TOC
Main News
- TSMC to Start 2nm Production and Accelerate Construction of 1.4nm Factory
TSMC has begun production of its 2nm process, intensifying competition with Samsung Electronics. Furthermore, the company is reportedly accelerating construction of a 1.4nm plant in Taiwan with the aim of starting mass production in 2028. At the same time, the company has obtained an import license from the U.S. Department of Commerce for manufacturing equipment for its Nanjing plant, and is poised to continue doing business in the Chinese market. While consolidating its position as a leader in cutting-edge technology, the company is expanding its manufacturing base amid the geopolitical balance between the U.S. and China. - Intel Officially Announces 18A Process “Panther Lake”
At CES 2026, Intel announced the Core Ultra Series 3 (Panther Lake) mobile processor based on its state-of-the-art Intel 18A manufacturing process. This product is a touchstone for Intel’s restructuring of its foundry business. Competing PC makers, such as Acer, immediately announced notebook PCs based on this chip, marking an important step toward regaining leadership in the AI PC market. - SK Hynix Unveils First 16-Layer HBM4 at CES
SK Hynix unveiled the world’s first 16-layer stacked HBM4, the next generation memory, at CES 2026. The company is pursuing a “dual strategy” of increasing HBM4 production while ensuring that HBM3E will continue to dominate the market in 2026, clearly demonstrating its commitment to maintaining its dominant market share and technological leadership in the AI memory market in anticipation of supplying Nvidia’s next-generation GPUs. - Japan’s Rapidus to Launch Back-end Prototype Line in Hokkaido in Spring 2026
Japan’s Rapidus will reportedly launch an advanced packaging prototype line in Hokkaido in spring 2026. Advanced packaging technologies such as 2.5D and 3D packaging are key to AI semiconductors, and concrete progress is being made toward building a domestic ecosystem. - Nvidia Announces Al pamayo, a New AI Development Platform for Self-Driving and Uber’s Adoption
Nvidia has announced Alpamayo, a new AI development platform for self-driving, and that Uber Technologies, a leading U.S. car-delivery company, has adopted it. Nvidia is strengthening its position as a platform not only for AI data centers, but also in the mobility sector, driving AI implementation in the real economy. - Chinese Memory CXMT Aims for US$4.2 Billion IPO
Chinese DRAM maker CXMT (Changjiang Memory) is reportedly planning an IPO (initial public offering) to raise approximately US$4.2 billion (over 600 billion yen) YMTC is also preparing to apply for listing. With the soaring price of memory benefiting the industry as a whole, Chinese companies are accelerating capital investment by obtaining huge amounts of money from the capital market to strengthen their self-sufficiency system against U.S. sanctions. - Hyundai Motor Company to mass-produce “30,000 robots a year”
Hyundai Motor Group has announced that it will establish a production system for 30,000 robots a year by 2028.At CES 2026, the company is promoting its technological capabilities as the “K-Humanoid Coalition” and is moving toward commercialization in earnest.LG Electronics Co. LG Electronics and others are also introducing robots for home use, and the Korean industry as a whole is increasingly moving to develop AI-equipped robots into a major export industry for the next generation. - TSMC Technology Leak Investigation, Tokyo Electron Officials Indicted
Investigations into TSMC’s leak of information on its 2nm process technology continue, and Taiwanese prosecutors have indicted three additional individuals, including a Tokyo Electron employee. As the battle for technological supremacy in cutting-edge semiconductors intensifies, the protection of trade secrets and the management of human resources have become serious security risks. The situation calls for renewed efforts to strengthen compliance throughout the supply chain and to take thorough measures to prevent technology leakage. - Nexchip to Invest US$5.1 Billion to Build New Mature Process Plant in Hefei, China
Nexchip Semiconductor of China will invest approximately US$5.1 billion to build a new plant in Hefei to expand manufacturing capacity for mature processes such as 28nm. This is part of the Chinese government’s semiconductor self-sufficiency policy, which is being pursued in parallel with industry restructuring through mergers and acquisitions. Although cutting-edge products are regulated, this move is aimed at expanding global market share by establishing a solid supply network for legacy semiconductors needed for consumer electronics and automobiles. - ASUS and Other PC Component Price Hikes, Inflation Spurred by AI Demand
Reports of a 15-20% price hike by ASUS have prompted retailers to raise prices, including those of competitors’ products, due to a shortage of memory and SSDs caused by increased demand for AI servers, MSI’s new RTX5090 GPU, and other products with advanced features. The rising cost of materials is spreading like a domino to the PC market as a whole, and “AI inflation,” which increases the burden on consumers, is becoming apparent.
News List
| 投稿日 | 日本語タイトル | 原語タイトル | 記事URL |
|---|---|---|---|
| DIGITIMES | |||
| Jan 5 | メモリ価格の急騰が業界全体に予期せぬ利益をもたらす | Memory price surge drives profit windfall across sector | https://www.digitimes.com/news/a20260105PD212/memory-profit-demand-2026-dram.html |
| Jan 5 | TSMCが2nm生産を開始、サムスンがこれに迫る | TSMC kicks off 2nm production with Samsung in hot pursuit | https://www.digitimes.com/news/a20260105PD222/samsung-tsmc-2nm-production-technology.html |
| Jan 5 | 日本のRapidus、2026年春に北海道で先端パッケージングの試作ラインを立ち上げる | Japan’s Rapidus to launch advanced packaging pilot line in Hokkaido by spring 2026 | https://www.digitimes.com/news/a20260105PD238/rapidus-packaging-2026-2nm-production.html |
| Jan 5 | 中国メモリメーカーのIPO計画:CXMTは42億米ドルを目標、YMTCは上場申請中 | China memory makers’ IPO line up: CXMT seeks US$4.2 billion, YMTC prepares filing | https://www.digitimes.com/news/a20260105PD207/cxmt-ymtc-demand-2026-2025.html |
| Jan 5 | Nexchip Semiconductor、28nm既成熟プロセスの能力拡大のため、51億米ドル規模の合肥工場を立ち上げる | Nexchip Semiconductor launches US$5.1bn Hefei fab to scale 28nm mature-node capacity | https://www.digitimes.com/news/a20260105VL203/nexchip-capacity-28nm-wafer-fab.html |
| Jan 6, 07:49 | 中国、受託製造M&Aを通じ半導体自給自足を加速 – 華虹とSMICの最新動向 | China accelerates semiconductor self-sufficiency through foundry M&A: updates on Hua Hong, SMIC | https://www.digitimes.com/news/a20260105PD227/smic-self-sufficiency-capacity-12-inch-technology.html |
| Jan 6, 07:48 | 台湾、AI輸出急増を活用して観光業と内需を活性化 | Taiwan leverages AI export surge to boost tourism, domestic demand | https://www.digitimes.com/news/a20260105PD230/taiwan-2026-growth-demand-electronic-components.html |
| Jan 6, 07:38 | 中国移动とCNBMが、華信マイクロナノの8インチMEMS事業拡大を牽引 | China Mobile, CNBM anchor Huaxin Micro-Nano’s 8-inch MEMS expansion | https://www.digitimes.com/news/a20260105VL205/mems-china-mobile-sensor-manufacturing-industrial.html |
| Jan 6, 07:38 | SKハイニックス、2026年にはHBM3Eがメモリ市場を席巻し、HBM4も増産へ | SK Hynix says HBM3E to dominate memory in 2026 as HBM4 ramps up | https://www.digitimes.com/news/a20260105VL206/sk-hynix-hbm3e-hbm4-market-2026.html |
| Jan 6, 07:35 | 中国の半導体メーカー、国産化推進にもかかわらず歩留まり問題に直面 | Chinese chipmakers confront yield challenges despite localization push | https://www.digitimes.com/news/a20260105PD221/advanced-process-supply-chain-equipment-production-high-end.html |
| Jan 6, 07:35 | Chang Wah社のインタビュー:貴金属不足にもかかわらずリードフレームが著しい成長を見せる | Chang Wah interview: strong lead frame growth despite precious metals shortage | https://www.digitimes.com/news/a20260105PD206/cwtc-interview-lead-frame-demand-inventory-taiwan-rare-earth.html |
| Jan 5 | TSMCの2nm情報流出調査が、東京エレクトロンおよび3名への追加起訴につながる | TSMC 2nm leak probe leads to additional indictments for three people and Tokyo Electron | https://www.digitimes.com/news/a20260105PD242/taiwan-tsmc-tokyo-electron-2nm-investigation.html |
| Jan 5 | Chunghwa Precision Test Tech、半導体需要拡大を背景に桃園で新工場を建設 | Chunghwa Precision Test Tech to build new plant in Taoyuan amid growing semiconductor demand | https://www.digitimes.com/news/a20260105PD240/chpt-testing-plant-2026.html |
| Jan 5 | InpaqのCEO陳佩仁氏、リソース再編計画を立ち上げる | Inpaq CEO Pei-Jen Chen launches resource realignment plan | https://www.digitimes.com/news/a20260105PD219/inpaq-passive-components-antenna-market-walsin.html |
| Jan 5 | 李在明氏の初の中国訪問が、韓国と中国の関係改善の兆しを示す | Lee Jae-myung’s first China visit signals warming South Korea-China ties | https://www.digitimes.com/news/a20260105PD235/bloomberg-business-market-beijing-hyundai.html |
| Jan 5 | TSMCの米国工場、台湾との構造的なコストギャップを露呈 | TSMC’s US fabs expose structural cost gap with Taiwan | https://www.digitimes.com/news/a20260105PD228/tsmc-semiconductors-manufacturing-gross-margin-usa-taiwan.html |
| 日経 Tech Foresight | |||
| 2026-01-06 | メタレンズ「カメラ設計思想を変革」 デンマーク新興 | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC2687U0W5A221C2000000 | |
| 2026-01-06 | 慶応大、超精密加工でマイクロ光コム THz波・光通信に | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC247YX0U5A221C2000000 | |
| 2026-01-06 | インテル・ラピダス正念場、2強躍進 26年半導体5大展望 | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC221QM0S5A221C2000000 | |
| 2026-01-06 | 【特許】日本フューテック、半導体実装しやすい放熱基板 | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC240F70U5A221C2000000 | |
| 2026-01-05 | 理研など、低温下のひずみ抑える結晶成長法 超電導発現に | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC197510Z11C25A2000000 | |
| 2026-01-05 | 2026年は量子5方式の攻防激化 1万量子ビット時代が到来 | https://www.nikkei.com/prime/tech-foresight/article/DGXZQOUC251EM0V21C25A2000000 | |
| マイナビニュース テックプラス | |||
| 2026-01-05 | 京セラが鹿児島の2工場を「鹿児島霧島工場」として統合、工場運営を効率化 | https://news.mynavi.jp/techplus/article/20260105-3927382/ | |
| 2026-01-05 | TSMCが南京工場向け装置輸入許可を米国より取得、NVIDIAからは中国向けGPUの増産要請 海外メディア報道 | https://news.mynavi.jp/techplus/article/20260105-3927331/ | |
| 2026-01-05 | TSMCが2028年の量産開始に向けて台湾での1.4nm工場の建設を加速、台湾メディア報道 | https://news.mynavi.jp/techplus/article/20260105-3926706/ | |
| 2026-01-05 | TSMC、計画通りの2025年第4四半期からの2nm量産を台湾の2工場にて開始 | https://news.mynavi.jp/techplus/article/20260105-3926640/ | |
| 2026-01-05 | MOSFETにおけるトップサイド冷却 – PCB冷却/両面冷却と比べる熱マネジメントのメリット | https://news.mynavi.jp/techplus/article/20260105-3877999/ | |
| 2026-01-05 | 笑う門にしか福は来ない、ams-OSRAMジャパンの針田社長が見据える2026年の半導体市場 | https://news.mynavi.jp/techplus/article/20260105-3878150/ | |
| TrendForce | |||
| 2026-01-06 | 米国、報道によると中国のブラックセサミ・フアシャンA2000自動車用チップのグローバル展開を承認 | US Reportedly Clears China’s Black Sesame Huashan A2000 Auto Chip for Global Launch | https://www.trendforce.com/news/2026/01/06/news-us-reportedly-clears-chinas-black-sesame-huashan-a2000-auto-chip-for-global-launch/ |
| 2026-01-05 | SKハイニックス 2026年展望:HBM3Eが主流、3つの市場逆風に直面する中、HBM4が二重戦略を展開 | SK hynix 2026 Outlook: HBM3E Dominates, HBM4 Dual Strategy Amid 3 Market Headwinds | https://www.trendforce.com/news/2026/01/05/news-sk-hynix-2026-outlook-hbm3e-remains-mainstream-hbm4-dual-strategy-amid-triple-market-headwinds/ |
| 2026-01-05 | 報道によると、ラージャン・プレシジョンがTSMCとCPOで連携、サンプルにはAMDが含まれているとされる | Largan Precision Reportedly Teams Up With TSMC on CPO; Samples Said to Involve AMD | https://www.trendforce.com/news/2026/01/05/news-largan-precision-reportedly-eyes-cpo-opportunity-via-tsmc-collaboration-amd-samples-in-testing/ |
| 2026-01-05 | 報道によると、AMD、NVIDIAなどがCES 2026で新型チップを初披露、TSMCの3nmおよび5nmプロセスに注目 | AMD, NVIDIA and Others Reportedly to Debut New Chips at CES 2026, Spotlighting TSMC 3nm and 5nm | https://www.trendforce.com/news/2026/01/05/news-amd-nvidia-and-others-reportedly-to-debut-new-chips-at-ces-2026-spotlighting-tsmc-3nm-and-5nm/ |
| 2026-01-05 | 報道によると、ASUSの15〜20%の値上げがドミノ効果を引き起こし、小売業者が1月5日に競合他社の価格も引き上げた | ASUS’s Reported 15-20% Price Hike Triggers Domino Effect as Retailers Raise Rivals’ Prices Jan. 5 | https://www.trendforce.com/news/2026/01/05/news-asuss-reported-15-20-price-hike-triggers-domino-effect-as-taiwan-retailers-raise-rivals-prices-jan-5/ |
| Semiconductor Digest | |||
| 1 hour ago | TianmaとUniversal Display Corporationが長期OLED契約を締結 | Tianma and Universal Display Corporation Enter into Long-Term OLED Agreements | https://www.semiconductor-digest.com/tianma-and-universal-display-corporation-enter-into-long-term-oled-agreements/ |
| 2 hours ago | HSCが新たな最高執行責任者を任命 | HSC Appoints New Chief Operating Officer | https://www.semiconductor-digest.com/hsc-appoints-new-chief-operating-officer/ |
| 2 hours ago | フロリダ州の成長する半導体製造エコシステムを紹介する年次フロリダ・セミコンダクター・サミット | Annual Florida Semiconductor Summit to Showcase the State’s Growing Chip Manufacturing Ecosystem | https://www.semiconductor-digest.com/annual-florida-semiconductor-summit-to-showcase-the-states-growing-chip-manufacturing-ecosystem/ |
| 2 hours ago | 米国に半導体製造を戻すために必要な要素 | What It Takes to Bring Semiconductor Manufacturing Back to the US | https://www.semiconductor-digest.com/what-it-takes-to-bring-semiconductor-manufacturing-back-to-the-us/ |
| 日本経済新聞 | |||
| 2026-01-06 | NVIDIA、自動運転向けのAI開発基盤「アルパマヨ」発表 ウーバーが採用 | https://www.nikkei.com/article/DGXZQOGN05A890V00C26A1000000/ | |
| 2026-01-06 | 日経平均株価、米株高が支えに(先読み株式相場) | https://www.nikkei.com/article/DGXZQOFL0603I0W6A100C2000000/ | |
| 2026-01-06 | 日本車6社、25年米新車販売2.4%増 ハイブリッド好調のトヨタ8%増 | https://www.nikkei.com/article/DGXZQOGN021NN0S6A100C2000000/ | |
| 2026-01-06 | ニッキフロン、フッ素樹脂を水平リサイクル 独自技術開発し新工場 | https://www.nikkei.com/article/DGXZQOCC199GR0Z11C25A2000000/ | |
| 2026-01-06 | 九州電力社長、洋上風力「アクセル踏む準備」 原発は資金調達課題 | https://www.nikkei.com/article/DGXZQOJC246M10U5A221C2000000/ | |
| 2026-01-06 | 北海道石狩市沖、洋上風力の法定協議会設立へ 道南には研修施設 | https://www.nikkei.com/article/DGXZQOFC2510I0V21C25A2000000/ | |
| 2026-01-06 | 西部ガスHD加藤卓二社長、LNG調達「ロシアと契約更新しない場合も」 | https://www.nikkei.com/article/DGXZQOJC2651F0W5A221C2000000/ | |
| 2026-01-06 | クラフティア石橋和幸社長「M&Aに500億円投資」 CVCも活用 | https://www.nikkei.com/article/DGXZQOJC27B3Q0X21C25A1000000/ | |
| 2026-01-06 | 最高値に沸くTSMC・サムスン電子にベネズエラの暗い影 | https://www.nikkei.com/article/DGXZQOFL051BS0V00C26A1000000/ | |
| 2026-01-06 | ドイツ株5日 続伸、最高値を約3カ月ぶりに更新 防衛ラインメタル9%高 | https://www.nikkei.com/article/DGXZQOFL05A260V00C26A1000000/ | |
| ダイヤモンドオンライン | |||
| Jan 5 19:45 | 【日米台vs中国17社】AI覇権戦争を大図解!日本のAI後進国ぶりが一目瞭然の“3つの不都合なデータ”とは? | https://diamond.jp/articles/-/377879 | |
| Jan 4 19:40 | 26年のドイツ経済は4年ぶり「実質成長率1%超え」か、鍵は日本と同じ積極財政・成長戦略の巧拙 | https://diamond.jp/articles/-/380599 | |
| Jan 4 19:35 | 国際協力銀行会長が日米関税合意の80兆円投資は「国益にかなう」と断言!創設した先進国向けの金融支援は、なんとTSMCやUSスチールも対象に?《再配信》 | https://diamond.jp/articles/-/380462 | |
| Jan 3 19:50 | 26年の米政治は「AI規制」が争点に?トランプ政権の規制緩和に州政府・MAGA派が反発 | https://diamond.jp/articles/-/380598 | |
| Jan 3 03:00 | 「守りながら増やす」がキーワード?読者が選んだ“人気No.1”の正体【2026年の注目テーマ&戦略】 | https://diamond.jp/articles/-/380399 | |
| Tom’s Hardware | |||
| TechPowerup | |||
| 2026-01-06T00:01:30+00:00 | NeurableがHyperXと共同で、神経技術を搭載したゲーミング用ウェアラブルヘッドセットを発表 | Neurable Intros Neurotechnology-Powered Gaming Wearable Headset with HyperX | https://www.techpowerup.com/344765/neurable-intros-neurotechnology-powered-gaming-wearable-headset-with-hyperx |
| 2026-01-05T23:53:34+00:00 | IntelがIntel 18Aノード上でCore Ultraシリーズ3「Panther Lake」モバイルプロセッサを発表 | Intel Launches Core Ultra Series 3 “Panther Lake” Mobile Processors on Intel 18A Node | https://www.techpowerup.com/344763/intel-launches-core-ultra-series-3-panther-lake-mobile-processors-on-intel-18a-node |
| 2026-01-05T23:46:43+00:00 | NVIDIA DGX SparkとDGX Stationが最新のオープンソースおよび最先端モデルを支える | NVIDIA DGX Spark and DGX Station Power the Latest Open-Source and Frontier Models | https://www.techpowerup.com/344762/nvidia-dgx-spark-and-dgx-station-power-the-latest-open-source-and-frontier-models |
| 2026-01-05T23:44:45+00:00 | NVIDIA DGX SuperPODがRubinベースのシステムの土台を構築 | NVIDIA DGX SuperPOD Sets the Stage for Rubin-Based Systems | https://www.techpowerup.com/344761/nvidia-dgx-superpod-sets-the-stage-for-rubin-based-systems |
| 2026-01-05T23:42:28+00:00 | NVIDIA BlueFieldを搭載したサイバーセキュリティおよびアクセラレーション機能が、NVIDIA Enterprise AI Factoryバリデートデザインに登場 | NVIDIA BlueField-Powered Cybersecurity and Acceleration Arrive on NVIDIA Enterprise AI Factory Validated Design | https://www.techpowerup.com/344760/nvidia-bluefield-powered-cybersecurity-and-acceleration-arrive-on-nvidia-enterprise-ai-factory-validated-design |
| 2026-01-05T23:38:59+00:00 | AcerがPredator XB273U F6 1000Hzゲーミングモニターを発表 | Acer Unleashes the Predator XB273U F6 1000 Hz Gaming Monitor | https://www.techpowerup.com/344758/acer-unleashes-the-predator-xb273u-f6-1000-hz-gaming-monitor |
| 2026-01-05T23:30:45+00:00 | ADATAとXPGがCES 2026でポータブルSSDを展示 | ADATA and XPG Portable SSDs at CES 2026 | https://www.techpowerup.com/344756/adata-and-xpg-portable-ssds-at-ces-2026 |
| 2026-01-05T23:18:18+00:00 | AcerがIntel Core Ultraシリーズ3プロセッサを搭載した新型PredatorおよびNitroゲーミングラップトップを発表 | Acer Unveils New Predator and Nitro Gaming Laptops with Intel Core Ultra Series 3 Processors | https://www.techpowerup.com/344754/acer-unveils-new-predator-and-nitro-gaming-laptops-with-intel-core-ultra-series-3-processors |
| 2026-01-05T23:18:06+00:00 | ADATAの組み込みおよびフラッシュストレージ製品が2026年CESで展示された | ADATA Embedded and Flash Storage Products Showcased at 2026 CES | https://www.techpowerup.com/344755/adata-embedded-and-flash-storage-products-showcased-at-2026-ces |
| 2026-01-05T23:06:11+00:00 | ADATAのメモリおよびストレージ製品が2026年CESで展示 | ADATA Memory and Storage Products at CES 2026 Showcased | https://www.techpowerup.com/344753/adata-memory-and-storage-products-at-ces-2026-showcased |
| 2026-01-05T22:10:56+00:00 | MSIがCES 2026で革新的なPCビルディングエコシステムを発表 | MSI Introduces a Breakthrough PC Building Ecosystem at CES 2026 | https://www.techpowerup.com/344750/msi-introduces-a-breakthrough-pc-building-ecosystem-at-ces-2026 |
| 2026-01-05T22:05:59+00:00 | ThermaltakeがCES 2026で新型の27インチ4K UHD IPSモニターおよび49インチ曲面OLEDモニターを発表 | Thermaltake Brings New 27-inch 4K UHD IPS and 49-inch Curved OLED Monitors to CES 2026 | https://www.techpowerup.com/344749/thermaltake-brings-new-27-inch-4k-uhd-ips-and-49-inch-curved-oled-monitors-to-ces-2026 |
| 2026-01-05T21:52:29+00:00 | MSIが27インチモニターと一体型PCシリーズを発表:5Kディスプレイと高速リフレッシュレートを搭載 | MSI Unveils 27-Inch Monitor and AIO Fleet: 5K Displays and High Refresh Rates | https://www.techpowerup.com/344746/msi-unveils-27-inch-monitor-and-aio-fleet-5k-displays-and-high-refresh-rates |
| 2026-01-05T21:44:22+00:00 | TRUSTAがCES 2026でエンタープライズ用の全面的なストレージおよびメモリソリューションを展示 | TRUSTA Showcases Its Full Enterprise Storage and Memory Solutions at CES 2026 | https://www.techpowerup.com/344739/trusta-showcases-its-full-enterprise-storage-and-memory-solutions-at-ces-2026 |
| 2026-01-05T21:43:36+00:00 | ThermaltakeがCES 2026でレトロデザインとモダンデザインを融合したレトロシリーズを展示 | Thermaltake’s Retro Lineup Showcased at CES 2026, Combining Modern With Retro Design | https://www.techpowerup.com/344745/thermaltakes-retro-lineup-showcased-at-ces-2026-combining-modern-with-retro-design |
| 2026-01-05T21:25:24+00:00 | MSIが2枚のCUDIMMを搭載した256GB大容量マザーボードのオーバークロックプラットフォームをデモンストレーション | MSI Demos 256 GB High-Capacity Motherboard Overclocking Platform with Two CUDIMMs | https://www.techpowerup.com/344743/msi-demos-256-gb-high-capacity-motherboard-overclocking-platform-with-two-cudimms |
| 2026-01-05T21:08:34+00:00 | ThermaltakeがCES 2026で新しい電源ユニットを展示、Dr. Power III Pro Testerを含む | Thermaltake Shows Its New Power Supplies at CES 2026, Including Dr. Power III Pro Tester | https://www.techpowerup.com/344741/thermaltake-shows-its-new-power-supplies-at-ces-2026-including-dr-power-iii-pro-tester |
| 2026-01-05T20:54:27+00:00 | MSIのGeForce RTX 5090 Lighting Zをハンズオン、40フェーズVRMと2,500W XOC BIOSを搭載 | MSI GeForce RTX 5090 Lighting Z Hands On: 40-Phase VRM and 2,500 W XOC BIOS | https://www.techpowerup.com/344738/msi-geforce-rtx-5090-lighting-z-hands-on-40-phase-vrm-and-2-500-w-xoc-bios |
| 2026-01-05T20:28:28+00:00 | 報道によると、MediaTekはモバイルチップよりAI ASICの開発を優先している | MediaTek Reportedly Prioritizing Development of AI ASICs Over Mobile Chips | https://www.techpowerup.com/344733/mediatek-reportedly-prioritizing-development-of-ai-asics-over-mobile-chips |
| 2026-01-05T20:19:48+00:00 | Digital StormがCES 2026で高性能VectorおよびAventum 5デスクトッププラットフォームを発表 | Digital Storm Debuts High-End Vector and Aventum 5 Desktop Platforms at CES 2026 | https://www.techpowerup.com/344737/digital-storm-debuts-high-end-vector-and-aventum-5-desktop-platforms-at-ces-2026 |
| 2026-01-05T20:15:33+00:00 | AudezeがMaxwell 2ワイヤレスゲーミングヘッドセットを発表 | Audeze Launches the Maxwell 2 Wireless Gaming Headset | https://www.techpowerup.com/344735/audeze-launches-the-maxwell-2-wireless-gaming-headset |
| 2026-01-05T19:39:48+00:00 | Styx: Blades of Greedのゲームプレイが9分間のトレーラーで紹介された | Styx: Blades of Greed Gameplay Showcased in 9-minute-long Trailer | https://www.techpowerup.com/344731/styx-blades-of-greed-gameplay-showcased-in-9-minute-long-trailer |
| 2026-01-05T19:22:23+00:00 | フランスの販売店において、AMD Ryzen 7 9850X3DのSKUが1月29日発売予定として掲載された | French Store Lists AMD Ryzen 7 9850X3D SKUs with January 29 Release Date | https://www.techpowerup.com/344728/french-store-lists-amd-ryzen-7-9850x3d-skus-with-january-29-release-date |
| 2026-01-05T19:09:40+00:00 | Terra Invicta サイエンスフィクションのエイリアン侵略シミュレーターが現在発売中 | Terra Invicta Sci-Fi Alien Invasion Simulator Out Now | https://www.techpowerup.com/344727/terra-invicta-sci-fi-alien-invasion-simulator-out-now |
| 2026-01-05T18:39:58+00:00 | XboxアプリがHisenseおよびV homeOS搭載の一部スマートTVに登場予定 | Xbox App Coming to Select Hisense & V homeOS-powered Smart TVs | https://www.techpowerup.com/344726/xbox-app-coming-to-select-hisense-v-homeos-powered-smart-tvs |
| 2026-01-05T18:31:01+00:00 | Inno3Dが最新のカスタムRTX 5060 Tiデザインを発表、将来的に16ピン電源コネクター対応を目指す | Inno3D’s Latest Custom RTX 5060 Ti Design Prepped for 16-pin Power Connector in Future | https://www.techpowerup.com/344725/inno3ds-latest-custom-rtx-5060-ti-design-prepped-for-16-pin-power-connector-in-future |
| 2026-01-05T17:52:00+00:00 | HPがCES 2026で新たなOmniBooks、OmniStudios、Chromebooksを発表 | HP Announces New OmniBooks, OmniStudios, and Chromebooks at CES 2026 | https://www.techpowerup.com/344723/hp-announces-new-omnibooks-omnistudios-and-chromebooks-at-ces-2026 |
| 2026-01-05T17:47:30+00:00 | QualcommがCES 2026でSnapdragon X2 Plusプラットフォームを発売 | Qualcomm Launches Snapdragon X2 Plus Platform at CES 2026 | https://www.techpowerup.com/344722/qualcomm-launches-snapdragon-x2-plus-platform-at-ces-2026 |
| 2026-01-05T17:34:31+00:00 | MediaTekがCES 2026でFilogic 8000 Wi-Fi 8ファミリーを発表 | MediaTek Announces Filogic 8000 Wi-Fi 8 Family at CES 2026 | https://www.techpowerup.com/344719/mediatek-announces-filogic-8000-wi-fi-8-family-at-ces-2026 |
| 2026-01-05T17:33:08+00:00 | GameSirがG7 Pro × Zenless Zone Zero Editionワイヤレスコントローラーを発表 | GameSir Reveals G7 Pro × Zenless Zone Zero Edition Wireless Controller | https://www.techpowerup.com/344720/gamesir-reveals-g7-pro-x-zenless-zone-zero-edition-wireless-controller |
| 2026-01-05T17:19:35+00:00 | GMKtecの『Panther Lake』フラッグシップ搭載EVO-T2ミニPCがCESの目玉となる | GMKtec’s “Panther Lake” Flagship-powered EVO-T2 Mini PC Will be Centerpiece of CES Portfolio | https://www.techpowerup.com/344711/gmktecs-panther-lake-flagship-powered-evo-t2-mini-pc-will-be-centerpiece-of-ces-portfolio |
| 2026-01-05T17:16:24+00:00 | HAVITがCES 2026でSPACEシリーズを初公開 | HAVIT to Debut SPACE Series at CES 2026 | https://www.techpowerup.com/344717/havit-to-debut-space-series-at-ces-2026 |
| 2026-01-05T17:15:48+00:00 | LexarがCESで30周年を祝うとともに、いくつかの新型ストレージ製品を展示 | Lexar Celebrates 30th Anniversary at CES, Bringing Several New Storage Products to the Show | https://www.techpowerup.com/344716/lexar-celebrates-30th-anniversary-at-ces-bringing-several-new-storage-products-to-the-show |
| 2026-01-05T17:11:17+00:00 | XGIMIがCES 2026で初のAIグラス『MEMOMIND』を発表 | XGIMI Announces MEMOMIND at CES 2026, Its First Pair of AI Glasses | https://www.techpowerup.com/344715/xgimi-announces-memomind-at-ces-2026-its-first-pair-of-ai-glasses |
| 2026-01-05T16:57:13+00:00 | Origin PCがS-Class Edge AIデベロッパーキットを発表 | Origin PC Introduces the S-Class Edge AI Developer Kit | https://www.techpowerup.com/344713/origin-pc-introduces-the-s-class-edge-ai-developer-kit |
| 2026-01-05T16:37:40+00:00 | JLabがCES 2026で新しいJBuds Mini ANCとGo Work 3を発表 | JLab Brings New JBuds Mini ANC and Go Work 3 to CES 2026 | https://www.techpowerup.com/344708/jlab-brings-new-jbuds-mini-anc-and-go-work-3-to-ces-2026 |
| 2026-01-05T16:31:41+00:00 | JLabが革新的な周辺機器のフルラインナップを揃え、ゲーミング市場に参入 | JLab Enters the Gaming Arena with a Full Suite of Innovative Peripherals | https://www.techpowerup.com/344707/jlab-enters-the-gaming-arena-with-a-full-suite-of-innovative-peripherals |
| 2026-01-05T16:18:04+00:00 | AMDがAvatar: FoP拡張において、FSRを活用して大幅なFPS向上を実現することを発表 | AMD Outlines Massive FPS Boost in Avatar: FoP Expansion – Enabled by FSR | https://www.techpowerup.com/344706/amd-outlines-massive-fps-boost-in-avatar-fop-expansion-enabled-by-fsr |
| 2026-01-05T16:17:47+00:00 | COUGARがCES 2026でゲーミングハードウェアの進化を披露 | COUGAR Unveils the Evolution of Gaming Hardware at CES 2026 | https://www.techpowerup.com/344705/cougar-unveils-the-evolution-of-gaming-hardware-at-ces-2026 |
| 2026-01-05T15:54:29+00:00 | Logitechが中国でG304 X Lightspeedゲーミングマウスを発表 | Logitech Launches G304 X Lightspeed Gaming Mouse in China | https://www.techpowerup.com/344703/logitech-launches-g304-x-lightspeed-gaming-mouse-in-china |
| 2026-01-05T15:39:17+00:00 | 電話認証が終了したため、WindowsとOfficeはMicrosoftアカウントでのサインインが必須に | Windows and Office Now Require Microsoft Account Sign-In as Phone Activation Ends | https://www.techpowerup.com/344704/windows-and-office-now-require-microsoft-account-sign-in-as-phone-activation-ends |
| 2026-01-05T15:14:41+00:00 | THX Spatial AudioとAIヘッドトラッキング技術が、ヘッドフォン、サウンドバー、ラップトップで展示された | THX Spatial Audio and AI Head Tracking for Headphones, Soundbars and Laptops Showcased | https://www.techpowerup.com/344702/thx-spatial-audio-and-ai-head-tracking-for-headphones-soundbars-and-laptops-showcased |
| 2026-01-05T15:06:01+00:00 | Code Vein IIの開発者がNPCコンパニオンシステムと拡大されたキャラクター陣について語る | Code Vein II Devs Discuss NPC Companion System & Larger Roster of Characters | https://www.techpowerup.com/344701/code-vein-ii-devs-discuss-npc-companion-system-larger-roster-of-characters |
| EETimes Taiwan | |||
| 2026-01-05 | AI推論領域の拡大:NvidiaがGroqの技術とチームを統合 | 擴展AI推論版圖 Nvidia整合Groq技術與團隊 | https://www.eettaiwan.com/20260105nt01-groq-nvidia-s-20-billion-bet-on-ai-inference/ |
| 2026-01-05 | 6Gが目前に 業者は早期の準備を | 6G近在眼前 業者應及早做好準備 | https://www.eettaiwan.com/20260105nt11-operators-should-prepare-for-6g-commercialization-as-early-as-possible/ |
| 2026-01-05 | CES 2026:AI運用の実現、SDVおよびエッジAI生態系が三大主軸に | CES 2026:AI運算落地、SDV與邊緣AI生態系成三大主軸 | https://www.eettaiwan.com/20260105nt21-ces-2026-s-three-main-themes/ |
| EETimes Asia | |||
| 2026-01-05 | チップレット:自動車先進電子技術へのコスト効率の高い近道 | Chiplets: A Cost-Effective Shortcut to Automotive Advanced Electronics | https://www.eetasia.com/embeddedblog-chiplets-a-cost-effective-shortcut-to-automotive-advanced-electronics/ |
| 2026-01-05 | SMT制約を克服:頑強なスルーホールコネクタソリューション | Bridging SMT Constraints: Robust Through-Hole Connector Solutions | https://www.eetasia.com/embeddedblog-bridging-smt-constraints-robust-through-hole-connector-solutions/ |
| 2026-01-05 | 2025年に回復へ向かうグローバルスマートウォッチ市場 | Global Smartwatch Market Set to Rebound in 2025 | https://www.eetasia.com/global-smartwatch-market-set-to-rebound-in-2025/ |
| 2026-01-05 | Portwell、Wincommの41%株式を取得し医療・ヘルスケアおよび産業市場での存在感を強化 | Portwell Acquires 41% Stake in Wincomm to Strengthen Presence in Medical/Healthcare, Industrial Markets | https://www.eetasia.com/portwell-acquires-41-stake-in-wincomm-to-strengthen-presence-in-medical-healthcare-industrial-markets/ |
| 2026-01-05 | MOKOSMARTとSilicon Labsがコールドチェーン監視を革命化 | MOKOSMART and Silicon Labs Revolutionize Cold Chain Monitoring | https://www.eetasia.com/mokosmart-and-silicon-labs-revolutionize-cold-chain-monitoring/ |
| 2026-01-05 | 次世代UFS規格にAIサポートが追加へ | Next UFS Standard to Include Support for AI | https://www.eetasia.com/next-ufs-standard-to-include-support-for-ai/ |
| EETimes India | |||
| 2026-01-05 | Mouser Electronics、Telit Cinterionとのグローバル流通契約を締結 | Mouser Electronics Inks Global Distribution Agreement with Telit Cinterion | https://www.eetindia.co.in/mouser-electronics-inks-global-distribution-agreement-with-telit-cinterion/ |
| 2026-01-05 | AdvantechとDEEPX、AIアクセラレーション技術で提携 | Advantech and DEEPX Partners on AI Acceleration Tech | https://www.eetindia.co.in/advantech-and-deepx-partners-on-ai-acceleration-tech/ |
| 2026-01-05 | インドの半導体市場が急成長:新たな潮流がファブを超えて広がる | India’s Semiconductor Takeoff: How the New Wave is Rising Beyond Fabs | https://www.eetindia.co.in/indias-semiconductor-takeoff-how-the-new-wave-is-rising-beyond-fabs/ |
| ZDNET Korea | |||
| 2026-01-06 | SKオン‐SKイノ、火災リスクのないバッテリーでESS市場に挑む | SK온-SK이노, 화재 위험 없는 배터리로 ESS 시장 공략 | https://www.zdnet.co.kr/20260106085602” title=” |
| 2026-01-06 | SKハイニクス、CESでHBM4 16段を初公開 | SK하이닉스, CES서 HBM4 16단 첫 공개 | https://www.zdnet.co.kr/20260106085759” title=” |
| 2026-01-06 | K-ヒューマノイド連合、CESグローバルステージへ出撃 | K-휴머노이드 연합, CES 글로벌 무대 출정 | https://www.zdnet.co.kr/20260106085459” title=” |
| 2026-01-06 | 米、航空会社などにおける『消費者保護違反』の責任を軽減 | 美, 항공사 등에 ‘소비자 보호 위반’ 책임 낮춘다 | https://www.zdnet.co.kr/20260106085218” title=” |
| 2026-01-06 | 電子顕微鏡にAIを搭載、軟質物質のナノ構造観察・予測も『チョッチョッ』 | 전자현미경에 AI붙이니…연성물질 나노구조 관찰·예측도 “척척” | https://www.zdnet.co.kr/20260106085703” title=” |
| 2026-01-06 | カリー、ファッション・ビューティ部門で二桁採用を実施 | 컬리, 패션·뷰티 두 자릿수 채용 진행 | https://www.zdnet.co.kr/20260106085356” title=” |
| 2026-01-06 | 家から道路へ…LG電子、AI空間を拡大 | 집에서 도로로…LG전자, AI 공간 넓힌다 | https://www.zdnet.co.kr/20260106082704” title=” |
| 2026-01-06 | 現代自動車『ロボット年3万台生産』の意味は…ヒューマノイド商業化始動 | 현대차 ‘로봇 연 3만대 생산’ 의미는…휴머노이드 상업화 시동 | https://www.zdnet.co.kr/20260106081420” title=” |
| 2026-01-06 | チームスパルタ『B2B AI教育』、昨年売上が前年の2.5倍↑ | 팀스파르타 ‘B2B AI 교육’ 작년 매출, 전년보다 2.5배↑ | https://www.zdnet.co.kr/20260106083554” title=” |
| 2026-01-06 | LGイノテック、自動運転・EV市場を攻略するための革新ソリューションを大々的に公開 | LG이노텍, 자율주행·EV 시장 공략할 혁신 솔루션 대거 공개 | https://www.zdnet.co.kr/20260106014740” title=” |
| 2026-01-06 | エヌビディア、次世代AI GPU『ルビン』を公開 | 엔비디아, 차세대 AI GPU ‘루빈’ 공개 | https://www.zdnet.co.kr/20260106080153” title=” |
| 2026-01-06 | サムスン電子、今月末に高性能AI PC『ギャラクシーブック6』を発売 | 삼성전자, 이달 말 고성능 AI PC ‘갤럭시북6’ 출시 | https://www.zdnet.co.kr/20260105195401” title=” |
| 2026-01-06 | 新年、より明るくなるOLED…サムスン・LG、4500ニットの壁を突破 | 새해 더 밝아지는 OLED…삼성·LG, 4500 니트 벽 ‘돌파’ | https://www.zdnet.co.kr/20260106072005” title=” |
| 2026-01-06 | ヒュンダイ自動車グループ、2028年までに年間3万台のロボット大量生産体制を構築 | 현대차그룹, 2028년까지 연 3만대 로봇 양산 체계 구축 | https://www.zdnet.co.kr/20260106070651” title=” |
| 2026-01-06 | LGディスプレイ、ヒューマノイド用OLED初登場…AIロボット時代の準備 | LG디스플레이, 휴머노이드용 OLED 첫선…AI 로봇 시대 준비 | https://www.zdnet.co.kr/20260106052828” title=” |
| 2026-01-06 | クアルコム、低価格AI PC向け『スナップドラゴン X2 プラス』SoCを公開 | 퀄컴, 보급형 AI PC용 ‘스냅드래곤 X2 플러스’ SoC 공개 | https://www.zdnet.co.kr/20260106051400” title=” |
| 2026-01-06 | 作って終わりではない…レゴがCESで披露した『次世代のおもちゃ』 | 만들고 끝이 아니다…레고가 CES서 꺼낸 ‘차세대 장난감’ | https://www.zdnet.co.kr/20260106044114” title=” |
| 2026-01-06 | 「家に入ってきたロボット」…LGクロイド、CESステージに登場 | “집으로 들어온 로봇”…LG 클로이드, CES 무대 등장 | https://www.zdnet.co.kr/20260106024318” title=” |
| 中央日報 | |||
| 2026-01-06 | イ・ヘフン、6年で財産が113億ウォン増加…未上場株式で99億ウォン保有も | 이혜훈 6년 새 재산 113억 늘어나…비상장 주식 99억 보유도 | https://www.joongang.co.kr/article/25395378 |
| 2026-01-06 | [イ・ジェスンのパースペクティブ] 『文明の衝突』シーズン2…西洋の価値が試されることとなった | [이재승의 퍼스펙티브] ‘문명의 충돌’ 시즌2…서구의 가치가 시험대 올랐다 | https://www.joongang.co.kr/article/25395346 |
| 2026-01-06 | [シロン] 荒唐無稽なヨンイン半導体工場の『セマングム移転論』 | [시론] 황당한 용인 반도체 공장의 ‘새만금 이전론’ | https://www.joongang.co.kr/article/25395344 |
| 2026-01-06 | 4400度を突破、天井知らずのコスピ | 4400도 뚫었다, 천장 없는 코스피 | https://www.joongang.co.kr/article/25395331 |
| 2026-01-06 | 中国『資源の武器化』が本格化…輸出管理違反に対する罰則が72%急増 | 중국 ‘자원 무기화’ 본격화…수출통제 위반 처벌 72% 급증 | https://www.joongang.co.kr/article/25395329 |
| 2026-01-05 | 日本国債金利、27年ぶりの最高水準…円安と財政懸念の中で日本首相が「大胆な投資」を呼びかける | 日국채금리 27년만 최고…엔저·재정 우려 속 日총리 “대담한 투자” | https://www.joongang.co.kr/article/25395291 |
| BAIDU | |||
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