Semiconductor News 20260106

TOC

Main News

  1. TSMC to Start 2nm Production and Accelerate Construction of 1.4nm Factory
    TSMC has begun production of its 2nm process, intensifying competition with Samsung Electronics. Furthermore, the company is reportedly accelerating construction of a 1.4nm plant in Taiwan with the aim of starting mass production in 2028. At the same time, the company has obtained an import license from the U.S. Department of Commerce for manufacturing equipment for its Nanjing plant, and is poised to continue doing business in the Chinese market. While consolidating its position as a leader in cutting-edge technology, the company is expanding its manufacturing base amid the geopolitical balance between the U.S. and China.
  2. Intel Officially Announces 18A Process “Panther Lake”
    At CES 2026, Intel announced the Core Ultra Series 3 (Panther Lake) mobile processor based on its state-of-the-art Intel 18A manufacturing process. This product is a touchstone for Intel’s restructuring of its foundry business. Competing PC makers, such as Acer, immediately announced notebook PCs based on this chip, marking an important step toward regaining leadership in the AI PC market.
  3. SK Hynix Unveils First 16-Layer HBM4 at CES
    SK Hynix unveiled the world’s first 16-layer stacked HBM4, the next generation memory, at CES 2026. The company is pursuing a “dual strategy” of increasing HBM4 production while ensuring that HBM3E will continue to dominate the market in 2026, clearly demonstrating its commitment to maintaining its dominant market share and technological leadership in the AI memory market in anticipation of supplying Nvidia’s next-generation GPUs.
  4. Japan’s Rapidus to Launch Back-end Prototype Line in Hokkaido in Spring 2026
    Japan’s Rapidus will reportedly launch an advanced packaging prototype line in Hokkaido in spring 2026. Advanced packaging technologies such as 2.5D and 3D packaging are key to AI semiconductors, and concrete progress is being made toward building a domestic ecosystem.
  5. Nvidia Announces Al pamayo, a New AI Development Platform for Self-Driving and Uber’s Adoption
    Nvidia has announced Alpamayo, a new AI development platform for self-driving, and that Uber Technologies, a leading U.S. car-delivery company, has adopted it. Nvidia is strengthening its position as a platform not only for AI data centers, but also in the mobility sector, driving AI implementation in the real economy.
  6. Chinese Memory CXMT Aims for US$4.2 Billion IPO
    Chinese DRAM maker CXMT (Changjiang Memory) is reportedly planning an IPO (initial public offering) to raise approximately US$4.2 billion (over 600 billion yen) YMTC is also preparing to apply for listing. With the soaring price of memory benefiting the industry as a whole, Chinese companies are accelerating capital investment by obtaining huge amounts of money from the capital market to strengthen their self-sufficiency system against U.S. sanctions.
  7. Hyundai Motor Company to mass-produce “30,000 robots a year”
    Hyundai Motor Group has announced that it will establish a production system for 30,000 robots a year by 2028.At CES 2026, the company is promoting its technological capabilities as the “K-Humanoid Coalition” and is moving toward commercialization in earnest.LG Electronics Co. LG Electronics and others are also introducing robots for home use, and the Korean industry as a whole is increasingly moving to develop AI-equipped robots into a major export industry for the next generation.
  8. TSMC Technology Leak Investigation, Tokyo Electron Officials Indicted
    Investigations into TSMC’s leak of information on its 2nm process technology continue, and Taiwanese prosecutors have indicted three additional individuals, including a Tokyo Electron employee. As the battle for technological supremacy in cutting-edge semiconductors intensifies, the protection of trade secrets and the management of human resources have become serious security risks. The situation calls for renewed efforts to strengthen compliance throughout the supply chain and to take thorough measures to prevent technology leakage.
  9. Nexchip to Invest US$5.1 Billion to Build New Mature Process Plant in Hefei, China
    Nexchip Semiconductor of China will invest approximately US$5.1 billion to build a new plant in Hefei to expand manufacturing capacity for mature processes such as 28nm. This is part of the Chinese government’s semiconductor self-sufficiency policy, which is being pursued in parallel with industry restructuring through mergers and acquisitions. Although cutting-edge products are regulated, this move is aimed at expanding global market share by establishing a solid supply network for legacy semiconductors needed for consumer electronics and automobiles.
  10. ASUS and Other PC Component Price Hikes, Inflation Spurred by AI Demand
    Reports of a 15-20% price hike by ASUS have prompted retailers to raise prices, including those of competitors’ products, due to a shortage of memory and SSDs caused by increased demand for AI servers, MSI’s new RTX5090 GPU, and other products with advanced features. The rising cost of materials is spreading like a domino to the PC market as a whole, and “AI inflation,” which increases the burden on consumers, is becoming apparent.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Jan 5メモリ価格の急騰が業界全体に予期せぬ利益をもたらすMemory price surge drives profit windfall across sectorhttps://www.digitimes.com/news/a20260105PD212/memory-profit-demand-2026-dram.html
Jan 5TSMCが2nm生産を開始、サムスンがこれに迫るTSMC kicks off 2nm production with Samsung in hot pursuithttps://www.digitimes.com/news/a20260105PD222/samsung-tsmc-2nm-production-technology.html
Jan 5日本のRapidus、2026年春に北海道で先端パッケージングの試作ラインを立ち上げるJapan’s Rapidus to launch advanced packaging pilot line in Hokkaido by spring 2026https://www.digitimes.com/news/a20260105PD238/rapidus-packaging-2026-2nm-production.html
Jan 5中国メモリメーカーのIPO計画:CXMTは42億米ドルを目標、YMTCは上場申請中China memory makers’ IPO line up: CXMT seeks US$4.2 billion, YMTC prepares filinghttps://www.digitimes.com/news/a20260105PD207/cxmt-ymtc-demand-2026-2025.html
Jan 5Nexchip Semiconductor、28nm既成熟プロセスの能力拡大のため、51億米ドル規模の合肥工場を立ち上げるNexchip Semiconductor launches US$5.1bn Hefei fab to scale 28nm mature-node capacityhttps://www.digitimes.com/news/a20260105VL203/nexchip-capacity-28nm-wafer-fab.html
Jan 6, 07:49中国、受託製造M&Aを通じ半導体自給自足を加速 – 華虹とSMICの最新動向China accelerates semiconductor self-sufficiency through foundry M&A: updates on Hua Hong, SMIChttps://www.digitimes.com/news/a20260105PD227/smic-self-sufficiency-capacity-12-inch-technology.html
Jan 6, 07:48台湾、AI輸出急増を活用して観光業と内需を活性化Taiwan leverages AI export surge to boost tourism, domestic demandhttps://www.digitimes.com/news/a20260105PD230/taiwan-2026-growth-demand-electronic-components.html
Jan 6, 07:38中国移动とCNBMが、華信マイクロナノの8インチMEMS事業拡大を牽引China Mobile, CNBM anchor Huaxin Micro-Nano’s 8-inch MEMS expansionhttps://www.digitimes.com/news/a20260105VL205/mems-china-mobile-sensor-manufacturing-industrial.html
Jan 6, 07:38SKハイニックス、2026年にはHBM3Eがメモリ市場を席巻し、HBM4も増産へSK Hynix says HBM3E to dominate memory in 2026 as HBM4 ramps uphttps://www.digitimes.com/news/a20260105VL206/sk-hynix-hbm3e-hbm4-market-2026.html
Jan 6, 07:35中国の半導体メーカー、国産化推進にもかかわらず歩留まり問題に直面Chinese chipmakers confront yield challenges despite localization pushhttps://www.digitimes.com/news/a20260105PD221/advanced-process-supply-chain-equipment-production-high-end.html
Jan 6, 07:35Chang Wah社のインタビュー:貴金属不足にもかかわらずリードフレームが著しい成長を見せるChang Wah interview: strong lead frame growth despite precious metals shortagehttps://www.digitimes.com/news/a20260105PD206/cwtc-interview-lead-frame-demand-inventory-taiwan-rare-earth.html
Jan 5TSMCの2nm情報流出調査が、東京エレクトロンおよび3名への追加起訴につながるTSMC 2nm leak probe leads to additional indictments for three people and Tokyo Electronhttps://www.digitimes.com/news/a20260105PD242/taiwan-tsmc-tokyo-electron-2nm-investigation.html
Jan 5Chunghwa Precision Test Tech、半導体需要拡大を背景に桃園で新工場を建設Chunghwa Precision Test Tech to build new plant in Taoyuan amid growing semiconductor demandhttps://www.digitimes.com/news/a20260105PD240/chpt-testing-plant-2026.html
Jan 5InpaqのCEO陳佩仁氏、リソース再編計画を立ち上げるInpaq CEO Pei-Jen Chen launches resource realignment planhttps://www.digitimes.com/news/a20260105PD219/inpaq-passive-components-antenna-market-walsin.html
Jan 5李在明氏の初の中国訪問が、韓国と中国の関係改善の兆しを示すLee Jae-myung’s first China visit signals warming South Korea-China tieshttps://www.digitimes.com/news/a20260105PD235/bloomberg-business-market-beijing-hyundai.html
Jan 5TSMCの米国工場、台湾との構造的なコストギャップを露呈TSMC’s US fabs expose structural cost gap with Taiwanhttps://www.digitimes.com/news/a20260105PD228/tsmc-semiconductors-manufacturing-gross-margin-usa-taiwan.html
日経 Tech Foresight
2026-01-06メタレンズ「カメラ設計思想を変革」 デンマーク新興https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC2687U0W5A221C2000000
2026-01-06慶応大、超精密加工でマイクロ光コム THz波・光通信にhttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC247YX0U5A221C2000000
2026-01-06インテル・ラピダス正念場、2強躍進 26年半導体5大展望https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC221QM0S5A221C2000000
2026-01-06【特許】日本フューテック、半導体実装しやすい放熱基板https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC240F70U5A221C2000000
2026-01-05理研など、低温下のひずみ抑える結晶成長法 超電導発現にhttps://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC197510Z11C25A2000000
2026-01-052026年は量子5方式の攻防激化 1万量子ビット時代が到来https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC251EM0V21C25A2000000
マイナビニュース テックプラス
2026-01-05京セラが鹿児島の2工場を「鹿児島霧島工場」として統合、工場運営を効率化https://news.mynavi.jp/techplus/article/20260105-3927382/
2026-01-05TSMCが南京工場向け装置輸入許可を米国より取得、NVIDIAからは中国向けGPUの増産要請 海外メディア報道https://news.mynavi.jp/techplus/article/20260105-3927331/
2026-01-05TSMCが2028年の量産開始に向けて台湾での1.4nm工場の建設を加速、台湾メディア報道https://news.mynavi.jp/techplus/article/20260105-3926706/
2026-01-05TSMC、計画通りの2025年第4四半期からの2nm量産を台湾の2工場にて開始https://news.mynavi.jp/techplus/article/20260105-3926640/
2026-01-05MOSFETにおけるトップサイド冷却 – PCB冷却/両面冷却と比べる熱マネジメントのメリットhttps://news.mynavi.jp/techplus/article/20260105-3877999/
2026-01-05笑う門にしか福は来ない、ams-OSRAMジャパンの針田社長が見据える2026年の半導体市場https://news.mynavi.jp/techplus/article/20260105-3878150/
TrendForce
2026-01-06米国、報道によると中国のブラックセサミ・フアシャンA2000自動車用チップのグローバル展開を承認US Reportedly Clears China’s Black Sesame Huashan A2000 Auto Chip for Global Launchhttps://www.trendforce.com/news/2026/01/06/news-us-reportedly-clears-chinas-black-sesame-huashan-a2000-auto-chip-for-global-launch/
2026-01-05SKハイニックス 2026年展望:HBM3Eが主流、3つの市場逆風に直面する中、HBM4が二重戦略を展開SK hynix 2026 Outlook: HBM3E Dominates, HBM4 Dual Strategy Amid 3 Market Headwindshttps://www.trendforce.com/news/2026/01/05/news-sk-hynix-2026-outlook-hbm3e-remains-mainstream-hbm4-dual-strategy-amid-triple-market-headwinds/
2026-01-05報道によると、ラージャン・プレシジョンがTSMCとCPOで連携、サンプルにはAMDが含まれているとされるLargan Precision Reportedly Teams Up With TSMC on CPO; Samples Said to Involve AMDhttps://www.trendforce.com/news/2026/01/05/news-largan-precision-reportedly-eyes-cpo-opportunity-via-tsmc-collaboration-amd-samples-in-testing/
2026-01-05報道によると、AMD、NVIDIAなどがCES 2026で新型チップを初披露、TSMCの3nmおよび5nmプロセスに注目AMD, NVIDIA and Others Reportedly to Debut New Chips at CES 2026, Spotlighting TSMC 3nm and 5nmhttps://www.trendforce.com/news/2026/01/05/news-amd-nvidia-and-others-reportedly-to-debut-new-chips-at-ces-2026-spotlighting-tsmc-3nm-and-5nm/
2026-01-05報道によると、ASUSの15〜20%の値上げがドミノ効果を引き起こし、小売業者が1月5日に競合他社の価格も引き上げたASUS’s Reported 15-20% Price Hike Triggers Domino Effect as Retailers Raise Rivals’ Prices Jan. 5https://www.trendforce.com/news/2026/01/05/news-asuss-reported-15-20-price-hike-triggers-domino-effect-as-taiwan-retailers-raise-rivals-prices-jan-5/
Semiconductor Digest
1 hour agoTianmaとUniversal Display Corporationが長期OLED契約を締結Tianma and Universal Display Corporation Enter into Long-Term OLED Agreementshttps://www.semiconductor-digest.com/tianma-and-universal-display-corporation-enter-into-long-term-oled-agreements/
2 hours agoHSCが新たな最高執行責任者を任命HSC Appoints New Chief Operating Officerhttps://www.semiconductor-digest.com/hsc-appoints-new-chief-operating-officer/
2 hours agoフロリダ州の成長する半導体製造エコシステムを紹介する年次フロリダ・セミコンダクター・サミットAnnual Florida Semiconductor Summit to Showcase the State’s Growing Chip Manufacturing Ecosystemhttps://www.semiconductor-digest.com/annual-florida-semiconductor-summit-to-showcase-the-states-growing-chip-manufacturing-ecosystem/
2 hours ago米国に半導体製造を戻すために必要な要素What It Takes to Bring Semiconductor Manufacturing Back to the UShttps://www.semiconductor-digest.com/what-it-takes-to-bring-semiconductor-manufacturing-back-to-the-us/
日本経済新聞
2026-01-06NVIDIA、自動運転向けのAI開発基盤「アルパマヨ」発表 ウーバーが採用https://www.nikkei.com/article/DGXZQOGN05A890V00C26A1000000/
2026-01-06日経平均株価、米株高が支えに(先読み株式相場)https://www.nikkei.com/article/DGXZQOFL0603I0W6A100C2000000/
2026-01-06日本車6社、25年米新車販売2.4%増 ハイブリッド好調のトヨタ8%増https://www.nikkei.com/article/DGXZQOGN021NN0S6A100C2000000/
2026-01-06ニッキフロン、フッ素樹脂を水平リサイクル 独自技術開発し新工場https://www.nikkei.com/article/DGXZQOCC199GR0Z11C25A2000000/
2026-01-06九州電力社長、洋上風力「アクセル踏む準備」 原発は資金調達課題https://www.nikkei.com/article/DGXZQOJC246M10U5A221C2000000/
2026-01-06北海道石狩市沖、洋上風力の法定協議会設立へ 道南には研修施設https://www.nikkei.com/article/DGXZQOFC2510I0V21C25A2000000/
2026-01-06西部ガスHD加藤卓二社長、LNG調達「ロシアと契約更新しない場合も」https://www.nikkei.com/article/DGXZQOJC2651F0W5A221C2000000/
2026-01-06クラフティア石橋和幸社長「M&Aに500億円投資」 CVCも活用https://www.nikkei.com/article/DGXZQOJC27B3Q0X21C25A1000000/
2026-01-06最高値に沸くTSMC・サムスン電子にベネズエラの暗い影https://www.nikkei.com/article/DGXZQOFL051BS0V00C26A1000000/
2026-01-06ドイツ株5日 続伸、最高値を約3カ月ぶりに更新 防衛ラインメタル9%高https://www.nikkei.com/article/DGXZQOFL05A260V00C26A1000000/
ダイヤモンドオンライン
Jan 5 19:45【日米台vs中国17社】AI覇権戦争を大図解!日本のAI後進国ぶりが一目瞭然の“3つの不都合なデータ”とは?https://diamond.jp/articles/-/377879
Jan 4 19:4026年のドイツ経済は4年ぶり「実質成長率1%超え」か、鍵は日本と同じ積極財政・成長戦略の巧拙https://diamond.jp/articles/-/380599
Jan 4 19:35国際協力銀行会長が日米関税合意の80兆円投資は「国益にかなう」と断言!創設した先進国向けの金融支援は、なんとTSMCやUSスチールも対象に?《再配信》https://diamond.jp/articles/-/380462
Jan 3 19:5026年の米政治は「AI規制」が争点に?トランプ政権の規制緩和に州政府・MAGA派が反発https://diamond.jp/articles/-/380598
Jan 3 03:00「守りながら増やす」がキーワード?読者が選んだ“人気No.1”の正体【2026年の注目テーマ&戦略】https://diamond.jp/articles/-/380399
Tom’s Hardware
TechPowerup
2026-01-06T00:01:30+00:00NeurableがHyperXと共同で、神経技術を搭載したゲーミング用ウェアラブルヘッドセットを発表Neurable Intros Neurotechnology-Powered Gaming Wearable Headset with HyperXhttps://www.techpowerup.com/344765/neurable-intros-neurotechnology-powered-gaming-wearable-headset-with-hyperx
2026-01-05T23:53:34+00:00IntelがIntel 18Aノード上でCore Ultraシリーズ3「Panther Lake」モバイルプロセッサを発表Intel Launches Core Ultra Series 3 “Panther Lake” Mobile Processors on Intel 18A Nodehttps://www.techpowerup.com/344763/intel-launches-core-ultra-series-3-panther-lake-mobile-processors-on-intel-18a-node
2026-01-05T23:46:43+00:00NVIDIA DGX SparkとDGX Stationが最新のオープンソースおよび最先端モデルを支えるNVIDIA DGX Spark and DGX Station Power the Latest Open-Source and Frontier Modelshttps://www.techpowerup.com/344762/nvidia-dgx-spark-and-dgx-station-power-the-latest-open-source-and-frontier-models
2026-01-05T23:44:45+00:00NVIDIA DGX SuperPODがRubinベースのシステムの土台を構築NVIDIA DGX SuperPOD Sets the Stage for Rubin-Based Systemshttps://www.techpowerup.com/344761/nvidia-dgx-superpod-sets-the-stage-for-rubin-based-systems
2026-01-05T23:42:28+00:00NVIDIA BlueFieldを搭載したサイバーセキュリティおよびアクセラレーション機能が、NVIDIA Enterprise AI Factoryバリデートデザインに登場NVIDIA BlueField-Powered Cybersecurity and Acceleration Arrive on NVIDIA Enterprise AI Factory Validated Designhttps://www.techpowerup.com/344760/nvidia-bluefield-powered-cybersecurity-and-acceleration-arrive-on-nvidia-enterprise-ai-factory-validated-design
2026-01-05T23:38:59+00:00AcerがPredator XB273U F6 1000Hzゲーミングモニターを発表Acer Unleashes the Predator XB273U F6 1000 Hz Gaming Monitorhttps://www.techpowerup.com/344758/acer-unleashes-the-predator-xb273u-f6-1000-hz-gaming-monitor
2026-01-05T23:30:45+00:00ADATAとXPGがCES 2026でポータブルSSDを展示ADATA and XPG Portable SSDs at CES 2026https://www.techpowerup.com/344756/adata-and-xpg-portable-ssds-at-ces-2026
2026-01-05T23:18:18+00:00AcerがIntel Core Ultraシリーズ3プロセッサを搭載した新型PredatorおよびNitroゲーミングラップトップを発表Acer Unveils New Predator and Nitro Gaming Laptops with Intel Core Ultra Series 3 Processorshttps://www.techpowerup.com/344754/acer-unveils-new-predator-and-nitro-gaming-laptops-with-intel-core-ultra-series-3-processors
2026-01-05T23:18:06+00:00ADATAの組み込みおよびフラッシュストレージ製品が2026年CESで展示されたADATA Embedded and Flash Storage Products Showcased at 2026 CEShttps://www.techpowerup.com/344755/adata-embedded-and-flash-storage-products-showcased-at-2026-ces
2026-01-05T23:06:11+00:00ADATAのメモリおよびストレージ製品が2026年CESで展示ADATA Memory and Storage Products at CES 2026 Showcasedhttps://www.techpowerup.com/344753/adata-memory-and-storage-products-at-ces-2026-showcased
2026-01-05T22:10:56+00:00MSIがCES 2026で革新的なPCビルディングエコシステムを発表MSI Introduces a Breakthrough PC Building Ecosystem at CES 2026https://www.techpowerup.com/344750/msi-introduces-a-breakthrough-pc-building-ecosystem-at-ces-2026
2026-01-05T22:05:59+00:00ThermaltakeがCES 2026で新型の27インチ4K UHD IPSモニターおよび49インチ曲面OLEDモニターを発表Thermaltake Brings New 27-inch 4K UHD IPS and 49-inch Curved OLED Monitors to CES 2026https://www.techpowerup.com/344749/thermaltake-brings-new-27-inch-4k-uhd-ips-and-49-inch-curved-oled-monitors-to-ces-2026
2026-01-05T21:52:29+00:00MSIが27インチモニターと一体型PCシリーズを発表:5Kディスプレイと高速リフレッシュレートを搭載MSI Unveils 27-Inch Monitor and AIO Fleet: 5K Displays and High Refresh Rateshttps://www.techpowerup.com/344746/msi-unveils-27-inch-monitor-and-aio-fleet-5k-displays-and-high-refresh-rates
2026-01-05T21:44:22+00:00TRUSTAがCES 2026でエンタープライズ用の全面的なストレージおよびメモリソリューションを展示TRUSTA Showcases Its Full Enterprise Storage and Memory Solutions at CES 2026https://www.techpowerup.com/344739/trusta-showcases-its-full-enterprise-storage-and-memory-solutions-at-ces-2026
2026-01-05T21:43:36+00:00ThermaltakeがCES 2026でレトロデザインとモダンデザインを融合したレトロシリーズを展示Thermaltake’s Retro Lineup Showcased at CES 2026, Combining Modern With Retro Designhttps://www.techpowerup.com/344745/thermaltakes-retro-lineup-showcased-at-ces-2026-combining-modern-with-retro-design
2026-01-05T21:25:24+00:00MSIが2枚のCUDIMMを搭載した256GB大容量マザーボードのオーバークロックプラットフォームをデモンストレーションMSI Demos 256 GB High-Capacity Motherboard Overclocking Platform with Two CUDIMMshttps://www.techpowerup.com/344743/msi-demos-256-gb-high-capacity-motherboard-overclocking-platform-with-two-cudimms
2026-01-05T21:08:34+00:00ThermaltakeがCES 2026で新しい電源ユニットを展示、Dr. Power III Pro Testerを含むThermaltake Shows Its New Power Supplies at CES 2026, Including Dr. Power III Pro Testerhttps://www.techpowerup.com/344741/thermaltake-shows-its-new-power-supplies-at-ces-2026-including-dr-power-iii-pro-tester
2026-01-05T20:54:27+00:00MSIのGeForce RTX 5090 Lighting Zをハンズオン、40フェーズVRMと2,500W XOC BIOSを搭載MSI GeForce RTX 5090 Lighting Z Hands On: 40-Phase VRM and 2,500 W XOC BIOShttps://www.techpowerup.com/344738/msi-geforce-rtx-5090-lighting-z-hands-on-40-phase-vrm-and-2-500-w-xoc-bios
2026-01-05T20:28:28+00:00報道によると、MediaTekはモバイルチップよりAI ASICの開発を優先しているMediaTek Reportedly Prioritizing Development of AI ASICs Over Mobile Chipshttps://www.techpowerup.com/344733/mediatek-reportedly-prioritizing-development-of-ai-asics-over-mobile-chips
2026-01-05T20:19:48+00:00Digital StormがCES 2026で高性能VectorおよびAventum 5デスクトッププラットフォームを発表Digital Storm Debuts High-End Vector and Aventum 5 Desktop Platforms at CES 2026https://www.techpowerup.com/344737/digital-storm-debuts-high-end-vector-and-aventum-5-desktop-platforms-at-ces-2026
2026-01-05T20:15:33+00:00AudezeがMaxwell 2ワイヤレスゲーミングヘッドセットを発表Audeze Launches the Maxwell 2 Wireless Gaming Headsethttps://www.techpowerup.com/344735/audeze-launches-the-maxwell-2-wireless-gaming-headset
2026-01-05T19:39:48+00:00Styx: Blades of Greedのゲームプレイが9分間のトレーラーで紹介されたStyx: Blades of Greed Gameplay Showcased in 9-minute-long Trailerhttps://www.techpowerup.com/344731/styx-blades-of-greed-gameplay-showcased-in-9-minute-long-trailer
2026-01-05T19:22:23+00:00フランスの販売店において、AMD Ryzen 7 9850X3DのSKUが1月29日発売予定として掲載されたFrench Store Lists AMD Ryzen 7 9850X3D SKUs with January 29 Release Datehttps://www.techpowerup.com/344728/french-store-lists-amd-ryzen-7-9850x3d-skus-with-january-29-release-date
2026-01-05T19:09:40+00:00Terra Invicta サイエンスフィクションのエイリアン侵略シミュレーターが現在発売中Terra Invicta Sci-Fi Alien Invasion Simulator Out Nowhttps://www.techpowerup.com/344727/terra-invicta-sci-fi-alien-invasion-simulator-out-now
2026-01-05T18:39:58+00:00XboxアプリがHisenseおよびV homeOS搭載の一部スマートTVに登場予定Xbox App Coming to Select Hisense & V homeOS-powered Smart TVshttps://www.techpowerup.com/344726/xbox-app-coming-to-select-hisense-v-homeos-powered-smart-tvs
2026-01-05T18:31:01+00:00Inno3Dが最新のカスタムRTX 5060 Tiデザインを発表、将来的に16ピン電源コネクター対応を目指すInno3D’s Latest Custom RTX 5060 Ti Design Prepped for 16-pin Power Connector in Futurehttps://www.techpowerup.com/344725/inno3ds-latest-custom-rtx-5060-ti-design-prepped-for-16-pin-power-connector-in-future
2026-01-05T17:52:00+00:00HPがCES 2026で新たなOmniBooks、OmniStudios、Chromebooksを発表HP Announces New OmniBooks, OmniStudios, and Chromebooks at CES 2026https://www.techpowerup.com/344723/hp-announces-new-omnibooks-omnistudios-and-chromebooks-at-ces-2026
2026-01-05T17:47:30+00:00QualcommがCES 2026でSnapdragon X2 Plusプラットフォームを発売Qualcomm Launches Snapdragon X2 Plus Platform at CES 2026https://www.techpowerup.com/344722/qualcomm-launches-snapdragon-x2-plus-platform-at-ces-2026
2026-01-05T17:34:31+00:00MediaTekがCES 2026でFilogic 8000 Wi-Fi 8ファミリーを発表MediaTek Announces Filogic 8000 Wi-Fi 8 Family at CES 2026https://www.techpowerup.com/344719/mediatek-announces-filogic-8000-wi-fi-8-family-at-ces-2026
2026-01-05T17:33:08+00:00GameSirがG7 Pro × Zenless Zone Zero Editionワイヤレスコントローラーを発表GameSir Reveals G7 Pro × Zenless Zone Zero Edition Wireless Controllerhttps://www.techpowerup.com/344720/gamesir-reveals-g7-pro-x-zenless-zone-zero-edition-wireless-controller
2026-01-05T17:19:35+00:00GMKtecの『Panther Lake』フラッグシップ搭載EVO-T2ミニPCがCESの目玉となるGMKtec’s “Panther Lake” Flagship-powered EVO-T2 Mini PC Will be Centerpiece of CES Portfoliohttps://www.techpowerup.com/344711/gmktecs-panther-lake-flagship-powered-evo-t2-mini-pc-will-be-centerpiece-of-ces-portfolio
2026-01-05T17:16:24+00:00HAVITがCES 2026でSPACEシリーズを初公開HAVIT to Debut SPACE Series at CES 2026https://www.techpowerup.com/344717/havit-to-debut-space-series-at-ces-2026
2026-01-05T17:15:48+00:00LexarがCESで30周年を祝うとともに、いくつかの新型ストレージ製品を展示Lexar Celebrates 30th Anniversary at CES, Bringing Several New Storage Products to the Showhttps://www.techpowerup.com/344716/lexar-celebrates-30th-anniversary-at-ces-bringing-several-new-storage-products-to-the-show
2026-01-05T17:11:17+00:00XGIMIがCES 2026で初のAIグラス『MEMOMIND』を発表XGIMI Announces MEMOMIND at CES 2026, Its First Pair of AI Glasseshttps://www.techpowerup.com/344715/xgimi-announces-memomind-at-ces-2026-its-first-pair-of-ai-glasses
2026-01-05T16:57:13+00:00Origin PCがS-Class Edge AIデベロッパーキットを発表Origin PC Introduces the S-Class Edge AI Developer Kithttps://www.techpowerup.com/344713/origin-pc-introduces-the-s-class-edge-ai-developer-kit
2026-01-05T16:37:40+00:00JLabがCES 2026で新しいJBuds Mini ANCとGo Work 3を発表JLab Brings New JBuds Mini ANC and Go Work 3 to CES 2026https://www.techpowerup.com/344708/jlab-brings-new-jbuds-mini-anc-and-go-work-3-to-ces-2026
2026-01-05T16:31:41+00:00JLabが革新的な周辺機器のフルラインナップを揃え、ゲーミング市場に参入JLab Enters the Gaming Arena with a Full Suite of Innovative Peripheralshttps://www.techpowerup.com/344707/jlab-enters-the-gaming-arena-with-a-full-suite-of-innovative-peripherals
2026-01-05T16:18:04+00:00AMDがAvatar: FoP拡張において、FSRを活用して大幅なFPS向上を実現することを発表AMD Outlines Massive FPS Boost in Avatar: FoP Expansion – Enabled by FSRhttps://www.techpowerup.com/344706/amd-outlines-massive-fps-boost-in-avatar-fop-expansion-enabled-by-fsr
2026-01-05T16:17:47+00:00COUGARがCES 2026でゲーミングハードウェアの進化を披露COUGAR Unveils the Evolution of Gaming Hardware at CES 2026https://www.techpowerup.com/344705/cougar-unveils-the-evolution-of-gaming-hardware-at-ces-2026
2026-01-05T15:54:29+00:00Logitechが中国でG304 X Lightspeedゲーミングマウスを発表Logitech Launches G304 X Lightspeed Gaming Mouse in Chinahttps://www.techpowerup.com/344703/logitech-launches-g304-x-lightspeed-gaming-mouse-in-china
2026-01-05T15:39:17+00:00電話認証が終了したため、WindowsとOfficeはMicrosoftアカウントでのサインインが必須にWindows and Office Now Require Microsoft Account Sign-In as Phone Activation Endshttps://www.techpowerup.com/344704/windows-and-office-now-require-microsoft-account-sign-in-as-phone-activation-ends
2026-01-05T15:14:41+00:00THX Spatial AudioとAIヘッドトラッキング技術が、ヘッドフォン、サウンドバー、ラップトップで展示されたTHX Spatial Audio and AI Head Tracking for Headphones, Soundbars and Laptops Showcasedhttps://www.techpowerup.com/344702/thx-spatial-audio-and-ai-head-tracking-for-headphones-soundbars-and-laptops-showcased
2026-01-05T15:06:01+00:00Code Vein IIの開発者がNPCコンパニオンシステムと拡大されたキャラクター陣について語るCode Vein II Devs Discuss NPC Companion System & Larger Roster of Charactershttps://www.techpowerup.com/344701/code-vein-ii-devs-discuss-npc-companion-system-larger-roster-of-characters
EETimes Taiwan
2026-01-05AI推論領域の拡大:NvidiaがGroqの技術とチームを統合擴展AI推論版圖 Nvidia整合Groq技術與團隊https://www.eettaiwan.com/20260105nt01-groq-nvidia-s-20-billion-bet-on-ai-inference/
2026-01-056Gが目前に 業者は早期の準備を6G近在眼前 業者應及早做好準備https://www.eettaiwan.com/20260105nt11-operators-should-prepare-for-6g-commercialization-as-early-as-possible/
2026-01-05CES 2026:AI運用の実現、SDVおよびエッジAI生態系が三大主軸にCES 2026:AI運算落地、SDV與邊緣AI生態系成三大主軸https://www.eettaiwan.com/20260105nt21-ces-2026-s-three-main-themes/
EETimes Asia
2026-01-05チップレット:自動車先進電子技術へのコスト効率の高い近道Chiplets: A Cost-Effective Shortcut to Automotive Advanced Electronicshttps://www.eetasia.com/embeddedblog-chiplets-a-cost-effective-shortcut-to-automotive-advanced-electronics/
2026-01-05SMT制約を克服:頑強なスルーホールコネクタソリューションBridging SMT Constraints: Robust Through-Hole Connector Solutionshttps://www.eetasia.com/embeddedblog-bridging-smt-constraints-robust-through-hole-connector-solutions/
2026-01-052025年に回復へ向かうグローバルスマートウォッチ市場Global Smartwatch Market Set to Rebound in 2025https://www.eetasia.com/global-smartwatch-market-set-to-rebound-in-2025/
2026-01-05Portwell、Wincommの41%株式を取得し医療・ヘルスケアおよび産業市場での存在感を強化Portwell Acquires 41% Stake in Wincomm to Strengthen Presence in Medical/Healthcare, Industrial Marketshttps://www.eetasia.com/portwell-acquires-41-stake-in-wincomm-to-strengthen-presence-in-medical-healthcare-industrial-markets/
2026-01-05MOKOSMARTとSilicon Labsがコールドチェーン監視を革命化MOKOSMART and Silicon Labs Revolutionize Cold Chain Monitoringhttps://www.eetasia.com/mokosmart-and-silicon-labs-revolutionize-cold-chain-monitoring/
2026-01-05次世代UFS規格にAIサポートが追加へNext UFS Standard to Include Support for AIhttps://www.eetasia.com/next-ufs-standard-to-include-support-for-ai/
EETimes India
2026-01-05Mouser Electronics、Telit Cinterionとのグローバル流通契約を締結Mouser Electronics Inks Global Distribution Agreement with Telit Cinterionhttps://www.eetindia.co.in/mouser-electronics-inks-global-distribution-agreement-with-telit-cinterion/
2026-01-05AdvantechとDEEPX、AIアクセラレーション技術で提携Advantech and DEEPX Partners on AI Acceleration Techhttps://www.eetindia.co.in/advantech-and-deepx-partners-on-ai-acceleration-tech/
2026-01-05インドの半導体市場が急成長:新たな潮流がファブを超えて広がるIndia’s Semiconductor Takeoff: How the New Wave is Rising Beyond Fabshttps://www.eetindia.co.in/indias-semiconductor-takeoff-how-the-new-wave-is-rising-beyond-fabs/
ZDNET Korea
2026-01-06SKオン‐SKイノ、火災リスクのないバッテリーでESS市場に挑むSK온-SK이노, 화재 위험 없는 배터리로 ESS 시장 공략https://www.zdnet.co.kr/20260106085602” title=”
2026-01-06SKハイニクス、CESでHBM4 16段を初公開SK하이닉스, CES서 HBM4 16단 첫 공개https://www.zdnet.co.kr/20260106085759” title=”
2026-01-06K-ヒューマノイド連合、CESグローバルステージへ出撃K-휴머노이드 연합, CES 글로벌 무대 출정https://www.zdnet.co.kr/20260106085459” title=”
2026-01-06米、航空会社などにおける『消費者保護違反』の責任を軽減美, 항공사 등에 ‘소비자 보호 위반’ 책임 낮춘다https://www.zdnet.co.kr/20260106085218” title=”
2026-01-06電子顕微鏡にAIを搭載、軟質物質のナノ構造観察・予測も『チョッチョッ』전자현미경에 AI붙이니…연성물질 나노구조 관찰·예측도 “척척”https://www.zdnet.co.kr/20260106085703” title=”
2026-01-06カリー、ファッション・ビューティ部門で二桁採用を実施컬리, 패션·뷰티 두 자릿수 채용 진행https://www.zdnet.co.kr/20260106085356” title=”
2026-01-06家から道路へ…LG電子、AI空間を拡大집에서 도로로…LG전자, AI 공간 넓힌다https://www.zdnet.co.kr/20260106082704” title=”
2026-01-06現代自動車『ロボット年3万台生産』の意味は…ヒューマノイド商業化始動현대차 ‘로봇 연 3만대 생산’ 의미는…휴머노이드 상업화 시동https://www.zdnet.co.kr/20260106081420” title=”
2026-01-06チームスパルタ『B2B AI教育』、昨年売上が前年の2.5倍↑팀스파르타 ‘B2B AI 교육’ 작년 매출, 전년보다 2.5배↑https://www.zdnet.co.kr/20260106083554” title=”
2026-01-06LGイノテック、自動運転・EV市場を攻略するための革新ソリューションを大々的に公開LG이노텍, 자율주행·EV 시장 공략할 혁신 솔루션 대거 공개https://www.zdnet.co.kr/20260106014740” title=”
2026-01-06エヌビディア、次世代AI GPU『ルビン』を公開엔비디아, 차세대 AI GPU ‘루빈’ 공개https://www.zdnet.co.kr/20260106080153” title=”
2026-01-06サムスン電子、今月末に高性能AI PC『ギャラクシーブック6』を発売삼성전자, 이달 말 고성능 AI PC ‘갤럭시북6’ 출시https://www.zdnet.co.kr/20260105195401” title=”
2026-01-06新年、より明るくなるOLED…サムスン・LG、4500ニットの壁を突破새해 더 밝아지는 OLED…삼성·LG, 4500 니트 벽 ‘돌파’https://www.zdnet.co.kr/20260106072005” title=”
2026-01-06ヒュンダイ自動車グループ、2028年までに年間3万台のロボット大量生産体制を構築현대차그룹, 2028년까지 연 3만대 로봇 양산 체계 구축https://www.zdnet.co.kr/20260106070651” title=”
2026-01-06LGディスプレイ、ヒューマノイド用OLED初登場…AIロボット時代の準備LG디스플레이, 휴머노이드용 OLED 첫선…AI 로봇 시대 준비https://www.zdnet.co.kr/20260106052828” title=”
2026-01-06クアルコム、低価格AI PC向け『スナップドラゴン X2 プラス』SoCを公開퀄컴, 보급형 AI PC용 ‘스냅드래곤 X2 플러스’ SoC 공개https://www.zdnet.co.kr/20260106051400” title=”
2026-01-06作って終わりではない…レゴがCESで披露した『次世代のおもちゃ』만들고 끝이 아니다…레고가 CES서 꺼낸 ‘차세대 장난감’https://www.zdnet.co.kr/20260106044114” title=”
2026-01-06「家に入ってきたロボット」…LGクロイド、CESステージに登場“집으로 들어온 로봇”…LG 클로이드, CES 무대 등장https://www.zdnet.co.kr/20260106024318” title=”
中央日報
2026-01-06イ・ヘフン、6年で財産が113億ウォン増加…未上場株式で99億ウォン保有も이혜훈 6년 새 재산 113억 늘어나…비상장 주식 99억 보유도https://www.joongang.co.kr/article/25395378
2026-01-06[イ・ジェスンのパースペクティブ] 『文明の衝突』シーズン2…西洋の価値が試されることとなった[이재승의 퍼스펙티브] ‘문명의 충돌’ 시즌2…서구의 가치가 시험대 올랐다https://www.joongang.co.kr/article/25395346
2026-01-06[シロン] 荒唐無稽なヨンイン半導体工場の『セマングム移転論』[시론] 황당한 용인 반도체 공장의 ‘새만금 이전론’https://www.joongang.co.kr/article/25395344
2026-01-064400度を突破、天井知らずのコスピ4400도 뚫었다, 천장 없는 코스피https://www.joongang.co.kr/article/25395331
2026-01-06中国『資源の武器化』が本格化…輸出管理違反に対する罰則が72%急増중국 ‘자원 무기화’ 본격화…수출통제 위반 처벌 72% 급증https://www.joongang.co.kr/article/25395329
2026-01-05日本国債金利、27年ぶりの最高水準…円安と財政懸念の中で日本首相が「大胆な投資」を呼びかける日국채금리 27년만 최고…엔저·재정 우려 속 日총리 “대담한 투자”https://www.joongang.co.kr/article/25395291
BAIDU
2小时前博時半導体テーマ混合Aの純資産が5.11%上昇博时半导体主题混合A净值上涨5.11%https://baijiahao.baidu.com/s?id=1853513040025562781&wfr=spider&for=pc
2小时前華安CES半導体チップ業界指数発起Aの純資産が4.30%上昇华安CES半导体芯片行业指数发起A净值上涨4.30%https://baijiahao.baidu.com/s?id=1853513067530284126&wfr=spider&for=pc
2小时前半導体大手ETFの純資産が4.69%上昇半导体龙头ETF净值上涨4.69%https://baijiahao.baidu.com/s?id=1853514472874149091&wfr=spider&for=pc
7分钟前3社の半導体大手企業が共同で再編取引を推進、科創板における買収合併が『質的変化』の新段階へ三家半导体龙头企业齐推重组交易 科创板并购迈向“质变”新阶段https://www.stcn.com/article/detail/3572575.html
45分钟前3社の半導体大手企業が共同で再編取引を推進、科創板における買収合併が『質的変化』の新段階へ三家半导体龙头企业齐推重组交易 科创板并购迈向“质变”新阶段https://www.stcn.com/article/detail/3572432.html
昨天19:31半導体設備ETF(159516)が約6%上昇、取引中に1.67億口の純流入、過去20日間の純流入は…半导体设备ETF(159516)收涨近6%,盘中净流入1.67亿份,近20日净流入…https://www.nbd.com.cn/articles/2026-01-05/4207731.html
昨天19:16粤芯半導体のIPOが現場検査の対象に選ばれる粤芯半导体IPO被抽中现场检查https://baijiahao.baidu.com/s?id=1853475536574272098&wfr=spider&for=pc
昨天19:07京隆科技の高性能半導体テストプロジェクト用新工場が稼働開始京隆科技高阶半导体测试项目新厂投用http://www.thepaper.cn/newsDetail_forward_32323258
昨天21:20日聯科技:X線検査技術と製品が半導体封装検査の現場で広く活用される日联科技:公司X射线检测技术和产品已广泛应用于半导体封测场景https://baijiahao.baidu.com/s?id=1853483078194364809&wfr=spider&for=pc
昨天21:31士蘭微が両面で画期的な進展を遂げ、第三世代半導体と高級アナログチップ分野で飛躍士兰微双线里程碑式进展,第三代半导体和高端模拟芯片领域能级跃升https://baijiahao.baidu.com/s?id=1853484346717912359&wfr=spider&for=pc
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