Semiconductor News 20250922

Main News

1. Nvidia’s $5 billion acquisition of Intel stock sparks concern at TSMC and Samsung foundries

Nvidia’s $5 billion acquisition of Intel stock has caused unrest in the semiconductor foundry industry. Nvidia, which dominates the design of AI chips, has made a major investment in Intel, which is restructuring its foundry business, signaling a clear shift in power in the semiconductor supply chain. The major investment by Nvidia, which dominates the design of AI chips, in Intel, which is restructuring its foundry business, signals a clear shift in the semiconductor supply chain.

2. TSMC’s 2nm process reportedly has up to 15 customers – 10 of which will use it for HPC products

Demand for TSMC’s 2nm process has been phenomenal, with up to 15 customers, according to press reports. Of these, 10 companies plan to adopt this state-of-the-art process for their high-performance computing (HPC) products. This fact is a strong indication that the demand for computing power in the AI and HPC sectors is so high that it is increasingly dependent on state-of-the-art manufacturing technology.

3. judge finds that amazon used dark patterns to trick users into signing up for prime before the ftc hearing, making it difficult for them to cancel

In advance of a hearing before the Federal Trade Commission (FTC), a judge has determined that Amazon used a “dark pattern” to deceive users. Specifically, the judge found that Amazon deceived users into signing up for Prime and then intentionally made the cancellation process more difficult. The ruling is an important legal development in the regulatory push against large tech companies’ design of interfaces that mislead consumers.

Intel Should “Go Private” and Split Into Foundry & Chip Design Units

In response to the investments in Intel by NVIDIA and the U.S. government, former directors have proposed that Intel should go private and split into a foundry division and a chip design division. The proposal is intended to simplify Intel’s complex corporate structure and make it more competitive. The proposal is notable as a strategic turning point for Intel’s future as competition in the semiconductor market intensifies.

IBIDEN to increase production of semiconductor substrates for generation AI by 2.5 times in 27 years

Ibiden plans to expand its production of semiconductor substrates (packaging substrates) for generative AI to 2.5 times its current capacity by 2027. This major capital investment and production increase is intended to meet the rapidly growing global demand for high-performance, highly integrated packaging technology that is essential for AI chips. It demonstrates that Japanese suppliers are strengthening their supply capabilities in the AI ecosystem.

6. Huawei patents SiC cooling technology for next-generation AI chips

Huawei has patented a silicon carbide (SiC) cooling technology to enable higher performance and power delivery for next-generation AI chips. ai chips generate a very high amount of heat, so this SiC cooling technology could be an innovative solution to dramatically improve chip operating efficiency and stability. This is an important technological development as thermal management becomes increasingly important in AI infrastructures.

7. AI SSD Boom Sends NAND Flash Prices Skyrocketing 10%; Phison Quotes Again

Driven by a surge in demand in the AI SSD market, NAND flash prices have surged 10%. In response, storage controller giant Phison has resumed offering price quotes with an eye toward stabilizing supply and pricing; demand for AI applications, especially SSDs that require large amounts of data processing, is having a direct impact on the overall memory market price increase.

8. NVIDIA to take control of the “brains of AI,” a clear change of semiconductor leader.

The analysis shows that NVIDIA has established a dominant position in the AI field and is taking control of the “brains of AI”. This underscores a clear shift in the traditional semiconductor industry allies, reflecting a situation where NVIDIA’s GPUs and platforms have become the standard for AI technology development and market deployment, setting the direction for the industry.

9. Apple’s foldable iPhone, possibly designed to resemble two side-by-side iPhone Airs

Apple’s foldable iPhone could feature a design similar to two iPhone Airs side-by-side and is expected to cost more than $2,000. The device is rumored to be made of titanium material for its ultra-thin design, suggesting that Apple is developing an innovative, high-priced new form factor for the high-end market.

10. Meta developing dual-display smart glasses that display messages, maps, etc. in front of your eyes.

Meta is developing dual-display smart glasses that can display messages, maps, and other information directly in front of the user’s eyes. The new wearable devices are intended to enhance augmented reality (AR) capabilities and provide a next-generation computing experience with hands-free access to information.

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