Semiconductor News 20260227

TOC

Main News

  1. NVIDIA Posts Record Revenues, Allaying AI Investment Bubble Concerns
    NVIDIA’s revenues for the fourth quarter of fiscal year 2026 reached a record high, up 73 percent year over year and up 65 percent for the year as well. The strong quarterly results and high guidance allayed concerns about the AI investment bubble that had been whispered in the market. On the other hand, there was a mix of hope and caution among investors in the U.S. stock market, with NVIDIA shares temporarily down 6 percent due to AI concerns.
  2. Samsung to Exit 2D NAND Business, Convert to Advanced DRAM Production
    Samsung Electronics will reportedly exit its final 2D NAND production line as early as March, withdrawing completely from the business. The corresponding Line 12 facility in Hwaseong will be converted to a final processing plant for next-generation 1c DRAM. This is seen as a strategic shift to optimize production resources by strengthening the company’s focus on high-value-added memory for AI, for which demand is rapidly increasing.
  3. Apple Secures DRAM from Samsung at Double Price Amid Soaring Memory Prices
    As global memory prices continue to soar, Apple has reportedly secured DRAM supplies from Samsung at double the previous price. It appears that the company is also considering the possibility of using Chinese-made memory as a bargaining chip. On the other hand, Samsung’s next smartphone, the Galaxy S26, will share DRAM supply with Micron on a 50/50 basis as a cost measure, and companies are struggling to procure memory.
  4. SambaNova Raises $350 Million to Develop AI Chip to Compete with Nvidia
    AI semiconductor startup SambaNova Systems has raised $350 million in new funding to develop a new AI inference chip targeting Nvidia’s B200 The new chip is five times faster than its predecessor. The new chip is said to be five times faster than its predecessor and aims to enter the market with a solution that enables faster and more efficient inference processing to compete with Nvidia’s dominant share of the AI infrastructure market.
  5. SK Hynix and Sandisk Launch Standardization of Next-Generation Memory HBF
    SK Hynix and Sandisk have launched a global standardization effort for HBF (High-Bandwidth Fabric), which is expected to be the next-generation standard for the current mainstream HBM. The HBF market is expected to expand rapidly by 2030, and major memory makers are now in a full-scale battle for the leadership of memory for next-generation AI infrastructure and the creation of an ecosystem.
  6. Several Chinese Power Semiconductor Manufacturers to Raise Prices by More Than 10 Percent Starting in March
    Several Chinese power semiconductor manufacturers have announced plans to raise the prices of their products starting in March. The price increase is expected to reach at least 10 percent. The price revisions are reportedly due to rising raw material costs and tight production capacities. While demand for power semiconductors for electric vehicles and industrial equipment is firm, the cost increase is affecting the entire supply chain.
  7. Chinese Team Achieves Important Technological Breakthrough in Semiconductor Star Materials Research
    A Chinese research team has reportedly achieved and successfully demonstrated an important breakthrough in star materials research in the semiconductor field. While U.S. export restrictions limit access to advanced semiconductor technology, China is focusing on basic research and the development of new materials, and is making steady progress toward domestic production to build a self-sustaining semiconductor supply chain.
  8. Malaysian Government Launches Investigation Over Arm Deal
    Malaysian authorities have reportedly launched an investigation related to a deal with British company Arm. The investigation appears to be taking place against a backdrop of seizures, arrests, and the political fallout associated with them. Since the case involves Arm, a world leader in semiconductor design IP, it may affect the business environment in Malaysia, which aims to become a hub of the semiconductor industry in Southeast Asia, and its relationship with multinational companies.
  9. Japan Supports Expansion of India’s Semiconductor Industry, from Manufacturing Equipment to Human Resources
    As India is making a national effort to foster its semiconductor industry and attract manufacturing bases, Japan is leading the expansion. Cooperative arrangements are being established in a wide range of fields, from the supply of semiconductor manufacturing equipment to human resource development for engineers. India’s fiscal year budget also shows priority investment in semiconductors and manufacturing, and a new global supply chain is expected to be established through Japan-India collaboration.
  10. ROHM Forms Alliance with TSMC to Establish Integrated Production System for GaN Power Semiconductors
    ROHM, a Japanese semiconductor manufacturer, has signed a technology license agreement with TSMC, the world’s largest foundry, to establish an integrated production system for GaN (gallium nitride) power semiconductors, the next-generation compound semiconductor, within the group. The company has concluded a technology license agreement with TSMC, the world’s largest foundry, to establish an integrated production system for GaN power semiconductors within the Group. In anticipation of growing demand for GaN devices that enable highly efficient power conversion, ROHM aims to strengthen its competitiveness in mass production by incorporating world-class manufacturing technology.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Feb 26Nvidiaの好調な四半期決算と高いガイダンスが、AI投資バブルへの懸念を和らげるNvidia’s strong quarter and outsized guidance soothe fears of an AI investment bubblehttps://www.digitimes.com/news/a20260226VL200/nvidia-guidance-investment-revenue-demand.html
Feb 26サムスン、報道によると2D NAND事業から撤退し、ファワソンライン12を1セルDRAM最終工程工場に転換Samsung reportedly exits 2D NAND, converts Hwaseong Line 12 to 1c DRAM end fabhttps://www.digitimes.com/news/a20260226PD226/samsung-dram-nand-planar-3d-production.html
Feb 26マレーシア、押収や逮捕、政治的影響を背景にArm社との取引を捜査Malaysia probes Arm deal amid seizures, arrests and political fallouthttps://www.digitimes.com/news/a20260226VL206/arm-probe-edge-government-investigation.html
Feb 26Nvidia GTC 2026、謎のチップ、シリコンフォトニクス、電力制限に注目Nvidia GTC 2026 to spotlight mystery chip, silicon photonics, and power limitshttps://www.digitimes.com/news/a20260226PD203/nvidia-gtc-siph-electricity-2026.html
Feb 26必然の敵友関係:台湾と韓国が展開するAIバランス戦略Frenemies by necessity: Taiwan and South Korea’s AI balancing acthttps://www.digitimes.com/news/a20260225VL212/taiwan-industrial-tsmc-samsung-technology.html
Feb 27, 04:23Yageo、AI注文で2026年第1四半期の好調を見込み;メモリ不足はまだ需要に影響していないYageo sees strong 1Q26 on AI orders; memory shortage yet to hit demandhttps://www.digitimes.com/news/a20260226PD231/yageo-passive-components-demand-revenue-2026.html
Feb 27, 04:21TSMC、日本のサプライヤーに台湾での電解めっき添加剤の現地生産を促すTSMC pushes Japanese suppliers to localize electroplating additives in Taiwanhttps://www.digitimes.com/news/a20260226PD234/tsmc-demand-production-taiwan-inspection.html
Feb 27, 03:21Galaxy S26、DRAMをMicronと50対50で分担、一方でAppleはSamsungから倍額で供給を確保Galaxy S26 splits DRAM 50-50 with Micron as Apple locks in Samsung supply at double pricehttps://www.digitimes.com/news/a20260226PD227/samsung-galaxy-micron-dram-price.html
Feb 27, 03:20図表:台湾のIC設計セクターが迎える2026年初頭の売上急増からの5つの重要ポイントChart: Five key takeaways from Taiwan’s IC design sector’s early 2026 revenue surgehttps://www.digitimes.com/news/a20260226VL220/taiwan-ic-design-ip-revenue-2026.html
Feb 27, 03:19機器から人材まで、日本がインドの半導体産業拡大を牽引へFrom equipment to talent, Japan moves to anchor India’s chip expansionhttps://www.digitimes.com/news/a20260226VL219/japan-india-ic-manufacturing-equipment-talent.html
Feb 27, 02:20SambaNova、NvidiaのB200を狙い、従来の5倍速AI推論チップを開発、3億5000万ドルを調達SambaNova targets Nvidia’s B200 with 5x faster AI inference chip, secures US$350Mhttps://www.digitimes.com/news/a20260226VL211/ai-chip-nvidia-ai-inference-startup-processor.html
Feb 27, 00:16ノーベル賞受賞者ジョン・マーティニス、量子コンピューティングがラボから工場へと広がる産業革命を解説Nobel laureate John Martinis explains quantum computing’s industrial revolution from lab to fabhttps://www.digitimes.com/news/a20260226VL221/quantum-computing-taiwan-training-technology.html
Feb 26台湾のパワーデバイスメーカーAPEC、AIサーバー需要急増で高電圧MOSFETやファンの需要が上昇AI server surge lifts high-voltage MOSFET, fan demand at Taiwan power device maker APEChttps://www.digitimes.com/news/a20260226PD230/2025-apec-ai-server-power-supply-demand.html
Feb 26WinWay、AI主導の需要で2025年記録更新を見込み、高雄への拡大を計画WinWay sees AI-driven demand push 2025 records, plans Kaohsiung expansionhttps://www.digitimes.com/news/a20260226PD229/winway-expansion-test-interface-revenue-2025.html
Feb 26Macronix、1月の利益が195%急増;OSEおよびWaltonの収益も上昇Macronix January profit surges 195%; OSE, Walton earnings risehttps://www.digitimes.com/news/a20260226PD228/ose-profit-earnings-market-testing.html
Feb 26『AI将軍』登場:OpenAI報告書が明かす日本・台湾回廊における中国の自動化作戦The ‘AI general’ emerges: OpenAI report details China’s automated operations in Japan-Taiwan corridorhttps://www.digitimes.com/news/a20260226VL214/openai-asia.html
日経 Tech Foresight
マイナビニュース テックプラス
2026-02-26AMD、vRANワークロード向け第5世代EPYC「EPYC 8005シリーズ」を発表https://news.mynavi.jp/techplus/article/20260226-4168680/
2026-02-26NXP、10BASE-T1S準拠の量産対応PMDトランシーバ2製品を発表https://news.mynavi.jp/techplus/article/20260226-4168230/
2026-02-26ロームがGaNパワー半導体のグループ内一貫生産体制構築へ、TSMCと技術ライセンス契約https://news.mynavi.jp/techplus/article/20260226-4167917/
2026-02-26NVIDIAの2026年会計年度第4四半期の売上高は前年同期比73%増、通期も65%増と過去最高を更新https://news.mynavi.jp/techplus/article/20260226-4167835/
2026-02-26AMATが2026年版のサプライヤーエクセレンス賞受賞企業12社を発表、日本からは3社が受賞https://news.mynavi.jp/techplus/article/20260226-4167739/
2026-02-26インドネシアの政府系投資機関がArmと提携、15000人のエンジニアトレーニングを計画https://news.mynavi.jp/techplus/article/20260226-4164789/
TrendForce
2026-02-26報道によると、魅族はメモリコスト高騰の影響で発売を中止した後、3月にスマートフォン市場から撤退する可能性を模索しているMeizu Reportedly Eyes March Smartphone Exit After Scrapping Launch Amid Memory Costs Surgehttps://www.trendforce.com/news/2026/02/26/news-meizu-reportedly-eyes-march-smartphone-exit-after-scrapping-launch-amid-memory-costs-surge/
2026-02-26報道によると、アップルはメモリコストの上昇を背景に、サムスンやSK hynixに対抗するため、中国製メモリを交渉材料として活用する可能性を検討しているApple Reportedly Eyes Chinese Memory as Leverage Against Samsung, SK hynix Amid Rising Costshttps://www.trendforce.com/news/2026/02/26/news-apple-reportedly-eyes-chinese-memory-as-leverage-against-samsung-and-sk-hynix-amid-rising-costs/
2026-02-26報道によると、サムスンは最終の2D NANDラインを早ければ3月に終了し、施設を1C DRAM向けに転用するSamsung Reportedly Ends Last 2D NAND Line as Early as March, Repurposes Facility for 1C DRAMhttps://www.trendforce.com/news/2026/02/26/news-samsung-reportedly-ends-last-2d-nand-line-as-early-as-march-repurposes-facility-for-1c-dram/
2026-02-26報道によると、SK hynixとSandiskはHBFのグローバル標準化を始動し、市場は2030年までに急拡大すると予測されているSK hynix & Sandisk Kick Off Global Standardization of HBF, Market Set to Surge by 2030https://www.trendforce.com/news/2026/02/26/news-sk-hynix-sandisk-kick-off-global-standardization-of-hbf-market-set-to-surge-by-2030/
2026-02-26メモリ大手によるHBMクリーンルームレース:サムスンとSK hynixは推進を加速する中、ミクロンは買収を実施Memory Giants’ HBM Cleanroom Race: Samsung & SK hynix Fast-Track, Micron Acquireshttps://www.trendforce.com/news/2026/02/26/news-memory-giants-hbm-cleanroom-race-samsung-sk-hynix-fast-track-micron-acquires/
Semiconductor Digest
6 hours agoジェームズ・レッドストーン氏、SIAの政府関係担当ディレクターに就任James Redstone Joins SIA as Director of Government Affairshttps://www.semiconductor-digest.com/james-redstone-joins-sia-as-director-of-government-affairs/
7 hours ago初のAI駆動型SoC検証ソリューションが誕生First AI-Driven SoC Verification Solution Createdhttps://www.semiconductor-digest.com/first-ai-driven-soc-verification-solution-created/
7 hours agoより持続可能な未来のために、ファブ内で削減と再利用を推進Reduce and Reuse in the Fab for a More Sustainable Futurehttps://www.semiconductor-digest.com/reduce-and-reuse-in-the-fab-for-a-more-sustainable-future/
日本経済新聞
2026-02-27NVIDIA株一時6%安、AI不安で薄れた神通力 米国株の伸びG7最低https://www.nikkei.com/article/DGXZQOGN26BXP0W6A220C2000000/
2026-02-27AI相場に疲れた米投資家、「トイレットペーパー」に逃避https://www.nikkei.com/article/DGXZQOUB26BS90W6A220C2000000/
2026-02-27AI投資リスク懸念のコアウィーブ、26日決算 売り上げ倍増も赤字予想https://www.nikkei.com/article/DGXZQOGN26C7I0W6A220C2000000/
2026-02-27米国株15時、ダウ小幅続伸 エヌビディア安は重荷https://www.nikkei.com/article/DGXZQOFL26BU30W6A220C2000000/
2026-02-27純利益率の首位はオービック 4〜12月、上位にゲームや半導体関連https://www.nikkei.com/article/DGXZQOUB196NN0Z10C26A2000000/
2026-02-27カローラやノート、10年で6〜7割値上がり 安全・燃費対応でコスト増https://www.nikkei.com/article/DGXZQOUC076GD0X01C25A0000000/
2026-02-27放射線量高くてもWi-Fi 科学大がチップ、原発の廃炉作業などにhttps://www.nikkei.com/article/DGXZQOSG1950Z0Z10C26A2000000/
2026-02-27関西企業の純利益3%増 26年3月期、AI特需や万博後の消費堅調https://www.nikkei.com/article/DGXZQOUF253PM0V20C26A2000000/
2026-02-27トランプ関税、企業は「不可欠性」磨け JETRO米州課長https://www.nikkei.com/article/DGXZQOCD262A00W6A220C2000000/
2026-02-27外国人共生策、サナエノミクスの成否占う 先進事例は地方に学べhttps://www.nikkei.com/article/DGXZQOUA230ES0T20C26A2000000/
ダイヤモンドオンライン
Feb 25 21:35【知っておきたいビジネス科学】取り組む企業の数が“最も多い”量子コンピュータの実現方法とは?https://diamond.jp/articles/-/384578
Feb 25 21:15「エージェントAI」時代に17戦略分野選定に意味はあるのか、高市「危機管理・成長投資」の死角https://diamond.jp/articles/-/384585
Feb 24 19:25高市「危機管理・成長投資」は経済安全保障と成長の二兎を追えるのか、実現の鍵は採算性チェックhttps://diamond.jp/articles/-/384503
Feb 24 03:40トランプ関税と引き換え「対米85兆円投資」で参画する日本企業はウハウハ…とはならない明白な理由https://diamond.jp/articles/-/384448
Tom’s Hardware
TechPowerup
2026-02-26T16:02:47+00:00NVIDIA、GeForce 595.59 WHQL ゲームレディドライバーをリリースNVIDIA Releases GeForce 595.59 WHQL Game Ready Drivershttps://www.techpowerup.com/346802/nvidia-releases-geforce-595-59-whql-game-ready-drivers
2026-02-26T20:23:03+00:00Running With Scissorsが「Flesh & Wire」を公開、2027年に新規IP登場予定Running With Scissors Reveals Flesh & Wire, New IP Coming in 2027https://www.techpowerup.com/346812/running-with-scissors-reveals-flesh-wire-new-ip-coming-in-2027
2026-02-26T20:00:05+00:00Marathonがサーバースラム前にSteamセールチャートでトップに躍り出るMarathon Tops Steam Sales Charts Ahead of Server Slamhttps://www.techpowerup.com/346807/marathon-tops-steam-sales-charts-ahead-of-server-slam
2026-02-26T19:50:38+00:00ACEMAGIC K1 Mini PC (Core i5-12600H)―プレミアムな性能を手頃な価格でACEMAGIC K1 Mini PC (Core i5-12600H)—Premium Performance Without the Premium Pricehttps://www.techpowerup.com/346734/acemagic-k1-mini-pc-core-i5-12600h-premium-performance-without-the-premium-price
2026-02-26T19:41:10+00:00NVIDIA、広範な不具合報告を受けGeForce 595.59 WHQL ゲームレディドライバーを撤回NVIDIA Pulls GeForce 595.59 WHQL Game Ready Driver After Widespread Bug Reportshttps://www.techpowerup.com/346811/nvidia-pulls-geforce-595-59-whql-game-ready-driver-after-widespread-bug-reports
2026-02-26T19:29:29+00:00Microsoft、DirectX 12 シェーダーモデル 6.9とDirect3D 12の新機能を発表Microsoft Intros DirectX 12 Shader Model 6.9 and New Direct3D 12 Improvementshttps://www.techpowerup.com/346810/microsoft-intros-directx-12-shader-model-6-9-and-new-direct3d-12-improvements
2026-02-26T19:20:18+00:00Windows 10搭載のPCは安全ではないが、Windows 11 Proは現在たったの13ドル(定価199ドル)Computers Running Windows 10 Aren’t Safe, But Windows 11 Pro Is Only $13 Right Now (Reg. $199)https://www.techpowerup.com/345912/computers-running-windows-10-arent-safe-but-windows-11-pro-is-only-usd-13-right-now-reg-usd-199
2026-02-26T19:11:06+00:00初期のAMD FSR 4.1 DLLアップデートが小規模な視覚改善と共にリークされた模様Early AMD FSR 4.1 DLL Update Reportedly Leaks with Minor Visual Improvementshttps://www.techpowerup.com/346795/early-amd-fsr-4-1-dll-update-reportedly-leaks-with-minor-visual-improvements
2026-02-26T19:06:36+00:00Spellcasters Chroniclesがアーリーアクセスに突入、Steamで配信開始Spellcasters Chronicles Enters Early Access, Now Available on Steamhttps://www.techpowerup.com/346808/spellcasters-chronicles-enters-early-access-now-available-on-steam
2026-02-26T18:06:44+00:00Keychron、V10 Ultra 75% エルゴノミックメカニカルキーボードとV0 Ultra Num Padを発表Keychron Announces V10 Ultra 75% Ergonomic Mechanical Keyboard and V0 Ultra Num Padhttps://www.techpowerup.com/346806/keychron-announces-v10-ultra-75-ergonomic-mechanical-keyboard-and-v0-ultra-num-pad
2026-02-26T17:49:42+00:00AMD Software Adrenalin 26.2.2 WHQL ドライバーがリリースAMD Software Adrenalin 26.2.2 WHQL Drivers Releasedhttps://www.techpowerup.com/346805/amd-software-adrenalin-26-2-2-whql-drivers-released
2026-02-26T17:19:51+00:00折りたたみ式のLenovo Legion Go ゲーミングハンドヘルドコンセプトがリークで登場Foldable Lenovo Legion Go Gaming Handheld Concept Appears in Leakhttps://www.techpowerup.com/346804/foldable-lenovo-legion-go-gaming-handheld-concept-appears-in-leak
2026-02-26T16:43:09+00:00Awekeys、キックスターターで全金属製ロー・プロファイルキーキャップを発売Awekeys Launches All-Metal Low-Profile Keycaps on Kickstarterhttps://www.techpowerup.com/346799/awekeys-launches-all-metal-low-profile-keycaps-on-kickstarter
2026-02-26T16:15:29+00:00Broadcom、業界初の2nmカスタム・コンピュートSoCを、3.5D eXtreme Dimension System in Packageプラットフォーム上で出荷Broadcom Ships Industry First 2 nm Custom Compute SoC Built on Its 3.5D eXtreme Dimension System in Package Platformhttps://www.techpowerup.com/346803/broadcom-ships-industry-first-2-nm-custom-compute-soc-built-on-its-3-5d-extreme-dimension-system-in-package-platform
2026-02-26T15:39:15+00:00NVIDIA GeForce NOW、CapcomのResident Evil: Requiemを究極のメンバーシッププロモーション付きで公開NVIDIA GeForce NOW Unleashes Capcom’s Resident Evil: Requiem With Ultimate Membership Promotionhttps://www.techpowerup.com/346800/nvidia-geforce-now-unleashes-capcoms-resident-evil-requiem-with-ultimate-membership-promotion
2026-02-26T15:29:33+00:00TCL CSOT、MWC 2026でスーパー・ピクセル・テクノロジーを公開予定TCL CSOT to Unveil Super Pixel Technology at MWC 2026https://www.techpowerup.com/346798/tcl-csot-to-unveil-super-pixel-technology-at-mwc-2026
2026-02-26T15:13:16+00:00JEDEC、ユニバーサルフラッシュストレージ(UFS)およびメモリーインターフェース規格の更新を発表JEDEC Announces Updates to Universal Flash Storage (UFS) and Memory Interface Standardshttps://www.techpowerup.com/346797/jedec-announces-updates-to-universal-flash-storage-ufs-and-memory-interface-standards
2026-02-26T15:00:31+00:00Phanteks、新型360M25 LCD AIO液体CPUクーラーを発表Phanteks Announces the All-New 360M25 LCD AIO Liquid CPU Coolerhttps://www.techpowerup.com/346769/phanteks-announces-the-all-new-360m25-lcd-aio-liquid-cpu-cooler
EETimes Taiwan
2026-02-26AIはどのようにして部品サプライチェーンの『ブルウィップ効果』を解消するかAI如何協助消除元件供應鏈的「長鞭效應」https://www.eettaiwan.com/20260226nt61-ai-s-role-in-ending-the-component-bullwhip-effect/
2026-02-26高電圧とゾーンアーキテクチャの融合がSDVを牽引 EV電力革命進行中高壓、分區架構融合SDV EV電力革命進行式https://www.eettaiwan.com/20260226nt51-high-voltage-and-zonal-architectures-power-the-ev-sdv-revolution/
2026-02-26SEMI:2025年、世界のシリコンウエハ出荷量が成長軌道に復帰SEMI:2025全球矽晶圓出貨量重返成長軌道https://www.eettaiwan.com/20260226nt21-202-global-si-wafer-shipments/
2026-02-25インドの財政年度予算、半導体・製造業・税制改革に重点印度財政年度預算聚焦半導體、製造業與稅改https://www.eettaiwan.com/20260225nt61-india-budget-2026-2027-semiconductors-manufacturing-and-tax-reforms/
2026-02-25窒化ガリウムの重要な転機:リーダーの視点から見るシンガポール半導体の次の一手氮化鎵的關鍵時刻:從領導者視角看見新加坡半導體的下一步https://www.eettaiwan.com/20250225nt31-singapore-gan-development/
2026-02-25エージェンティックAIがMWC 2026のメインテーマにAgentic AI成MWC 2026最大主軸https://www.eettaiwan.com/20260224nt21-mwc-2026-spindle/
2026-02-25中国の5大ヒューマノイドロボット企業がAW 2026に登場中國五大人形機器人企業亮相AW 2026https://www.eettaiwan.com/20260225nt22-chinas-humanoid-robot-big-5-confirm-participation-in-aw-2026/
EETimes Asia
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2026-02-26業界ベテランのベン・リー氏がEfinixの戦略顧問に就任Industry Veteran Ben Lee Appointed Strategic Advisor at Efinixhttps://www.eetasia.com/industry-veteran-ben-lee-appointed-strategic-advisor-at-efinix/
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2026-02-26中国が2025年の世界スマートウォッチ出荷成長を牽引China Fuels Global Smartwatch Shipment Growth in 2025https://www.eetasia.com/china-fuels-global-smartwatch-shipment-growth-in-2025/
2026-02-252030年までにOLEDがディスプレイ装置への支出を席巻OLED to Dominate Display Equipment Spending by 2030https://www.eetasia.com/oled-to-dominate-display-equipment-spending-by-2030/
2026-02-25ルネサス、車載SoC向けに3nm TCAM技術を展開Renesas 3nm TCAM Technology Targeted at Automotive SoCshttps://www.eetasia.com/renesas-3nm-tcam-technology-targeted-at-automotive-socs/
2026-02-25台湾のITRI、 新竹で先進半導体研究開発センターの建設を開始Taiwan’s ITRI Breaks Ground on Advanced Semiconductor R&D Center in Hsinchuhttps://www.eetasia.com/taiwans-itri-breaks-ground-on-advanced-semiconductor-rd-center-in-hsinchu/
2026-02-252026年のヒューマノイドとロボティクス:『フィジカルAI』時代の早期現実Humanoids & Robotics in 2026: Early Reality of the “Physical AI” Erahttps://www.eetasia.com/humanoids-robotics-in-2026-early-reality-of-the-physical-ai-era/
EETimes India
2026-02-26IDC:2025年、インドのスマートフォン市場は横ばいIDC: India Smartphone Market Flat in 2025https://www.eetindia.co.in/idc-india-smartphone-market-flat-in-2025/
2026-02-25ルネサスの3nm TCAM技術、車載用SoCを狙うRenesas 3nm TCAM Technology Targeted at Automotive SoCshttps://www.eetindia.co.in/renesas-3nm-tcam-technology-targeted-at-automotive-socs/
2026-02-25GaNの技術的優位性:EPCが電力変換においてMOSFETに勝つ理由GaN’s Technological Superiority: How EPC is Winning Against MOSFETs in Power Conversionhttps://www.eetindia.co.in/gans-technological-superiority-how-epc-is-winning-against-mosfets-in-power-conversion/
2026-02-25インド、半導体労働力戦略をAIと製造の目標に連携India Links Semiconductor Workforce Strategy to AI and Manufacturing Goalshttps://www.eetindia.co.in/india-links-semiconductor-workforce-strategy-to-ai-and-manufacturing-goals/
ZDNET Korea
2026-02-27ロッテハイマート、サムスン『ギャラクシーS26シリーズ』購入特典提供롯데하이마트, 삼성 ‘갤럭시S26 시리즈’ 구매 혜택 제공https://www.zdnet.co.kr/20260226230054” title=”
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中央日報
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