Semiconductor News 20260103

TOC

Main News

  1. U.S. Approval of TSMC’s Equipment Exports to China, a Shift in Strategy?
    The U.S. government has approved TSMC’s exports of semiconductor manufacturing equipment to its Chinese factories. This may reflect a shift in U.S. strategy to allow manufacturing to continue under certain conditions. The slight modification from the previous strict across-the-board restrictions to a more administrative approach means that TSMC will continue to operate in the delicate balance between the U.S. and China while maintaining a presence in the Chinese market.
  2. Intel and Samsung Struggle with 2nm Yield, TSMC in Solo Position
    Intel and Samsung Electronics are developing 2nm GAA (Gate-All-Around) technology, but the low yield has not been resolved. Therefore, TSMC, with its stable mass production technology, is expected to be the only 2nm chip supplier for external customers for the time being. The technology gap may further increase the dependence on TSMC by major customers, and the company may continue to be the sole supplier in the leading-edge process market.
  3. Memory Shortage to Continue in 2026 Due to AI Demand, ASUS to Suspend Smartphone Launches
    Memory shortages are expected to continue throughout 2026 due to explosive demand for AI servers. The resulting cost increases are directly impacting end products, and ASUS has indicated that it plans to suspend the launch of new smartphones in 2026. Although the company has stated that it will maintain its mobile business, rising component prices and supply difficulties are beginning to seriously impact the hardware maker’s product roadmap.
  4. Samsung Leads Testing with Broadcom on HBM4 to Gain Advantage
    Samsung Electronics has reportedly led Broadcom’s system-level testing on its next-generation memory HBM4 to gain an advantage in the AI memory race. After customer validation, the company aims to begin mass production in 2026.SK Hynix had been ahead in this market, but Samsung is trying to reel in its technological prowess, and with the announcement of 7200Mbps DDR5 samples, the company is stepping up its offensive to regain memory supremacy.
  5. Reorganization accelerates in China’s semiconductor industry; Hua Hong integrates H uali Micro
    Reorganization is accelerating in China’s semiconductor industry, following SMIC’s move, Hua Hong Semiconductor (Hua Hong) has acquired approximately 97.5% of Huali Micro Electronics (Huali Micro), an affiliate, and is proceeding with integration. From a state in which numerous companies are in disarray, national policy is to concentrate resources and increase the efficiency of manufacturing capacity and technology development in order to build a strong domestic supply chain capable of resisting U.S. sanctions.
  6. Baidu-owned Kunlunxin and Other Chinese AI Chip Firms to IPO in Hong Kong
    Baidu’s AI chip division Kunlunxin has filed confidentially for an IPO in Hong Kong. GPU maker Biren Technology and memory giant CXMT are also accelerating their efforts to list. As U.S. export restrictions make it more difficult to raise funds from outside sources, Chinese companies are taking advantage of the Hong Kong and mainland stock markets to secure huge amounts of capital and are poised to finance R&D and capital expenditures on their own.
  7. OpenAI Changes Hardware Order from Chinese Firm to Foxconn
    OpenAI has reportedly moved its first AI hardware manufacturing order from China’s Luxshare (立訊精密) to Taiwan’s Foxconn. The move is seen as aimed at avoiding geopolitical risks associated with the escalation of the U.S.-China confrontation, and is a concrete manifestation of the “derisking” trend of choosing partners with lower security risks by reducing dependence on mainland Chinese supply chains for core AI technology.
  8. Micron, SanDisk in battle over PSMC factory capacity
    Micron and SanDisk are in a battle over securing production capacity at Taiwanese foundry PSMC’s Tong Luo factory. The company is urgently required to secure the existing production line and immediately increase production capacity. Since it takes time to build new factories, the current situation reflects the intensifying competition to acquire existing facilities.
  9. China’s Industrial Competitiveness Surpasses Korea in Smart Cars and Semiconductors
    According to a report by the Korea Industry Research Institute, China’s competitiveness has already surpassed that of Korea in key industries such as smart cars, robots, and semiconductors, according to an analysis. In particular, Chinese companies are making remarkable strides not only in price competitiveness but also in technological capabilities, threatening the export industry, which is the backbone of the Korean economy. A sense of crisis is growing within the ROK regarding economic growth, and national measures are urgently needed.
  10. Samsung SDS to Invest 427.3 Billion Won to Build AI Data Center
    Samsung SDS has decided to invest 427.3 billion won to build an AI data center in Gumi, Gyeongsangbuk-do. The facility will be dedicated to high-performance computing (HPC) and will strengthen the foundation for AI cloud services. Samsung is also pursuing a land deal to build a semiconductor mega cluster in Yongin, and is strongly promoting the vertical integration of AI infrastructure from manufacturing to data center operations.

News List

投稿日日本語タイトル原語タイトル記事URL
DIGITIMES
Jan 2, 12:24中国向けTSMC装置輸出の米国承認、戦略転換を反映US approval of TSMC equipment exports to China reflects strategy shifthttps://www.digitimes.com/news/a20260102PD228/equipment-tsmc-government-wafer-production.html
Jan 2, 16:11BaiduのAIチップ部門『崑崙芯』が香港でIPO申請を内密に実施Baidu’s AI chip unit Kunlunxin confidentially files for Hong Kong IPOhttps://www.digitimes.com/news/a20260102VL204/baidu-ai-chip-ipo-chips-self-sufficiency.html
Jan 2, 12:12サムスン、土地取引を締結か―龍仁半導体複合施設建設への道を開くSamsung reportedly seals land deal, paving way for Yongin semiconductor complexhttps://www.digitimes.com/news/a20260102PD217/samsung-manufacturing-infrastructure-production-materials.html
Jan 2, 11:09SanDiskとMicron、PSMCのトンルオ工場の生産能力を争うSanDisk, Micron vie for PSMC’s Tongluo fab capacityhttps://www.digitimes.com/news/a20260102PD205/micron-psmc-capacity-sandisk-production.html
Jan 2, 09:00Intelとサムスン、2nm GAA技術を進展させるも歩留まり格差でTSMCが唯一の外部供給元にIntel and Samsung advance 2nm GAA, but yield gaps leave TSMC as the sole external supplierhttps://www.digitimes.com/news/a20260102PD207/tsmc-2nm-intel-samsung-gaa.html
Jan 2, 17:19AIサーバー需要急増に伴い、2026年までメモリ不足が続く見通しMemory shortages to persist through 2026 as AI server demand surgeshttps://www.digitimes.com/news/a20260102PD222/dram-capacity-growth-ddr4-ddr5-demand-2026.html
Jan 2, 17:13ASUS、2026年に新スマホ発売を一時停止しモバイル事業は継続Asus to pause new smartphone launches in 2026, maintain mobile operationshttps://www.digitimes.com/news/a20260102PD236/smartphone-asus-taiwan-mobile-market.html
Jan 2, 16:59IC基板およびネットワークPCBは成長する一方、材料と装置は不足に直面IC substrates and networking PCBs grow; materials and equipment face shortageshttps://www.digitimes.com/news/a20260102PD223/ic-substrate-pcb-equipment-supply-chain-taiwan.html
Jan 2, 15:05CXMT、DRAM価格の反発で初の年間黒字を計上CXMT logs first annual profit on DRAM price reboundhttps://www.digitimes.com/news/a20260102PD220/dram-cxmt-2025-profit-price.html
Jan 2, 14:48サムスン、Broadcomのシステムレベルテストを主導したと報じられた後、AIメモリ競争で優位に立つSamsung gains edge in AI memory race after reportedly leading Broadcom system-level testshttps://www.digitimes.com/news/a20251231VL202/samsung-broadcom-hbm4-hbm-google.html
Jan 2, 12:31ベトナム、インテルに半導体バックエンド能力の強化を促すVietnam urges Intel to boost semiconductor backend capacityhttps://www.digitimes.com/news/a20260102PD209/intel-packaging-testing-supply-chain-government.html
Jan 2, 12:20中国のCXMT、世界DRAM市場シェアが4%に迫る中、IPOに向け動き出すChina’s CXMT moves toward IPO with global DRAM share nearing 4%https://www.digitimes.com/news/a20260102PD221/dram-cxmt-ipo-capacity-market.html
Jan 2, 11:28サムスン、7,200Mbps DDR5サンプルを発表―SKハイニックスやCXMTとの競争激化Samsung rolls out 7,200Mbps DDR5 samples as SK Hynix, CXMT intensify competitionhttps://www.digitimes.com/news/a20260101PD201/samsung-ddr5-sk-hynix-cxmt-dram.html
Jan 2, 11:17サムスン、顧客検証を経て2026年にHBM4の量産を目指すSamsung aims for 2026 HBM4 mass production after customer validationhttps://www.digitimes.com/news/a20260102VL202/samsung-production-2026-hbm4-chips.html
Jan 2, 11:14メモリの供給遅延拡大に伴い、スマートフォンとノートパソコンの価格上昇の可能性Smartphones and notebook prices could increase as memory lead times extendhttps://www.digitimes.com/news/a20260102PD226/hbm-production-capacity-demand-cost.html
Jan 2, 11:05韓国の半導体法案、他国の現金補助策展開により競争力低下のリスクを孕むSouth Korea’s semiconductor bill risks weakening competitiveness as rivals roll out cash subsidieshttps://www.digitimes.com/news/a20260102PD206/south-korea-subsidies-dram-equipment-2026.html
日経 Tech Foresight
マイナビニュース テックプラス
TrendForce
2026-01-02決算説明会プレビュー:TSMCの2nmに注目 — 生産能力、売上貢献などEarnings Call Preview: TSMC 2nm in Focus — Capacity, Sales Contribution, and Morehttps://www.trendforce.com/news/2026/01/02/news-earnings-call-preview-tsmc-2nm-mass-production-in-focus-capacity-sales-contribution-and-more/
2026-01-02中国のAIチップメーカー、百度の昆侖心提出を受け香港IPOを加速、Birenが58億香港ドル上場China AI Chipmakers Step Up Hong Kong IPO with Baidu Kunlunxin Filing, Biren HK$5.58B Listinghttps://www.trendforce.com/news/2026/01/02/news-china-ai-chipmakers-step-up-hong-kong-ipo-with-baidu-kunlunxin-filing-biren-hk5-58b-listing/
2026-01-02報道によると、OpenAIが初のAIハードウェア注文を中国のLuxshareからFoxconnへ移管OpenAI Reportedly Shifts First AI Hardware Order from China’s Luxshare to Foxconnhttps://www.trendforce.com/news/2026/01/02/news-openai-reportedly-shifts-first-ai-hardware-order-from-chinas-luxshare-to-foxconn/
2026-01-02中国の半導体再編が加速:SMICの先行措置に続き、華虹が華力の97.5%を取得China’s Chip Consolidation Heats Up: Hua Hong Acquires 97.5% of Huali, Following SMIC’s Earlier Movehttps://www.trendforce.com/news/2026/01/02/news-chinas-chip-consolidation-heats-up-hua-hong-acquires-97-5-of-huali-following-smics-earlier-move/
2026-01-02中国の半導体研究、メモリおよびIC設計で複数のブレイクスルーを達成Chinese Semiconductor Research Achieves Multiple Breakthroughs in Memory and IC Designhttps://www.trendforce.com/news/2026/01/02/news-chinese-semiconductor-research-achieves-multiple-breakthroughs-in-memory-and-ic-design/
Semiconductor Digest
日本経済新聞
2026-01-03米国株の2026年、ダウ319ドル高で幕開け AI期待は経験則打破なるかhttps://www.nikkei.com/article/DGXZQOGN021L40S6A100C2000000/
2026-01-03米国株、ダウ反発し319ドル高 景気敏感株などを中心に買い直し ナスダックは続落https://www.nikkei.com/article/DGXZQOFL0300F0T00C26A1000000/
2026-01-03NYダウ、5営業日ぶりに反発し319ドル高 主力株を買い直す動きhttps://www.nikkei.com/article/DGXZQOFL0301C0T00C26A1000000/
2026-01-03米国株15時、ダウ反発 主力株を買い直す動きhttps://www.nikkei.com/article/DGXZQOFL021JQ0S6A100C2000000/
2026-01-03三井化学など、石化再編の実行局面へ トップが描く26年の戦略https://www.nikkei.com/article/DGXZQOUC23AZT0T21C25A2000000/
2026-01-032026年の日経平均、市場予想は5万3000〜6万1000円 成長期待に濃淡https://www.nikkei.com/article/DGXZQOUB267W80W5A221C2000000/
2026-01-03自動車部品、トランプ関税の価格転嫁4割どまり 交渉力弱く苦境にhttps://www.nikkei.com/article/DGXZQOUC2035H0Q5A221C2000000/
2026-01-03空売り王チェイノス氏、米国株は強欲局面 「利益なき3番手銘柄に問題」https://www.nikkei.com/article/DGXZQOGN272RT0X21C25A2000000/
2026-01-03テスラ、EV販売9%減で首位陥落 ヒト型ロボット量産も中国猛追https://www.nikkei.com/article/DGXZQOGN293970Z21C25A2000000/
2026-01-03ドイツ株2日 続伸、約3カ月ぶり高値 仏株も上昇https://www.nikkei.com/article/DGXZQOFL021ED0S6A100C2000000/
ダイヤモンドオンライン
Jan 1 19:45大和ハウスの「次なる買収ターゲット」はどこなのか?芳井会長が語る、住友電設をTOBした真の狙いと“その先”https://diamond.jp/articles/-/377871
Dec 31 23:30ただのリアクション芸じゃない!出川哲朗の「ヤバいよ、ヤバいよ」は逆境をチャンスに変える最強技術だったhttps://diamond.jp/articles/-/380309
Dec 31 19:50【主要24業種の天気予報2026】銀行、商社、自動車、半導体、コンビニ…「業績」「トランプ政権の影響」「中国事業」「業界再編」どうなる?https://diamond.jp/articles/-/377869
Dec 31 19:45【26年の日本の景気】専門家10人が詳細予測!インフレ・賃上げ・金利…チャンスとリスクを総点検https://diamond.jp/articles/-/379865
Dec 31 19:4026年の「無難な経済予測」の裏に潜む“不穏”要因、勝機とリスクを踏まえて描く投資スタンスhttps://diamond.jp/articles/-/380563
Tom’s Hardware
2026-01-02 22:50以前リコールされたBambu Lab 3Dプリンターに再び火災の危険性が報告され、新たに電源基板部品の問題が原因と特定されるReports of the previously-recalled Bambu Lab 3D printer being a fire hazard resurface, new power board component issue identified as the causehttps://www.tomshardware.com/3d-printing/reports-of-the-bambu-lab-3d-printer-being-a-fire-hazard-resurface-but-for-a-new-power-board-component-issue-bambu-says-the-a1s-new-issue-has-been-addressed-affected-units-replaced-or-repaired
2026-01-02 22:46LG、世界最軽量の17インチRTXラップトップを発売へLG says it’s launching the world’s lightest 17-inch RTX laptophttps://www.tomshardware.com/laptops/ultrabooks-ultraportables/lg-says-that-its-launching-the-worlds-lightest-17-inch-rtx-laptop-also-announces-16-inch-ultra-portable-laptop-with-dual-ai-functionality
2026-01-02 21:40最新のSteamハードウェア調査でAMDがIntelに迫るAMD closes in on Intel in latest Steam Hardware Surveyhttps://www.tomshardware.com/video-games/pc-gaming/amd-closes-in-on-intel-in-latest-steam-hardware-survey-ram-capacity-continues-to-rise-despite-the-ongoing-memory-crunch
2026-01-02 21:00開発者、Claude AIを利用して『動作するNESエミュレーター』を作成Dev uses Claude AI to write a ‘functional NES emulator’https://www.tomshardware.com/video-games/retro-gaming/dev-uses-claude-ai-to-write-a-functional-nes-emulator-you-can-test-it-now-playing-donkey-kong-in-your-browser
2026-01-02 04:49検索結果:中国、台湾統一を呼びかけるSearch result: China calls Taiwan reunificationhttps://www.tomshardware.com/tech-industry/semiconductors/chinas-president-xi-jinping-calls-taiwan-reunification-unstoppable-military-drills-around-the-island-escalate-in-area-and-deployments
2026-01-02 01:592025年、アメリカ人はBitcoin ATM詐欺で3億3300万ドルを失ったAmericans lost $333 million to Bitcoin ATM fraud in 2025https://www.tomshardware.com/tech-industry/cryptocurrency/americans-lost-usd333-million-to-bitcoin-atm-fraud-in-2025-fbi-says-there-is-a-clear-and-constant-rise-of-this-scam-and-that-it-is-not-slowing-down
TechPowerup
2026-01-02T18:32:36+00:00NVIDIA GeForce NOW、1月に新たに14本のゲームを追加NVIDIA GeForce NOW Gets 14 New Games in Januaryhttps://www.techpowerup.com/344628/nvidia-geforce-now-gets-14-new-games-in-january
2026-01-02T15:59:54+00:00YPlasma、CES 2026でDBDプラズマアクチュエーター搭載の無音ノートPCを初公開YPlasma to Debut Noiseless Laptop Cooled with DBD Plasma Actuators at CES 2026https://www.techpowerup.com/344626/yplasma-to-debut-noiseless-laptop-cooled-with-dbd-plasma-actuators-at-ces-2026
2026-01-02T15:24:09+00:00全てのAIサブスクリプションを1つの生涯ツールで置き換えようReplace All of Your AI Subscriptions with a Single Lifetime Toolhttps://www.techpowerup.com/344501/replace-all-of-your-ai-subscriptions-with-a-single-lifetime-tool
EETimes Taiwan
2026-01-02DRAMがAI需要に追いつけないDRAM追不上AI需求https://www.eettaiwan.com/20260102nt61-dram-cannot-keep-up-with-ai-demand/
2026-01-023つの重要な関門を突破する必要があり、銅に代わるアルミニウムの流行が期待される須跨越三道關鍵門檻 鋁代銅趨勢可望萌芽https://www.eettaiwan.com/20260102nt61-the-trend-of-replacing-copper-with-aluminum-is-expected-to-emerge/
2026-01-02CES 2026がAIの実用化を検証、テック系スタートアップがサプライチェーンと共に登場CES 2026驗證AI落地 科技新創攜手供應鏈登場https://www.eettaiwan.com/20250102nt11-ces-2026-puts-taiwans-ai-into-practice-as-startups-join-supply-chains/
2026-01-02エージェント型AIがサイバー攻撃の規模拡大と自動化を助長する代理式AI助長網路攻擊規模與自動化https://www.eettaiwan.com/20260102nt21-agentic-ai-fuels-cyberattacks/
EETimes Asia
2026-01-02WBG半導体市場は2032年までに46億6,000万ドルの収益を創出する見通しWBG Semiconductor Market to Generate $4.66B Revenue by 2032https://www.eetasia.com/wbg-semiconductor-market-to-generate-4-66b-revenue-by-2032/
2026-01-02MICROIP、NFCチップで初回合格を達成MICROIP Achieves First-Pass Success of NFC Chiphttps://www.eetasia.com/microip-achieves-first-pass-success-of-nfc-chip/
2026-01-02MediaTekとDENSOがADAS用SoCの開発で協力MediaTek and DENSO Collaborate on ADAS SoCshttps://www.eetasia.com/mediatek-and-denso-collaborate-on-adas-socs/
2026-01-02中国のEUVにおける躍進と、世界半導体産業の分断China’s EUV Moment and the Fracturing of the Global Chip Industryhttps://www.eetasia.com/chinas-euv-moment-and-the-fracturing-of-the-global-chip-industry/
EETimes India
ZDNET Korea
2026-01-03チャバイオグループ「新年、AI融合生命科学企業へ飛躍」차바이오그룹 “새해 AI 융합생명과학 기업 도약”https://www.zdnet.co.kr/20260103081813” title=”
2026-01-03アイオニックに環境配慮型素材が豊富な理由は、チョンウィソンのESG経営にあった아이오닉에 친환경 소재 가득한 이유…정의선의 ESG 경영에 있었다https://www.zdnet.co.kr/20260103012344” title=”
2026-01-03新年もモバイル革命は続く…5大製品に注目せよ새해도 모바일 혁명 계속…5대 제품 주목하라https://www.zdnet.co.kr/20260102221731” title=”
2026-01-03‘建国大学の起業エネルギーをグローバルな舞台へ’…CES 2026派遣団の発足式‘건국대 창업 에너지를 글로벌 무대로’…CES 2026 파견단 발대식https://www.zdnet.co.kr/20260103080521” title=”
2026-01-03エスネットグループ、2026年に組織改革を実施…エスネットシステムのキムヒョンウ社長を任命에스넷그룹, 2026년 조직개편 단행…에스넷시스템 김형우 사장 선임https://www.zdnet.co.kr/20260102234709” title=”
2026-01-03低軌道衛星の衝突リスク…スターリンクは高度を半分の70kmに下げる저궤도 위성 충돌 위험…스타링크 절반 고도 70km 낮춘다https://www.zdnet.co.kr/20260103072824” title=”
2026-01-02CES 2026 韓国参加企業853社…3位を維持CES 2026 韓 참가기업 853개…3위 유지https://www.zdnet.co.kr/20260102231245” title=”
2026-01-02“eスポーツ発展功労”…『ペイカー』イサンヒョク、体育勲章 チョンリョンジャン受章“e스포츠 발전 공로”…’페이커’ 이상혁, 체육훈장 청룡장 수훈https://www.zdnet.co.kr/20260102201305” title=”
2026-01-02“ソーラー独創性、99.99%”…アップステージ、データ公開で流用疑惑を否定“솔라 독창성, 99.99%”…업스테이지, 데이터 공개로 도용 의혹 반박https://www.zdnet.co.kr/20260102181257” title=”
2026-01-02チェ・テウォン “韓国経済、このままだと5年後にマイナス成長”최태원 “韓 경제, 이대로 가면 5년 뒤 마이너스 성장”https://www.zdnet.co.kr/20260102182034” title=”
2026-01-02サムスンSDS、グミでAIデータセンター建設着手…4273億ウォン投資を決議삼성SDS, 구미 AI 데이터센터 건립 착수…4273억원 투자 의결https://www.zdnet.co.kr/20260102175017” title=”
2026-01-02キム・ジョンチョル 米国訪問統一委員会委員長 “新任委員と迅速に業務を推進”김종철 방미통위 위원장 “새 위원과 속도감 있게 업무 추진”https://www.zdnet.co.kr/20260102170145” title=”
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中央日報
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