Semiconductor News 20260110

TOC

Main News

  1. Nvidia “Vera Rubin” and HBM4 Competition Intensifies
    As discussions continue regarding the production schedule for Nvidia’s next-generation Vera Rubin GPU, the company is accelerating its race to introduce HBM4 (6th generation broadband memory). to SK Hynix, Samsung and Micron, The evolution of memory technology, driven by AI demand, has entered a new phase, with increasing impact on the entire supply chain.
  2. Intel, Trump Administration Support and New “14A” Process Focus
    Intel’s stock price rose sharply. The company was well received after President-elect Trump met with CEO Gelsinger and expressed his support for boosting semiconductor production in the U.S. The launch of the new “Panther Lake” chip was also praised. Furthermore, the company’s CEO spoke of the company’s full focus on the cutting-edge “14A” process and expressed his extraordinary determination to rebuild the foundry business and win customers.
  3. SanDisk to Double Enterprise SSD Prices
    Western Digital-owned SanDisk reportedly plans to double the price of 3D NAND used in enterprise SSDs in the first quarter of 2026, driven by a surge in data storage demand due to the AI boom. Furthermore, the company is reportedly seeking upfront cash transactions from customers to guarantee long-term NAND supply, underscoring the tight supply-demand balance and seller dominance in the storage market.
  4. TSMC Considering Transfer of Mature Processes to Singapore
    TSMC reportedly plans to transfer its manufacturing equipment for mature processes in Taiwan to a plant in Singapore. This is seen as part of the company’s move to redeploy and withdraw resources in line with the expansion of its advanced plant in Arizona, USA. On the other hand, while December revenues declined due to seasonal factors, the company has achieved solid growth for the full year 2025, and its strategy is to both optimize its global manufacturing footprint and maintain profitability.
  5. Lithography Restructuring in China and Shenzhen EUV Operation
    Chinese semiconductor equipment manufacturer AMIES has acquired a SMEE affiliate and is restructuring its domestic exposure technology. A prototype extreme ultraviolet (EUV) lithography tool was reportedly started up in Shenzhen, sharpening the country’s stance against the “silicon curtain” technology blockade by Western countries; domestic production and financing are accelerating, including an IPO plan for GPU maker Iluvatar CoreX; and the Chinese government is also pushing for a new EUV lithography system in Shenzhen.
  6. Canon takes advantage of NAND shortage to chase ASML
    Canon Inc. is stepping up its offensive, seeing the shortage of NAND flash memory due to rising demand for AI data centers as a commercial opportunity. The company aims to steal market share from ASML, the largest player, in areas such as KrF lithography equipment, a field in which the company excels. lamination technology is crucial for 3D NAND production, and Canon’s equipment with its superior cost performance may be reevaluated. Japanese companies are trying to make their presence felt with niche-top technologies.
  7. Tokyo Electron to Increase Capital Expenditures 48% to Record High
    Tokyo Electron, Japan’s leading semiconductor equipment manufacturer, reportedly plans to increase its capital expenditures for fiscal year 2026 (FY26) by 48% over the previous year to a record high level. In particular, the company expects demand for equipment for the DRAM etch process to increase, and is betting on increased production capacity to meet the explosion in demand for AI memory. This is an aggressive investment strategy based on the belief that a semiconductor market super-cycle has arrived.
  8. Apple’s Head of Hardware Emerges as Candidate for Next CEO
    John Tarnas, Apple’s senior vice president of hardware engineering, has reportedly emerged as a potential successor to CEO Tim Cook. The move comes as the board of directors prepares for a management succession. Tarnas has led the development of key products such as the iPhone and iPad, and it is increasingly likely that a leader with a technical background will helm the next generation of Apple.
  9. Qualcomm signs long-term supply deal with VW to expand automotive sector
    Qualcomm has signed a long-term supply agreement with Volkswagen AG (VW) to supply chips for in-vehicle infotainment and connectivity. At CES 2026, the company announced an expansion of its automotive partnerships, accelerating the transition to AI-powered “software-defined vehicles” (SDVs). The company is steadily expanding the application of AI technology from the smartphone market to the automotive industry.
  10. Thai Government Formulates First National Semiconductor Strategy
    The Thai government has announced that it has formulated the country’s first-ever national semiconductor strategy, aiming to attract investment worth over 12 trillion yen. The strategy aims to establish Thailand as a new manufacturing hub in Southeast Asia, taking advantage of supply chain restructuring due to the conflict between the U.S. and China. In addition, Japan’s Mie Prefecture has seven times the investment attractiveness of Tokyo, highlighting the current situation in which the semiconductor industry is both revitalizing local economies and attracting global investment money.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Jan 9, 14:29TSMC、12月の収益は季節的出荷パターンで軟調ながらも2025年は堅調な通年成長を達成TSMC posts strong full-year growth in 2025 as December revenue eases on seasonal shipment patternshttps://www.digitimes.com/news/a20260109VL209/tsmc-semiconductors-revenue-growth-taiwan-2025.html
Jan 9, 15:50NvidiaのVera Rubin生産スケジュールが議論を呼ぶ 一方、HBM4の実装準備と韓国メモリメーカーとの交渉も注目されるNvidia’s Vera Rubin production timeline sparks debate as HBM4 readiness and talks with Korean memory makers draw scrutinyhttps://www.digitimes.com/news/a20260109PD250/nvidia-rubin-hbm4-production-2026.html
Jan 9, 14:41MA-tek、AIチップと先進プロセス需要により12月および通年の収益増を報告MA-tek reports higher December and full-year revenue driven by AI chip and advanced process demandhttps://www.digitimes.com/news/a20260109PD211/ma-tek-advanced-process-ai-chip-testing-revenue-demand.html
Jan 9, 11:51VolkswagenとQualcomm、インフォテインメントおよびコネクティビティ向けチップの長期供給契約を発表Volkswagen and Qualcomm announce long-term supply deal for infotainment and connectivity chipshttps://www.digitimes.com/news/a20260109VL204/volkswagen-qualcomm-infotainment-vehicle-rivian.html
Jan 9, 10:30独占:SanDisk、長期のHAND供給に向け前払い現金取引を模索Exclusive: SanDisk seeks prepaid cash deals for long-term HAND supplyhttps://www.digitimes.com/news/a20260109PD226/sandisk-nand-demand-market-nand-flash.html
Jan 9, 16:36CES 2026:Qualcomm、自動車向けパートナーシップを拡大し、ソフトウェア定義およびAI駆動のモビリティを加速CES 2026: Qualcomm expands automotive partnerships to accelerate software-defined and AI-driven mobilityhttps://www.digitimes.com/news/a20260109VL205/qualcomm-snapdragon-automotive-smart-cockpit-ces-2026.html
Jan 9, 15:18台湾、10年計画でSiPh CPO-AIエコシステムの構築を目指すTaiwan targets SiPh CPO-AI ecosystem in 10-year planhttps://www.digitimes.com/news/a20260109PD244/taiwan-siph-cpo-nstc-data.html
Jan 9, 15:17AMEC会長、再び中国国籍を取得後に株式売却を計画AMEC chairman plans share sale after restoring Chinese citizenshiphttps://www.digitimes.com/news/a20260109VL210/amec-chairman-2022.html
Jan 9, 15:10Iluvatar CoreXのIPO、中国における汎用GPU大規模展開競争を浮き彫りにするIluvatar CoreX IPO highlights China’s race to scale general-purpose GPUshttps://www.digitimes.com/news/a20260108VL211/gpu-shanghai-ipo-software-2025.html
Jan 9, 15:09AMIES Technology、3200万ドルの取引でSMEE系列会社を買収し、中国のリソグラフィ再編を明確にするAMIES Technology acquires SMEE affiliate in US$32m deal, clarifying China’s lithography splithttps://www.digitimes.com/news/a20260108VL214/smee-equipment-shanghai-industrial-packaging.html
Jan 9, 14:52MSScorps、AIおよびチップ需要により2025年第4四半期および通年で記録的な収益を達成MSScorps hits record 4Q25, 2025 revenue on AI and chip demandhttps://www.digitimes.com/news/a20260109PD201/msscorps-revenue-demand-2025-siph.html
Jan 9, 14:50Walsin子会社Joyin、銀価格の高騰に伴いサーミスタとバリスタの価格を引き上げるWalsin subsidiary Joyin raises prices on thermistors and varistors as silver cost surgeshttps://www.digitimes.com/news/a20260109PD255/passive-taiwan-price-component-cost.html
Jan 9, 12:32論説:中国-日本間の半導体サプライチェーンはどれほど脆弱か?Commentary: How fragile is the China–Japan semiconductor supply chain?https://www.digitimes.com/news/a20260109PD241/exports-silicon.html
Jan 9, 12:19Largan、メモリ価格の影響が広がる中で課題に直面Largan faces challenges as memory price impacts spreadhttps://www.digitimes.com/news/a20260109PD218/largan-precision-lens-maker-earnings-memory-price-2026.html
Jan 9, 11:59SASおよびGlobalWafers、2025年の収益がわずかに減少する一方、TSC、AWSC、ATCは新たな高水準に達するSAS and GlobalWafers see slight 2025 revenue dip; TSC, AWSC, ATC hit new highshttps://www.digitimes.com/news/a20260109PD238/revenue-2025-sas-globalwafers-topco.html
Jan 9, 11:48論説:中国のDCS調査が日本における代替可能分野を示すCommentary: China’s DCS probe against Japan shows where substitution is viablehttps://www.digitimes.com/news/a20260109PD223/gases-materials-capacity-china-probe-2026.html
日経 Tech Foresight
2026-01-09キヤノン「NAND不足に商機」 KrF露光装置、ASML超え狙うhttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC080860Y6A100C2000000
マイナビニュース テックプラス
2026-01-09NVIDIAのJensen Huang CEO、2026年のIEEE名誉勲章の授与者に選出https://news.mynavi.jp/techplus/article/20260109-3948440/
2026-01-09デロイト トーマツ、恒例の半導体セミナーを開催―地政学変動と日本企業の勝ち筋https://news.mynavi.jp/techplus/kikaku/20260109-3829841/
2026-01-09シーメンスとNVIDIA、産業用AIオペレーティングシステム構築に向けて協業を拡大https://news.mynavi.jp/techplus/article/20260109-3948284/
2026-01-09ローデが日本でADIおよびGRLとパートナーシップ、車載ソリューションを強化https://news.mynavi.jp/techplus/article/20260109-3948132/
2026-01-09半導体地政学に挑む先端半導体開発・製造を議論 – ISSM戦略フォーラム2025https://news.mynavi.jp/techplus/article/20260109-3948052/
2026-01-092025年11月の半導体市場は前年同月比29.8%増の753億ドルで過去最高を更新、SIA調べhttps://news.mynavi.jp/techplus/article/20260109-3947367/
2026-01-09“制度化”された対中経済圧力 トランプ米大統領が民間企業の半導体事業買収を阻止する理由https://news.mynavi.jp/techplus/article/20260109-3942774/
TrendForce
2026-01-09NVIDIAがHBM4競争を加速:SK hynix、Samsung、Micronが12層体制の立ち上げと16層技術への挑戦を推進NVIDIA Fuels HBM4 Race: 12-Layer Ramps, 16-Layer Push by SK hynix, Samsung, and Micronhttps://www.trendforce.com/news/2026/01/09/news-nvidia-demand-fuels-hbm4-race-12-layer-ramps-16-layer-push-by-sk-hynix-samsung-and-micron/
2026-01-09東京エレクトロン、報道によるとFY26の設備投資額を48%増加させ史上最高水準に、DRAMエッチング需要に賭けるTokyo Electron Reportedly Raises FY26 CapEx 48% to Record High, Bets on DRAM Etching Demandhttps://www.trendforce.com/news/2026/01/09/news-tokyo-electron-reportedly-raises-fy26-capex-48-to-record-high-bets-on-dram-etching-demand/
2026-01-09Appleのハードウェア担当責任者ジョン・ターナス、取締役会が交代準備を進める中、次期CEO候補に浮上Apple Hardware Chief John Ternus May Become Next CEO as Board Reportedly Prepares for Transitionhttps://www.trendforce.com/news/2026/01/09/news-apple-hardware-chief-john-ternus-may-become-next-ceo-as-board-reportedly-prepares-for-transition/
2026-01-09TSMC、成熟ノード用ツールのシンガポール移管を計画、アリゾナでの拡大に伴い撤退を加速すると報じられるTSMC Reportedly Plans Mature-Node Tool Shift to Singapore, Accelerates Exit as Arizona Expandshttps://www.trendforce.com/news/2026/01/09/news-tsmc-reportedly-plans-mature-node-tool-shift-to-singapore-accelerates-exit-as-arizona-expands/
2026-01-09茅台、国信マイクロ、エンピリアンがIC製造関連の新会社を設立Moutai, Guoxin Micro, Empyrean Set up New Firms Related to IC Manufacturinghttps://www.trendforce.com/news/2026/01/09/news-moutai-guoxin-micro-empyrean-set-up-new-firms-related-to-ic-manufacturing/
Semiconductor Digest
7 hours ago2026年の展望:経営層の見解2026 Outlook: Executive Viewpointshttps://www.semiconductor-digest.com/2026-outlook-executive-viewpoints/
7 hours ago2026年の展望:経営層の見解2026 Outlook: Executive Viewpointshttps://www.semiconductor-digest.com/2026-outlook-executive-viewpoints/
日本経済新聞
2026-01-10米国株、ダウ続伸し237ドル高 最高値更新 労働市場の底堅さが支え S&P500種も最高値https://www.nikkei.com/article/DGXZQOFL09CPO0Z00C26A1000000/
2026-01-10NYダウ続伸237ドル高、最高値更新 米雇用統計を好感https://www.nikkei.com/article/DGXZQOFL100230Q6A110C2000000/
2026-01-10米国株15時、ダウ続伸 米雇用統計が労働市場の底堅さを示すhttps://www.nikkei.com/article/DGXZQOFL09CNY0Z00C26A1000000/
2026-01-10日本の半導体復権、最後のチャンス ラピダス・東哲郎会長https://www.nikkei.com/article/DGXZQOUC15AT40V11C25A2000000/
2026-01-10α世代取り込み、主要企業3割が開発組織 カシオは仮想空間Gショックhttps://www.nikkei.com/article/DGXZQOUC2697T0W5A221C2000000/
2026-01-10CESに戻ってきた中国企業、本社移し関税回避も 「トランプ後」にらむhttps://www.nikkei.com/article/DGXZQOGN070160X00C26A1000000/
2026-01-10インテル株価1割急伸 トランプ氏がCEOと面会、半導体生産後押しhttps://www.nikkei.com/article/DGXZQOGN080SV0Y6A100C2000000/
2026-01-10ドイツ株9日 続伸し最高値、仏株も最高値を2カ月半ぶりに更新https://www.nikkei.com/article/DGXZQOFL09C810Z00C26A1000000/
2026-01-10投資誘致力、三重が東京の7倍 半導体関連けん引し地方に13兆円https://www.nikkei.com/article/DGXZQOCC11C6V0R11C25A2000000/
2026-01-10タイ政府、半導体で初の国家戦略 12兆円超の投資誘致へhttps://www.nikkei.com/article/DGXZQOUC089L20Y6A100C2000000/
ダイヤモンドオンライン
Jan 8 19:35世界を「闘技場」に変えた3つの衝撃、戦略的依存では乗り切れない過酷な未来https://diamond.jp/articles/-/380916
Jan 7 21:45AI「2026年問題」でまた露呈!?高市成長戦略だけでない日本の新技術導入政策の“構造的欠陥”https://diamond.jp/articles/-/381058
Jan 7 20:00中国兵器産業、いかに欧米並みに成長したかhttps://diamond.jp/articles/-/381110
Jan 7 19:55トランプ関税でサプライヤーに不利益を押し付けた完成車メーカーランキング【部品メーカー138人アンケート】トヨタ、ホンダ、日産…https://diamond.jp/articles/-/375856
Tom’s Hardware
2026-01-09 22:57研究者が腐敗した牛乳を3Dプリント用素材に変えるResearchers turn spoiled milk into 3D printing materialshttps://www.tomshardware.com/3d-printing/researchers-turn-spoiled-milk-into-3d-printing-materials-extracted-proteins-from-dairy-waste-combined-with-polymers-to-create-plastic-alternative
2026-01-09 21:56トランプ大統領とLutnick長官、パンサー・レイク・チップ発売後にインテルを称賛President Trump, Sec. Lutnick praise Intel after the launch of Panther Lake chipshttps://www.tomshardware.com/tech-industry/president-trump-sec-lutnick-praise-intel-after-the-launch-of-panther-lake-chips-says-investment-in-company-already-bringing-tens-of-billions-of-dollars-for-the-american-people
2026-01-09 21:56CEOリップ・ブー・タン、インテルが『14A』に本格的に注力すると語るIntel is ‘going big time into 14A,’ says CEO Lip-Bu Tanhttps://www.tomshardware.com/tech-industry/semiconductors/intel-is-going-big-time-into-14a-says-ceo-lip-bu-tan-serve-the-customer-well-remark-hints-at-external-client
2026-01-09 21:00Apple-1『Prototype Board #0』システム、50周年記念オークションで50万ドル以上で落札されると予想Apple-1 ‘Prototype Board #0’ system is expected to fetch $500,000+ at a 50th Anniversary auctionhttps://www.tomshardware.com/desktops/pc-building/apple-1-prototype-board-0-system-is-expected-to-fetch-usd500-000-at-a-50th-anniversary-auction-and-the-firms-first-ever-check-is-valued-at-the-same-amount
2026-01-09 20:00Acemagic、NESとPlayStation 1にインスパイアされたミニPCを発表Acemagic presents mini-PCs inspired by the NES and PlayStation 1https://www.tomshardware.com/video-games/retro-gaming/acemagic-presents-mini-pcs-inspired-by-the-nes-and-playstation-1-retro-shells-conceal-ryzen-ai-9-465-up-to-64gb-of-ram-and-up-to-4tb-of-ssd-storage
2026-01-09 19:29SanDisk、2026年第1四半期に企業向けSSDの3D NANDの価格を倍増するSanDisk to double price of 3D NAND for enterprise SSDs in Q1 2026https://www.tomshardware.com/pc-components/ssds/sandisk-to-double-price-of-3d-nand-for-enterprise-ssds-in-q1-2026-hyperscalers-to-pay-top-dollar-for-storage-as-ai-continues-to-roll
2026-01-09 07:24Audeze、より優れた空間没入感と重低音を実現したMaxwell 2ヘッドセットを発売Audeze launches Maxwell 2 headset with better spatial immersion and basshttps://www.tomshardware.com/peripherals/gaming-headsets/audeze-launches-maxwell-2-headset-with-better-spatial-immersion-and-bass-plus-of-course-improved-ai-noise-canceling-mic-tech
TechPowerup
2026-01-09T20:27:04+00:00KeychronがCES 2026でNape Proワイヤレストラックボールマウスと新型キーボードを発表Keychron Unveils Nape Pro Wireless Trackball Mouse and New Keyboards at CES 2026https://www.techpowerup.com/345036/keychron-unveils-nape-pro-wireless-trackball-mouse-and-new-keyboards-at-ces-2026
2026-01-09T18:44:58+00:00MinisforumがCES 2026でIntel「Panther Lake」ミニPCなどを展示Minisforum Shows Intel “Panther Lake” Mini PC and More at CES 2026https://www.techpowerup.com/345034/minisforum-shows-intel-panther-lake-mini-pc-and-more-at-ces-2026
2026-01-09T18:44:08+00:00ThunderobotがCES 2026でIntel Panther Lake搭載のZERO Airゲーミングラップトップを発売Thunderobot Launches ZERO Air Gaming Laptops with Intel Panther Lake at CES 2026https://www.techpowerup.com/345033/thunderobot-launches-zero-air-gaming-laptops-with-intel-panther-lake-at-ces-2026
2026-01-09T17:48:15+00:00HuionがCES 2026でデジタルアート向けKamvas Gen 3タブレットを展示Huion at CES 2026 Shows Kamvas Gen 3 Tablets for Digital Artworkhttps://www.techpowerup.com/345032/huion-at-ces-2026-shows-kamvas-gen-3-tablets-for-digital-artwork
2026-01-09T17:04:32+00:00AMD「Strix Halo/Point」搭載のGPDミニラップトップとハンドヘルドがCES 2026に登場GPD Mini Laptops and Handhelds Powered by AMD “Strix Halo/Point” Arrive to CES 2026https://www.techpowerup.com/345031/gpd-mini-laptops-and-handhelds-powered-by-amd-strix-halo-point-arrive-to-ces-2026
2026-01-09T16:26:10+00:00TianmaがCES 2026で27インチQHD 610Hz酸化ディスプレイを発表Tianma Introduces 27-inch QHD 610 Hz Oxide Display at CES 2026https://www.techpowerup.com/345029/tianma-introduces-27-inch-qhd-610-hz-oxide-display-at-ces-2026
2026-01-09T16:14:09+00:00GL.iNetがCES 2026で次世代トラベルルーターを発表GL.iNet Unveils Next-Gen Travel Routers at CES 2026https://www.techpowerup.com/345028/gl-inet-unveils-next-gen-travel-routers-at-ces-2026
2026-01-09T15:00:57+00:00KTCが2026国際CESでゲーミングモニターを披露KTC Gaming Monitors at 2026 International CEShttps://www.techpowerup.com/345025/ktc-gaming-monitors-at-2026-international-ces
EETimes Taiwan
2026-01-09HBMの需給不均衡と長鑫の躍進 — AI駆動によるDRAMの重大な転換点HBM供需失衡與長鑫崛起—AI驅動DRAM關鍵轉折https://www.eettaiwan.com/20260109nt01-two-events-illustrate-how-ai-is-rewriting-the-memory-book/
2026-01-09CES 2026:Nvidiaが解説するPhysical AIのフルスタック計算アーキテクチャCES 2026:Nvidia闡述Physical AI全棧運算架構https://www.eettaiwan.com/ces-2026%ef%bc%9anvidia%e9%97%a1%e8%bf%b0physical-ai%e5%85%a8%e6%a3%a7%e9%81%8b%e7%ae%97%e6%9e%b6%e6%a7%8b/
2026-01-09CLを組み入れたマルチフェーズ降圧レギュレータ設計の実装CL融入多相降壓穩壓器設計實作https://www.eettaiwan.com/20260109ta71-multiphase-solutions-for-high-current-fast-transient-noise-sensitive-applications-part-2-coupled-inductors/
2026-01-092026:適応型アイデンティティ時代の幕開け2026:適應性身分時代的黎明https://www.eettaiwan.com/20260109nt21-adaptive-identity-era/
2026-01-08深圳、EUVプロトタイプ起動 — 半導体産業に『シリコンカーテン』の幕開け深圳EUV原型機啟動 半導體產業「矽幕」升起https://www.eettaiwan.com/20260108nt01-china-euv-breakthrough-and-the-rise-of-the-silicon-curtain/
2026-01-08システムアーキテクトが知るべきマルチダイ相互接続ガイド系統架構師的多晶片互連指南https://www.eettaiwan.com/20260108nt61a-system-architect-s-guide-to-multi-die-interconnect/
2026-01-08CES 2026:AMDが明かすYottaスケールの計算能力とAIエッジCES 2026:AMD揭示Yotta算力與AI終端https://www.eettaiwan.com/20250108nt11-ces-2026-amd-unveils-yotta-scale-compute-and-edge-ai/
2026-01-082025年第3四半期、世界のセルラーIoTモジュール出荷量が前年比10%増2025年第3季全球蜂巢式物聯網模組出貨量年增10%https://www.eettaiwan.com/2025-q3-global-cellular-iot-modules-shipments/
2026-01-08AIブームが半導体サプライチェーンに『蝶の効果』を引き起こす—マクロニックス、完全なFlash展開で新たなスーパーサイクルに挑むAI 浪潮引爆半導體供應鏈「蝴蝶效應」 旺宏完整Flash佈局迎戰新一輪超級循環https://www.eettaiwan.com/20260108-macronix-ai-triggers-a-new-memory-super-cycle/
EETimes Asia
2026-01-08大手サプライヤの撤退により、2026年にMLC NANDフラッシュ容量が42%減少する見通しMLC NAND Flash Capacity Forecast to Decrease 42% in 2026 as Major Suppliers Exithttps://www.eetasia.com/mlc-nand-flash-capacity-forecast-to-decrease-42-in-2026-as-major-suppliers-exit/
2026-01-08Nordic Semiconductor、数十億のIoTデバイス向けエッジAIを簡素化Nordic Semiconductor Simplifies Edge AI for Billions of IoT Deviceshttps://www.eetasia.com/nordic-semiconductor-simplifies-edge-ai-for-billions-of-iot-devices/
2026-01-08ST社の最新STM32 MPU、強力な処理エンジンを搭載ST’s Latest STM32 MPUs Boast Powerful Processing Enginehttps://www.eetasia.com/sts-latest-stm32-mpus-boast-powerful-processing-engine/
2026-01-08NXP、次世代SDV向け制御モジュールにCEVAを起用NXP Taps CEVA to Power Next-Gen Control Modules for SDVshttps://www.eetasia.com/nxp-taps-ceva-to-power-next-gen-control-modules-for-sdvs/
EETimes India
ZDNET Korea
2026-01-10ギャラクシーS26 ウルトラ、充電速度はどれほど速くなるのか갤럭시S26 울트라, 충전속도 얼마나 빨라질까https://www.zdnet.co.kr/20260110070440” title=”
2026-01-10B&Mカンパニー、モニターブランド『キューニックス』に投資し、『B&Mキューニックス』を立ち上げ비엔엠컴퍼니, 모니터 브랜드 큐닉스에 투자…’비엔엠큐닉스’ 출범https://www.zdnet.co.kr/20260110080648” title=”
2026-01-10ネオゲームズ『リアルファームクラフト』、事前予約開始네오게임즈 ‘레알팜 크래프트’, 사전예약 시작https://www.zdnet.co.kr/20260109114739” title=”
2026-01-10フェイカー所属のチームリード、2026 LCKシーズンオープニングで2年連続優勝페이커 소속 ‘팀 리드’, 2026 LCK 시즌 오프닝 2년 연속 우승https://www.zdnet.co.kr/20260110001104” title=”
2026-01-09男性は使い、女性はためらう… AI格差が生む新たな性別格差남성은 쓰고 여성은 망설인다…AI 격차가 만들 새로운 ‘성별 격차’https://www.zdnet.co.kr/20260109193136” title=”
2026-01-09ネクソン『アジュール プロミリア』、コミックワールドのメインスポンサーとして参加넥슨 ‘아주르 프로밀리아’, 코믹월드 메인 스폰서 참가https://www.zdnet.co.kr/20260109173324” title=”
2026-01-09起亜、EV2を世界初公開…「電気自動車の普及を先導」기아, EV2 세계 최초 공개…”전기차 대중화 앞장”https://www.zdnet.co.kr/20260109160448” title=”
2026-01-09スマイルゲート『ロストアーク』、OSTアルバム『Dear Friends』を正式発売스마일게이트 ‘로스트아크’, OST 앨범 ‘Dear Friends’ 정식 발매https://www.zdnet.co.kr/20260109172210” title=”
2026-01-09現代自動車のスタリア、電気自動車として生まれ変わり…ブリュッセルモーターショーで初公開현대차 스타리아, 전기차로 재탄생…브뤼셀모터쇼서 최초 공개https://www.zdnet.co.kr/20260109154143” title=”
2026-01-09政府、AIで賃貸詐欺を防止…「契約前にリスクを捉える」정부, AI로 전세사기 막는다…”계약 전 위험 포착”https://www.zdnet.co.kr/20260109174604” title=”
2026-01-09チョ・ジュンヒ KOSA会長、ラスベガスで大胆な行動…「韓国企業のグローバル進出を牽引」조준희 KOSA 회장, 라스베이거스서 광폭 행보…”韓 기업 글로벌 진출 앞장”https://www.zdnet.co.kr/20260109174333” title=”
2026-01-09ハンジン、昨年の営業利益は1,114億ウォン…前年比11.3%増加한진, 작년 영업익 1천114억원…전년비 11.3% 증가https://www.zdnet.co.kr/20260109173307” title=”
2026-01-09[ZD SWトゥデイ] ウィベアソフト、データバウチャー支援事業の供給企業に連続選定ほか[ZD SW 투데이] 위베어소프트, 데이터바우처 지원사업 공급기업 연속 선정 外https://www.zdnet.co.kr/20260109173735” title=”
中央日報
2026-01-10360度の空中回転後、スイカを粉砕…完璧な蹴り技『武林の達人』の正体360도 공중회전 후 수박 격파…완벽 발차기 '무림 고수' 정체https://www.joongang.co.kr/article/25396525
2026-01-10今年2%の成長予測…半導体支援特別委員会を設ける올해 2% 성장 전망…반도체지원 특위 만든다https://www.joongang.co.kr/article/25396506
2026-01-10ホナム団体長『半導体クラスター指定を求める』、大統領「ホナムに最大の企業都市を作りたい」호남 단체장 “반도체 클러스터 지정을” 이 대통령 “호남에 최대 기업도시 만들고파”https://www.joongang.co.kr/article/25396502
2026-01-10局長は特化ISAで個人投資家の心を掴む국장 특화 ISA로 개미 마음 돌린다https://www.joongang.co.kr/article/25396499
2026-01-10重イオン加速器『ラオン』本格稼働開始중이온가속기 라온 본격 가동https://www.joongang.co.kr/article/25396488
2026-01-10半導体効果…昨年の累計経常収支黒字が史上最大반도체 효과…작년 누적 경상수지 흑자 사상 최대https://www.joongang.co.kr/article/25396484
BAIDU
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7小时前国林科技:国林の半導体企業は自主開発技術により段階的成果を上げた国林科技:国林半导体公司通过自主研发技术取得了阶段性成果https://baijiahao.baidu.com/s?id=1853855665286940420&wfr=spider&for=pc
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