Semiconductor News 20260108

TOC

Main News

  1. Nvidia “Vera Rubin” Mass Production Begins and Confidence in HBM4 Exclusivity
    Nvidia’s next-generation GPU architecture, Vera Rubin, has entered full mass production, and with it Micron is reportedly betting on expanding HBM4 production capacity for 2026. CEO Jensen Huang dismissed concerns about memory supply and emphasized the exclusive use of HBM4; demand for H200 also remains high, and the company is poised to maintain its dominant position in the AI hardware market while making a strong transition to the next-generation technology.
  2. Memory “Super Cycle” Arrives, Apple and CSPs Fight for Supply
    Anticipating a sharp rise in memory prices due to AI demand, Apple has reportedly secured NAND flash supply through 2026. The supply contract for 2027 is already being fought over. Concerns about supply shortages throughout the market are causing tension throughout the supply chain, as PC makers rush to launch new products.
  3. China’s SMEE Reorganizes Assets, Accelerates Domestic Production of Lithography
    Chinese semiconductor equipment-related company AMIES has acquired all of the subsidiary shares of Shanghai Microelectronics Equipment (SMEE) through an asset reorganization to strengthen its promotion of lithography technology. This is a move to counter U.S. export controls and accelerate domestic production of lithography equipment, the core of the semiconductor manufacturing process. By concentrating capital and technological resources, we are rushing to build our own supply chain and increase self-sufficiency.
  4. Samsung P5 Plant to Go Live in 2028; SDS Achieves Results in AI
    Samsung Electronics is accelerating construction of its Pyeongtaek Plant 5 (P5), aiming to go live in 2028. This is in preparation for future DRAM demand growth. In addition, subsidiary Samsung SDS expects concrete results from its cooperation with Nvidia and OpenAI in the first quarter of 2026. With the expansion of manufacturing capacity and the results of collaboration in the area of AI cloud services, the company is increasing its offensive throughout the ecosystem.
  5. China Suggests Rare Earth Retaliation, Rekindling Geopolitical Risk
    Chinese President Xi Jinping has reportedly suggested retaliatory measures against Japan by restricting exports of rare earths (REEs). South Korean media are also becoming increasingly alarmed that this will be a test for their country. There are growing concerns that the key minerals essential for semiconductors and high-tech products will once again be used as a diplomatic card, and geopolitical risk in the supply chain is the biggest concern for industries in neighboring countries, including Japan and South Korea.
  6. Apple’s Indian Exports Surpass $50 Billion, Accelerating De-China
    Apple’s iPhone exports from India exceeded $50 billion by December 2025, just four years after entering the PLI (production-linked incentives) program. The Indian government has also approved 22 more electronic component projects, and the supply chain is rapidly moving away from dependence on China. India is establishing itself as a major hub for global electronics manufacturing.
  7. AMD “YottaScale” Proposed, but Reusing Older Models Due to Soaring DDR5 Prices
    AMD CEO Lisa Su predicted at CES 2026 that AI computation will reach “YottaScale”. At the same time, the company is reportedly considering bringing back older-generation Zen 3 chips to keep costs down in response to the current surge in DDR5 memory prices. The company is faced with the duality of pursuing cutting-edge AI performance while at the same time adopting a pragmatic product strategy to keep pace with inflation in the general PC market.
  8. Sony “Optoelectronic Fusion” Sets Sights on Humanoid Robots
    The CTO of Sony Semiconductor Solutions cited “optoelectronic fusion,” “analog,” and “lamination” as strategies for the next 10 years, with particular strength in technologies for humanoid robots. nvidia CEO also at CES. Japanese companies’ technological capabilities could play an important role in vision and sensor technologies that support the physicality of AI.
  9. TSMC Reveals “Secrets” for Countering Seismic Risk and U.S. Appointments
    TSMC has unveiled technical details for countering seismic risk. The company aims to demonstrate the stability of its production in Taiwan through advanced seismic isolation equipment and structural reinforcement. The company also appointed a new finance director for its Arizona subsidiary. By improving transparency and strengthening our organizational structure against both geopolitical and natural disaster risks, we are striving to maintain the trust of our global customers.
  10. AI Inflation” in the PC market, soaring prices make upgrading difficult
    While companies are introducing new products at CES 2026, memory shortages and rising prices are casting a shadow over the market. Demand for Nvidia products is strong, but “AI inflation” may be a drag on market penetration as higher component costs begin to be passed on to end-product prices.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Jan 7, 10:59Nvidia社CEO、メモリ供給への懸念を軽視し、HBM4の独占使用を強調Nvidia CEO downplays memory supply concerns, highlights exclusive use of HBM4https://www.digitimes.com/news/a20260107PD218/nvidia-ceo-jensen-huang-hbm4-ces.html
Jan 7, 16:00アップル、DRAM価格急騰前にNAND供給を2026年まで確保したと報じられるApple reportedly locks in NAND through 2026 ahead of DRAM price spikehttps://www.digitimes.com/news/a20260107VL211/apple-dram-2026-nand-production.html
Jan 7, 16:00NvidiaのVera Rubin、完全量産に突入しMicronの2026年向けHBM4生産能力拡大への賭けに火をつけるNvidia’s Vera Rubin enters full production, igniting Micron’s HBM4 capacity bet for 2026https://www.digitimes.com/news/a20260107PD236/nvidia-hbm4-micron-2026-rubin.html
Jan 7, 11:54CES 2026:メモリ不足を背景にPCブランドが新製品を次々と投入CES 2026: PC brands push new launches amid memory crunchhttps://www.digitimes.com/news/a20260107PD223/2026-acer-ces-2026-ces-market-pc.html
Jan 7, 11:09TSMC、地震リスクに対抗するための秘密を公開TSMC’s secret behind countering quake riskshttps://www.digitimes.com/news/a20260107PD216/tsmc-earthquake-equipment-security-2025.html
Jan 7, 16:45Marvell、PCIeおよびCXLスイッチングポートフォリオ拡充のためXConnを買収Marvell to acquire XConn to expand PCIe and CXL switching portfoliohttps://www.digitimes.com/news/a20260107VL208/marvell-cxl-pcie-infrastructure-accelerator.html
Jan 7, 14:39Zhen Ding Tech、2026年の設備投資が16億ドル超に先駆けて10工場の生産体制を強化Zhen Ding Tech ramps 10 plants as 2026 capex tops US$1.6bnhttps://www.digitimes.com/news/a20260107PD239/2026-revenue-zhen-ding-pcb-2025.html
Jan 7, 12:39Sigurd、AIブームで売上が最高水準に達し、NT$60億の設備投資計画で拡大を強化Sigurd hits revenue highs on AI momentum, ramps up expansion with NT$6 billion capex planhttps://www.digitimes.com/news/a20260106PD252/sigurd-ic-testing-ai-asic-demand-revenue-2026.html
Jan 7, 12:01CES 2026:AMDのリサ・スー氏、YottaScaleコンピュートが転換点になると予測CES 2026: AMD’s Lisa Su predicts YottaScale compute to be turning pointhttps://www.digitimes.com/news/a20260107PD229/amd-lisa-su-ai-gpu-ces-2026.html
Jan 7, 11:39CES 2026:Nvidia社CEOがヒューマノイドロボットに注目、サプライチェーンでは人材育成のギャップを指摘CES 2026: Nvidia CEO spotlights humanoid robots, supply chain cites training gapshttps://www.digitimes.com/news/a20260107PD214/nvidia-humanoid-robot-ai-agent-supply-chain-training-ces-2026.html
Jan 7, 11:04メモリ価格の急騰により、NanyaとAdataが12月の売上記録を更新Memory price surge drives Nanya, Adata to record December revenuehttps://www.digitimes.com/news/a20260107PD200/revenue-2025-adata-price-performance.html
Jan 7, 10:54Nvidia CEO Jensen Huang、H200の中国向け出荷は控えめなアプローチで開始されると語るH200 shipments to China set to start with low-profile approach, says CEO Jensen Huanghttps://www.digitimes.com/news/a20260107VL203/nvidia-chips-shipments-china-sales.html
Jan 7, 10:14TSMC、アリゾナ子会社の財務担当役員にジーナ・プロクターを任命TSMC names Gina Proctor Treasurer of Arizona subsidiaryhttps://www.digitimes.com/news/a20260107VL204/tsmc-arizona-subsidiary-personnel-taiwan.html
Jan 7, 09:55CES 2026:NvidiaとAMD、印象に残らないスピーチを展開CES 2026: Nvidia and AMD deliver underwhelming speecheshttps://www.digitimes.com/news/a20260107PD207/nvidia-amd-ces-2026-market.html
Jan 7, 07:34Samsung、ピョンテクP5工場の2028年稼働に向けた取り組みを加速Samsung speeds Pyeongtaek P5 fab toward 2028 outputhttps://www.digitimes.com/news/a20260106PD219/samsung-fab-dram-production-2028.html
Jan 7, 07:33台湾、6Gおよびスマート製造分野で欧州との協力をさらに深化させる模様Taiwan seeks deeper Europen cooperation in 6G, smart manufacturinghttps://www.digitimes.com/news/a20260106PD218/russia-ukraine-war-europe-6g-smart-manufacturing.html
日経 Tech Foresight
2026-01-08ソニーセミコン照準、光電融合と人型ロボ CTO語った強みhttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC073LW0X00C26A1000000
2026-01-08【特許】晶科能源、ペロブスカイト太陽電池の効率改善https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC051QW0V00C26A1000000
2026-01-0725年12月記事ランキング 1位は半導体レジストの新星MORhttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC053MN0V00C26A1000000
2026-01-07ソニーセミコン 10年先へ布石「光・アナログ・積層」https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC062H00W6A100C2000000
マイナビニュース テックプラス
2026-01-07NXP、自律型AIのエッジへの展開を支援するフレームワーク「eIQ Agentic AI Framework」を発表https://news.mynavi.jp/techplus/article/20260107-3938246/
2026-01-07主要各社によるMLC NANDの減産/撤退でNANDの需給不一致が拡大の可能性、TrendForce予測https://news.mynavi.jp/techplus/article/20260107-3937949/
2026-01-07トレックス・セミコンダクターが本社を豊洲に移転、働き方改革を推進https://news.mynavi.jp/techplus/article/20260107-3937811/
2026-01-07Cadenceがチップレット向けパートナーエコシステムを発表、SamsungやArmと連携https://news.mynavi.jp/techplus/article/20260107-3937731/
2026-01-07SK hynix、次世代AIメモリとなる16層HBM4をCES 2026にて展示https://news.mynavi.jp/techplus/article/20260107-3937652/
2026-01-07中国商務部が日本向けデュアルユース品目の輸出管理強化を発表、即日発効https://news.mynavi.jp/techplus/article/20260107-3937495/
2026-01-07東北工大など、鉛フリー量子ドットで単一スピン状態の制御と室温動作に成功https://news.mynavi.jp/techplus/article/20260107-3936684/
2026-01-07高まる地政学リスク、国内テック企業の経営戦略の最重要課題とはhttps://news.mynavi.jp/techplus/article/20260107-3838760/
2026-01-07日本IBM・山口明夫社長に聞く、2026年の展望 – AI、ハイブリッドクラウド、量子の現在地https://news.mynavi.jp/techplus/article/20260107-3932560/
2026-01-07AMD、Ryzen AI Embedded Processorを発表 – CES 2026https://news.mynavi.jp/techplus/article/20260107-3932925/
TrendForce
2026-01-07中国のリソグラフィ推進:AMIES、資産再編を通じてSMEE子会社の全株式を取得China’s Lithography Push: AMIES Takes Full Shareholding in SMEE Subsidiary in Asset Restructuringhttps://www.trendforce.com/news/2026/01/07/news-chinas-lithography-push-amies-takes-full-shareholding-in-smee-subsidiary-in-asset-restructuring/
2026-01-07AMD、DDR5価格の上昇でPCアップグレード費用が増加する中、旧型Zen 3チップの復活を検討中AMD Reportedly Weighs Reviving Older Zen 3 Chips as DDR5 Prices Push Up PC Upgrade Costshttps://www.trendforce.com/news/2026/01/07/news-amd-reportedly-weighs-reviving-older-zen-3-chips-as-ddr5-prices-push-up-pc-upgrade-costs/
2026-01-07メモリ不足がCSPの買いだめを引き起こすとの報道;2027年の供給契約が早ければ第1四半期に狙われるMemory Shortages Reportedly Spark CSP Buying Spree; 2027 Supply Contracts Eyed as Early as Q1https://www.trendforce.com/news/2026/01/07/news-memory-shortages-reportedly-spark-csp-buying-spree-2027-supply-contracts-eyed-as-early-as-q1/
2026-01-07NVIDIAはメモリ不足の影響を受けない:ジェンセンが初回独占HBM4と高いH200需要を強調Memory Crunch Won’t Hit NVIDIA: Jensen Highlights Initial Exclusive HBM4, High H200 Demandhttps://www.trendforce.com/news/2026/01/07/news-memory-crunch-wont-hit-nvidia-jensen-huang-highlights-initial-exclusive-hbm4-high-h200-demand/
2026-01-07Apple、PLI参入からわずか4年で、2025年12月までにインドから500億ドル超のiPhoneを輸出Apple Exports Over $50B in iPhones From India by Dec 2025, Just Four Years After PLI Entryhttps://www.trendforce.com/news/2026/01/07/news-apple-exports-record-50b-in-iphones-from-india-by-december-2025-after-fy22-pli-entry/
Semiconductor Digest
24 hours agoCadence、チップレットの市場投入加速を目指したパートナーエコシステムを開始Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Markethttps://www.semiconductor-digest.com/cadence-launches-partner-ecosystem-to-accelerate-chiplet-time-to-market/
24 hours agoSiemensとNVIDIA、産業用AIオペレーティングシステム構築に向けたパートナーシップを拡大Siemens and NVIDIA Expand Partnership to Build the Industrial AI Operating Systemhttps://www.semiconductor-digest.com/siemens-and-nvidia-expand-partnership-to-build-the-industrial-ai-operating-system/
24 hours agoNXP、エッジAI分野でのリーダーシップを新しいeIQ Agentic AIフレームワークで強化NXP Advances Edge AI Leadership with New eIQ Agentic AI Frameworkhttps://www.semiconductor-digest.com/nxp-advances-edge-ai-leadership-with-new-eiq-agentic-ai-framework/
日本経済新聞
2026-01-08トランプ氏、防衛企業に高額な配当や役員報酬の制限要求 生産増へ圧力https://www.nikkei.com/article/DGXZQOGN0805B0Y6A100C2000000/
2026-01-08AIデータセンター冷却関連株急落 NVIDIAトップの「不要」発言でhttps://www.nikkei.com/article/DGXZQOGN07CPM0X00C26A1000000/
2026-01-08忘れやすい市場とAIバブル 「中の人」は言えない不都合https://www.nikkei.com/article/DGXZQOGN07CQV0X00C26A1000000/
2026-01-08AIロボットは労働力補う「移民」か CESの現場で聞いた雇用への影響https://www.nikkei.com/article/DGXZQOUC078FY0X00C26A1000000/
2026-01-08信越化学、半導体を微細加工 チップ運ぶ「後工程」でAI需要開拓https://www.nikkei.com/article/DGXZQOUC03AGQ0T01C25A2000000/
2026-01-08ロボット制御のMujinに大型マネー 25年スタートアップ調達額https://www.nikkei.com/article/DGXZQOUC2561I0V21C25A2000000/
2026-01-08F1争奪で揺れるホンダの街 「世界の鈴鹿」を残せるかhttps://www.nikkei.com/article/DGXZQOUC221160S5A221C2000000/
2026-01-08三浦工業社長「工場全体の課題解決へ」、ボイラー市場の縮小にらむhttps://www.nikkei.com/article/DGXZQOCC030VD0T00C26A1000000/
2026-01-08JR九州社長、博多駅上のビル中止「資金は物流施設など成長投資に」https://www.nikkei.com/article/DGXZQOJC265TL0W5A221C2000000/
2026-01-08西鉄社長、国際物流「半導体・車部品以外へ品目拡大」 地政学リスクでhttps://www.nikkei.com/article/DGXZQOJC262XB0W5A221C2000000/
ダイヤモンドオンライン
Jan 7 21:45AI「2026年問題」でまた露呈!?高市成長戦略だけでない日本の新技術導入政策の“構造的欠陥”https://diamond.jp/articles/-/381058
Jan 7 20:00中国兵器産業、いかに欧米並みに成長したかhttps://diamond.jp/articles/-/381110
Jan 7 19:55トランプ関税でサプライヤーに不利益を押し付けた完成車メーカーランキング【部品メーカー138人アンケート】トヨタ、ホンダ、日産…https://diamond.jp/articles/-/375856
Jan 6 19:3026年にAIと財政「過剰投資」の調整は起こるのか?株価バブル崩壊回避の鍵は生産性上昇https://diamond.jp/articles/-/381018
Jan 5 19:45【日米台vs中国17社】AI覇権戦争を大図解!日本のAI後進国ぶりが一目瞭然の“3つの不都合なデータ”とは?https://diamond.jp/articles/-/377879
Tom’s Hardware
TechPowerup
2026-01-07T21:36:05+00:00Ace Computers、CES 2026で「Firestorm」PCと「Nightsky」ワークステーションラップトップを展示Ace Computers Shows “Firestorm” PCs and “Nightsky” Workstation Laptops at CES 2026https://www.techpowerup.com/344948/ace-computers-shows-firestorm-pcs-and-nightsky-workstation-laptops-at-ces-2026
2026-01-07T21:10:21+00:00ASUS ZenBook A16がCESで登場 ― 21時間バッテリーを持つ超軽量Snapdragon X2 Elite ExtremeラップトップASUS ZenBook A16 Launches at CES As Ultra-Portable Snapdragon X2 Elite Extreme Laptop with 21-Hour Batteryhttps://www.techpowerup.com/344933/asus-zenbook-a16-launches-at-ces-as-ultra-portable-snapdragon-x2-elite-extreme-laptop-with-21-hour-battery
2026-01-07T20:56:53+00:00be quiet!がCES 2026で新型クーラーを展示、今後の製品ラインナップを先行公開be quiet! Showcases New Coolers, Previews Upcoming Lineup at CES 2026https://www.techpowerup.com/344946/be-quiet-showcases-new-coolers-previews-upcoming-lineup-at-ces-2026
2026-01-07T20:54:24+00:00ASRockがCES 2026でPSUを展示:過熱防止機能付きL型12V-2×6ケーブルASRock PSUs at 2026 CES: L-type 12V-2×6 Cable with Overheat Protectionhttps://www.techpowerup.com/344947/asrock-psus-at-2026-ces-l-type-12v-2×6-cable-with-overheat-protection
2026-01-07T20:32:41+00:00AMD、Instinct MI355X GPUにおけるシングルノードおよび分散型推論性能を詳細解説AMD Details Single Node & Distributed Inference Performance on Instinct MI355X GPUhttps://www.techpowerup.com/344945/amd-details-single-node-distributed-inference-performance-on-instinct-mi355x-gpu
2026-01-07T20:24:52+00:00ASRockがCES 2026でAIO水冷に挑戦ASRock Dips Into AIO Watercooling At CES 2026https://www.techpowerup.com/344944/asrock-dips-into-aio-watercooling-at-ces-2026
2026-01-07T20:19:36+00:00ASRockがCES 2026で新型DeskSlim、DeskMini、およびBox PCシステムを発表ASRock Presents New DeskSlim, DeskMini, & Box PC Systems at CES 2026https://www.techpowerup.com/344942/asrock-presents-new-deskslim-deskmini-box-pc-systems-at-ces-2026
2026-01-07T19:38:29+00:00MSIがMPG 272QRF X36 G-SYNC Pulsarゲーミングモニターを発売MSI Launches the MPG 272QRF X36 G-SYNC Pulsar Gaming Monitorhttps://www.techpowerup.com/344943/msi-launches-the-mpg-272qrf-x36-g-sync-pulsar-gaming-monitor
2026-01-07T19:03:13+00:00StarRuptureの早期アクセスステージがSteamで配信開始StarRupture’s Early Access Stage Available Now via Steamhttps://www.techpowerup.com/344940/starruptures-early-access-stage-available-now-via-steam
2026-01-07T19:02:11+00:00Digital StormがCES 2026で「Vector」と「Aventum 5」PCビルドを展示Digital Storm Displays “Vector” and “Aventum 5” PC Builds at CES 2026https://www.techpowerup.com/344939/digital-storm-displays-vector-and-aventum-5-pc-builds-at-ces-2026
2026-01-07T19:00:15+00:00TCOMASがCES 2026で最新CPUクーラーとケースを披露TCOMAS Shows off its Latest CPU Coolers and Cases at 2026 CEShttps://www.techpowerup.com/344938/tcomas-shows-off-its-latest-cpu-coolers-and-cases-at-2026-ces
2026-01-07T18:57:53+00:00ASUS ROG Wi-Fi 8デモユニット―8本のアンテナと3つのLANポート、さらに新型ProArtネットワーキングデバイスも登場ASUS ROG Wi-Fi 8 Demo Unit: 8 Antennas + 3 LAN Ports, Also New ProArt Networking Deviceshttps://www.techpowerup.com/344937/asus-rog-wi-fi-8-demo-unit-8-antennas-3-lan-ports-also-new-proart-networking-devices
2026-01-07T18:43:41+00:00AMDがライザン9 9950X3D2 CPUの発売延期を示唆した模様AMD Reportedly Hints About Later Launch of Ryzen 9 9950X3D2 CPUhttps://www.techpowerup.com/344935/amd-reportedly-hints-about-later-launch-of-ryzen-9-9950x3d2-cpu
2026-01-07T18:27:49+00:00ASUSがCESでROG Kitharaプラナーマグネティックゲーミングヘッドセットを展示ASUS Displays its ROG Kithara Planar Magnetic Gaming Headset at CEShttps://www.techpowerup.com/344936/asus-displays-its-rog-kithara-planar-magnetic-gaming-headset-at-ces
2026-01-07T18:04:53+00:00ASUSがCES 2026で、セラルミニウムシャーシとフラッグシップのPanther Lake CPUを搭載したZenBook Duoリフレッシュモデルを発表ASUS Reveals ZenBook Duo Refresh with Ceraluminum Chassis and Flagship Panther Lake CPU at CES 2026https://www.techpowerup.com/344921/asus-reveals-zenbook-duo-refresh-with-ceraluminum-chassis-and-flagship-panther-lake-cpu-at-ces-2026
2026-01-07T18:02:40+00:00ASUSがROG GR70、ExpertCenter PN55ミニPC、及びAscent GX10超小型AIスパコンを展示ASUS Shows ROG GR70, ExpertCenter PN55 Mini PCs and Ascent GX10 Ultra-Small AI Supercomputerhttps://www.techpowerup.com/344930/asus-shows-rog-gr70-expertcenter-pn55-mini-pcs-and-ascent-gx10-ultra-small-ai-supercomputer
2026-01-07T17:59:20+00:00LexarがCES 2026でSSD、メモリー、MicroSDカード、そしてAIビジョン技術を展示Lexar Shows SSDs, Memory, MicroSD Cards, and AI Vision at CES 2026https://www.techpowerup.com/344886/lexar-shows-ssds-memory-microsd-cards-and-ai-vision-at-ces-2026
2026-01-07T17:58:13+00:00ドラゴンクエストVII リイマジンドデモが現在配信中DRAGON QUEST VII Reimagined Demo Available Nowhttps://www.techpowerup.com/344932/dragon-quest-vii-reimagined-demo-available-now
2026-01-07T17:44:23+00:00PowiserがCES 2026で新型VOLIX 3 Pシリーズ屋外向けエネルギーソリューションを展示Powiser Showcases New VOLIX 3 P-series Outdoor Energy Solutions at CES 2026https://www.techpowerup.com/344929/powiser-showcases-new-volix-3-p-series-outdoor-energy-solutions-at-ces-2026
2026-01-07T17:22:57+00:00ASUSがChromebook CM32 Detachableを発表ASUS Announces Chromebook CM32 Detachablehttps://www.techpowerup.com/344927/asus-announces-chromebook-cm32-detachable
2026-01-07T17:21:23+00:00NVIDIAがTechPowerUpの質問に回答 ― DLSS 4.5、6倍Multi FrameGen、及び240HzモードについてNVIDIA Answers TechPowerUp Questions on DLSS 4.5, 6x Multi FrameGen, and 240 Hz Modehttps://www.techpowerup.com/344926/nvidia-answers-techpowerup-questions-on-dlss-4-5-6x-multi-framegen-and-240-hz-mode
2026-01-07T17:00:07+00:00RazerがAIKitを発表 ― ローカルLLM開発を容易にするオープンソースプロジェクトRazer Intros AIKit: an Open-Source Project for Easier Local LLM Developmenthttps://www.techpowerup.com/344924/razer-intros-aikit-an-open-source-project-for-easier-local-llm-development
2026-01-07T16:50:45+00:00JackeryがCESでExplorer 1500超携帯型パワーステーションをデビューJackery Debuts Explorer 1500 Ultra Portable Power Station at CEShttps://www.techpowerup.com/344922/jackery-debuts-explorer-1500-ultra-portable-power-station-at-ces
2026-01-07T16:43:25+00:00ASUS ROGがCESでZephyrus G14とG16ゲーミングラップトップを刷新ASUS ROG Refreshes Zephyrus G14 and G16 Gaming Laptops at CEShttps://www.techpowerup.com/344923/asus-rog-refreshes-zephyrus-g14-and-g16-gaming-laptops-at-ces
2026-01-07T16:34:52+00:00GIGABYTEがHyperNitsを追加 ― 新たに4モデルのOLEDゲーミングモニターをディスプレイ強化と共に発表GIGABYTE Adds HyperNits, Four New OLED Gaming Monitors with Display Enhancementshttps://www.techpowerup.com/344920/gigabyte-adds-hypernits-four-new-oled-gaming-monitors-with-display-enhancements
2026-01-07T16:20:35+00:00iBuyPowerがCES 2026で新型Trace XおよびElement Pulse XのプレビルトPCとケースを発表iBuyPower Debuts New Trace X and Element Pulse X Pre-Built PCs and Cases at CES 2026https://www.techpowerup.com/344906/ibuypower-debuts-new-trace-x-and-element-pulse-x-pre-built-pcs-and-cases-at-ces-2026
2026-01-07T16:14:30+00:00IO Interactiveが『007ファーストライト』の最低及び推奨PCスペック要件を公表IO Interactive Publishes 007 First Light’s Minimum & Recommended PC Spec Requirementshttps://www.techpowerup.com/344919/io-interactive-publishes-007-first-lights-minimum-recommended-pc-spec-requirements
2026-01-07T16:07:02+00:00Micronが歴史的なニューヨークのメガファブの着工式を発表Micron Announces Groundbreaking for Historic New York Megafabhttps://www.techpowerup.com/344918/micron-announces-groundbreaking-for-historic-new-york-megafab
2026-01-07T16:00:32+00:00HyperkinがCES 2026でモジュラーInfinaKoreギターとX5 Alteronモバイルコントローラーを展示Hyperkin Shows Off Modular InfinaKore Guitar & X5 Alteron Mobile Controllers at CES 2026https://www.techpowerup.com/344913/hyperkin-shows-off-modular-infinakore-guitar-x5-alteron-mobile-controllers-at-ces-2026
2026-01-07T15:48:25+00:00NuPhyがCESで次世代キーボードを公開NuPhy Unveils Next-Gen Keyboards at CEShttps://www.techpowerup.com/344916/nuphy-unveils-next-gen-keyboards-at-ces
2026-01-07T15:39:42+00:00TCLがCESで5G Wi-Fi 7モバイルルーター及びWi-Fi 7メッシュルーターを展示TCL Shows 5G Wi-Fi 7 Mobile Router and Wi-Fi 7 Mesh Router at CEShttps://www.techpowerup.com/344915/tcl-shows-5g-wi-fi-7-mobile-router-and-wi-fi-7-mesh-router-at-ces
2026-01-07T15:33:41+00:00HYTEがCES 2026でプロトタイプのケース、ファン、アクセサリを展示HYTE Showcases Prototype Cases, Fans, and Accessories at CES 2026https://www.techpowerup.com/344914/hyte-showcases-prototype-cases-fans-and-accessories-at-ces-2026
2026-01-07T15:14:28+00:00RazerがForge AI Dev Workstationを発表 ― 強力な専用ハードウェアへのビジョンを提示Razer Unveils Forge AI Dev Workstation – Their Vision of Powerful Purpose-built Hardwarehttps://www.techpowerup.com/344910/razer-unveils-forge-ai-dev-workstation-their-vision-of-powerful-purpose-built-hardware
2026-01-07T15:12:18+00:00AGON by AOCがPRO AG276QSG2 27インチゲーミングモニターをNVIDIA G-Sync Pulsar搭載で発売AGON by AOC Launches PRO AG276QSG2 27-inch Gaming Monitors with NVIDIA G-Sync Pulsarhttps://www.techpowerup.com/344908/agon-by-aoc-launches-pro-ag276qsg2-27-inch-gaming-monitors-with-nvidia-g-sync-pulsar
2026-01-07T15:06:18+00:00iBuyPowerがCES 2026で新型AW5およびAC5 CPUクーラーを発表iBuyPower Presents New AW5 & AC5 CPU Coolers at CES 2026https://www.techpowerup.com/344902/ibuypower-presents-new-aw5-ac5-cpu-coolers-at-ces-2026
EETimes Taiwan
2026-01-072026年の電子産業:トップ10市場および応用トレンド2026年電子產業十大市場及應用趨勢https://www.eettaiwan.com/20260107nt61-top-10-market-and-application-trends-in-the-electronics-industry-in-2026/
2026-01-07PRTDをNTCスロットにシームレスに配置 ――不可能なミッション?將PRTD無縫置入NTC槽位——不可能的任務?https://www.eettaiwan.com/20260107nt51-dropping-a-prtd-into-a-thermistor-slot-impossible/
2026-01-07CES 2026:TTAが率いる台湾スタートアップが世界のイノベーションステージに登場CES 2026:TTA領軍台灣新創亮相全球創新舞臺https://www.eettaiwan.com/20260107nt11-tta-leads-taiwan-startups-onto-the-global-innovation-stage/
2026-01-07AIが推進する 2026年のトップ10主要テクノロジートレンドが形成AI持續推動 2026年十大重點科技趨勢成形https://www.eettaiwan.com/20260107nt21-top-10-key-technology-trends-for-2026/
2026-01-06先行投資と累積された経験が革新的製品を実現 インフィニオン、AI電源革新を継続推進先期投入、累積經驗成就創新產品 英飛凌持續推動AI供電革新https://www.eettaiwan.com/20260106nt41-infineon-ee-awards-asia/
2026-01-062Dから3DへのNORフラッシュメモリの転換從2D到3D NOR快閃記憶體的轉變https://www.eettaiwan.com/20260106nt31-the-shift-from-2d-to-3d-nor-flash/
2026-01-06サプライチェーンの実力:2026年の主要競争優位性供應鏈實力:2026年關鍵競爭優勢https://www.eettaiwan.com/20250106nt71-key-competitive-advantages-by-2026/
2026-01-06CES 2026:スマートトランスフォーメーション、デジタルヘルスおよび工学の未来に注目CES 2026:聚焦智慧轉型、數位健康與工程未來https://www.eettaiwan.com/20260106nt11-ces-2026-cta-tech-trends-to-watch/
2026-01-06AIが再構築する2026年のテクノロジー産業の構図AI重構2026年科技產業格局https://www.eettaiwan.com/20260106nt21-ai-will-reshape-the-technology-industry-landscape-in-2026/
EETimes Asia
2026-01-07AIが新たなメモリスーパーサイクルを引き起こすAI Triggers a New Memory Super Cyclehttps://www.eetasia.com/ai-triggers-a-new-memory-super-cycle/
2026-01-07Aegis AerospaceとUnited Semiconductorsが宇宙空間で先進材料製造施設を立ち上げるAegis Aerospace and United Semiconductors Launch In-Space Advanced Materials Manufacturing Facilityhttps://www.eetasia.com/aegis-aerospace-and-united-semiconductors-launch-in-space-advanced-materials-manufacturing-facility/
2026-01-07Skyworksが知能をエッジへ押し上げる取り組みについて議論するSkyworks Discusses Pushing Intelligence to the Edgehttps://www.eetasia.com/skyworks-discusses-pushing-intelligence-to-the-edge/
2026-01-07etherWhereとAsiaRFがEW6181ベースのGNSSモジュールで協力etherWhere and AsiaRF Collaborate on EW6181-based GNSS Moduleshttps://www.eetasia.com/etherwhere-and-asiarf-collaborate-on-ew6181-based-gnss-modules/
2026-01-07MIPSが自律エッジにおける物理的AIを実現MIPS Enabling Physical AI at the Autonomous Edgehttps://www.eetasia.com/mips-enabling-physical-ai-at-the-autonomous-edge/
2026-01-06TIが自動車向けポートフォリオを拡充し、AVへのシフトを加速TI Expands Automotive Portfolio to Accelerate Shift Toward AVshttps://www.eetasia.com/ti-expands-automotive-portfolio-to-accelerate-shift-toward-avs/
2026-01-06GUCのHBM4E IPがEE Awards Asia 2025で最優秀IP/プロセッサーおよび五年連続の功績賞を受賞GUC’s HBM4E IP Honored with Best IP/Processor and Five-Year Achievement in EE Awards Asia 2025https://www.eetasia.com/gucs-hbm4e-ip-honored-with-best-ip-processor-and-five-year-achievement-in-ee-awards-asia-2025/
2026-01-06TrendForceが2026年の世界ノートPC出荷予測を前年比5.4%減に下方修正TrendForce Revises Down 2026 Global Notebook Shipment Forecast to 5.4% YoY Declinehttps://www.eetasia.com/trendforce-revises-down-2026-global-notebook-shipment-forecast-to-5-4-yoy-decline/
2026-01-06TianmaとUniversal Displayが長期OLED契約を締結Tianma and Universal Display Ink Long-Term OLED Agreementshttps://www.eetasia.com/tianma-and-universal-display-ink-long-term-oled-agreements/
2026-01-06AferoとTIが安全なIoTプラットフォーム開発で協力Afero and TI Collaborating to Develop Secure IoT Platformhttps://www.eetasia.com/afero-and-ti-collaborating-to-develop-secure-iot-platform/
2026-01-06Chris JacobsがPower IntegrationsのSVPに任命Chris Jacobs Appointed SVP at Power Integrationshttps://www.eetasia.com/chris-jacobs-appointed-svp-at-power-integrations/
2026-01-06IntelがCore Ultra Series 3を発表Intel Debuts Core Ultra Series 3https://www.eetasia.com/intel-debuts-core-ultra-series-3/
EETimes India
2026-01-07MICROIP、NFCチップの初回合格に成功MICROIP Achieves First-Pass Success of NFC Chiphttps://www.eetindia.co.in/microip-achieves-first-pass-success-of-nfc-chip/
2026-01-07MediaTekとDENSOがADAS向けSoCで協業MediaTek and DENSO Collaborate on ADAS SoCshttps://www.eetindia.co.in/mediatek-and-denso-collaborate-on-adas-socs/
2026-01-07Mouser新着:ロボットや産業用途向けInfineon PSOC Edge ML MCUNew at Mouser: Infineon PSOC Edge ML MCUs for Robotics, Industrial Applicationshttps://www.eetindia.co.in/new-at-mouser-infineon-psoc-edge-ml-mcus-for-robotics-industrial-applications/
2026-01-07政府、さらに22件のECMSプロジェクトを承認し、インドの電子部品サプライチェーンを強化Government Clears 22 More ECMS Projects, Deepening India’s Electronics Supply Chainhttps://www.eetindia.co.in/government-clears-22-more-ecms-projects-deepening-indias-electronics-supply-chain/
ZDNET Korea
2026-01-08サムスンSDS、エヌビディア・オープンAIの協力が実を結ぶ…「今年第1四半期の成果」삼성SDS, 엔비디아·오픈AI 협력 빛 본다…”올 1분기 성과”https://www.zdnet.co.kr/20260108044617%22%20title=%22
2026-01-08サムスンSDS、公衆AXを牽引すると宣言…イジュンヒ「AI三大強国への飛躍を支える」삼성SDS, 공공 AX 주도 선언…이준희 “AI 3대 강국 도약 뒷받침할 것”https://www.zdnet.co.kr/20260107161148%22%20title=%22
2026-01-08サムスン電子のAIホームエコシステム、米国で『実を結ぶ』…パートナー企業とスマートホームセービング事業を推進삼성전자 AI홈 생태계, 美서 ‘결실’…파트너사와 스마트홈 세이빙 사업 추진https://www.zdnet.co.kr/20260106025004%22%20title=%22
2026-01-07個人情報保護委員会「クーパンのCCTV映像の目的外利用などを徹底調査中」개보위 “쿠팡의 CCTV 영상 목적외 이용 등 철저 조사중”https://www.zdnet.co.kr/20260107224616%22%20title=%22
2026-01-07コレイル、旧正月連休の乗車券、15日から予約開始…ウェブサーバーの容量を2倍に増強코레일, 설 연휴 승차권 15일부터 예매…웹서버 용량 2배 증설https://www.zdnet.co.kr/20260107215847%22%20title=%22
2026-01-07国立グンサン大学、オンラインベースの『AI活用共通基礎教育』を無料で運営국립군산대, 온라인 기반 ‘AI 활용 공통 기초교육’ 무료 운영https://www.zdnet.co.kr/20260107212555%22%20title=%22
2026-01-07チャットGPTの全対話の5%が健康相談…オープンAI、チャットGPTの医療活用に関する報告書を公開챗GPT 전체 대화 5%가 건강 상담…오픈AI, 챗GPT 의료 활용 보고서 공개https://www.zdnet.co.kr/20260107212132%22%20title=%22
2026-01-07中小企業庁、『韓中ベンチャースタートアップサミット』を開催…「スタートアップ協力を具体化」중기부, ‘한·중 벤처스타트업 서밋’ 개최…”스타트업 협력 구체화”https://www.zdnet.co.kr/20260107202238%22%20title=%22
2026-01-07カスペルスキー「『偽のレポート』に偽装した研究機関を対象にフィッシング攻撃を検出」카스퍼스키 “‘가짜 보고서’ 위장한 연구 기관 대상 피싱 공격 탐지”https://www.zdnet.co.kr/20260107200727%22%20title=%22
2026-01-07ヒュネシオン、愛の実り分かち合い名門企業に加盟휴네시온, 사랑의열매 나눔명문기업 가입https://www.zdnet.co.kr/20260107195354%22%20title=%22
2026-01-07中小企業庁、新年に変わるベンチャー投資制度を発表중기부, 새해 달라지는 벤처투자 제도 발표https://www.zdnet.co.kr/20260107194910%22%20title=%22
2026-01-07『タルパン』効果、誰が一番大きいかと見たら…「ジーマーケット」‘탈팡’ 효과, 누가 제일 큰가 봤더니…”지마켓”https://www.zdnet.co.kr/20260107172524%22%20title=%22
2026-01-07李大統領「クーパンの個人情報流出、社員は中国人? どうするんだ」이 대통령 “쿠팡 개인정보 유출 직원 중국인? 어쩌라고요”https://www.zdnet.co.kr/20260107185150%22%20title=%22
2026-01-07インテル コア ウルトラ シリーズ3「バッテリーはより長持ち、AIはより高速に」인텔 코어 울트라 시리즈3 “배터리는 더 오래, AI는 더 빠르게”https://www.zdnet.co.kr/20260107185731%22%20title=%22
2026-01-07李在明「5000 コスピ」…韓銀・金融委員会、ステーブルコインやSTOの規制整備でオールストップ이재명 ”5000 코스피”…한은·금융위, 스테이블코인·STO 규제 마련 올스톱https://www.zdnet.co.kr/20260107172454%22%20title=%22
2026-01-07CJオリーブヨング、『アルファドライブワン』のポップアップを開催CJ올리브영, ‘알파드라이브원’ 팝업 연다https://www.zdnet.co.kr/20260107184426%22%20title=%22
2026-01-07[独占] コビット、FIUの罰金科が今週判明予定[단독] 코빗, FIU 과태료 부과 이번 주 판가름https://www.zdnet.co.kr/20260107182838%22%20title=%22
2026-01-07建国大学、光学ベースの診断・治療研究で『成果を認められる』건국대, 광학기반 진단·치료 연구서 ‘성과 인정’https://www.zdnet.co.kr/20260107182736%22%20title=%22
2026-01-07李在明大統領が、科学技術情報通信部のAI室にピザを贈った理由は?이재명 대통령, 과기정통부 AI 실에 피자 선물한 이유는?https://www.zdnet.co.kr/20260107180844%22%20title=%22
中央日報
2026-01-08日本を攻撃しながら韓国も脅かす…中国の『ケジッペ外交』일본 때리면서 한국도 위협…중국의 ‘개집외교’https://www.joongang.co.kr/article/25395971
2026-01-08[社説] 中国、レアアース報復を敢行――試練に晒される韓国外交[사설] 희토류 보복 꺼낸 중국, 시험받는 한국 외교https://www.joongang.co.kr/article/25395967
2026-01-08[時論] 米・日・豪の鉱物協力、韓国にとっては危機でありチャンスでもある[시론] 미·일·호 광물협력, 한국엔 위기이자 기회https://www.joongang.co.kr/article/25395962
2026-01-08ジェンセン・ファンの一言で『14万ジョンジャ』となった젠슨 황 한마디에 ‘14만전자’ 됐다https://www.joongang.co.kr/article/25395958
2026-01-08文政権を批判したキム・ソンファン「国内で原発を建設せず、輸出に頼った結果、窮状に陥った」문 정부 비판한 김성환 “국내 원전 안 지으며 수출, 궁색했다”https://www.joongang.co.kr/article/25395956
2026-01-08コスピが初めて4600に到達した日…『借金投資』が史上最大規模で殺到した코스피 4600 처음 터치한 날…‘빚투’ 역대 최대 몰렸다https://www.joongang.co.kr/article/25395929
BAIDU
昨天15:29複数の半導体設備ETFが7%以上上昇多只半导体设备ETF涨逾7%https://www.cnstock.com/commonDetail/615027
51分钟前科半导体の純資産価値が7.09%上昇科半导体净值上涨7.09%https://baijiahao.baidu.com/s?id=1853693795168861837&wfr=spider&for=pc
54分钟前南方半导体産業株式発起Cの純資産価値が4.26%上昇南方半导体产业股票发起C净值上涨4.26%https://baijiahao.baidu.com/s?id=1853693633449165534&wfr=spider&for=pc
昨天18:04中图半導体がIPOを目指し、グラフィック基板材料分野に注力―一部の顧客と競合中中图半导体冲击IPO,深耕图形化衬底材料领域,与少数客户存在竞争https://baijiahao.baidu.com/s?id=1853652424741633844&wfr=spider&for=pc
昨天17:48国内初!原集微の二次元半導体技術エンジニアリングデモンストレーションラインが成功稼働、今年6月に予定…国内首条!原集微二维半导体工程化示范工艺线成功点亮 预计今年6月…https://baijiahao.baidu.com/s?id=1853651006544989455&wfr=spider&for=pc
昨天19:38半導体設備ETF(159516)が7.5%上昇、取引中に1.4億以上の純流入、直近20日間で純…半导体设备ETF(159516)收涨7.5%,盘中净流入超1.4亿份,近20日净…http://www.nbd.com.cn/articles/2026-01-07/4211134.html
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