Semiconductor News 20260114

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1. TSMC to Build Five More Factories in Arizona, Investment to Exceed $100 B illion
   TSMC reportedly plans to build five more factories in Arizona under a trade agreement with the United States, with total investment likely to exceed $100 billion. This move is related to the fact that trade negotiations between the U.S. and Taiwan are in their final stages, linked to the massive semiconductor expansion under the Trump administration. The tariff negotiations focus on the application of remedies under Section 232 of the Trade Expansion Act.
2. Samsung Electronics to Reclaim DRAM Market Share Leadership and Set Record Sales
   Samsung Electronics is on track to set a new record for Q4 2025 sales and reclaim its share leadership in the global DRAM market, with growing demand for AI servers strongly driving revenue, as the overall memory market is entering a super The memory market as a whole is entering a super cycle. On the other hand, labor union membership has jumped eightfold in the past four months due to dissatisfaction with performance-based pay, highlighting the rising labor-management tensions within the company behind the strong performance.
3. Micron Warns Memory Supply Shortage for AI Will Continue through 2028
   Micron has warned that the tight supply-demand balance for memory for AI could continue through 2028 amid slow progress in building a new fab in Idaho.Enthusiastic investment in AI infrastructure is causing a global memory shortage, and DDR5 production increase has also been noted to have the exclusionary effect of squeezing production capacity for other products. To strengthen its supply structure, the company has begun construction of a new plant with up to four manufacturing buildings, also in New York State.
4. Global Semiconductor Market to Grow 21% to $793 Billion in 2025; NVIDIA Leads in Sales
   According to preliminary figures from Gartner, the global semiconductor market will reach $793 billion in 2025, up 21% from the previous year, with NVIDIA at the top in sales.Against the backdrop of the AI boom, Topco, which handles advanced process materials Scientific, which handles advanced process materials, and WT Microelectronics, which handles distribution, also posted record sales. The industry as a whole is strongly benefiting from AI demand, with component value expected to surge even further by 2026 due to the proliferation of edge AI devices.
5. SK H ynix to Build Advanced Packaging Plant in Cheongju to Increase HBM Output
   SK Hynix has decided to build an advanced packaging plant in Cheongju, South Korea, to increase HBM (broadband memory) output by 2027. The possibility of continuing to use MR-MUF technology as the manufacturing process in the next generation HBM4 is being considered. The company is also ranked high in the 2025 semiconductor sales rankings, solidifying its position as a key memory supplier essential for AI chips.
6. Rapidus plans to reduce semiconductor design costs by 30% through the use of generative AI
   Rapidus, a Japanese manufacturer of next-generation semiconductors, has announced its policy to reduce design costs by 30% by introducing semiconductor design support that utilizes generative AI. This is intended to improve design efficiency and increase international cost competitiveness. In Japan, the Tokyo Metropolitan Government has established an 11 billion yen corporate location subsidy with economic security in mind, and other public-private sector moves to strengthen semiconductor-related supply chains and human resource development are accelerating in both directions.
7. Canon puts wafer flattening technology based on nanoimprint lithography technology to practical use
   Canon Inc. has put to practical use a technology that makes wafer surfaces extremely flat by applying nanoimprint lithography technology. Using a stamp-like mold pressing technique, it is possible to reduce unevenness to less than 5 nanometers. As a new alternative to conventional polishing technology, it is expected to contribute to yield improvement and cost reduction in semiconductor manufacturing processes, which are becoming increasingly miniaturized, and demonstrates Japan’s technological superiority in the field of manufacturing equipment.
8. Rising Memory Prices Spill Over to End Products, Leading to Cancellation of Smartphone Launch in China
   Rising costs due to priority production of memory for AI servers are hurting consumers. China’s Meizo was forced to cancel the launch of its new Meizo 22 Air smartphone due to soaring memory costs. Passive component makers are also facing cost pressures due to rising prices of raw materials such as silver and copper. The competition for memory is beginning to have a serious impact on the supply and prices of consumer devices.
9. The U.S.-China race to build a space data center has become a new stage in the battle for AI supremacy.
   Attempts to build a data center in space have become a new focal point in the battle for AI supremacy between the United States and China. By utilizing the space environment, which is not subject to infrastructure constraints on the ground, the aim is to improve AI processing capacity and secure a security advantage. Related to this, geopolitical risks over sensitive communication cables and satellite networks have also been pointed out, and semiconductor technology is directly linked to the struggle for leadership in space infrastructure as well as terrestrial manufacturing.
10. Tohoku University Develops Low-Cost Manufacturing Technique for Semiconductor Components Using Sodium V apor
    Tohoku University has developed a new technique for sintering semiconductor ceramics by using sodium vapor. This technique enables the manufacture of high-quality ceramic components at a significantly lower cost than previously possible. The improvement in the manufacturing efficiency of ceramics, a key component of semiconductor manufacturing equipment, will lead to a reduction in overall equipment costs and is attracting attention as a groundbreaking achievement that will support the competitiveness of Japanese equipment manufacturers in terms of basic technology.

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