Semiconductor News 20260210

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1. Intel and SoftBank Promote “ZAM” Technology to Replace HBM
   Intel and SoftBank are focusing on promoting a new memory architecture, ZAM (Z-Alignment Memory), to replace HBM (High Bandwidth Memory), which is the current mainstream for AI chips. With HBM in short supply, ZAM is attracting attention as a strategic innovation that aims to become the next-generation industry standard.
2. Samsung Expands Investment in HBM4 and First Shipments
   Samsung Electronics is significantly expanding its capital investment in order to secure market leadership for its next-generation memory, HBM4. According to reports, the first shipments of HBM4 are expected after the Chinese New Year, and initial market share is expected to be in the mid-20% range. in a market where SK Hynix is ahead, the company is accelerating its production capacity expansion and technology introduction to reel in memory for AI servers.
3. TSMC Supports Construction of Advanced Packaging Plant in Japan
   TSMC has made clear its support for the construction of an advanced packaging plant in Japan, aiming to leverage the strengths of Japanese companies in materials and equipment in packaging technology, which is essential for improving the performance of AI chips. In conjunction with moves such as the Resonac-led consortium, Taiwan-Japan collaboration is taking shape to expand production capacity in the back-end process, which has been a bottleneck in the industry.
4. Sanae Takaichi’s Victory in Japan’s Elections Paves the Way for Establishment of Japan’s Semiconductor Sovereignty
   Sanae Takaichi’s victory in Japan’s elections reportedly paves the way for the establishment of Japan’s semiconductor sovereignty and the strengthening of its defense industry. Expectations for “Sanaenomics,” which emphasizes aggressive fiscal policy and economic security, have pushed the Nikkei Stock Average to new all-time highs. The government’s continued support for the semiconductor industry and the promotion of projects such as Lapidus are expected to gain momentum, and foreign investors are also favoring political stability.
5. MediaTek to be early adopter of TSMC’s 2nm and A14 processes
   Taiwan’s MediaTek has decided to be an early adopter of TSMC’s cutting-edge 2nm and A14 node processes, which are aimed at dramatically increasing AI computing power and making its SoC for smartphones The company aims to dramatically improve its AI computing capabilities and increase its competitiveness not only in SoCs for smartphones, but also in chips for cloud computing and edge AI. By adopting cutting-edge technologies ahead of competitors, the company is in a hurry to establish its position in the high-end market.
6. ASML Forecasts 2027-2028 for Next-Generation EUV Mass Production
   ASML, a leading semiconductor lithography equipment manufacturer, has forecast that mass production of next-generation ultra-high NA (Hyper-NA) EUV equipment that exceeds current High-NA EUV will be around 2027 to 2028. This technology challenges the limits of further miniaturization, and although the manufacturing cost and technological hurdles are high, it is being developed as a fundamental technology that will support the semiconductor roadmap in the 2030s.
7. Amazon and STMicro to collaborate on data center construction
   Amazon (AWS) and STMicroelectronics have agreed to collaborate on data center construction, which is expected to leverage STMicro’s power semiconductor technology to improve the power and operational efficiency of AWS’ data centers. This is an example of how chip makers and cloud providers are deepening their collaboration at the infrastructure level as power consumption in data centers increases sharply with the demand for AI.
8. Qualcomm Proves Technology Capability of Indian Base with Completion of 2nm Design
   Qualcomm has completed the design (tape-out) of a chip using its 2nm process. The company’s Indian base is said to have played a leading role in this achievement, symbolizing that India is not just attracting manufacturing (fabs), but has begun to establish a global presence in the area of cutting-edge chip design. It is also consistent with the Indian government’s semiconductor support program, which is shifting its focus to design and IP development.
9. China’s Semiconductor Production Capacity Ranks First in the World; Equipment Self-Sufficiency Also Improves
   China’s semiconductor production capacity has reportedly reached the top of the world as it continues to expand, especially in legacy nodes, led by three major manufacturing companies, including SMIC, which is also rapidly producing manufacturing equipment domestically in response to U.S. export restrictions. Although challenges remain in advanced processes, China’s influence in the global general-purpose chip market has grown to a scale that cannot be ignored, prompting structural changes in the supply chain.
10. Tower Semiconductor and Nvidia Collaborate on Optical Modules
    Tower Semiconductor and Nvidia are collaborating on the development of 1.6 terabit (T) capable optical modules to accelerate networking for AI data centers. The aim is to dramatically increase data transfer speeds between AI clusters by leveraging silicon photonics technologies that push the limits of conventional electrical wiring. The implementation of “optical” technology in next-generation AI infrastructure is accelerating.

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