TOC
Main News
- U.S. Approval of TSMC’s Equipment Exports to China, a Shift in Strategy?
The U.S. government has approved TSMC’s exports of semiconductor manufacturing equipment to its Chinese factories. This may reflect a shift in U.S. strategy to allow manufacturing to continue under certain conditions. The slight modification from the previous strict across-the-board restrictions to a more administrative approach means that TSMC will continue to operate in the delicate balance between the U.S. and China while maintaining a presence in the Chinese market. - Intel and Samsung Struggle with 2nm Yield, TSMC in Solo Position
Intel and Samsung Electronics are developing 2nm GAA (Gate-All-Around) technology, but the low yield has not been resolved. Therefore, TSMC, with its stable mass production technology, is expected to be the only 2nm chip supplier for external customers for the time being. The technology gap may further increase the dependence on TSMC by major customers, and the company may continue to be the sole supplier in the leading-edge process market. - Memory Shortage to Continue in 2026 Due to AI Demand, ASUS to Suspend Smartphone Launches
Memory shortages are expected to continue throughout 2026 due to explosive demand for AI servers. The resulting cost increases are directly impacting end products, and ASUS has indicated that it plans to suspend the launch of new smartphones in 2026. Although the company has stated that it will maintain its mobile business, rising component prices and supply difficulties are beginning to seriously impact the hardware maker’s product roadmap. - Samsung Leads Testing with Broadcom on HBM4 to Gain Advantage
Samsung Electronics has reportedly led Broadcom’s system-level testing on its next-generation memory HBM4 to gain an advantage in the AI memory race. After customer validation, the company aims to begin mass production in 2026.SK Hynix had been ahead in this market, but Samsung is trying to reel in its technological prowess, and with the announcement of 7200Mbps DDR5 samples, the company is stepping up its offensive to regain memory supremacy. - Reorganization accelerates in China’s semiconductor industry; Hua Hong integrates H uali Micro
Reorganization is accelerating in China’s semiconductor industry, following SMIC’s move, Hua Hong Semiconductor (Hua Hong) has acquired approximately 97.5% of Huali Micro Electronics (Huali Micro), an affiliate, and is proceeding with integration. From a state in which numerous companies are in disarray, national policy is to concentrate resources and increase the efficiency of manufacturing capacity and technology development in order to build a strong domestic supply chain capable of resisting U.S. sanctions. - Baidu-owned Kunlunxin and Other Chinese AI Chip Firms to IPO in Hong Kong
Baidu’s AI chip division Kunlunxin has filed confidentially for an IPO in Hong Kong. GPU maker Biren Technology and memory giant CXMT are also accelerating their efforts to list. As U.S. export restrictions make it more difficult to raise funds from outside sources, Chinese companies are taking advantage of the Hong Kong and mainland stock markets to secure huge amounts of capital and are poised to finance R&D and capital expenditures on their own. - OpenAI Changes Hardware Order from Chinese Firm to Foxconn
OpenAI has reportedly moved its first AI hardware manufacturing order from China’s Luxshare (立訊精密) to Taiwan’s Foxconn. The move is seen as aimed at avoiding geopolitical risks associated with the escalation of the U.S.-China confrontation, and is a concrete manifestation of the “derisking” trend of choosing partners with lower security risks by reducing dependence on mainland Chinese supply chains for core AI technology. - Micron, SanDisk in battle over PSMC factory capacity
Micron and SanDisk are in a battle over securing production capacity at Taiwanese foundry PSMC’s Tong Luo factory. The company is urgently required to secure the existing production line and immediately increase production capacity. Since it takes time to build new factories, the current situation reflects the intensifying competition to acquire existing facilities. - China’s Industrial Competitiveness Surpasses Korea in Smart Cars and Semiconductors
According to a report by the Korea Industry Research Institute, China’s competitiveness has already surpassed that of Korea in key industries such as smart cars, robots, and semiconductors, according to an analysis. In particular, Chinese companies are making remarkable strides not only in price competitiveness but also in technological capabilities, threatening the export industry, which is the backbone of the Korean economy. A sense of crisis is growing within the ROK regarding economic growth, and national measures are urgently needed. - Samsung SDS to Invest 427.3 Billion Won to Build AI Data Center
Samsung SDS has decided to invest 427.3 billion won to build an AI data center in Gumi, Gyeongsangbuk-do. The facility will be dedicated to high-performance computing (HPC) and will strengthen the foundation for AI cloud services. Samsung is also pursuing a land deal to build a semiconductor mega cluster in Yongin, and is strongly promoting the vertical integration of AI infrastructure from manufacturing to data center operations.
News List
| 投稿日 | 日本語タイトル | 原語タイトル | 記事URL |
|---|---|---|---|
| DIGITIMES | |||
| Jan 2, 12:24 | 中国向けTSMC装置輸出の米国承認、戦略転換を反映 | US approval of TSMC equipment exports to China reflects strategy shift | https://www.digitimes.com/news/a20260102PD228/equipment-tsmc-government-wafer-production.html |
| Jan 2, 16:11 | BaiduのAIチップ部門『崑崙芯』が香港でIPO申請を内密に実施 | Baidu’s AI chip unit Kunlunxin confidentially files for Hong Kong IPO | https://www.digitimes.com/news/a20260102VL204/baidu-ai-chip-ipo-chips-self-sufficiency.html |
| Jan 2, 12:12 | サムスン、土地取引を締結か―龍仁半導体複合施設建設への道を開く | Samsung reportedly seals land deal, paving way for Yongin semiconductor complex | https://www.digitimes.com/news/a20260102PD217/samsung-manufacturing-infrastructure-production-materials.html |
| Jan 2, 11:09 | SanDiskとMicron、PSMCのトンルオ工場の生産能力を争う | SanDisk, Micron vie for PSMC’s Tongluo fab capacity | https://www.digitimes.com/news/a20260102PD205/micron-psmc-capacity-sandisk-production.html |
| Jan 2, 09:00 | Intelとサムスン、2nm GAA技術を進展させるも歩留まり格差でTSMCが唯一の外部供給元に | Intel and Samsung advance 2nm GAA, but yield gaps leave TSMC as the sole external supplier | https://www.digitimes.com/news/a20260102PD207/tsmc-2nm-intel-samsung-gaa.html |
| Jan 2, 17:19 | AIサーバー需要急増に伴い、2026年までメモリ不足が続く見通し | Memory shortages to persist through 2026 as AI server demand surges | https://www.digitimes.com/news/a20260102PD222/dram-capacity-growth-ddr4-ddr5-demand-2026.html |
| Jan 2, 17:13 | ASUS、2026年に新スマホ発売を一時停止しモバイル事業は継続 | Asus to pause new smartphone launches in 2026, maintain mobile operations | https://www.digitimes.com/news/a20260102PD236/smartphone-asus-taiwan-mobile-market.html |
| Jan 2, 16:59 | IC基板およびネットワークPCBは成長する一方、材料と装置は不足に直面 | IC substrates and networking PCBs grow; materials and equipment face shortages | https://www.digitimes.com/news/a20260102PD223/ic-substrate-pcb-equipment-supply-chain-taiwan.html |
| Jan 2, 15:05 | CXMT、DRAM価格の反発で初の年間黒字を計上 | CXMT logs first annual profit on DRAM price rebound | https://www.digitimes.com/news/a20260102PD220/dram-cxmt-2025-profit-price.html |
| Jan 2, 14:48 | サムスン、Broadcomのシステムレベルテストを主導したと報じられた後、AIメモリ競争で優位に立つ | Samsung gains edge in AI memory race after reportedly leading Broadcom system-level tests | https://www.digitimes.com/news/a20251231VL202/samsung-broadcom-hbm4-hbm-google.html |
| Jan 2, 12:31 | ベトナム、インテルに半導体バックエンド能力の強化を促す | Vietnam urges Intel to boost semiconductor backend capacity | https://www.digitimes.com/news/a20260102PD209/intel-packaging-testing-supply-chain-government.html |
| Jan 2, 12:20 | 中国のCXMT、世界DRAM市場シェアが4%に迫る中、IPOに向け動き出す | China’s CXMT moves toward IPO with global DRAM share nearing 4% | https://www.digitimes.com/news/a20260102PD221/dram-cxmt-ipo-capacity-market.html |
| Jan 2, 11:28 | サムスン、7,200Mbps DDR5サンプルを発表―SKハイニックスやCXMTとの競争激化 | Samsung rolls out 7,200Mbps DDR5 samples as SK Hynix, CXMT intensify competition | https://www.digitimes.com/news/a20260101PD201/samsung-ddr5-sk-hynix-cxmt-dram.html |
| Jan 2, 11:17 | サムスン、顧客検証を経て2026年にHBM4の量産を目指す | Samsung aims for 2026 HBM4 mass production after customer validation | https://www.digitimes.com/news/a20260102VL202/samsung-production-2026-hbm4-chips.html |
| Jan 2, 11:14 | メモリの供給遅延拡大に伴い、スマートフォンとノートパソコンの価格上昇の可能性 | Smartphones and notebook prices could increase as memory lead times extend | https://www.digitimes.com/news/a20260102PD226/hbm-production-capacity-demand-cost.html |
| Jan 2, 11:05 | 韓国の半導体法案、他国の現金補助策展開により競争力低下のリスクを孕む | South Korea’s semiconductor bill risks weakening competitiveness as rivals roll out cash subsidies | https://www.digitimes.com/news/a20260102PD206/south-korea-subsidies-dram-equipment-2026.html |
| 日経 Tech Foresight | |||
| マイナビニュース テックプラス | |||
| TrendForce | |||
| 2026-01-02 | 決算説明会プレビュー:TSMCの2nmに注目 — 生産能力、売上貢献など | Earnings Call Preview: TSMC 2nm in Focus — Capacity, Sales Contribution, and More | https://www.trendforce.com/news/2026/01/02/news-earnings-call-preview-tsmc-2nm-mass-production-in-focus-capacity-sales-contribution-and-more/ |
| 2026-01-02 | 中国のAIチップメーカー、百度の昆侖心提出を受け香港IPOを加速、Birenが58億香港ドル上場 | China AI Chipmakers Step Up Hong Kong IPO with Baidu Kunlunxin Filing, Biren HK$5.58B Listing | https://www.trendforce.com/news/2026/01/02/news-china-ai-chipmakers-step-up-hong-kong-ipo-with-baidu-kunlunxin-filing-biren-hk5-58b-listing/ |
| 2026-01-02 | 報道によると、OpenAIが初のAIハードウェア注文を中国のLuxshareからFoxconnへ移管 | OpenAI Reportedly Shifts First AI Hardware Order from China’s Luxshare to Foxconn | https://www.trendforce.com/news/2026/01/02/news-openai-reportedly-shifts-first-ai-hardware-order-from-chinas-luxshare-to-foxconn/ |
| 2026-01-02 | 中国の半導体再編が加速:SMICの先行措置に続き、華虹が華力の97.5%を取得 | China’s Chip Consolidation Heats Up: Hua Hong Acquires 97.5% of Huali, Following SMIC’s Earlier Move | https://www.trendforce.com/news/2026/01/02/news-chinas-chip-consolidation-heats-up-hua-hong-acquires-97-5-of-huali-following-smics-earlier-move/ |
| 2026-01-02 | 中国の半導体研究、メモリおよびIC設計で複数のブレイクスルーを達成 | Chinese Semiconductor Research Achieves Multiple Breakthroughs in Memory and IC Design | https://www.trendforce.com/news/2026/01/02/news-chinese-semiconductor-research-achieves-multiple-breakthroughs-in-memory-and-ic-design/ |
| Semiconductor Digest | |||
| 日本経済新聞 | |||
| 2026-01-03 | 米国株の2026年、ダウ319ドル高で幕開け AI期待は経験則打破なるか | https://www.nikkei.com/article/DGXZQOGN021L40S6A100C2000000/ | |
| 2026-01-03 | 米国株、ダウ反発し319ドル高 景気敏感株などを中心に買い直し ナスダックは続落 | https://www.nikkei.com/article/DGXZQOFL0300F0T00C26A1000000/ | |
| 2026-01-03 | NYダウ、5営業日ぶりに反発し319ドル高 主力株を買い直す動き | https://www.nikkei.com/article/DGXZQOFL0301C0T00C26A1000000/ | |
| 2026-01-03 | 米国株15時、ダウ反発 主力株を買い直す動き | https://www.nikkei.com/article/DGXZQOFL021JQ0S6A100C2000000/ | |
| 2026-01-03 | 三井化学など、石化再編の実行局面へ トップが描く26年の戦略 | https://www.nikkei.com/article/DGXZQOUC23AZT0T21C25A2000000/ | |
| 2026-01-03 | 2026年の日経平均、市場予想は5万3000〜6万1000円 成長期待に濃淡 | https://www.nikkei.com/article/DGXZQOUB267W80W5A221C2000000/ | |
| 2026-01-03 | 自動車部品、トランプ関税の価格転嫁4割どまり 交渉力弱く苦境に | https://www.nikkei.com/article/DGXZQOUC2035H0Q5A221C2000000/ | |
| 2026-01-03 | 空売り王チェイノス氏、米国株は強欲局面 「利益なき3番手銘柄に問題」 | https://www.nikkei.com/article/DGXZQOGN272RT0X21C25A2000000/ | |
| 2026-01-03 | テスラ、EV販売9%減で首位陥落 ヒト型ロボット量産も中国猛追 | https://www.nikkei.com/article/DGXZQOGN293970Z21C25A2000000/ | |
| 2026-01-03 | ドイツ株2日 続伸、約3カ月ぶり高値 仏株も上昇 | https://www.nikkei.com/article/DGXZQOFL021ED0S6A100C2000000/ | |
| ダイヤモンドオンライン | |||
| Jan 1 19:45 | 大和ハウスの「次なる買収ターゲット」はどこなのか?芳井会長が語る、住友電設をTOBした真の狙いと“その先” | https://diamond.jp/articles/-/377871 | |
| Dec 31 23:30 | ただのリアクション芸じゃない!出川哲朗の「ヤバいよ、ヤバいよ」は逆境をチャンスに変える最強技術だった | https://diamond.jp/articles/-/380309 | |
| Dec 31 19:50 | 【主要24業種の天気予報2026】銀行、商社、自動車、半導体、コンビニ…「業績」「トランプ政権の影響」「中国事業」「業界再編」どうなる? | https://diamond.jp/articles/-/377869 | |
| Dec 31 19:45 | 【26年の日本の景気】専門家10人が詳細予測!インフレ・賃上げ・金利…チャンスとリスクを総点検 | https://diamond.jp/articles/-/379865 | |
| Dec 31 19:40 | 26年の「無難な経済予測」の裏に潜む“不穏”要因、勝機とリスクを踏まえて描く投資スタンス | https://diamond.jp/articles/-/380563 | |
| Tom’s Hardware | |||
| 2026-01-02 22:50 | 以前リコールされたBambu Lab 3Dプリンターに再び火災の危険性が報告され、新たに電源基板部品の問題が原因と特定される | Reports of the previously-recalled Bambu Lab 3D printer being a fire hazard resurface, new power board component issue identified as the cause | https://www.tomshardware.com/3d-printing/reports-of-the-bambu-lab-3d-printer-being-a-fire-hazard-resurface-but-for-a-new-power-board-component-issue-bambu-says-the-a1s-new-issue-has-been-addressed-affected-units-replaced-or-repaired |
| 2026-01-02 22:46 | LG、世界最軽量の17インチRTXラップトップを発売へ | LG says it’s launching the world’s lightest 17-inch RTX laptop | https://www.tomshardware.com/laptops/ultrabooks-ultraportables/lg-says-that-its-launching-the-worlds-lightest-17-inch-rtx-laptop-also-announces-16-inch-ultra-portable-laptop-with-dual-ai-functionality |
| 2026-01-02 21:40 | 最新のSteamハードウェア調査でAMDがIntelに迫る | AMD closes in on Intel in latest Steam Hardware Survey | https://www.tomshardware.com/video-games/pc-gaming/amd-closes-in-on-intel-in-latest-steam-hardware-survey-ram-capacity-continues-to-rise-despite-the-ongoing-memory-crunch |
| 2026-01-02 21:00 | 開発者、Claude AIを利用して『動作するNESエミュレーター』を作成 | Dev uses Claude AI to write a ‘functional NES emulator’ | https://www.tomshardware.com/video-games/retro-gaming/dev-uses-claude-ai-to-write-a-functional-nes-emulator-you-can-test-it-now-playing-donkey-kong-in-your-browser |
| 2026-01-02 04:49 | 検索結果:中国、台湾統一を呼びかける | Search result: China calls Taiwan reunification | https://www.tomshardware.com/tech-industry/semiconductors/chinas-president-xi-jinping-calls-taiwan-reunification-unstoppable-military-drills-around-the-island-escalate-in-area-and-deployments |
| 2026-01-02 01:59 | 2025年、アメリカ人はBitcoin ATM詐欺で3億3300万ドルを失った | Americans lost $333 million to Bitcoin ATM fraud in 2025 | https://www.tomshardware.com/tech-industry/cryptocurrency/americans-lost-usd333-million-to-bitcoin-atm-fraud-in-2025-fbi-says-there-is-a-clear-and-constant-rise-of-this-scam-and-that-it-is-not-slowing-down |
| TechPowerup | |||
| 2026-01-02T18:32:36+00:00 | NVIDIA GeForce NOW、1月に新たに14本のゲームを追加 | NVIDIA GeForce NOW Gets 14 New Games in January | https://www.techpowerup.com/344628/nvidia-geforce-now-gets-14-new-games-in-january |
| 2026-01-02T15:59:54+00:00 | YPlasma、CES 2026でDBDプラズマアクチュエーター搭載の無音ノートPCを初公開 | YPlasma to Debut Noiseless Laptop Cooled with DBD Plasma Actuators at CES 2026 | https://www.techpowerup.com/344626/yplasma-to-debut-noiseless-laptop-cooled-with-dbd-plasma-actuators-at-ces-2026 |
| 2026-01-02T15:24:09+00:00 | 全てのAIサブスクリプションを1つの生涯ツールで置き換えよう | Replace All of Your AI Subscriptions with a Single Lifetime Tool | https://www.techpowerup.com/344501/replace-all-of-your-ai-subscriptions-with-a-single-lifetime-tool |
| EETimes Taiwan | |||
| 2026-01-02 | DRAMがAI需要に追いつけない | DRAM追不上AI需求 | https://www.eettaiwan.com/20260102nt61-dram-cannot-keep-up-with-ai-demand/ |
| 2026-01-02 | 3つの重要な関門を突破する必要があり、銅に代わるアルミニウムの流行が期待される | 須跨越三道關鍵門檻 鋁代銅趨勢可望萌芽 | https://www.eettaiwan.com/20260102nt61-the-trend-of-replacing-copper-with-aluminum-is-expected-to-emerge/ |
| 2026-01-02 | CES 2026がAIの実用化を検証、テック系スタートアップがサプライチェーンと共に登場 | CES 2026驗證AI落地 科技新創攜手供應鏈登場 | https://www.eettaiwan.com/20250102nt11-ces-2026-puts-taiwans-ai-into-practice-as-startups-join-supply-chains/ |
| 2026-01-02 | エージェント型AIがサイバー攻撃の規模拡大と自動化を助長する | 代理式AI助長網路攻擊規模與自動化 | https://www.eettaiwan.com/20260102nt21-agentic-ai-fuels-cyberattacks/ |
| EETimes Asia | |||
| 2026-01-02 | WBG半導体市場は2032年までに46億6,000万ドルの収益を創出する見通し | WBG Semiconductor Market to Generate $4.66B Revenue by 2032 | https://www.eetasia.com/wbg-semiconductor-market-to-generate-4-66b-revenue-by-2032/ |
| 2026-01-02 | MICROIP、NFCチップで初回合格を達成 | MICROIP Achieves First-Pass Success of NFC Chip | https://www.eetasia.com/microip-achieves-first-pass-success-of-nfc-chip/ |
| 2026-01-02 | MediaTekとDENSOがADAS用SoCの開発で協力 | MediaTek and DENSO Collaborate on ADAS SoCs | https://www.eetasia.com/mediatek-and-denso-collaborate-on-adas-socs/ |
| 2026-01-02 | 中国のEUVにおける躍進と、世界半導体産業の分断 | China’s EUV Moment and the Fracturing of the Global Chip Industry | https://www.eetasia.com/chinas-euv-moment-and-the-fracturing-of-the-global-chip-industry/ |
| EETimes India | |||
| ZDNET Korea | |||
| 2026-01-03 | チャバイオグループ「新年、AI融合生命科学企業へ飛躍」 | 차바이오그룹 “새해 AI 융합생명과학 기업 도약” | https://www.zdnet.co.kr/20260103081813” title=” |
| 2026-01-03 | アイオニックに環境配慮型素材が豊富な理由は、チョンウィソンのESG経営にあった | 아이오닉에 친환경 소재 가득한 이유…정의선의 ESG 경영에 있었다 | https://www.zdnet.co.kr/20260103012344” title=” |
| 2026-01-03 | 新年もモバイル革命は続く…5大製品に注目せよ | 새해도 모바일 혁명 계속…5대 제품 주목하라 | https://www.zdnet.co.kr/20260102221731” title=” |
| 2026-01-03 | ‘建国大学の起業エネルギーをグローバルな舞台へ’…CES 2026派遣団の発足式 | ‘건국대 창업 에너지를 글로벌 무대로’…CES 2026 파견단 발대식 | https://www.zdnet.co.kr/20260103080521” title=” |
| 2026-01-03 | エスネットグループ、2026年に組織改革を実施…エスネットシステムのキムヒョンウ社長を任命 | 에스넷그룹, 2026년 조직개편 단행…에스넷시스템 김형우 사장 선임 | https://www.zdnet.co.kr/20260102234709” title=” |
| 2026-01-03 | 低軌道衛星の衝突リスク…スターリンクは高度を半分の70kmに下げる | 저궤도 위성 충돌 위험…스타링크 절반 고도 70km 낮춘다 | https://www.zdnet.co.kr/20260103072824” title=” |
| 2026-01-02 | CES 2026 韓国参加企業853社…3位を維持 | CES 2026 韓 참가기업 853개…3위 유지 | https://www.zdnet.co.kr/20260102231245” title=” |
| 2026-01-02 | “eスポーツ発展功労”…『ペイカー』イサンヒョク、体育勲章 チョンリョンジャン受章 | “e스포츠 발전 공로”…’페이커’ 이상혁, 체육훈장 청룡장 수훈 | https://www.zdnet.co.kr/20260102201305” title=” |
| 2026-01-02 | “ソーラー独創性、99.99%”…アップステージ、データ公開で流用疑惑を否定 | “솔라 독창성, 99.99%”…업스테이지, 데이터 공개로 도용 의혹 반박 | https://www.zdnet.co.kr/20260102181257” title=” |
| 2026-01-02 | チェ・テウォン “韓国経済、このままだと5年後にマイナス成長” | 최태원 “韓 경제, 이대로 가면 5년 뒤 마이너스 성장” | https://www.zdnet.co.kr/20260102182034” title=” |
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