and-expands-edge-ai-portfolio
2026-03-09T18:11:02+00:00GoDeal24の女性の日ソフトウェアセール:驚愕の価格で必要なソフトウェアを入手しよう!GoDeal24 Women’s Day Software Sale: Get the Software You Need at Jaw-Dropping Prices!https://www.techpowerup.com/347142/godeal24-womens-day-software-sale-get-the-software-you-need-at-jaw-dropping-prices
2026-03-09T17:54:34+00:00EA、発売周辺の記録的な利益にもかかわらず、複数のスタジオで『Battlefield 6』開発者を解雇EA Lays Off Battlefield 6 Devs Across Multiple Studios Despite Record Profits Around Launchhttps://www.techpowerup.com/347200/ea-lays-off-battlefield-6-devs-across-multiple-studios-despite-record-profits-around-launch
2026-03-09T17:44:29+00:00Intel、公式XeSS 3.0ソフトウェア開発キットをリリースIntel Releases Official XeSS 3.0 Software Development Kithttps://www.techpowerup.com/347202/intel-releases-official-xess-3-0-software-development-kit
2026-03-09T16:43:34+00:00Xiaomi Book 14、Panther Lake CPU、32GB RAM、Arc B390 iGPU搭載でリーク情報が明らかにXiaomi Book 14 Leaks With Panther Lake CPU, 32 GB RAM, Arc B390 iGPUhttps://www.techpowerup.com/347195/xiaomi-book-14-leaks-with-panther-lake-cpu-32-gb-ram-arc-b390-igpu
2026-03-09T16:33:10+00:00Intuit QuickBooks、永久ライセンスを提供中でセール実施中Intuit QuickBooks Now Offers a Lifetime License, and It’s on Salehttps://www.techpowerup.com/346953/intuit-quickbooks-now-offers-a-lifetime-license-and-its-on-sale
2026-03-09T16:22:45+00:00Montech、Sky 3ミッドタワーケースシリーズを発売Montech Launches Sky 3 Mid-Tower Case Serieshttps://www.techpowerup.com/347198/montech-launches-sky-3-mid-tower-case-series
2026-03-09T16:05:44+00:00Akasa、Pascal MX防水・ファンレス(薄型)Mini-ITXインダストリアルケースを発表Akasa Unveils Pascal MX Waterproof Fanless (Thin) Mini-ITX Industrial Casehttps://www.techpowerup.com/347197/akasa-unveils-pascal-mx-waterproof-fanless-thin-mini-itx-industrial-case
2026-03-09T15:36:45+00:00Samsung、GDC 2026で裸眼3DおよびHDR10+対応のゲーム体験を披露Samsung Showcases Glasses-Free 3D and HDR10+ Gaming at GDC 2026https://www.techpowerup.com/347196/samsung-showcases-glasses-free-3d-and-hdr10-gaming-at-gdc-2026
2026-03-09T15:20:42+00:00NVIDIA、GDC 2026向けにGeForce ONコミュニティアップデートを準備NVIDIA Prepares GeForce ON Community Update for GDC 2026https://www.techpowerup.com/347194/nvidia-prepares-geforce-on-community-update-for-gdc-2026
EETimes Taiwan
2026-03-09AI駆動によるチップ装置投資ブーム、2027年に歴史的記録を更新へAI驅動晶片設備投資潮 2027年將破歷史紀錄https://www.eettaiwan.com/20260309nt31-ai-drives-capex-chip-equipment-to-record-156b-in-2027/
2026-03-09ガラス基板:チップ封装における次なる『材料革命』玻璃基板:晶片封裝的下一場「材料革命」https://www.eettaiwan.com/20260309nt61-glass-substrates-represent-the-next-materials-revolution/
2026-03-092026年、世界のAIサーバー出荷台数が前年比28%以上増加2026年全球AI伺服器出貨年增逾28%https://www.eettaiwan.com/20260309nt21-2026-global-ai-server-shipment/
EETimes Asia
2026-03-09Arrow ElectronicsとInfineonがモーター制御アプリケーション向けリファレンスデザインで協力Arrow Electronics and Infineon Collaborate on Reference Design for Motor Control Applicationshttps://www.eetasia.com/arrow-electronics-and-infineon-collaborate-on-reference-design-for-motor-control-applications/
2026-03-09imecとAtlasが合成DNAベースのデジタルデータ記憶技術で連携imec and Atlas Collaborate on Synthetic DNA-based Digital Data Storagehttps://www.eetasia.com/imec-and-atlas-collaborate-on-synthetic-dna-based-digital-data-storage/
2026-03-09TI、NVIDIAと提携し次世代物理AIの実現を加速TI Partners with NVIDIA to Accelerate Next-gen Physical AIhttps://www.eetasia.com/ti-partners-with-nvidia-to-accelerate-next-gen-physical-ai/
2026-03-09トップ5のNANDフラッシュサプライヤー、2025年第4四半期で24%のQoQ収益成長を達成Top Five NAND Flash Suppliers Post 24% QoQ Revenue Growth in 4Q 2025https://www.eetasia.com/top-five-nand-flash-suppliers-post-24-qoq-revenue-growth-in-4q-2025/
2026-03-09AV Innovations、CES 2026で注目を集めるAV Innovations Take Center Stage at CES 2026https://www.eetasia.com/av-innovations-take-center-stage-at-ces-2026/
EETimes India
2026-03-09MAHEがインドの量子ハードウェア・エコシステムを推進するためのハブを設立MAHE Establishes Hub to Advance India’s Quantum Hardware Ecosystemhttps://www.eetindia.co.in/mahe-establishes-hub-to-advance-indias-quantum-hardware-ecosystem/
ZDNET Korea
2026-03-10AMD, CPU強化されたライゼン組み込みSoCでエッジAI攻略拡大AMD, CPU 강화한 라이젠 임베디드 SoC로 엣지 AI 공략 확대https://www.zdnet.co.kr/20260309193736%22%20title=%22
2026-03-09ブースターズ、ビューティーブランドのイコルベリ正規品認証アプリを発売부스터스, 뷰티 브랜드 이퀄베리 정품 인증 앱 출시https://www.zdnet.co.kr/20260309235653%22%20title=%22
2026-03-09ガヒ、コスメックスと『キャビア PDRN』の商用化に成功가히, 코스맥스와 ‘캐비아 PDRN’ 상용화 성공https://www.zdnet.co.kr/20260309235224%22%20title=%22
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2026-03-09[カードニュース] ガソリン価格が突然2倍になりました[카드뉴스] 기름값이 갑자기 2배가 됐어요https://www.zdnet.co.kr/20260309140438%22%20title=%22
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2026-03-09“新たな出発 BoB”…KISA、15期メンター募集“새출발 BoB”…KISA, 15기 멘토 모집https://www.zdnet.co.kr/20260309172104%22%20title=%22
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中央日報
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BAIDU
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