Semiconductor News 20260120

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Based on the sources provided, we extract and summarize the Top 10 most important news items around January 20, 2026.

1. U.S. and Taiwan Agree on Tariff Agreement; TSMC to Transfer 40% of Production Capacity to the U.S.
   The U.S. and Taiwan have finalized a tariff agreement, securing favorable conditions for semiconductor exports. In this connection, TSMC is looking to move 40% of its chip production capacity to the U.S. while pushing ahead with tariff negotiations. The company is aiming for rapid growth in 2nm technology by 2026 through expansion in Arizona and massive capital investment, a strategic move that balances geopolitical imperatives with technological leadership.
2. Global Semiconductor Market to Reach $1 Trillion in 2026 for First Time; NVIDIA Surpasses $100 Billion
   Global semiconductor revenue is projected to reach $1 trillion in 2026 for the first time ever. This historic growth is being driven by demand for AI, with NVIDIA’s annual revenue surpassing $100 billion for the first time globally. The industry as a whole is entering an unprecedented super-cycle with the advent of the AI era.
3. 100% Tariffs Suggested on Non-U.S. Memory, Pressure on Samsung and SK Hynix
   U.S. Lutnick has reportedly suggested the possibility of imposing 100% memory tariffs on non-U.S. products. This move would put strong pressure on Korean manufacturers such as Samsung Electronics and SK Hynix to expand production in the US. While tariff policies are encouraging the restructuring of global supply chains, the revival of manufacturing in the U.S. is still a ways off, and geopolitical tensions continue to directly affect the business strategies of certain companies.
4. Supply shortages of fiberglass and specialty glass are becoming more severe, affecting Apple and AI devices.
   Fiberglass and specialty glass used in AI hardware and Apple’s devices for 2026 are in severe short supply, as competition from AI giants intensifies and shortages of these materials are becoming a manufacturing bottleneck. There are growing concerns that the shortage of these materials will become a bottleneck in manufacturing. In a related development, BOE and other companies in China are accelerating their moves toward mass production of glass substrates, intensifying competition for the key materials for next-generation packaging technology.
5. Micron to Acquire PSMC Plant and Accelerate Adoption of Next-Generation 1-Gamma Process
   Micron is moving forward with plans to acquire PSMC’s 300mm-capable P5 plant in Taiwan for $1.8 billion. The company also plans to adopt the “1-Gamma” node as its main process in 2026 and to increase production of HBM and SOCAMM2. We are strengthening our investments to maintain our dominance in the next-generation memory market, including a focus on DRAM modules.
6. Optoelectronic fusion technology grows into a multi-trillion yen market , silicon photonics development accelerates
   “Optoelectronic fusion” technology, which converts data transmission within data centers from electricity to light, is growing into a multi-trillion yen market on the back of AI demand. Optical manufacturers and semiconductor companies are strengthening cooperation, and manufacturing infrastructure is being developed, with Oxford Instruments supporting automated production of 6-inch InP wafers, etc. Communications between GPUs are also expected to be converted to optical, resulting in a paradigm shift in infrastructure technology.
7. Elon Musk Announces Plan to Release AI Processors Every 9 Months
   Elon Musk has revealed a roadmap to release new AI processors for his AI company on a nine-month cycle. This is faster than NVIDIA and AMD’s annual releases, symbolizing the intensifying competition in AI development. On the other hand, friction with regulators has surfaced in terms of infrastructure development, as the U.S. government refuses to grant exemptions from permits and approvals for gas turbine generators for xAI.
8. Tesla Completes Manufacturing of AI5 Chip and Restarts Dojo 3 with Intel
   Tesla has completed manufacturing of its next-generation “AI5” chip and restarted its Dojo 3 supercomputer project through a packaging agreement with Intel. Despite safety and software design challenges, the company is accelerating in-house development of AI chips, which will be at the core of self-driving technology. The trend of automakers becoming more deeply involved in semiconductor design is gaining ground, and partnerships with tech companies are becoming more complex.
9. Memory Shortages Drive DDR4 Prices up 50%, SSD Controllers Face Challenges
   DDR4 is driving price increases in the legacy memory market, with up to 50% price increases expected in the first quarter of 2026. DDR3 is also in tight supply, and combined with SSD price spikes due to NAND shortages In addition, controller makers are facing multiple challenges, including a shortage of NAND, which is driving up SSD prices. Nanya Technology is also signaling tight supply and price increases, and the entire memory market is coming under increasing inflationary pressure from tightening supply and demand.
10. Chinese Companies Push for Technology Independence, Ship LPDDR6 IP and Enter Glass Substrates
    While U.S. regulations continue, China’s Innosilicon has launched its LPDDR6 IP and begun commercial shipments. In addition, BOE and Visionox are stepping up their focus on glass substrate technology with the aim of mass production from 2026 onward. The country is also promoting domestic production in the fields of semiconductor materials and IP (circuit blueprints), and is rapidly building its own supply chain and commercializing advanced technologies in response to the technology blockade imposed by Western countries.

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