Semiconductor News 20260205

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1. SK H ynix Makes Breakthrough in HBM4 Quality Testing to Supply NVIDIA’s Next Generation
   SK Hynix has made significant progress in quality testing of its next-generation high-bandwidth memory, HBM4, to supply NVIDIA’s next-generation AI chip, Rubin. Korean experts are also predicting the arrival of the “HBF” (High-Bandwidth Fabric) era beyond HBM, and the company is poised to lead the intensifying memory development competition by maintaining its technological edge in the AI server market and deepening cooperation with key customers.
2. SpaceX acquires xAI to build 1 TW-class “on-orbit data center” in space
   SpaceX, led by Elon Musk, has acquired the AI company xAI and launched a grand plan to build a data center in space. The plan is to deploy 1 TW years worth of computing power in orbit, utilizing 1 million tons of satellite launch capacity per year. By utilizing the space environment, which is not constrained by terrestrial power grids and cooling facilities, the company aims to secure the vast resources needed for AI learning and to push the limits of infrastructure.
3. OpenAI Seeks to Break Dependence on NVIDIA for Inference Chips and Looks to Alternative Vendors
   OpenAI is looking to alternative chip vendors such as Groq and Cerebras to reduce its reliance on NVIDIA GPUs for AI inference processing. With the urgent need to reduce costs and improve efficiency in AI operations, we are looking for strategies that are not tied to a specific hardware supply. As the software giant moves to diversify its hardware offerings in response to NVIDIA’s dominant market share, commercial opportunities are opening up for competitors.
4. Chinese AI Chips Expand on a Large Scale, Threatening NVIDIA’s Market Share and Accelerating Domestic Production
   Chinese AI chip makers are expanding their product deployment and beginning to chip away at NVIDIA’s dominant share of the Chinese market. As U.S. export restrictions make high-performance chips more difficult to obtain, local companies such as Huawei are increasing their technological capabilities and switching to domestically produced chips. Shanghai has also added the development of 4th generation semiconductors to its roadmap, and the construction of a self-sufficient semiconductor ecosystem is proceeding at a rapid pace under the support of the entire country.
5. Intel Seeks Re-entry into Memory Market Amid Delay Concerns over Next-Generation 14A Process
   Skepticism has emerged over Intel’s mass production schedule for its next-generation “14A” process in terms of production capacity and reliability. Meanwhile, the company is reportedly considering re-entering the DRAM market using “Z-Angle” technology through a collaboration with SoftBank. Faced with the challenge of restructuring its manufacturing division, Intel’s complex shift in strategy to secure new sources of revenue and diversify its technology portfolio is highlighted.
6. Rising Memory Prices Hit IC Design Firms; Realtek, Others Raise Product Prices
   Rising memory prices are putting pressure on the bottom line for IC design firms, with major firms such as Realtek, MediaTek, and Airoha raising product prices in response to rising OSAT costs and memory procurement costs. The concentration of production in advanced memory due to AI demand has led to shortages in general-purpose products, increasing inflationary pressure throughout the supply chain, which is being passed on in prices to end products.
7. China’s YMTC Enters LPDDR5 Market to Diversify Memory Products
   Chinese NAND flash giant YMTC has entered the LPDDR5 market, a DRAM for mobile applications. By expanding its business into the DRAM field in addition to the NAND field, where it has been strong, YMTC aims to establish itself as a comprehensive memory solution provider. This is a strategic move to strengthen our product portfolio while responding to the demand for greater supply chain self-sufficiency in China.
8. DISCO Maintains Over 90% Global Market Share in Back-end Equipment for Gener ative AI
   DISCO, a Japanese semiconductor equipment manufacturer, has revealed that it holds over 90% of the global market share in back-end equipment for cutting, grinding, and polishing, which is essential for the production of semiconductors for generative AI. The company’s advanced technological capabilities and dominant position are strong drivers of its performance, as demand for advanced processing technologies such as HBM and 2.5D packages is rapidly increasing in line with the
9. Nittobo and Samsung are focusing on the development of “glass substrates,” a key to the evolution of AI semiconductors.
   Attention is rapidly turning to “glass substrates” as a next-generation semiconductor packaging technology. Nittobo is developing high-performance glass materials required by U.S. tech companies, and Samsung is accelerating its glass substrate business, aiming for full-scale operation in 2027. Compared to conventional plastic substrates, glass substrates have superior flatness and thermal stability, and competition for practical application is intensifying as an important technology for further miniaturization and enlargement of AI semiconductors.
10. AMD’s Net Income Triples on Strong AI Semiconductor Sales
    AMD’s October-December 2025 financial results showed a threefold jump in net income over the same period last year, helped by increased sales of AI semiconductors. Sales of GPUs for data centers have been strong, and the company is steadily expanding its market share in a market where NVIDIA is considered to be the dominant player. We are also working to strengthen our manufacturing ecosystem, such as by supporting Powertech’s FOPLP technology with Broadcom, and are increasing our presence in the AI market.

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