TOC
Main News
- ASML Says Chip Equipment Demand Still Not Rising Despite AI Boom ASML has announced that despite the ongoing demand boom in the AI sector, overall demand for chip manufacturing equipment has yet to rise. Despite the optimistic outlook for the market, the analysis indicates that actual capital investment from semiconductor manufacturers has yet to increase, and while demand for AI chips such as NVIDIA’s products is high, the ripple effect on the overall equipment market is limited.
- TSMC Sets Series of Records as AI Demand Supports October Sales Peak TSMC set a series of records as AI demand was a key driver, with sales peaking in October. the CEO expressed confidence that this strong momentum will continue. the CEO said that the demand for AI-related Demand for high-performance computing (HPC) chips has been a central driver of the company’s performance.
- AI Drives the Shift to Memory-Centric Computing Developments in AI technology are driving the shift to memory-centric computing across the semiconductor supply chain, redefining the structure of the industry. advanced memory solutions such as HBM (high bandwidth memory) and flash memory have become essential to further increasing AI performance and efficiency, shifting the focus of design and manufacturing.
- Memory Module Makers Expect Supply Shortages and Price Spikes to Extend into 2026 Memory module makers are predicting that the current supply shortages and resulting price spikes will extend into 2026, according to a grim outlook. Tight supply, particularly in the DRAM and NAND flash markets, is cited as a major factor that will persist over the next several years.
- NAND Price Doubles in Six Months; Phison CEO Foresees Long-Term Supply Shortage Dramatic market volatility has seen the price of NAND flash memory double in just six months. In response, Phison’s CEO predicts that supply shortages in the NAND market will likely continue for several years, likely due to increased demand for AI and high-performance storage.
- TSMC’s Tight CoWoS Capacity Could Push U.S. AI Chipmakers to Powertech through 2027 TSMC’s tight production capacity for CoWoS, its advanced packaging technology, is reportedly forcing some U.S. AI chipmakers to rely on Powertech (Powertech) for advanced packaging operations through 2027. This illustrates the severity of the advanced packaging bottleneck in the finalization of AI chips.
- TSMC Plans 12 New Advanced Process and Packaging Factories in Taiwan Against Backdrop of Tight 2nm Supply TSMC is reportedly planning 12 new advanced process and packaging factories in Taiwan to address the ongoing tight 2nm process supply situation. This is a major expansion strategy to meet the explosive demand for next-generation leading-edge nodes and advanced packaging technologies such as CoWoS.
- Micron’s Large New York Plant Faces 2-3 Year Delay Construction of Micron’s large semiconductor manufacturing plant (megafab) in New York State is reportedly facing a 2-3 year delay. This is expected to delay the first facility startup until late 2030. However, Micron’s strategy is to accelerate construction of a second fab in Idaho and reallocate CHIPS Act funds.
- Samsung Unveils LPDDR6 Memory Specs: 10.7Gbps at 12nm, May Target 14Gbps Samsung has unveiled LPDDR6 memory specs, using a 12nm process to achieve a high transfer rate of 10.7Gbps, with a future target of 14Gbps speeds The new memory specification is based on a 12nm process and achieves a high transfer rate of 10.7Gbps. This new memory specification is expected to help improve the performance of next-generation mobile devices and edge AI devices.
- Analysis : China Combines Sanctions and Exemptions Against Nexperia, Launches New Supply Chain Strategy China is launching a new supply chain strategy, applying a combination of sanctions and exemptions against Nexperia in the Netherlands, according to an analysis. This is being looked at as a new way to exert influence over certain technologies and companies in geopolitical competition while securing its own industrial needs.
News List
| 投稿日 | 日本語タイトル | 原語タイトル | 記事URL |
|---|---|---|---|
| DIGITIMES | |||
| Nov 10, 16:43 | ASML、AIブームにもかかわらずチップ装置需要がまだ上昇していないと発表 | ASML says AI boom has yet to lift chip equipment demand | https://www.digitimes.com/news/a20251110PD237/nvidia-asml-demand-tsmc-equipment.html |
| Nov 10, 16:02 | TSMC、一連の記録更新：AI需要が10月の売上高のピークを支え、CEOはこの勢いが今後も続くと自信を示す | TSMC breaks one record after another: AI demand powers October revenue height, CEO confident streak will continue | https://www.digitimes.com/news/a20251110PD239/tsmc-revenue-2025-demand-growth.html |
| Nov 10, 15:36 | AIがメモリ中心のコンピューティングへの転換を促進し、半導体サプライチェーンを再定義 | AI drives shift to memory-centric computing, redefining semiconductor supply chains | https://www.digitimes.com/news/a20251110PD235/hbm-flash-semiconductor-industry-ai-efficiency.html |
| Nov 10, 14:58 | 中国のメモリ逼迫が深刻化：NORフラッシュ価格が急騰、Puyaが2D NAND市場に進出 | China’s memory squeeze deepens: NOR flash prices jump, Puya expands into 2D NAND | https://www.digitimes.com/news/a20251110VL205/china-dram-nand-flash-price.html |
| Nov 10, 10:34 | メモリモジュールメーカーは、供給不足と価格急騰が2026年にまで及ぶと予測 | Memory module makers expect supply shortage and price surge to extend into 2026 | https://www.digitimes.com/news/a20251110PD215/2026-price-2025-nand-memory-module.html |
| Nov 10, 16:02 | Sunlit社の幹部によると、台湾の半導体材料は3つの大きな障壁に直面している | Taiwan semiconductor materials face three major obstacles, says Sunlit exec | https://www.digitimes.com/news/a20251109PD202/taiwan-semiconductors-materials-manufacturing-government.html |
| Nov 10, 13:53 | Fitpower、2026年のAIoTチップ需要拡大でDDIの売上比率を低減する狙い | Fitpower eyes AIoT chip surge in 2026 to cut DDI revenue share | https://www.digitimes.com/news/a20251110PD209/fitipower-ddi-supplier-revenue-2026.html |
| Nov 10, 12:55 | 分析：中国、Nexperiaに対する制裁と免除措置を組み合わせ、新たなサプライチェーン戦略を打ち出す | Analysis: China pairs Nexperia sanctions with exemptions, unveiling new supply chain playbook | https://www.digitimes.com/news/a20251110PD216/nexperia-government-dutch-netherlands-takeover.html |
| Nov 10, 12:35 | Macronix、メモリ市場の回復を背景にNOR、NAND、eMMCの需要増加を見込む | Macronix sees rising NOR, NAND, and eMMC demand amid memory market recovery | https://www.digitimes.com/news/a20251110PD218/demand-emmc-nand-market-macronix-international.html |
| Nov 10, 11:42 | NANDの価格が6か月で倍になり、Phison社のCEOは長期に及ぶ供給不足を予見する | NAND prices double in six months; Phison CEO predicts years-long shortages | https://www.digitimes.com/news/a20251110PD213/nand-phison-ceo-chips-revenue.html |
| Nov 10, 11:17 | Topoint、AIによるPCBおよび基板需要の拡大とともにチップドリル不足に直面する可能性 | Topoint eyes chip drill shortage as AI boosts PCB, substrate demand in 2026 | https://www.digitimes.com/news/a20251110PD221/topoint-pcb-drill-substrate-high-end-demand-2026.html |
| Nov 10, 11:00 | Ableprint、規制当局の捜査にもかかわらず、記録的な第三四半期売上高を発表 | Ableprint reports record third quarter revenue despite regulatory search | https://www.digitimes.com/news/a20251110PD206/revenue-packaging-equipment-supplier-2025.html |
| Nov 10, 10:56 | PixArt Imaging、ドローン用センサー需要がゲーム市場の低迷を相殺し、2025年第4四半期の安定を示唆 | PixArt Imaging signals stable 4Q25 as drone sensor demand offsets gaming softness | https://www.digitimes.com/news/a20251110PD200/pixart-ic-design-demand-sensor-gaming.html |
| Nov 10, 10:11 | 週刊ニュースまとめ：LGESが技術窃盗を調査、ASMLが中国で戦略を転換、Samsungが市場混乱を招き、Nexperiaの抗争が激化 | Weekly news roundup: LGES probes tech Theft; ASML pivots in China; Samsung sparks market chaos; Nexperia feud explodes | https://www.digitimes.com/news/a20251110VL204/digitimes-asia-weekly-news-roundup-lges-nexperia-samsung-tsmc.html |
| Nov 10, 08:47 | マレーシア、AIチップの中立性を再確認し、NvidiaおよびHuawei Ascendを採用する | Malaysia reaffirms AI chip neutrality, adopts Nvidia and Huawei Ascend | https://www.digitimes.com/news/a20251110PD202/huawei-ai-chip-ascend-chips-nvidia.html |
| Nov 10, 07:30 | Etron会長、台湾の次世代競争優位性に向けたビジョンを示す | Etron chairman outlines vision for Taiwan’s next competitive edge | https://www.digitimes.com/news/a20251106PD251/taiwan-etron-demand-talent-development.html |
| 日経 Tech Foresight | |||
| 2025-11-11 | ラピダス小池社長の勝算、自前主義捨てた座組に 顧客は | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC106F60Q5A111C2000000 | |
| 2025-11-11 | 早大など、近赤外光も利用可能なペロブスカイト太陽電池 | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC0625X0W5A101C2000000 | |
| 2025-11-11 | ホンダとルネサス、SoC設計「爆速フロー」構築中 SDV用 | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC101ID0Q5A111C2000000 | |
| 2025-11-10 | ラピダス、2ナノ品「世界が驚いた」 日の丸半導体の重責 | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC0787X0X01C25A1000000 | |
| 2025-11-10 | 【特許】日本ガイシ、品質ばらつき防ぐウエハーステージ | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC052N30V01C25A1000000 | |
| 2025-11-10 | 東北大、酸化亜鉛で三重量子ドット形成 量子計算機に | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC311TQ0R31C25A0000000 | |
| 2025-11-10 | 「超電導Ge半導体」「μW級電力でエッジAI」 海外動向 | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC061OB0W5A101C2000000 | |
| マイナビニュース テックプラス | |||
| 2025-11-10 | PFASの中でも分解が難しい「PFOS」を光触媒と近紫外光で分解する手法、立命館が開発 | https://news.mynavi.jp/techplus/article/20251110-3649301/ | |
| 2025-11-10 | 半導体用BA精密細管を手掛ける丸一ステンレス鋼管、供給先である米Valexの国内代理店の全株式を取得 | https://news.mynavi.jp/techplus/article/20251110-3649198/ | |
| 2025-11-10 | OpenAI、米政府に税制優遇の拡大を要請 – AIインフラ整備で1.4兆ドル投資計画 | https://news.mynavi.jp/techplus/article/20251110-3649132/ | |
| 2025-11-10 | サムスン電機が住友化学グループとパッケージ基板用「ガラスコア」の合弁会社設立へ | https://news.mynavi.jp/techplus/article/20251110-3649139/ | |
| TrendForce | |||
| 2025-11-10 | サムスン、2026年2月のGalaxy S26発売を狙う模様；Ultraモデルはクアルコム採用の可能性 | Samsung Reportedly Eyes Feb. 2026 Galaxy S26 Launch; Ultra Model May Stick With Qualcomm | https://www.trendforce.com/news/2025/11/10/news-samsung-reportedly-eyes-feb-2026-galaxy-s26-launch-ultra-model-may-stick-with-qualcomm/ |
| 2025-11-10 | TSMCのCoWoS生産能力逼迫、米国のAIチップメーカーを2027年までパワーテックに押しやる可能性 | TSMC CoWoS Capacity Crunch Reportedly Pushes U.S. AI Chipmakers to Powertech Through 2027 | https://www.trendforce.com/news/2025/11/10/news-tsmc-cowos-capacity-crunch-reportedly-pushes-u-s-ai-chipmakers-to-powertech-through-2027/ |
| 2025-11-10 | Micronのニューヨーク大規模工場、2～3年の遅延に直面か；最初の施設は2030年後半稼働へ | Micron’s New York Megafabs Reportedly Face 2–3 Year Delay, First Now Set for Late 2030 | https://www.trendforce.com/news/2025/11/10/news-microns-new-york-megafabs-reportedly-face-2-3-year-delay-first-now-set-for-late-2030/ |
| 2025-11-10 | TSMC、2nm供給逼迫を背景に台湾で12の新先進プロセス・パッケージング工場を計画か | TSMC Reportedly Plans 12 New Advanced Process and Packaging Fabs in Taiwan as 2nm Supply Tightens | https://www.trendforce.com/news/2025/11/10/news-tsmc-reportedly-plans-12-new-advanced-process-and-packaging-fabs-in-taiwan-as-2nm-supply-tightens/ |
| 2025-11-10 | サムスン、LPDDR6メモリ仕様を公開：12nmで10.7Gbps、14Gbpsを狙う可能性も | Samsung LPDDR6 Memory Specs Unveiled: 10.7Gbps Speed on 12nm; Reportedly Eyes 14 Gbps | https://www.trendforce.com/news/2025/11/10/news-samsung-lpddr6-memory-specs-unveiled-10-7gbps-speed-on-12nm-reportedly-eyes-14-gbps/ |
| Semiconductor Digest | |||
| 2 hours ago | 初の2D半導体FPGAがウェーハスケール統合を達成、査読付き論文として発表 | First 2D Semiconductor FPGA Achieves Wafer-Scale Integration Peer-Reviewed Publication | https://www.semiconductor-digest.com/first-2d-semiconductor-fpga-achieves-wafer-scale-integration-peer-reviewed-publication/ |
| 2 hours ago | HPEとパートナーが量子スケーリングアライアンスを立ち上げ、量子コンピューティングのブレークスルーを加速 | HPE and Partners Launch Quantum Scaling Alliance to Accelerate Quantum Computing Breakthroughs | https://www.semiconductor-digest.com/hpe-and-partners-launch-quantum-scaling-alliance-to-accelerate-quantum-computing-breakthroughs/ |
| 3 hours ago | ZEISS顕微鏡がISTFAで先進故障解析技術を披露 | ZEISS Microscopy Spotlights Advanced Failure Analysis Technologies at ISTFA | https://www.semiconductor-digest.com/zeiss-microscopy-spotlights-advanced-failure-analysis-technologies-at-istfa/ |
| 4 hours ago | GlobalFoundriesがTSMCからGaN技術のライセンスを取得 | GlobalFoundries Licenses GaN Technology from TSMC | https://www.semiconductor-digest.com/globalfoundries-licenses-gan-technology-from-tsmc/ |
| 日本経済新聞 | |||
| 2025-11-11 | NYダウ381ドル高、ナスダック2%高 米政府閉鎖解除への動きを好感 | https://www.nikkei.com/article/DGXZQOFL1101H0R11C25A1000000/ | |
| 2025-11-11 | 米国株、ダウ続伸し381ドル高 米政府閉鎖解除へ前進 エヌビディア大幅高 | https://www.nikkei.com/article/DGXZQOFL10ASR0Q5A111C2000000/ | |
| 2025-11-11 | 米国株15時、ダウ続伸 米政府閉鎖解除に前進、ナスダック2%超高 | https://www.nikkei.com/article/DGXZQOFL10ASP0Q5A111C2000000/ | |
| 2025-11-11 | ソフトバンクG、「割引株価」解消もAIバブルの懸念 1週間で2割下げ | https://www.nikkei.com/article/DGXZQOUC05AUP0V01C25A1000000/ | |
| 2025-11-11 | 覆面AIがいる日常、米国発の生産性革命 行き着く先は超成長か破滅か | https://www.nikkei.com/article/DGXZQOGN033EA0T01C25A1000000/ | |
| 2025-11-11 | 富山の「やわらかい鉄工所」、一点ものを柔軟に受注 月間2400点 | https://www.nikkei.com/article/DGXZQOCC081O10Y5A101C2000000/ | |
| 2025-11-11 | テスラもつかむキーエンス流営業 モーレツから科学へ | https://www.nikkei.com/article/DGXZQOUC30BLM0Q5A430C2000000/ | |
| 2025-11-11 | 台湾の半導体産業、官民で防空強化策 有事なら世界のGDP10%減 | https://www.nikkei.com/article/DGXZQOCB15A840V10C25A7000000/ | |
| 2025-11-11 | 日本製鋼所、50億円超で千葉県柏市に研究所 次世代半導体材料視野 | https://www.nikkei.com/article/DGXZQOUC309C80Q5A031C2000000/ | |
| 2025-11-11 | 計算科学やAI開発を支援、筑波大など中核のセンター新設 文科省 | https://www.nikkei.com/article/DGXZQOSG228FX0S5A021C2000000/ | |
| ダイヤモンドオンライン | |||
| Nov 10 21:00 | トヨタも恐れる「半導体ネクスペリア問題」…その裏で中国が着実に進めていた“国家戦略”とは？ | https://diamond.jp/articles/-/376774 | |
| Nov 9 20:05 | AIブームの株高は「バブル」なのか「今回は違う」のか、“本物のイノベーション”が招く熱狂の罠 | https://diamond.jp/articles/-/376554 | |
| Nov 8 22:50 | 「自分もやりがち…」投資で大損する人の“独りよがりな思考”がグサっとくる | https://diamond.jp/articles/-/374223 | |
| Tom’s Hardware | |||
| 2025-11-10 21:56 | マイクロン、ニューヨークのファブ建設を5年遅らせる一方、アイダホで第2のファブ建設を加速 | Micron delays New York fabs by five years, but accelerates second fab in Idaho | https://www.tomshardware.com/pc-components/dram/microns-new-york-chipmaking-fabs-by-five-years-but-accelerates-second-fab-in-idaho-and-reallocates-chips-act-funding |
| TechPowerup | |||
| 2025-11-10T19:09:06+00:00 | NANDフラッシュメモリの価格が6ヶ月で倍増、フィソンCEOが警告 | NAND Flash Prices Doubled in Six Months, Warns Phison CEO | https://www.techpowerup.com/342787/nand-flash-prices-doubled-in-six-months-warns-phison-ceo |
| 2025-11-10T16:36:08+00:00 | Thieaudio、HYPE 4 MKIIモニターを発表 | Thieaudio Unveils the HYPE 4 MKII Monitors | https://www.techpowerup.com/342783/thieaudio-unveils-the-hype-4-mkii-monitors |
| 2025-11-10T16:17:28+00:00 | Windows 11 Proへたった10ドルでアップグレード（定価199ドル） | Upgrade to Windows 11 Pro for Just $10 (MSRP $199) | https://www.techpowerup.com/342760/upgrade-to-windows-11-pro-for-just-usd-10-msrp-usd-199 |
| 2025-11-10T15:58:47+00:00 | Zhitai、YMTC Xtacking 4.0 NAND搭載のTiPlus 7100s PCIe 4.0 SSDを発表 | Zhitai Intros TiPlus 7100s PCIe 4.0 SSD Featuring YMTC Xtacking 4.0 NAND | https://www.techpowerup.com/342780/zhitai-intros-tiplus-7100s-pcie-4-0-ssd-featuring-ymtc-xtacking-4-0-nand |
| 2025-11-10T15:46:22+00:00 | Valve、デスクトップゲーマー向けに再設計されたSteamストアページを展開 | Valve Rolls Out Redesigned Steam Store Pages for Desktop Gamers | https://www.techpowerup.com/342781/valve-rolls-out-redesigned-steam-store-pages-for-desktop-gamers |
| EETimes Taiwan | |||
| 2025-11-10 | CANopenブートローダー：安全で一貫性のあるファームウェア更新の実現 | CANopen開機載入程式：實現安全一致的韌體更新 | https://www.eettaiwan.com/20251110ta31-secure-and-harmonized-firmware-updates-with-the-canopen-bootloader/ |
| 2025-11-10 | LEDライトの挙動がおかしい？ 分解してその薄暗さの謎を解明する | LED燈不太對勁？ 拆解一窺黯淡之謎 | https://www.eettaiwan.com/20251110nt51-disassembling-a-led-based-light-that-s-not-acting-quite-right-right/ |
| 2025-11-10 | 高級競争に挑む：技術融合が無人機市場に新たなブルーオーシャンを切り拓く | 迎向高階競爭 技術融合開啟無人機新藍海 | https://www.eettaiwan.com/202511xxnt11-tech-fusion-drives-new-drone-blue-ocean/ |
| 2025-11-10 | 2H25におけるウェハファウンドリの生産能力稼働率、予想を上回る | 2H25晶圓代工產能利用率優於預期 | https://www.eettaiwan.com/20251110nt21-2h25-wafer-foundry-capacity-utilization-rate/ |
| EETimes Asia | |||
| 2025-11-10 | ドローンの革新 | Revolutionizing Drones | https://www.eetasia.com/revolutionizing-drones/ |
| 2025-11-10 | サムスンと住友、パッケージ基板で使用されるガラスコア向け合弁会社を設立 | Samsung and Sumitomo Set Up JV for Glass Core Used in Package Substrates | https://www.eetasia.com/samsung-and-sumitomo-set-up-jv-for-glass-core-used-in-package-substrates/ |
| 2025-11-10 | デルタ、半導体業界向けパワーソリューション事業強化のためNRFを買収 | Delta to Acquire NRF to Strengthen Power Solutions Portfolio for Chip Industry | https://www.eetasia.com/delta-to-acquire-nrf-to-strengthen-power-solutions-portfolio-for-chip-industry/ |
| 2025-11-10 | セバとマイクロチップ、エッジデバイスおよびデータセンターでのAIアクセラレーションで協業 | Ceva and Microchip Collaborate on AI Acceleration Across Edge Devices, Datacenters | https://www.eetasia.com/ceva-and-microchip-collaborate-on-ai-acceleration-across-edge-devices-datacenters/ |
| EETimes India | |||
| 2025-11-10 | インドのハードウェア設計の飛躍：設計サービスからシステムへの移行 | India’s Hardware Design Leap: From Design Services to Systems | https://www.eetindia.co.in/indias-hardware-design-leap-from-design-services-to-systems/ |
| ZDNET Korea | |||
| 2025-11-10 | ヨンセ大学、『チャットGPT』による団体カンニング騒動…600人中190人が「カンニングした」 | 연세대, ‘챗GPT’ 집단 커닝 파문… 600명 중 190명 “컨닝했다” | https://www.zdnet.co.kr/20251110230745%22%20title=%22 |
| 2025-11-10 | AIに絵を描くよう頼んだら… ‘<' と '>‘ の区別すらできなかった | AI에게 그림 그리라고 했더니…’<' 와 '>‘ 구분도 못했다 | https://www.zdnet.co.kr/20251110230142%22%20title=%22 |
| 2025-11-10 | 「AI悪用攻撃は『ニューノーマル』…国家の背後にあるサイバー脅威も知能化」 | “AI 악용 공격은 ‘뉴노멀’…국가 배후 사이버 위협도 지능화” | https://www.zdnet.co.kr/20251110200042%22%20title=%22 |
| 2025-11-10 | チャットGPT、大量の訴訟に巻き込まれ…自殺計画利用者に「よくやった」と励ました件で論争 | 챗GPT, 무더기 소송 당했다…자살 계획 사용자에 “잘했다” 격려 논란 | https://www.zdnet.co.kr/20251110214556%22%20title=%22 |
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| 2025-11-10 | ハイブ「赤字は短期費用のせい…グローバル競争力は堅調」 | 하이브 “적자는 단기 비용 탓…글로벌 경쟁력 견조” | https://www.zdnet.co.kr/20251110174320%22%20title=%22 |
| 2025-11-10 | 政府、来年上半期にK-GX戦略策定…2018年比で温室効果ガスを53～61%削減 | 정부, 내년 상반기 K-GX 전략 수립…2018년 대비 온실가스 53~61% 감축 | https://www.zdnet.co.kr/20251110181920%22%20title=%22 |
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| 中央日報 | |||
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| 2025-11-11 | 第3四半期輸出1850億ドル…10大企業が40%を占め、史上最大 | 3분기 수출 1850억 달러…10대 기업의 몫 40%, 역대 최대 | https://www.joongang.co.kr/article/25381014 |
| 2025-11-11 | 配当税緩和とシャットダウン解除への期待感…コスピが一日で4000台を回復 | 배당세 완화·셧다운 해제 기대감…코스피, 하루만에 4000선 탈환 | https://www.joongang.co.kr/article/25381013 |
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