Semiconductor News 20260313

Today’s semiconductor news is a vivid mix of strong growth from the accelerating AI shift and the fragility of supply chains brought about by geopolitical risks such as the situation in the Middle East As global semiconductor sales grew 3.7% in January and the market size expanded, giant tech companies like NVIDIA, Meta, and AMD are working on next-generation AI chips and the battle for market share is intensifying. Meanwhile, the hit to the supply chain has been severe, as indicated by the helium supply outage in Qatar, with prices jumping several fold due to tight memory supplies and major semiconductor manufacturers such as NXP announcing massive, simultaneous price hikes starting in April. The entire industry is teetering between intense cost increases and innovative technological development.

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TOC

Main News

  1. Helium Supply Outage Caused by Tensions in the Middle East Hurts Supply Chain
    The effects of the Middle East conflict have rocked energy markets, and the supply risk of helium, which is essential for semiconductor manufacturing, is rapidly emerging. A helium supply shutdown in Qatar has led to a two-week restriction on the global chip supply chain, dealing a major blow to South Korean semiconductor manufacturers and others. The business environment for IC distributors is becoming increasingly severe due to the combination of disruptions in logistics networks and raw material shortages.
  2. NXP, TI, and other semiconductor giants all plan to raise prices starting in April
    A new round of price hikes is brewing in the semiconductor industry, with NXP Semiconductors reportedly set to raise prices starting April 1, and Texas Instruments (TI) and Infineon Technologies and other major companies are also planning to adjust their prices simultaneously. The wave of cost increases is spreading throughout component makers and is significantly pushing up the cost of manufacturing electronics products.
  3. Meta Announces Four New MTIA Chips Designed Specifically for AI Inference
    Meta has announced four new MTIA chips designed specifically for AI inference to enhance its AI infrastructure. anticipating a severe memory shortage expected in 2027, the company plans to release new products at six-month intervals. The company plans to release new products at six-month intervals. By accelerating the development of custom AI chips for its own use, the company aims to build an efficient computing infrastructure.
  4. IBM and Lam Research Collaborate on Sub-1nm Logic Technology Development
    IBM and Lam Research, a leading semiconductor manufacturing equipment company, announced a strategic collaboration to promote scaling of logic semiconductors below 1nm. The two companies will work together to develop materials and manufacturing processes utilizing next-generation High-NA EUV technology. This will be an important partnership to achieve further scaling and higher performance in the field of semiconductor manufacturing, which is approaching its physical limits.
  5. Samsung Wins DRAM Supply for Foldable iPhone, Doubles Price
    Samsung has reportedly won a contract to supply DRAM for Apple’s foldable iPhone. The price of the supplied 12GB LPDDR5X memory is reportedly double the previous price, symbolizing a wave of intense price hikes in the mobile memory market. The combination of increased demand for high-performance folderable devices and memory shortages is rapidly increasing the cost burden of component procurement.
  6. NVIDIA Further Expands GPU Market Share Despite Rising Costs
    NVIDIA is further expanding its dominant share of the GPU market with an increase in add-in board (AIB) shipments despite an environment of rising component procurement costs. New announcements regarding next-generation AI semiconductors and physical AI are expected at the company’s upcoming developer conference, GTC, and the entire industry is watching NVIDIA’s dominance of the AI chip market.
  7. AMD CEO Lisa Su to Visit Korea for Talks with Samsung and Naver
    AMD CEO Lisa Su is reportedly planning to visit Korea during NVIDIA’s GTC to hold talks with Samsung Electronics and Naver.As competition in the AI semiconductor market As competition in the AI semiconductor market intensifies, AMD is likely aiming to strengthen cooperation with South Korean tech giants for stable supply and technology development of next-generation AI chips, and to establish a strategic encirclement to counter NVIDIA’s solo drive.
  8. Tight supply and prolonged price spikes in the DRAM and HBM markets
    The DRAM and HBM markets continue to be severely tight as memory manufacturers pursue elaborate supply strategies focused on profitability. Some retailers have seen DDR5 memory prices jump fourfold, and some have refused to accept replacements. Hua Shuo’s co-CEOs also predict that memory shortages will continue for the next two years, and soaring memory prices, driven by AI demand, are weighing on the industry as a whole.
  9. TSMC is developing PDK, design information, to take the lead in optoelectronic fusion technology
    TSMC, the world’s largest semiconductor foundry, has begun full-scale development of PDK, fundamental information essential for chip design, to take the lead in the field of optoelectronic fusion, a next-generation technology that combines electronic and optical circuits. TSMC is rapidly building a development ecosystem for the commercialization of silicon photonics technology, which is expected to be the trump card for solving the increasing power consumption associated with massive data processing.
  10. Global Semiconductor Sales Increase 3.7% Monthly in January, Continuing Market Growth Trend
    Global semiconductor sales increased 3.7% month-over-month in January 2026, confirming a strong recovery and growth in the semiconductor market. Executives at ASE, one of the world’s leading packaging companies, noted trends in global semiconductor production value surpassing $1 trillion, with AI and growing hardware demand driving the industry. The global semiconductor industry is showing that it is firmly on track for a new super cycle

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Mar 12, 16:11中東紛争がエネルギー市場を揺るがし、IC流通業者に打撃を与えるMiddle East conflict rattles energy markets, squeezes IC distributorshttps://www.digitimes.com/news/a20260312PD209/ic-taiwan-inflation-financing-war.html
Mar 12, 16:18コスト上昇にもかかわらずAIB出荷が増加し、NvidiaがGPU市場でのシェアを拡大するNvidia expands GPU market share as AIB shipments rise despite increased costshttps://www.digitimes.com/news/a20260310VL205/nvidia-gpu-shipments-market-market-share.html
Mar 12, 16:10中東紛争が韓国の半導体メーカーに対するヘリウム供給リスクを高めるMiddle East conflict raises helium supply risks for South Korean chipmakershttps://www.digitimes.com/news/a20260312PD218/samsung-chipmakers-sk-hynix-qatar-production.html
Mar 12, 15:00Samsungが折りたたみ式iPhone向けDRAM供給契約を獲得、12GB LPDDR5Xの価格は倍増したと報じられるSamsung reportedly wins foldable iPhone DRAM supply deal; 12GB LPDDR5X prices doublehttps://www.digitimes.com/news/a20260312PD228/samsung-dram-foldable-iphone-apple.html
Mar 12, 11:55アナリストによると、インドの2026年に向けた半導体増産は世界のウェーハ供給に大きな影響を与えない見込みだIndia’s 2026 semiconductor ramp unlikely to move global wafer supply needle, analysts sayhttps://www.digitimes.com/news/a20260312VL210.html
Mar 12, 16:37UMCとHyperLightがAIデータセンター向けのTFLNフォトニクスチップレットを量産へUMC, HyperLight to mass-produce TFLN photonics chiplets for AI data centershttps://www.digitimes.com/news/a20260312VL208/umc-photonics-data-startup-transmission.html
Mar 12, 16:20SemcoがSamsungファウンドリを通じてTesla向けAIチップのABF基板を供給すると見られているSemco seen supplying ABF substrates for Tesla AI chips via Samsung foundryhttps://www.digitimes.com/news/a20260312PD229/semco-tesla-chips-samsung-production.html
Mar 12, 16:11ArdentecがASICウェーハ試験の協業を開始、新たなLongtan生産能力は2026年下半期に稼働予定Ardentec launches ASIC wafer test collaboration; new Longtan capacity to be ready by 2H26https://www.digitimes.com/news/a20260310PD228/ardentec-capacity-testing-wafer-demand.html
Mar 12, 14:36Asia Opticalが技術強化を背景に2025年の利益成長を大きく伸ばすAsia Optical posts strong 2025 profit growth led by tech upgradeshttps://www.digitimes.com/news/a20260312PD219/asia-optical-2025-growth-profit-revenue.html
Mar 12, 12:49AMD CEOのLisa SuがNvidia GTC期間中にSamsungおよびNaverとの協議のため韓国訪問を計画していると報じられるAMD CEO Lisa Su reportedly plans South Korea trip for Samsung, Naver talks during Nvidia GTChttps://www.digitimes.com/news/a20260312PD220/amd-lisa-su-naver-samsung.html
Mar 12, 12:17IBMとLam Researchが1nm未満のロジックおよびHigh-NA EUV技術の開発で協力体制を組むIBM, Lam Research join forces on sub-1nm logic and High-NA EUV developmenthttps://www.digitimes.com/news/a20260312VL212/ibm-lam-research-high-na-euv-materials-manufacturing.html
Mar 12, 11:22ASEのTien Wu氏:米国の半導体競争が激化する中、台湾はハードウェアの強みを活かすASE’s Tien Wu: Taiwan leverages hardware strength as US chip rivalry intensifieshttps://www.digitimes.com/news/a20260312PD212/ase-ai-hardware-software-taiwan.html
Mar 12, 10:52ASEのTien Wu博士が、世界の半導体生産額が1兆ドルを超える中での3つの重要なトレンドを語るASE’s Dr. Tien Wu shares three key trends as global semiconductor output to surpass US$1 trillionhttps://www.digitimes.com/news/a20260312PD213/semiconductor-industry-ase-trends-taiwan-hardware.html
Mar 12, 10:20MediaTekがハイエンドIoT向けの需要に対応するため、需要の限定を認めつつTSMCの3nm Genio Proに賭けるMediaTek bets on TSMC 3nm Genio Pro to serve high-end IoT needs while acknowledging limited demandhttps://www.digitimes.com/news/a20260312PD210/mediatek-iot-3nm-tsmc-2026.html
Mar 12, 10:17SMICがメモリおよびBCDチップの供給逼迫を示唆SMIC flags supply squeeze in memory, BCD chipshttps://www.digitimes.com/news/a20260312VL205/smic-chips-demand-capacity-electronics.html
Mar 12, 09:45市場が緩和の可能性を見込む中、米伊対立は短期的な衝撃と見られているUS-Iran clash seen as short-term shock as markets look toward possible de-escalationhttps://www.digitimes.com/news/a20260312PD201/middle-east-military-nuclear-shipping.html
日経 Tech Foresight
2026-03-13NVIDIA「GTC」を先読み フィジカルAI続々、新半導体もhttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC1251M0S6A310C2000000
2026-03-13中国勢、2億画素の画像センサーでサムスンに対抗 ISSCChttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC123780S6A310C2000000
2026-03-13ラピダス、新参者の不利益補うAIツール 「3社が使用中」https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC1205X0S6A310C2000000
2026-03-12【特許】徳蘭明海、太陽光発電の故障検出を低コストにhttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC0239Y0S6A300C2000000
2026-03-12TSMC、光電融合の主導権へ一手 設計情報「PDK」整備https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC112U30R10C26A3000000
マイナビニュース テックプラス
2026-03-13Infineon、コモンクライテリアEAL6+認証の耐量子暗号搭載車載セキュリティコントローラを発表https://news.mynavi.jp/techplus/article/20260313-4212152/
2026-03-12早大発ベンチャーのPDSがダイヤモンドMOSFETで耐圧550V/0.8Aを実現、200V・1Aのスイッチング動作も確認https://news.mynavi.jp/techplus/article/20260312-4212228/
2026-03-12Infineon、自動車向けソフトバンドル「DRIVECORE」に3つのバンドルを追加https://news.mynavi.jp/techplus/article/20260312-4212100/
2026-03-122025年第4四半期のファウンドリトップ10売上高は前四半期比2.6%増、AI需要がけん引 TrendForce調べhttps://news.mynavi.jp/techplus/article/20260312-4212031/
2026-03-12東広島市中心部にマイクロンが新オフィスを開設、イノベーション創出能力を加速https://news.mynavi.jp/techplus/article/20260312-4211855/
2026-03-12ローム、スマートリングなど向けに超小型ワイヤレス給電チップセットを開発https://news.mynavi.jp/techplus/article/20260312-4211822/
2026-03-12TI、NPUを搭載した2種類のエッジAI対応Armマイコンファミリを発表https://news.mynavi.jp/techplus/article/20260312-4211770/
2026-03-12エプソンとManz Asia、インクジェットによる半導体製造プロセス革新へ協業https://news.mynavi.jp/techplus/article/20260312-4211549/
2026-03-12TSMCの20026年2月売上高は前年同月比22%増で2月としての過去最高を更新https://news.mynavi.jp/techplus/article/20260312-4211443/
2026-03-12京大KUIASと旭化成エレクトロニクス、2μm帯赤外線フォトニック結晶レーザーの発振に成功https://news.mynavi.jp/techplus/article/20260312-4211306/
2026-03-12NXP、NPUとトライラジオ無線を統合したアプリケーション・プロセッサ「i.MX 93W」を発表https://news.mynavi.jp/techplus/article/20260312-4211156/
2026-03-12Intel、デスクトップPC向けプロセッサ「Core Ultra 200S Plus」を発表https://news.mynavi.jp/techplus/article/20260312-4211061/
2026-03-12三菱電機がエレファンテックに40億円を出資、プリント基板分野で協業https://news.mynavi.jp/techplus/article/20260312-4210984/
2026-03-12世界に評価されるフォトマスク測定装置は、こうして生まれた─妥協なき技術で進化を止めないDR-8000の開発物語https://news.mynavi.jp/techplus/kikaku/20260312-4200139/
2026-03-12ルネサスが電子機器開発プラットフォーム「Renesas 365」を一般提供、第一弾としてRAマイコンが対応https://news.mynavi.jp/techplus/article/20260312-4208618/
2026-03-12JX金属、ひたちなか新工場の半導体用スパッタリングターゲット増産に向けた投資を決定https://news.mynavi.jp/techplus/article/20260312-4208541/
2026-03-12吉川明日論の半導体放談 第365回 米国防総省への協力を拒否したAnthropicのCEO、ダリオ・アモディの矜持https://news.mynavi.jp/techplus/article/semicon-365/
2026-03-12ST、第2世代MasterGaNハーフブリッジファミリ「MasterGaN6」を発表https://news.mynavi.jp/techplus/article/20260312-4208644/
2026-03-12PFNとGMOグループ、国産AI半導体と生成AIのセキュリティを支える合弁会社を設立https://news.mynavi.jp/techplus/article/20260312-4208510/
TrendForce
2026-03-12インド、スマートフォン輸出奨励策を検討―AppleはそこでiPhoneの25%を製造すると報じられるIndia Reportedly Eyes Smartphone Export Incentives as Apple Said to Make 25% of iPhones Therehttps://www.trendforce.com/news/2026/03/12/news-india-reportedly-plans-new-smartphone-export-incentives-as-apple-said-to-make-a-quarter-of-iphones-there/
2026-03-12急騰するTPU需要を背景に、2025年にGoogleがSamsungの主要クライアント上位5社に初めて名を連ねるGoogle Makes First Appearance in Samsung’s Top Five Clients in 2025 amid Soaring TPU Demandhttps://www.trendforce.com/news/2026/03/12/news-google-makes-first-appearance-in-samsungs-top-five-clients-in-2025-amid-soaring-tpu-demand/
2026-03-12チップ価格上昇の波:NXPが4月1日の値上げを実施、Texas InstrumentsおよびInfineonも価格を引き上げると報じられるChip Price Hike Wave: NXP Reportedly Sets Apr. 1 Increase as Texas Instruments, Infineon Also Raise Priceshttps://www.trendforce.com/news/2026/03/12/news-chip-price-hike-wave-nxp-reportedly-sets-apr-1-increase-as-texas-instruments-infineon-also-raise-prices/
2026-03-12UMCとHyperLightが提携し、TFLNチップレットを大量生産、1.6Tのデータセンター帯域幅を狙うUMC, HyperLight Team up to Mass-Produce TFLN Chiplets, Targeting 1.6T Data Center Bandwidthhttps://www.trendforce.com/news/2026/03/12/news-umc-hyperlight-team-up-to-mass-produce-tfln-chiplets-targeting-1-6t-data-center-bandwidth/
2026-03-12Metaの自社AIチップ開発:2027年のメモリ不足を見据え、4つの新アクセラレーターが準備に入るMeta’s In-House AI Chip Push: Four New Accelerators Gear Up Amid Memory Crunch by 2027https://www.trendforce.com/news/2026/03/12/news-metas-in-house-ai-chip-push-four-new-accelerators-gear-up-amid-memory-crunch-by-2027/
Semiconductor Digest
22 hours ago1月の世界半導体販売、月次で3.7%増加Global Semiconductor Sales Increase 3.7% Month-to-Month in Januaryhttps://www.semiconductor-digest.com/global-semiconductor-sales-increase-3-7-month-to-month-in-january/
22 hours agoSEMI ISS Europe 2026開幕、リーダーたちが地政学課題に立ち向かうSEMI ISS Europe 2026 Opens as Leaders Convene to Navigate Geopoliticshttps://www.semiconductor-digest.com/semi-iss-europe-2026-opens-as-leaders-convene-to-navigate-geopolitics/
22 hours ago光の『手性』における動的なひねりA Dynamic Twist of Light’s ‘Handedness’https://www.semiconductor-digest.com/a-dynamic-twist-of-lights-handedness/
22 hours agoAyar LabsとWiwynnが提携し、ラックスケールAIシステム向けに同梱パッケージ光学技術を提供Ayar Labs and Wiwynn Partner to Bring Co-Packaged Optics to Rack-Scale AI Systemshttps://www.semiconductor-digest.com/ayar-labs-and-wiwynn-partner-to-bring-co-packaged-optics-to-rack-scale-ai-systems/
22 hours agoFAMES、2026年向けにチップ産業関係者へのオープンアクセス公募を発表FAMES Announces 2026 Open-Access Call for Chip Industry Stakeholdershttps://www.semiconductor-digest.com/fames-announces-2026-open-access-call-for-chip-industry-stakeholders/
22 hours agoAdvanced Packaging International Conferenceプログラムに、NHanced Semiconductors社長ロバート・パティのプレゼンテーションが登場Advanced Packaging International Conference Program to Feature a Presentation from NHanced Semiconductors President Robert Pattihttps://www.semiconductor-digest.com/advanced-packaging-international-conference-program-to-feature-a-presentation-from-nhanced-semiconductors-president-robert-patti/
日本経済新聞
2026-03-13イラン、GoogleやNVIDIAなど米7社標的名指し AI企業に攻撃リスクhttps://www.nikkei.com/article/DGXZQOUC12CHH0S6A310C2000000/
2026-03-13今日の株価材料(新聞など、13日)ホンダ、今期最大6900億円の最終赤字https://www.nikkei.com/article/DGXZQOFL125XM0S6A310C2000000/
2026-03-13NVIDIA開発者会議を現地解説 ファンCEOは何を語ったか 17日生配信https://www.nikkei.com/article/DGXZQOKE00002_R10C26A3000000/
2026-03-13米国株、ダウ続落し739ドル安 原油高で心理悪化 ナスダックも11月下旬以来の安値https://www.nikkei.com/article/DGXZQOFL12CB40S6A310C2000000/
2026-03-13NYダウ続落739ドル安 原油高で心理悪化、金融株の下げも重荷https://www.nikkei.com/article/DGXZQOFL1300O0T10C26A3000000/
2026-03-13米国株、ダウ続落 原油高で心理悪化、金融株の下げも重荷https://www.nikkei.com/article/DGXZQOFL12CB70S6A310C2000000/
2026-03-13富士フイルム、逆転の半導体 「流儀」に背いた4人組https://www.nikkei.com/article/DGXZQOUC10BW80Q6A310C2000000/
2026-03-13三菱ケミカルG「化学事業でコア営業利益1000億円」 構造改革は一巡https://www.nikkei.com/article/DGXZQOUB049EI0U6A300C2000000/
2026-03-1325年の大型倒産、目立つ清算型 負債総額最大はドローンネットhttps://www.nikkei.com/article/DGXZQOUC267ZD0W6A120C2000000/
2026-03-13ドイツ株12日 続落、原油高が重荷 仏株も下落https://www.nikkei.com/article/DGXZQOFL12CEK0S6A310C2000000/
ダイヤモンドオンライン
Mar 12 19:15原油急騰・財政拡張で世界の「インフレ基調」今後3年続く!?インフレ予測を複雑化するAI実装のデフレ要因https://diamond.jp/articles/-/385762
Mar 11 11:00「え…まだスマホ決済やってないの?」物価高騰時代の買い物で“クレジットカード派”が損をするワケhttps://diamond.jp/articles/-/385640
Mar 10 23:00サムスン電子が「虎の子の半導体」事業で全てを失う日…前門の台湾TSMCに後門の中国SMIChttps://diamond.jp/articles/-/384235
Mar 10 19:15イラン情勢「シナリオ別」原油相場見通しは?原油「100ドル超」定着とナフサ供給混乱が揺るがす日本の化学産業https://diamond.jp/articles/-/385609
Tom’s Hardware
2026-03-12 21:58イランのハッキンググループが医療技術企業Strykerに対する攻撃を仕掛けたと主張Iran hacking group claims attack on med-tech company Strykerhttps://www.tomshardware.com/tech-industry/cyber-security/iran-hacking-group-claims-attack-on-med-tech-company-stryker-says-over-200-000-devices-have-been-wiped-clean-and-over-50tb-of-data-extracted
2026-03-12 19:53カタールでのヘリウム供給停止により、チップ供給チェーンは2週間の制約を受けるQatar helium shutdown puts chip supply chain on a two-week clockhttps://www.tomshardware.com/tech-industry/qatar-helium-shutdown-puts-chip-supply-chain-on-a-two-week-clock
2026-03-12 19:20MetaがAI推論向けに設計された新型MTIAチップ4種を発表 ― 6ヶ月間隔でのリリースが予定されるMeta reveals four new MTIA chips built for AI inference – to be released on a six-month cadencehttps://www.tomshardware.com/tech-industry/semiconductors/meta-reveals-four-new-mtia-chips-built-for-ai-inference
2026-03-12 19:00小売業者、DDR5価格の4倍増加を理由にメモリ交換を否定 ― 価格上昇は顧客にとって『アップグレード』に相当すると主張Retailer denies memory replacement due to 4x increase in DDR5 pricing, says price increase would equate to an ‘upgrade’ for the customerhttps://www.tomshardware.com/pc-components/ddr5/retailer-denies-memory-return-due-to-4x-increase-in-ddr5-pricing-says-price-increase-would-mean-an-upgrade-for-the-customer-australian-retailer-refuses-to-replace-faulty-corsair-kit
TechPowerup
2026-03-12T21:27:18+00:00中国のノートパソコンメーカーChuwiがAMD Ryzen 5 7430U SoCを宣伝したにも関わらず、実際には旧型のRyzen 5 5500Uを出荷Chinese Laptop Maker Chuwi Advertised AMD Ryzen 5 7430U SoC, but Shipped the Older Ryzen 5 5500Uhttps://www.techpowerup.com/347336/chinese-laptop-maker-chuwi-advertised-amd-ryzen-5-7430u-soc-but-shipped-the-older-ryzen-5-5500u
2026-03-12T19:40:42+00:00AIインフラ向けのオープン仕様を策定するために、光学スケールアップコンソーシアムが設立されたOptical Scale-up Consortium Established to Create an Open Specification for AI Infrastructurehttps://www.techpowerup.com/347335/optical-scale-up-consortium-established-to-create-an-open-specification-for-ai-infrastructure
2026-03-12T19:32:45+00:00Microsoft 365の支払いをやめよう――最新のOfficeが140ドルで手に入るStop Paying for Microsoft 365—The Newest Office is $140https://www.techpowerup.com/347296/stop-paying-for-microsoft-365-the-newest-office-is-usd-140
2026-03-12T19:24:47+00:00中国のLisuan LX 7G106 GPUが6月18日に登場、主要なAAAゲームにも対応Chinese Lisuan LX 7G106 GPU Arrives June 18 with Support for Major AAA Gameshttps://www.techpowerup.com/347334/chinese-lisuan-lx-7g106-gpu-arrives-june-18-with-support-for-major-aaa-games
2026-03-12T18:59:21+00:00ジョン・カーペンター監督の『トキシック・コマンド』が本日発売John Carpenter’s Toxic Commando is Out Nowhttps://www.techpowerup.com/347333/john-carpenters-toxic-commando-is-out-now
2026-03-12T17:13:01+00:00Jeff KaplanのKintsugiyamaが、『The Legend of California』と題した、スキルベースのオープンワールドFPS(オンラインマルチプレイヤー対応)を発表Jeff Kaplan’s Kintsugiyama Announces “The Legend of California” Skills-Based Open World FPS With Online Multiplayerhttps://www.techpowerup.com/347331/jeff-kaplans-kintsugiyama-announces-the-legend-of-california-skills-based-open-world-fps-with-online-multiplayer
2026-03-12T16:55:38+00:00Unity、正式にSteam、SteamOS、Linuxサポートを獲得Unity Officially Gets Steam, SteamOS, and Linux Supporthttps://www.techpowerup.com/347332/unity-officially-gets-steam-steamos-and-linux-support
2026-03-12T16:28:42+00:00GoDeal24:国際女性デー記念ソフトウェアセール―必要なソフトが衝撃の価格で手に入る!GoDeal24 Women’s Day Software Sale: Get the Software You Need at Jaw-Dropping Prices!https://www.techpowerup.com/347142/godeal24-womens-day-software-sale-get-the-software-you-need-at-jaw-dropping-prices
2026-03-12T16:01:46+00:00Metaが高性能推論に特化した4つのMTIAチップを発表Meta Unveils Four MTIA Chips Focused on High-Perfomance Inferencehttps://www.techpowerup.com/347328/meta-unveils-four-mtia-chips-focused-on-high-perfomance-inference
2026-03-12T16:01:11+00:00SamaがV62カーブド・パノラマ・ガラスPCケースシリーズを発表Sama Introduces V62 Curved Panoramic Glass PC Case Serieshttps://www.techpowerup.com/347329/sama-introduces-v62-curved-panoramic-glass-pc-case-series
2026-03-12T15:43:15+00:00SamsungがHBM4Eベースダイにおいて2nmプロセスを採用する模様Samsung Reportedly to Use 2 nm Process on HBM4E Base Diehttps://www.techpowerup.com/347327/samsung-reportedly-to-use-2-nm-process-on-hbm4e-base-die
EETimes Taiwan
2026-03-12アメリカに依存せず、ヨーロッパはデータ主権の掌握を目指す並非依賴美國 歐洲力求掌控資料主權https://www.eettaiwan.com/20260312nt61-true-data-sovereignty-requires-control-not-dependence-on-the-us/
2026-03-126Gパワーアンプ向けに、GaN-on-Si RFトランジスタ技術が応用の道を切り開くGaN-on-Si RF電晶體技術為6G PA應用鋪路https://www.eettaiwan.com/20260312ta51-an-alternative-gan-on-si-rf-transistor-technology-for-6g-power-amplifiers/
2026-03-12高機能化の傾向が収益成長を支える 2026年のスマートフォンSoC出荷量は前年比で7%減少の恐れがある高階化趨勢支撐營收成長 2026年智慧型手機SoC出貨量恐年減7%https://www.eettaiwan.com/20260312nt21-2026-smartphone-soc-shipments/
2026-03-11人型ロボットが実験室を飛び出す AW 2026が具現的知能技術の道筋を示す人形機器人走出實驗室 AW 2026透視具身智慧技術路徑https://www.eettaiwan.com/20260311nt11-aw2026-humanoid-robots-exit-the-lab/
2026-03-11エネルギー効率の問題がAI開発の足かせに 応材は材料科学で対症療法に取り組む能效成AI發展瓶頸 應材由材料科學「對症下藥」https://www.eettaiwan.com/20260311nt11-solve-bottlenecks-in-ai-development/
2026-03-11世界のスマートフォンの平均販売価格が四半期で初めて400ドルを超える全球智慧型手機平均售價單季首度突破400美元https://www.eettaiwan.com/20260311nt21-global-smartphone-asp/
EETimes Asia
2026-03-12Digilent、高速・大帯域幅MSOを発売開始Digilent to Launch High-speed, High-bandwidth MSOshttps://www.eetasia.com/digilent-to-launch-high-speed-high-bandwidth-msos/
2026-03-122025年、世界のスマートフォン生産は前年比2.5%増加Global Smartphone Production Up 2.5% YoY in 2025https://www.eetasia.com/global-smartphone-production-up-2-5-yoy-in-2025/
2026-03-12InfineonとUMCがサプライチェーンにおける排出削減を促進するために提携Infineon and UMC Partner to Promote Supply Chain Emissions Reductionshttps://www.eetasia.com/infineon-and-umc-partner-to-promote-supply-chain-emissions-reductions/
2026-03-12MacDermid Alpha、2026年中国のプロダクトロニカにて統合材料プラットフォームを展示MacDermid Alpha to Showcase Integrated Materials Platform at productronica China 2026https://www.eetasia.com/macdermid-alpha-to-showcase-integrated-materials-platform-at-productronica-china-2026/
2026-03-12Wolfspeedの300mm SiCプラットフォーム、次世代AIおよび高性能計算パッケージングソリューションを実現Wolfspeed 300mm SiC Platform to Enable Next‑Gen AI and HPC Packaging Solutionshttps://www.eetasia.com/wolfspeed-300mm-sic-platform-to-enable-next%e2%80%91gen-ai-and-hpc-packaging-solutions/
2026-03-12緻密な供給戦略によりDRAMおよびHBM市場が逼迫状態にDisciplined Supply Strategy Keeps DRAM and HBM Markets Tighthttps://www.eetasia.com/disciplined-supply-strategy-keeps-dram-and-hbm-markets-tight/
2026-03-11TI、MCUポートフォリオとソフトウェアエコシステムを強化してあらゆるデバイスでエッジAIを実現TI Strengthens MCU Portfolio, Software Ecosystem to Enable Edge AI in Every Devicehttps://www.eetasia.com/ti-strengthens-mcu-portfolio-software-ecosystem-to-enable-edge-ai-in-every-device/
2026-03-11IBMとLam Research、サブ1nmロジックスケーリングの進展に向け協力IBM and Lam Research Collaborating to Advance Sub-1nm Logic Scalinghttps://www.eetasia.com/ibm-and-lam-research-collaborating-to-advance-sub-1nm-logic-scaling/
2026-03-11メモリアロケーション危機:AI時代の隠れたインフラボトルネックMemory Allocation Crisis: The Hidden Infrastructure Bottleneck in the AI Erahttps://www.eetasia.com/memory-allocation-crisis-the-hidden-infrastructure-bottleneck-in-the-ai-era/
EETimes India
2026-03-11ノルディック社、MWC 2026で最新のセルラーIoTソリューションを発表Nordic Launches Latest Cellular IoT Solutions at MWC 2026https://www.eetindia.co.in/nordic-launches-latest-cellular-iot-solutions-at-mwc-2026/
2026-03-11インドTWS市場、第4四半期は12%成長したものの、2025年は横ばいIndia TWS Market Remains Flat in 2025 Despite 12% Growth in 4Qhttps://www.eetindia.co.in/india-tws-market-remains-flat-in-2025-despite-12-growth-in-4q/
2026-03-11インド、電気自動車向けに国産30kW WBGベース統合駆動システムを発表India Launches Indigenous 30kW WBG-based Integrated Drive System for Electric Vehicleshttps://www.eetindia.co.in/india-launches-indigenous-30kw-wbg-based-integrated-drive-system-for-electric-vehicles/
ZDNET Korea
ヌリフレックス・ベトナム、ナイキ供給会社 チャンシンとの屋根型太陽光パイロット事業契約
東西発電、長寿郡・郡議会と『新規揚水発電所誘致』業務協定
南部発電、フュリオサAIと国産AI半導体エコシステム構築で協力
SR、SRTユニフォームを着た『タントゥンベア』グッズ発売
コレイルトーク列車『座席指定』、出発直前まで可能
コレイル、上半期採用枠1,800に対し2万9,242人が応募
道路公社、高速道路EX-OILを全国最安値水準で販売…国民負担を軽減
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[カードニュース] アメリカが韓国を調査するらしい
米国訪問調査委員会初代委員長候補にコ・グァンホンが指名
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ストレージアン、世界舞台でネットワーク露出制御技術を披露
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[現場] スノーフレーク、韓国進出6年ぶりに初のオフィス…「DX・AXのパートナーとなる」
チョン・ウィソン会長、昨年起亜で初の報酬…年54億ウォン
2兆ウォン規模の国家GPU増強、舵を切る…『AI高速道路』始動
中央日報
2026-03-13「戦争よりも危険な変数」…JPモルガンがコスピ7500を予言した警告“전쟁보다 위험한 변수”…코스피 7500 예언한 JP모건의 경고https://www.joongang.co.kr/article/25411480
2026-03-13[分譲フォーカス] サムスン電子P5工事再開、恩恵を受けた職住近接大規模団地[분양 포커스] 삼성전자 P5 공사 재개 호재 품은 직주근접 대단지https://www.joongang.co.kr/article/25411472
2026-03-13「お金を失えば買えない」…300億を使って得た絶対収益の秘訣“돈 잃고 못 산다”…300억 쓰고 얻은 절대수익 비법https://www.joongang.co.kr/article/25411461
2026-03-13同盟を揺るがす米国、スーパー301条を発動…韓国の鉄鋼・石化業界が非常事態동맹 때리는 미국, 수퍼 301조 발동…한국 철강·석화 비상https://www.joongang.co.kr/article/25411378
2026-03-12対米投資特別法の本会議での処理、李大統領「圧倒的な決断に感謝」대미투자특별법 본회의 처리, 李 대통령 “대승적 결단 감사”https://www.joongang.co.kr/article/25411338
2026-03-12『核融合』を新たに導入し、AI・量子は実用性を強調…中国、5か年計画を確定'핵융합' 새로 넣고, AI·양자는 실용 강조…中, 5개년 규획 확정https://www.joongang.co.kr/article/25411337
BAIDU
昨天22:52世界的に有名な半導体企業が黄浦に進出!新たな目標はロボットレース分野を狙う全球知名半导体企业落子黄浦!新目标瞄准机器人赛道https://www.jfdaily.com/sgh/detail?id=1719851
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昨天17:59サムスン電子、SKハイニックスの株価が調整、中韓半導体ETFの場内プレミアム率が24.61%に達する…三星电子、SK海力士股价回调,中韩半导体ETF场内溢价率达24.61%…https://baijiahao.baidu.com/s?id=1859449904980439122&wfr=spider&for=pc
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昨天17:41機関調査|AIチップ+人工知能+半導体 この企業は業績が史上最高を記録し、主力…机构调研丨AI芯片+人工智能+半导体 这家公司业绩创历史新高 主力…https://baijiahao.baidu.com/s?id=1859448704020422965&wfr=spider&for=pc
昨天20:41时代電気:パワー半導体製品のラインナップが充実し、600V~6500Vの全電圧に対応时代电气:公司功率半导体产品谱系齐全,覆盖600V-6500V全电压等级https://finance.eastmoney.com/a/202603123670384544.html
昨天11:15半導体部品に徹底的に取り組む华丞電子は、プロフェッショナルな測定制御技術でチップ製造を支援する深耕半导体零部件,华丞电子以专业测控技术赋能芯片制造https://baijiahao.baidu.com/s?id=1859446727421110525&wfr=spider&for=pc
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昨天14:38華碩の共同CEOは、メモリ不足が今後2年間続くと述べ、高い「デバイス」含有量の科創半導体について言及…华硕联席CEO表示内存缺货将持续两年,高“设备”含量的科创半导体…https://baijiahao.baidu.com/s?id=1859437321976631551&wfr=spider&for=pc
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