Semiconductor News 20260204

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1. SK Hynix Makes Breakthrough in HBM4 Quality Testing, Aims to Supply Nvidia Rubin
   SK Hynix has made significant progress in quality testing of its next-generation broadband memory, HBM4, and is aiming for a stable supply for Nvidia’s next-generation AI chip, Rubin AI Server As competition in the market intensifies, our strategy is to maintain our leadership in HBM technology and deepen our partnerships with key customers. Korean experts are also predicting the arrival of the “HBF (High Bandwidth Fabric)” era beyond HBM, and technological innovation is accelerating.
2. SpaceX acquires xAI, grand plans to build an in-orbit data center
   SpaceX, led by Elon Musk, has acquired the AI company xAI and launched plans to realize an “in-orbit data center” in space. The idea is to launch 1 million tons of satellites per year and deploy 1 TW (terawatt) year worth of computing power in orbit. By utilizing the space environment, which is not subject to power constraints on the ground, the plan aims to secure the vast computing resources needed for AI learning and inference and to break through infrastructure constraints.
3. OpenAI Seeks to Reduce Dependence on Nvidia for Inference GPUs
   OpenAI is reportedly becoming frustrated with Nvidia GPUs for inference processing and is looking at alternative chip vendors such as Groq and Cerebras. and are seeking strategies to reduce their dependence on specific hardware. This move is drawing market attention to Nvidia’s AI chip strategy, which has a dominant market share, and provides an opportunity for competitors to expand their market share.
4. Chinese AI Chips Roll Out on a Large Scale , Challenging Nvidia’s Foothold
   Chinese AI chip makers are rolling out their products on a large scale and beginning to chip away at Nvidia’s dominant market share in China. As U.S. export restrictions make high-performance chips more difficult to obtain, Huawei and other local companies are improving their technological capabilities and accelerating domestic production. Shanghai has added 4th generation semiconductors to its roadmap and is rushing to develop them, and is building a self-sufficient ecosystem under a national support system.
5. Intel Re-enters Memory Market with Manufacturing Process Delay Conc erns
   Analysts at DIGITIMES are skeptical about Intel’s mass production schedule for its next-generation “14A” process due to concerns about capacity expansion and reliability. Meanwhile, Intel is reportedly seeking to re-enter the DRAM market with “Z-Angle” technology through collaboration with SoftBank. This highlights the company’s multifaceted strategy shift toward restructuring its manufacturing division and securing new sources of revenue.
6. Rising memory prices hit IC design firms, prompting them to raise product prices
   Rising memory prices are putting pressure on IC design firms’ cost structures, prompting major firms such as Realtek, MediaTek, and Airoha to raise product prices in response to rising OSAT (assembly and test) costs and memory price increases. The concentration of production in advanced memory due to AI demand has led to shortages in commodity products, increasing inflationary pressure throughout the supply chain.
7. YMTC Enters LPDDR5 Market, Aims for Synergy with Stabilized NAND Supply
   Chinese memory giant YMTC has entered the LPDDR5 market, a DRAM for mobile applications. The company has established a presence in the NAND flash market, and by expanding its business into the DRAM field, it aims to establish itself as a comprehensive memory solution provider. In addition to responding to the demand for supply chain stabilization in China, the company is diversifying its product portfolio.
8. DISCO Maintains Over 90% Share in AI-related Back-end Equipment
   Japanese semiconductor equipment manufacturer DISCO has revealed that it holds over 90% of the global market share in back-end equipment, which is essential for the manufacture of semiconductors for generation AI. President Sekiya mentioned that as AI chips become more sophisticated, demand for advanced processing technology to shave and cut chips into thin strips is rapidly increasing, and the company’s dominant position is a strong driver of its performance.
9. Nittobo and Samsung focus on “glass substrates” as key to AI semiconductor evolution
   Glass substrates are attracting increasing attention as a next-generation semiconductor packaging technology. Nittobo is developing high-performance glass materials that are coveted by U.S. tech companies, and Samsung has transferred its glass substrate project to a division and is aiming for full-scale operations in 2027. Glass substrates, which have superior flatness and thermal stability compared to conventional plastic substrates, will be an important technology for further miniaturization and higher performance of AI semiconductors.
10. AMD Triples Net Income on Expanded AI Semiconductor Sales
    AMD’s October-December 2025 financial results showed a threefold jump in net income over the same period last year, thanks to expanded sales of AI semiconductors. Sales of GPUs for data centers and other products have been strong, and the company is steadily expanding its share in the AI market, which is considered Nvidia’s monopoly. We are also working to strengthen our manufacturing ecosystem by supporting Powertech’s FOPLP (panel-level packaging) technology with Broadcom.

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