Semiconductor News 20260122

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Based on the sources provided, the Top 10 most important news items are extracted and summarized.

1. Global Semiconductor Market to Surpass $1 Trillion Mark by 2026
   According to Omdia’s forecast, the global semiconductor market size could surpass $1 trillion by 2026, with explosive growth driven by AI-related demand, putting the entire market in a super cycle. The semiconductor materials market is also projected to expand at a compound annual growth rate (CAGR) of 5.4% from 2025 to 2030, according to TECHCET, and the entire industry is booming, not only in device manufacturing but also in the materials sector.
2. Nvidia emerges as TSMC’s top priority customer, surpassing Apple
   Nvidia CEO Jensen Huang has recognized that his company has become TSMC’s largest customer, as demand for AI chips surges and TSMC’s foundry division reportedly is prioritizing Nvidia over Apple, its longtime preferred customer. Nvidia is reportedly being prioritized over Apple, which has long been a preferred customer for TSMC’s foundry division. To counter this, Nvidia is also pursuing a strategy to improve the performance of its next-generation Vera Rubin chip and prevent hyperscalers from adopting AMD products.
3. Tight TSMC Capacity Provides New Commercial Opportunity for Samsung Electronics
   Tight TSMC capacity due to demand for AI chips is providing an opportunity for Samsung Electronics’ competing advanced nodes. Samsung has reportedly moved its first custom HBM logic die to a 2nm foundry process. The company is also accelerating its technology investments and supply chain enhancements to capture replacement demand from TSMC, including considering the introduction of ASMPT equipment for its packaging process (TCB).
4. Memory Shortage Worsens , Xiaomi and OPPO to Cut 2026 Shipments
   Memory chip supply shortages and price hikes are taking a toll on Chinese smartphone makers. According to reports, Xiaomi and OPPO have been forced to cut their shipment targets for 2026 due to memory shortages. The challenges are particularly pronounced in mid- and low-end models and SoCs, and while Huawei has been relatively unaffected, the entire smartphone market is facing supply constraints due to component shortages.
5. Chinese Semiconductor Equipment Giants Push for HBM Manufacturing Autonomy
   In response to tighter U.S. export controls, Chinese semiconductor equipment makers are accelerating moves to become more autonomous in HBM (broadband memory) production. In the field of SiC power semiconductors, China is also keen to manufacture with domestically produced equipment and is moving away from dependence on the U.S. in its supply chain.
6. JX Metals to Invest 5 Billion Yen in Rapidus, Plans to Supply Critical Materials
   JX Advanced Metals (JX Advanced Metals) reportedly plans to make a 5 billion yen investment in Rapidus, a Japanese company that aims to manufacture next-generation semiconductors. In addition to this, JX Advanced Metals is expected to supply critical materials essential for semiconductor manufacturing. Other reports have discussed the possibility of Rapidus joining with Konoha and Sharp’s plans to produce AI servers domestically, and the collaboration to build an advanced semiconductor ecosystem in Japan is taking shape.
7. Supply of high-grade glass fiber cloth is tight , hitting AI server demand
   The rapid increase in demand for AI servers has led to a tight supply of high-grade glass fiber cloth, which is used as a substrate material. This has drawn the attention of major suppliers such as Nittobo (Nittobo). The shortage of a single piece of glass fiber cloth has been plaguing major global companies, surfacing a bottleneck not only in chips but also in substrate materials in the construction of AI infrastructure, pushing up profits for related companies in December 2025.
8. TSMC and imec advance to 0.7 nm process; optoelectronic fusion technology also makes progress
   TSMC and research institute imec have made significant progress with complementary field-effect transistor (CFET) structures to achieve 0.7 nm semiconductors as a miniaturization technology beyond 1 nm. In addition, there is growing interest in photoelectric fusion technology (CPO) for faster AI processing, and research trends toward solving inspection technology issues such as alignment and reproducibility are gaining momentum. Technological innovations continue to support the next-generation computing infrastructure.
9. Taiwan Secures Preferential Tariff Treatment with the U.S.; Investment Environment Changes
   Taiwan has secured tariff terms similar to MFN treatment for its exports to the U.S., while commentary suggests that it is losing investment advantages in China and Vietnam. In the geopolitical balance, Taiwan’s export competitiveness and manufacturing base strategies are under review. In addition, TSMC plans to grow its advanced packaging capex at an annual rate of 24% from 2025 to 2027, clearly indicating a shift to high value-added manufacturing within Taiwan.
10. Micron to Acquire PSMC’s Factories to Increase DRAM Supply in 2027
    Micron has agreed to acquire the Causeway Plant of Taiwan’s PSMC (Power Supply and Manufacturing Company). The acquisition is expected to result in an upward revision of global DRAM supply capacity in 2027, a strategic expansion of production capacity to meet surging memory demand for AI and data center applications, and to strengthen the supply chain through industry consolidation. The acquisition of existing plants is expected to enable a more rapid production ramp-up than new construction.

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